KR101172410B1 - 증착 제어 방법 및 기화 제어 장치 - Google Patents

증착 제어 방법 및 기화 제어 장치 Download PDF

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Publication number
KR101172410B1
KR101172410B1 KR1020077010468A KR20077010468A KR101172410B1 KR 101172410 B1 KR101172410 B1 KR 101172410B1 KR 1020077010468 A KR1020077010468 A KR 1020077010468A KR 20077010468 A KR20077010468 A KR 20077010468A KR 101172410 B1 KR101172410 B1 KR 101172410B1
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South Korea
Prior art keywords
organic material
heating
temperature
vaporization
manifold
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Expired - Lifetime
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KR1020077010468A
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English (en)
Korean (ko)
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KR20070074616A (ko
Inventor
마이클 루이스 보로슨
마이클 롱
제레미 매튜 그레이스
진메이 장
브루스 에드워드 코페
토마스 윌리암 팔로네
네일 피터 리덴
Original Assignee
글로벌 오엘이디 테크놀러지 엘엘씨
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Publication of KR20070074616A publication Critical patent/KR20070074616A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020077010468A 2004-11-09 2005-11-09 증착 제어 방법 및 기화 제어 장치 Expired - Lifetime KR101172410B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/984,095 2004-11-09
US10/984,095 US20060099344A1 (en) 2004-11-09 2004-11-09 Controlling the vaporization of organic material
PCT/US2005/040539 WO2006053017A1 (en) 2004-11-09 2005-11-09 Method and apparatus for controlling the vaporization of organic material

Publications (2)

Publication Number Publication Date
KR20070074616A KR20070074616A (ko) 2007-07-12
KR101172410B1 true KR101172410B1 (ko) 2012-08-09

Family

ID=35892418

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077010468A Expired - Lifetime KR101172410B1 (ko) 2004-11-09 2005-11-09 증착 제어 방법 및 기화 제어 장치

Country Status (8)

Country Link
US (2) US20060099344A1 (enExample)
EP (1) EP1834364B1 (enExample)
JP (1) JP5144268B2 (enExample)
KR (1) KR101172410B1 (enExample)
CN (1) CN101057349B (enExample)
DE (1) DE602005025695D1 (enExample)
TW (1) TWI382099B (enExample)
WO (1) WO2006053017A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7989021B2 (en) 2005-07-27 2011-08-02 Global Oled Technology Llc Vaporizing material at a uniform rate
JP5325471B2 (ja) * 2007-07-06 2013-10-23 株式会社半導体エネルギー研究所 発光装置の作製方法
KR20110050690A (ko) * 2008-09-24 2011-05-16 이데미쓰 고산 가부시키가이샤 복합 유기 전계 발광 재료
US8425801B2 (en) * 2009-04-10 2013-04-23 Idemitsu Kosan Co., Ltd. Composite organic electroluminescent material and production method thereof
DE102010007111B4 (de) * 2010-02-05 2012-02-16 Von Ardenne Anlagentechnik Gmbh Verfahren und Pulvermischung zur Beschichtung von Substraten aus der Dampfphase
CN104711514B (zh) * 2015-04-07 2017-05-31 合肥京东方光电科技有限公司 一种成膜装置及方法
CN117051361B (zh) * 2023-08-14 2025-10-28 兰州空间技术物理研究所 一种真空卷绕有机物蒸镀防护装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2447789A (en) * 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
GB1253124A (enExample) 1969-02-28 1971-11-10
DE3200848C2 (de) * 1982-01-14 1984-09-27 GfO Gesellschaft für Oberflächentechnik mbH, 7070 Schwäbisch Gmünd Vorrichtung zum Beschicken von Verdampfern in Aufdampfanlagen
JPS59177365A (ja) * 1983-03-24 1984-10-08 Matsushita Electric Ind Co Ltd 蒸発方法とその装置
JPH0743322B2 (ja) 1985-07-19 1995-05-15 株式会社日立製作所 検査方法および装置
US4885211A (en) * 1987-02-11 1989-12-05 Eastman Kodak Company Electroluminescent device with improved cathode
US4769292A (en) * 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
US5041719A (en) * 1990-06-01 1991-08-20 General Electric Company Two-zone electrical furnace for molecular beam epitaxial apparatus
JPH05117864A (ja) 1991-06-25 1993-05-14 Anelva Corp Ｃｖｄ装置
JPH0530761U (ja) 1991-09-30 1993-04-23 京セラ株式会社 欠陥観察装置
JPH09219289A (ja) 1996-02-09 1997-08-19 Chisso Corp 有機薄膜電界発光素子とその製造方法
US5849089A (en) * 1997-03-14 1998-12-15 Kabushiki Kaisha Toshiba Evaporator for liquid raw material and evaporation method therefor
US6340501B1 (en) * 1997-05-08 2002-01-22 Matsushita Electric Industrial Co., Ltd. Device and method for manufacturing an optical recording medium
JPH1161386A (ja) * 1997-08-22 1999-03-05 Fuji Electric Co Ltd 有機薄膜発光素子の成膜装置
US6337102B1 (en) * 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
JPH11251067A (ja) * 1998-03-02 1999-09-17 Junji Kido 有機エレクトロルミネッセント素子
DE69943312D1 (de) * 1998-06-09 2011-05-12 Sony Corp Manipulator und verfahren zur steuerung seiner lage
JP2000068055A (ja) 1998-08-26 2000-03-03 Tdk Corp 有機ｅｌ素子用蒸発源、この有機ｅｌ素子用蒸発源を用いた有機ｅｌ素子の製造装置および製造方法
JP3610837B2 (ja) 1998-09-18 2005-01-19 株式会社日立製作所 試料表面の観察方法及びその装置並びに欠陥検査方法及びその装置
US6123993A (en) * 1998-09-21 2000-09-26 Advanced Technology Materials, Inc. Method and apparatus for forming low dielectric constant polymeric films
JP2000248358A (ja) 1999-03-01 2000-09-12 Casio Comput Co Ltd 蒸着装置および蒸着方法
TW521303B (en) * 2000-02-28 2003-02-21 Semiconductor Energy Lab Electronic device
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
US6660328B1 (en) * 2000-03-31 2003-12-09 Florida State University Research Foundation Powder precursor delivery system for chemical vapor deposition
ATE497028T1 (de) * 2000-06-22 2011-02-15 Panasonic Elec Works Co Ltd Vorrichtung und verfahren zum vakuum-ausdampfen
JP4153652B2 (ja) 2000-10-05 2008-09-24 株式会社東芝 パターン評価装置及びパターン評価方法
US6467427B1 (en) 2000-11-10 2002-10-22 Helix Technology Inc. Evaporation source material supplier
JP4906018B2 (ja) 2001-03-12 2012-03-28 株式会社半導体エネルギー研究所 成膜方法、発光装置の作製方法及び成膜装置
US20030015140A1 (en) * 2001-04-26 2003-01-23 Eastman Kodak Company Physical vapor deposition of organic layers using tubular sources for making organic light-emitting devices
AU2002346665A1 (en) 2001-12-04 2003-06-17 Primaxx, Inc. Chemical vapor deposition vaporizer
WO2003083169A1 (en) * 2002-04-01 2003-10-09 Ans Inc Apparatus and method for depositing organic matter of vapor phase
JP2003293121A (ja) * 2002-04-05 2003-10-15 Cluster Ion Beam Technology Kk 蒸着材料供給手段を備えた蒸着用坩堝
ATE326555T1 (de) * 2002-07-19 2006-06-15 Lg Electronics Inc Quelle zur thermischen pvd-beschichtung für organische elektrolumineszente schichten
US7643137B2 (en) 2003-03-26 2010-01-05 Nikon Corporation Defect inspection apparatus, defect inspection method and method of inspecting hole pattern
JP4901090B2 (ja) 2004-10-06 2012-03-21 株式会社ニコン 欠陥検査方法及び欠陥検出装置
US6837939B1 (en) * 2003-07-22 2005-01-04 Eastman Kodak Company Thermal physical vapor deposition source using pellets of organic material for making OLED displays
TWI242463B (en) 2003-08-28 2005-11-01 Ind Tech Res Inst Apparatus and process for vacuum sublimation
US7339139B2 (en) * 2003-10-03 2008-03-04 Darly Custom Technology, Inc. Multi-layered radiant thermal evaporator and method of use
KR101346492B1 (ko) 2003-10-27 2013-12-31 가부시키가이샤 니콘 패턴 검사장치 및 패턴 검사방법
US7232588B2 (en) 2004-02-23 2007-06-19 Eastman Kodak Company Device and method for vaporizing temperature sensitive materials
US7364772B2 (en) 2004-03-22 2008-04-29 Eastman Kodak Company Method for coating an organic layer onto a substrate in a vacuum chamber
US7501151B2 (en) 2004-09-21 2009-03-10 Eastman Kodak Company Delivering particulate material to a vaporization zone
US7501152B2 (en) 2004-09-21 2009-03-10 Eastman Kodak Company Delivering particulate material to a vaporization zone

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SID DIGEST vol.33 (2002) pp.886-889

Also Published As

Publication number Publication date
JP2008519904A (ja) 2008-06-12
KR20070074616A (ko) 2007-07-12
EP1834364B1 (en) 2010-12-29
TW200624577A (en) 2006-07-16
US20100233367A1 (en) 2010-09-16
JP5144268B2 (ja) 2013-02-13
DE602005025695D1 (de) 2011-02-10
CN101057349B (zh) 2010-06-23
CN101057349A (zh) 2007-10-17
US8012537B2 (en) 2011-09-06
WO2006053017A1 (en) 2006-05-18
TWI382099B (zh) 2013-01-11
US20060099344A1 (en) 2006-05-11
EP1834364A1 (en) 2007-09-19

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