JP5153574B2 - 実装構造体 - Google Patents

実装構造体 Download PDF

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Publication number
JP5153574B2
JP5153574B2 JP2008279937A JP2008279937A JP5153574B2 JP 5153574 B2 JP5153574 B2 JP 5153574B2 JP 2008279937 A JP2008279937 A JP 2008279937A JP 2008279937 A JP2008279937 A JP 2008279937A JP 5153574 B2 JP5153574 B2 JP 5153574B2
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JP
Japan
Prior art keywords
circuit board
flux
mounting structure
terminals
underfill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008279937A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009135470A5 (enExample
JP2009135470A (ja
Inventor
行壮 松野
秀規 宮川
茂昭 酒谷
敦史 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008279937A priority Critical patent/JP5153574B2/ja
Publication of JP2009135470A publication Critical patent/JP2009135470A/ja
Publication of JP2009135470A5 publication Critical patent/JP2009135470A5/ja
Application granted granted Critical
Publication of JP5153574B2 publication Critical patent/JP5153574B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP2008279937A 2007-11-05 2008-10-30 実装構造体 Expired - Fee Related JP5153574B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008279937A JP5153574B2 (ja) 2007-11-05 2008-10-30 実装構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007287673 2007-11-05
JP2007287673 2007-11-05
JP2008279937A JP5153574B2 (ja) 2007-11-05 2008-10-30 実装構造体

Publications (3)

Publication Number Publication Date
JP2009135470A JP2009135470A (ja) 2009-06-18
JP2009135470A5 JP2009135470A5 (enExample) 2011-09-22
JP5153574B2 true JP5153574B2 (ja) 2013-02-27

Family

ID=40587895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008279937A Expired - Fee Related JP5153574B2 (ja) 2007-11-05 2008-10-30 実装構造体

Country Status (4)

Country Link
US (1) US8138426B2 (enExample)
JP (1) JP5153574B2 (enExample)
KR (1) KR101138599B1 (enExample)
CN (1) CN101431867B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5627097B2 (ja) * 2009-10-07 2014-11-19 ルネサスエレクトロニクス株式会社 配線基板
KR20110041179A (ko) * 2009-10-15 2011-04-21 한국전자통신연구원 패키지 구조
US8536672B2 (en) * 2010-03-19 2013-09-17 Xintec, Inc. Image sensor package and fabrication method thereof
JP5807145B2 (ja) * 2010-05-20 2015-11-10 パナソニックＩｐマネジメント株式会社 実装構造体
US20120002386A1 (en) * 2010-07-01 2012-01-05 Nokia Corporation Method and Apparatus for Improving the Reliability of Solder Joints
WO2012147352A1 (ja) * 2011-04-26 2012-11-01 パナソニック株式会社 太陽電池セル、接合構造体、および太陽電池セルの製造方法
US10261370B2 (en) 2011-10-05 2019-04-16 Apple Inc. Displays with minimized border regions having an apertured TFT layer for signal conductors
US9171818B2 (en) * 2011-12-13 2015-10-27 Cyntec Co., Ltd. Package structure and the method to manufacture thereof
JP5516696B2 (ja) * 2012-11-01 2014-06-11 株式会社豊田自動織機 基板
FR2998710B1 (fr) 2012-11-29 2016-02-05 Commissariat Energie Atomique Procede ameliore de realisation d'une structure pour l'assemblage de dispositifs microelectroniques
CN103889149B (zh) * 2012-12-21 2017-07-14 华为终端有限公司 电子装置和栅格阵列模块
JP6182928B2 (ja) * 2013-03-27 2017-08-23 セイコーエプソン株式会社 半導体装置
JP6362066B2 (ja) * 2013-12-17 2018-07-25 キヤノン株式会社 プリント回路板の製造方法及びプリント回路板
US9711474B2 (en) * 2014-09-24 2017-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure with polymeric layer and manufacturing method thereof
JP6468054B2 (ja) * 2015-04-28 2019-02-13 富士通株式会社 プリント基板及びシールド板金固定方法
CN106356353A (zh) * 2015-07-14 2017-01-25 苏州旭创科技有限公司 基板及应用该基板的焊接结构和焊接方法
US10276402B2 (en) * 2016-03-21 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and manufacturing process thereof
JP2018125436A (ja) * 2017-02-01 2018-08-09 株式会社デンソー 電子装置
JP2018182005A (ja) * 2017-04-10 2018-11-15 株式会社デンソー 電子装置
CN107293482B (zh) * 2017-06-14 2021-03-23 成都海威华芯科技有限公司 一种氮化镓高电子迁移率晶体管栅电极的制作方法
CN109659291A (zh) * 2018-12-24 2019-04-19 烟台艾睿光电科技有限公司 一种焊接环防溢流结构
JP7491209B2 (ja) * 2020-12-22 2024-05-28 株式会社デンソー 電気部品
KR102897594B1 (ko) 2021-06-25 2025-12-10 삼성전자주식회사 반도체 패키지

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3080512B2 (ja) * 1993-05-21 2000-08-28 株式会社日立製作所 表面実装部品搭載用配線基板及び部品搭載接続方法
JPH07283493A (ja) * 1994-04-14 1995-10-27 Nippon Chemicon Corp フラックス残渣付着防止機能付き回路基板
JP3346263B2 (ja) * 1997-04-11 2002-11-18 イビデン株式会社 プリント配線板及びその製造方法
JPH1187899A (ja) 1997-09-09 1999-03-30 Sony Corp 実装基板
JPH11145176A (ja) * 1997-11-11 1999-05-28 Fujitsu Ltd ハンダバンプの形成方法及び予備ハンダの形成方法
JP3700598B2 (ja) 2001-03-21 2005-09-28 セイコーエプソン株式会社 半導体チップ及び半導体装置、回路基板並びに電子機器
JP3692978B2 (ja) * 2001-07-24 2005-09-07 日立電線株式会社 配線基板の製造方法
JP4200274B2 (ja) 2002-07-26 2008-12-24 パナソニック電工株式会社 立体回路基板の電極端子構造
JP2004103928A (ja) * 2002-09-11 2004-04-02 Fujitsu Ltd 基板及びハンダボールの形成方法及びその実装構造
JP3631230B2 (ja) 2002-11-21 2005-03-23 富士通株式会社 予備ハンダの形成方法
TWI222192B (en) * 2003-09-04 2004-10-11 Advanced Semiconductor Eng Substrate with net structure
US7126164B2 (en) * 2003-09-26 2006-10-24 Flipchip International Llc Wafer-level moat structures
KR100555706B1 (ko) 2003-12-18 2006-03-03 삼성전자주식회사 미세 솔더볼 구현을 위한 ｕｂｍ 및 이를 이용한 플립칩패키지 방법
US7575955B2 (en) * 2004-01-06 2009-08-18 Ismat Corporation Method for making electronic packages
US20050151268A1 (en) * 2004-01-08 2005-07-14 Boyd William D. Wafer-level assembly method for chip-size devices having flipped chips
JP4060806B2 (ja) * 2004-01-09 2008-03-12 日本オプネクスト株式会社 硬質回路基板とフレキシブル基板との接続構造、接続方法及びそれを用いた回路モジュール
JP2006269772A (ja) * 2005-03-24 2006-10-05 Nec Saitama Ltd 半導体パッケージ、配線基板、及び半導体装置
JP2006294835A (ja) 2005-04-11 2006-10-26 Seiko Epson Corp 印刷回路基板及びその作製方法
JP2007220940A (ja) 2006-02-17 2007-08-30 Matsushita Electric Ind Co Ltd プリント基板及び半導体装置
JP5264585B2 (ja) * 2009-03-24 2013-08-14 パナソニック株式会社 電子部品接合方法および電子部品

Also Published As

Publication number Publication date
US8138426B2 (en) 2012-03-20
CN101431867B (zh) 2011-03-09
KR101138599B1 (ko) 2012-05-10
CN101431867A (zh) 2009-05-13
US20090116203A1 (en) 2009-05-07
KR20090046712A (ko) 2009-05-11
JP2009135470A (ja) 2009-06-18

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