TW201008971A - Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof - Google Patents

Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof Download PDF

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Publication number
TW201008971A
TW201008971A TW097136142A TW97136142A TW201008971A TW 201008971 A TW201008971 A TW 201008971A TW 097136142 A TW097136142 A TW 097136142A TW 97136142 A TW97136142 A TW 97136142A TW 201008971 A TW201008971 A TW 201008971A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
microcapsule
curing agent
type
latent curing
Prior art date
Application number
TW097136142A
Other languages
English (en)
Chinese (zh)
Inventor
Shigeaki Funyuu
Yutaka Okada
Yoshii Morishita
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201008971A publication Critical patent/TW201008971A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW097136142A 2007-09-20 2008-09-19 Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof TW201008971A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007243852 2007-09-20
JP2007243851 2007-09-20
JP2008043346 2008-02-25
JP2008166246 2008-06-25

Publications (1)

Publication Number Publication Date
TW201008971A true TW201008971A (en) 2010-03-01

Family

ID=40467907

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097136142A TW201008971A (en) 2007-09-20 2008-09-19 Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof
TW101126619A TW201244814A (en) 2007-09-20 2008-09-19 Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101126619A TW201244814A (en) 2007-09-20 2008-09-19 Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof

Country Status (5)

Country Link
JP (1) JP5158088B2 (fr)
KR (2) KR101243511B1 (fr)
CN (2) CN101802050A (fr)
TW (2) TW201008971A (fr)
WO (1) WO2009038097A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086701B1 (ko) * 2009-06-10 2011-11-25 한국과학기술연구원 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법
KR102270461B1 (ko) * 2016-03-10 2021-06-29 한국전자기술연구원 점접착제 조성물 및 그의 제조방법
KR101870777B1 (ko) * 2017-03-28 2018-06-26 한국신발피혁연구원 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제
KR102095115B1 (ko) * 2018-07-27 2020-03-30 한국전력공사 자가치유 실리콘 절연체 및 그 제조방법
CN111087576A (zh) * 2019-12-31 2020-05-01 芜湖天道绿色新材料有限公司 一种可降解微胶囊固化剂的制备及应用
CN111171285B (zh) * 2020-02-15 2022-04-26 常州大学 一种以聚氨酯为壳材的环氧树脂固化剂微胶囊及其制备方法
CN111518500B (zh) * 2020-04-22 2023-04-11 湖北回天新材料股份有限公司 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法
CN111389317B (zh) * 2020-04-28 2022-04-12 西北工业大学 基于巯基-异氰酸酯点击反应和油包油界面聚合的咪唑微胶囊的制备方法
CN116323837A (zh) * 2020-09-30 2023-06-23 旭化成株式会社 聚氨酯系固化剂及其应用
JPWO2023286499A1 (fr) * 2021-07-12 2023-01-19
CN114230767B (zh) * 2021-12-13 2024-03-19 江苏钛得新材料技术有限公司 胶粘剂用咪唑类衍生物微胶囊型潜伏固化剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3611439B2 (ja) * 1998-01-12 2005-01-19 株式会社日立製作所 マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物
JP4567377B2 (ja) * 2004-06-04 2010-10-20 旭化成イーマテリアルズ株式会社 潜在性硬化剤および組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP4877716B2 (ja) * 2005-09-29 2012-02-15 旭化成イーマテリアルズ株式会社 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
CA2625794A1 (fr) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy
JP4877717B2 (ja) * 2005-09-29 2012-02-15 旭化成イーマテリアルズ株式会社 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007204669A (ja) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
WO2007088889A1 (fr) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite
JP4911981B2 (ja) * 2006-02-03 2012-04-04 旭化成イーマテリアルズ株式会社 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物

Also Published As

Publication number Publication date
KR20120024963A (ko) 2012-03-14
WO2009038097A1 (fr) 2009-03-26
JPWO2009038097A1 (ja) 2011-01-06
KR20100072030A (ko) 2010-06-29
KR101243511B1 (ko) 2013-03-20
CN101802050A (zh) 2010-08-11
TW201244814A (en) 2012-11-16
CN102936331A (zh) 2013-02-20
JP5158088B2 (ja) 2013-03-06

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