JP5147755B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5147755B2
JP5147755B2 JP2009037305A JP2009037305A JP5147755B2 JP 5147755 B2 JP5147755 B2 JP 5147755B2 JP 2009037305 A JP2009037305 A JP 2009037305A JP 2009037305 A JP2009037305 A JP 2009037305A JP 5147755 B2 JP5147755 B2 JP 5147755B2
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electronic component
pad
sealing resin
electrode pad
semiconductor device
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Japanese (ja)
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JP2010192781A (ja
JP2010192781A5 (enExample
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規良 清水
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009037305A priority Critical patent/JP5147755B2/ja
Priority to US12/704,709 priority patent/US20100213605A1/en
Publication of JP2010192781A publication Critical patent/JP2010192781A/ja
Publication of JP2010192781A5 publication Critical patent/JP2010192781A5/ja
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JP5826532B2 (ja) * 2010-07-15 2015-12-02 新光電気工業株式会社 半導体装置及びその製造方法
US8581421B2 (en) * 2010-12-20 2013-11-12 Shinko Electric Industries Co., Ltd. Semiconductor package manufacturing method and semiconductor package
JP5864180B2 (ja) * 2011-09-21 2016-02-17 新光電気工業株式会社 半導体パッケージ及びその製造方法
US9576873B2 (en) * 2011-12-14 2017-02-21 STATS ChipPAC Pte. Ltd. Integrated circuit packaging system with routable trace and method of manufacture thereof
JP5994484B2 (ja) * 2012-08-24 2016-09-21 イビデン株式会社 プリント配線板
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US9775246B2 (en) * 2015-08-07 2017-09-26 Unimicron Technology Corp. Circuit board and manufacturing method thereof
KR101809521B1 (ko) * 2015-09-04 2017-12-18 주식회사 네패스 반도체 패키지 및 그 제조방법
WO2022091954A1 (ja) * 2020-10-29 2022-05-05 株式会社村田製作所 高周波モジュール及び通信装置
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