JP5144268B2 - 有機材料の気化を制御するための方法と装置 - Google Patents

有機材料の気化を制御するための方法と装置 Download PDF

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Publication number
JP5144268B2
JP5144268B2 JP2007540188A JP2007540188A JP5144268B2 JP 5144268 B2 JP5144268 B2 JP 5144268B2 JP 2007540188 A JP2007540188 A JP 2007540188A JP 2007540188 A JP2007540188 A JP 2007540188A JP 5144268 B2 JP5144268 B2 JP 5144268B2
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Japan
Prior art keywords
organic material
manifold
temperature
substrate
heating device
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Expired - Lifetime
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JP2007540188A
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English (en)
Japanese (ja)
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JP2008519904A (ja
JP2008519904A5 (enExample
Inventor
ルイス ボロソン，マイケル
ロング，マイケル
マシュー グレース，ジェレミー
チャン，ジンメイ
エドワード コッペ，ブルース
ウィリアム パロン，トーマス
ピーター レッデン，ニール
Original Assignee
グローバル オーエルイーディー テクノロジー リミティド ライアビリティ カンパニー
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Publication of JP2008519904A5 publication Critical patent/JP2008519904A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2007540188A 2004-11-09 2005-11-09 有機材料の気化を制御するための方法と装置 Expired - Lifetime JP5144268B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/984,095 US20060099344A1 (en) 2004-11-09 2004-11-09 Controlling the vaporization of organic material
US10/984,095 2004-11-09
PCT/US2005/040539 WO2006053017A1 (en) 2004-11-09 2005-11-09 Method and apparatus for controlling the vaporization of organic material

Publications (3)

Publication Number Publication Date
JP2008519904A JP2008519904A (ja) 2008-06-12
JP2008519904A5 JP2008519904A5 (enExample) 2008-12-04
JP5144268B2 true JP5144268B2 (ja) 2013-02-13

Family

ID=35892418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007540188A Expired - Lifetime JP5144268B2 (ja) 2004-11-09 2005-11-09 有機材料の気化を制御するための方法と装置

Country Status (8)

Country Link
US (2) US20060099344A1 (enExample)
EP (1) EP1834364B1 (enExample)
JP (1) JP5144268B2 (enExample)
KR (1) KR101172410B1 (enExample)
CN (1) CN101057349B (enExample)
DE (1) DE602005025695D1 (enExample)
TW (1) TWI382099B (enExample)
WO (1) WO2006053017A1 (enExample)

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KR20110050690A (ko) * 2008-09-24 2011-05-16 이데미쓰 고산 가부시키가이샤 복합 유기 전계 발광 재료
US8425801B2 (en) * 2009-04-10 2013-04-23 Idemitsu Kosan Co., Ltd. Composite organic electroluminescent material and production method thereof
DE102010007111B4 (de) * 2010-02-05 2012-02-16 Von Ardenne Anlagentechnik Gmbh Verfahren und Pulvermischung zur Beschichtung von Substraten aus der Dampfphase
CN104711514B (zh) * 2015-04-07 2017-05-31 合肥京东方光电科技有限公司 一种成膜装置及方法
CN117051361B (zh) * 2023-08-14 2025-10-28 兰州空间技术物理研究所 一种真空卷绕有机物蒸镀防护装置

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Also Published As

Publication number Publication date
JP2008519904A (ja) 2008-06-12
KR20070074616A (ko) 2007-07-12
EP1834364B1 (en) 2010-12-29
CN101057349A (zh) 2007-10-17
US8012537B2 (en) 2011-09-06
CN101057349B (zh) 2010-06-23
TWI382099B (zh) 2013-01-11
TW200624577A (en) 2006-07-16
DE602005025695D1 (de) 2011-02-10
US20100233367A1 (en) 2010-09-16
US20060099344A1 (en) 2006-05-11
KR101172410B1 (ko) 2012-08-09
WO2006053017A1 (en) 2006-05-18
EP1834364A1 (en) 2007-09-19

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