WO2009038097A1 - Agent de durcissement latent de type microcapsule pour résine époxy et son procédé de fabrication, et composition de résine époxy à un composant et son produit durci - Google Patents
Agent de durcissement latent de type microcapsule pour résine époxy et son procédé de fabrication, et composition de résine époxy à un composant et son produit durci Download PDFInfo
- Publication number
- WO2009038097A1 WO2009038097A1 PCT/JP2008/066774 JP2008066774W WO2009038097A1 WO 2009038097 A1 WO2009038097 A1 WO 2009038097A1 JP 2008066774 W JP2008066774 W JP 2008066774W WO 2009038097 A1 WO2009038097 A1 WO 2009038097A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- type
- microcapsule
- curing agent
- pack
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Epoxy Resins (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009533162A JP5158088B2 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
CN200880107917A CN101802050A (zh) | 2007-09-20 | 2008-09-17 | 环氧树脂用微囊型潜在性固化剂及其制造方法,和一液性环氧树脂组合物及其固化物 |
KR1020127000991A KR101243511B1 (ko) | 2007-09-20 | 2008-09-17 | 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-243852 | 2007-09-20 | ||
JP2007243852 | 2007-09-20 | ||
JP2007-243851 | 2007-09-20 | ||
JP2007243851 | 2007-09-20 | ||
JP2008-043346 | 2008-02-25 | ||
JP2008043346 | 2008-02-25 | ||
JP2008166246 | 2008-06-25 | ||
JP2008-166246 | 2008-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009038097A1 true WO2009038097A1 (fr) | 2009-03-26 |
Family
ID=40467907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/066774 WO2009038097A1 (fr) | 2007-09-20 | 2008-09-17 | Agent de durcissement latent de type microcapsule pour résine époxy et son procédé de fabrication, et composition de résine époxy à un composant et son produit durci |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5158088B2 (fr) |
KR (2) | KR20100072030A (fr) |
CN (2) | CN102936331A (fr) |
TW (2) | TW201008971A (fr) |
WO (1) | WO2009038097A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101086701B1 (ko) * | 2009-06-10 | 2011-11-25 | 한국과학기술연구원 | 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법 |
CN111087576A (zh) * | 2019-12-31 | 2020-05-01 | 芜湖天道绿色新材料有限公司 | 一种可降解微胶囊固化剂的制备及应用 |
CN111518500A (zh) * | 2020-04-22 | 2020-08-11 | 湖北回天新材料股份有限公司 | 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102270461B1 (ko) * | 2016-03-10 | 2021-06-29 | 한국전자기술연구원 | 점접착제 조성물 및 그의 제조방법 |
KR101870777B1 (ko) * | 2017-03-28 | 2018-06-26 | 한국신발피혁연구원 | 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제 |
KR102095115B1 (ko) * | 2018-07-27 | 2020-03-30 | 한국전력공사 | 자가치유 실리콘 절연체 및 그 제조방법 |
CN111171285B (zh) * | 2020-02-15 | 2022-04-26 | 常州大学 | 一种以聚氨酯为壳材的环氧树脂固化剂微胶囊及其制备方法 |
CN111389317B (zh) * | 2020-04-28 | 2022-04-12 | 西北工业大学 | 基于巯基-异氰酸酯点击反应和油包油界面聚合的咪唑微胶囊的制备方法 |
CN116323837A (zh) * | 2020-09-30 | 2023-06-23 | 旭化成株式会社 | 聚氨酯系固化剂及其应用 |
WO2023286499A1 (fr) * | 2021-07-12 | 2023-01-19 | 旭化成株式会社 | Composition de résine époxy, film, procédé de production de film et produit durci |
CN114230767B (zh) * | 2021-12-13 | 2024-03-19 | 江苏钛得新材料技术有限公司 | 胶粘剂用咪唑类衍生物微胶囊型潜伏固化剂及其制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199655A (ja) * | 1998-01-12 | 1999-07-27 | Hitachi Ltd | マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物 |
JP2005344046A (ja) * | 2004-06-04 | 2005-12-15 | Asahi Kasei Chemicals Corp | 潜在性硬化剤および組成物 |
WO2007037378A1 (fr) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy |
JP2007091900A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091901A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
WO2007088889A1 (fr) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite |
JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007204670A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
-
2008
- 2008-09-17 KR KR1020107008435A patent/KR20100072030A/ko not_active Application Discontinuation
- 2008-09-17 KR KR1020127000991A patent/KR101243511B1/ko not_active IP Right Cessation
- 2008-09-17 CN CN2012104288004A patent/CN102936331A/zh active Pending
- 2008-09-17 WO PCT/JP2008/066774 patent/WO2009038097A1/fr active Application Filing
- 2008-09-17 CN CN200880107917A patent/CN101802050A/zh active Pending
- 2008-09-17 JP JP2009533162A patent/JP5158088B2/ja not_active Expired - Fee Related
- 2008-09-19 TW TW097136142A patent/TW201008971A/zh unknown
- 2008-09-19 TW TW101126619A patent/TW201244814A/zh unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199655A (ja) * | 1998-01-12 | 1999-07-27 | Hitachi Ltd | マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物 |
JP2005344046A (ja) * | 2004-06-04 | 2005-12-15 | Asahi Kasei Chemicals Corp | 潜在性硬化剤および組成物 |
WO2007037378A1 (fr) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy |
JP2007091900A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091901A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
WO2007088889A1 (fr) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite |
JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007204670A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101086701B1 (ko) * | 2009-06-10 | 2011-11-25 | 한국과학기술연구원 | 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법 |
CN111087576A (zh) * | 2019-12-31 | 2020-05-01 | 芜湖天道绿色新材料有限公司 | 一种可降解微胶囊固化剂的制备及应用 |
CN111518500A (zh) * | 2020-04-22 | 2020-08-11 | 湖北回天新材料股份有限公司 | 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20100072030A (ko) | 2010-06-29 |
KR101243511B1 (ko) | 2013-03-20 |
CN102936331A (zh) | 2013-02-20 |
CN101802050A (zh) | 2010-08-11 |
KR20120024963A (ko) | 2012-03-14 |
TW201244814A (en) | 2012-11-16 |
JPWO2009038097A1 (ja) | 2011-01-06 |
TW201008971A (en) | 2010-03-01 |
JP5158088B2 (ja) | 2013-03-06 |
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