TWI382099B - 有機材料汽化之控制 - Google Patents

有機材料汽化之控制 Download PDF

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Publication number
TWI382099B
TWI382099B TW094139065A TW94139065A TWI382099B TW I382099 B TWI382099 B TW I382099B TW 094139065 A TW094139065 A TW 094139065A TW 94139065 A TW94139065 A TW 94139065A TW I382099 B TWI382099 B TW I382099B
Authority
TW
Taiwan
Prior art keywords
organic material
heating
vaporization
temperature
temperature control
Prior art date
Application number
TW094139065A
Other languages
English (en)
Chinese (zh)
Other versions
TW200624577A (en
Inventor
Michael L Boroson
Michael Long
Jeremy M Grace
Jinmei Zhang
Bruce E Koppe
Thomas W Palone
Neil P Redden
Original Assignee
Global Oled Technology Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global Oled Technology Llc filed Critical Global Oled Technology Llc
Publication of TW200624577A publication Critical patent/TW200624577A/zh
Application granted granted Critical
Publication of TWI382099B publication Critical patent/TWI382099B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW094139065A 2004-11-09 2005-11-08 有機材料汽化之控制 TWI382099B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/984,095 US20060099344A1 (en) 2004-11-09 2004-11-09 Controlling the vaporization of organic material

Publications (2)

Publication Number Publication Date
TW200624577A TW200624577A (en) 2006-07-16
TWI382099B true TWI382099B (zh) 2013-01-11

Family

ID=35892418

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139065A TWI382099B (zh) 2004-11-09 2005-11-08 有機材料汽化之控制

Country Status (8)

Country Link
US (2) US20060099344A1 (enExample)
EP (1) EP1834364B1 (enExample)
JP (1) JP5144268B2 (enExample)
KR (1) KR101172410B1 (enExample)
CN (1) CN101057349B (enExample)
DE (1) DE602005025695D1 (enExample)
TW (1) TWI382099B (enExample)
WO (1) WO2006053017A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7989021B2 (en) 2005-07-27 2011-08-02 Global Oled Technology Llc Vaporizing material at a uniform rate
JP5325471B2 (ja) * 2007-07-06 2013-10-23 株式会社半導体エネルギー研究所 発光装置の作製方法
KR20110050690A (ko) * 2008-09-24 2011-05-16 이데미쓰 고산 가부시키가이샤 복합 유기 전계 발광 재료
US8425801B2 (en) * 2009-04-10 2013-04-23 Idemitsu Kosan Co., Ltd. Composite organic electroluminescent material and production method thereof
DE102010007111B4 (de) * 2010-02-05 2012-02-16 Von Ardenne Anlagentechnik Gmbh Verfahren und Pulvermischung zur Beschichtung von Substraten aus der Dampfphase
CN104711514B (zh) * 2015-04-07 2017-05-31 合肥京东方光电科技有限公司 一种成膜装置及方法
CN117051361B (zh) * 2023-08-14 2025-10-28 兰州空间技术物理研究所 一种真空卷绕有机物蒸镀防护装置

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CN1487116A (zh) * 2002-07-19 2004-04-07 Lg������ʽ���� 有机场致发光膜蒸镀用蒸镀源

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CN1487116A (zh) * 2002-07-19 2004-04-07 Lg������ʽ���� 有机场致发光膜蒸镀用蒸镀源

Also Published As

Publication number Publication date
JP2008519904A (ja) 2008-06-12
KR20070074616A (ko) 2007-07-12
EP1834364B1 (en) 2010-12-29
CN101057349A (zh) 2007-10-17
US8012537B2 (en) 2011-09-06
CN101057349B (zh) 2010-06-23
TW200624577A (en) 2006-07-16
DE602005025695D1 (de) 2011-02-10
US20100233367A1 (en) 2010-09-16
JP5144268B2 (ja) 2013-02-13
US20060099344A1 (en) 2006-05-11
KR101172410B1 (ko) 2012-08-09
WO2006053017A1 (en) 2006-05-18
EP1834364A1 (en) 2007-09-19

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