JP5137635B2 - インプリント方法、チップの製造方法及びインプリント装置 - Google Patents
インプリント方法、チップの製造方法及びインプリント装置 Download PDFInfo
- Publication number
- JP5137635B2 JP5137635B2 JP2008064858A JP2008064858A JP5137635B2 JP 5137635 B2 JP5137635 B2 JP 5137635B2 JP 2008064858 A JP2008064858 A JP 2008064858A JP 2008064858 A JP2008064858 A JP 2008064858A JP 5137635 B2 JP5137635 B2 JP 5137635B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- substrate
- imprint
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0053—Moulding articles characterised by the shape of the surface, e.g. ribs, high polish
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
- B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
- B29C2043/3634—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices having specific surface shape, e.g. grooves, projections, corrugations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0042—Deflection of neutralising particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0044—Neutralising arrangements of objects being observed or treated
- H01J2237/0047—Neutralising arrangements of objects being observed or treated using electromagnetic radiations, e.g. UV, X-rays, light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008064858A JP5137635B2 (ja) | 2007-03-16 | 2008-03-13 | インプリント方法、チップの製造方法及びインプリント装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007068628 | 2007-03-16 | ||
| JP2007068628 | 2007-03-16 | ||
| JP2008064858A JP5137635B2 (ja) | 2007-03-16 | 2008-03-13 | インプリント方法、チップの製造方法及びインプリント装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008260273A JP2008260273A (ja) | 2008-10-30 |
| JP2008260273A5 JP2008260273A5 (enExample) | 2011-02-03 |
| JP5137635B2 true JP5137635B2 (ja) | 2013-02-06 |
Family
ID=39586034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008064858A Expired - Fee Related JP5137635B2 (ja) | 2007-03-16 | 2008-03-13 | インプリント方法、チップの製造方法及びインプリント装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8828307B2 (enExample) |
| EP (1) | EP2126632B1 (enExample) |
| JP (1) | JP5137635B2 (enExample) |
| KR (1) | KR101114178B1 (enExample) |
| CN (1) | CN101632040B (enExample) |
| WO (1) | WO2008114881A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10067420B2 (en) | 2013-12-10 | 2018-09-04 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090166317A1 (en) * | 2007-12-26 | 2009-07-02 | Canon Kabushiki Kaisha | Method of processing substrate by imprinting |
| JP4892025B2 (ja) | 2008-09-26 | 2012-03-07 | 株式会社東芝 | インプリント方法 |
| NL2004685A (en) * | 2009-07-27 | 2011-01-31 | Asml Netherlands Bv | Imprint lithography apparatus and method. |
| JP5583374B2 (ja) * | 2009-09-07 | 2014-09-03 | 株式会社島津製作所 | 光硬化樹脂の特性試験装置、その試験装置で使用する保持具、特性試験方法 |
| KR101134383B1 (ko) | 2009-11-27 | 2012-04-09 | 현대자동차주식회사 | 빛 반사 억제 효과가 우수한 폴리메틸메타크릴레이트 패널 나노임프린팅용 코팅제 |
| WO2012020741A1 (ja) * | 2010-08-12 | 2012-02-16 | 株式会社日立ハイテクノロジーズ | 光インプリント方法及び装置 |
| JP5539113B2 (ja) * | 2010-08-30 | 2014-07-02 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| JP5836652B2 (ja) | 2011-06-10 | 2015-12-24 | キヤノン株式会社 | インプリント方法、インプリント装置及び物品の製造方法 |
| JP2013003541A (ja) * | 2011-06-21 | 2013-01-07 | Konica Minolta Advanced Layers Inc | 複合レンズの製造方法 |
| JP6200135B2 (ja) | 2012-07-24 | 2017-09-20 | キヤノン株式会社 | インプリント装置、インプリント方法、および、物品製造方法 |
| JP6032036B2 (ja) * | 2013-02-06 | 2016-11-24 | 大日本印刷株式会社 | インプリント方法およびインプリント装置 |
| JP6123321B2 (ja) * | 2013-02-06 | 2017-05-10 | 大日本印刷株式会社 | インプリント方法およびインプリント装置 |
| JP6028602B2 (ja) * | 2013-02-06 | 2016-11-16 | 大日本印刷株式会社 | インプリント方法およびインプリント装置 |
| JP6413507B2 (ja) * | 2014-09-02 | 2018-10-31 | 大日本印刷株式会社 | インプリント方法およびインプリント装置 |
| JP6584182B2 (ja) * | 2015-07-16 | 2019-10-02 | キヤノン株式会社 | インプリント装置、インプリント方法および物品製造方法 |
| WO2017145924A1 (ja) * | 2016-02-26 | 2017-08-31 | キヤノン株式会社 | インプリント装置およびその動作方法ならびに物品製造方法 |
| JP6603678B2 (ja) * | 2016-02-26 | 2019-11-06 | キヤノン株式会社 | インプリント装置およびその動作方法ならびに物品製造方法 |
| JP6365619B2 (ja) * | 2016-10-17 | 2018-08-01 | 大日本印刷株式会社 | インプリント方法およびインプリント装置 |
| JP6365620B2 (ja) * | 2016-10-17 | 2018-08-01 | 大日本印刷株式会社 | インプリント方法およびインプリント装置 |
| JP6735656B2 (ja) * | 2016-11-18 | 2020-08-05 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| US11040482B2 (en) * | 2017-02-28 | 2021-06-22 | Toshiba Kikai Kabushiki Kaisha | Transfer method, transfer apparatus, and mold |
| US10895806B2 (en) * | 2017-09-29 | 2021-01-19 | Canon Kabushiki Kaisha | Imprinting method and apparatus |
| JP6948924B2 (ja) * | 2017-11-21 | 2021-10-13 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品製造方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4534921A (en) * | 1984-03-06 | 1985-08-13 | Asm Fico Tooling, B.V. | Method and apparatus for mold cleaning by reverse sputtering |
| JPH01101128A (ja) * | 1987-10-15 | 1989-04-19 | Pioneer Electron Corp | 光ディスク製造装置 |
| US5450463A (en) * | 1992-12-25 | 1995-09-12 | Olympus Optical Co., Ltd. | X-ray microscope |
| JPH0745397A (ja) * | 1993-07-27 | 1995-02-14 | Sigma Tec:Kk | 静電気除去装置 |
| JPH10269636A (ja) * | 1997-03-19 | 1998-10-09 | Teijin Ltd | 光記録媒体用基板の製造方法 |
| JP2000218659A (ja) | 1999-01-28 | 2000-08-08 | Sony Corp | 射出成形装置、射出成形方法及びディスク基板 |
| JP2000321777A (ja) * | 1999-05-07 | 2000-11-24 | Toppan Printing Co Ltd | 露光装置 |
| WO2001009999A1 (en) * | 1999-07-30 | 2001-02-08 | Illinois Tool Works Inc. | Ionizer for static elimination in variable ion mobility environments |
| US6465795B1 (en) * | 2000-03-28 | 2002-10-15 | Applied Materials, Inc. | Charge neutralization of electron beam systems |
| US6729922B2 (en) * | 2000-06-05 | 2004-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Device for inspecting element substrates and method of inspection using this device |
| JP2002353096A (ja) * | 2001-05-22 | 2002-12-06 | Nikon Corp | 基板搬送方法、露光装置及び露光方法 |
| JP3850718B2 (ja) * | 2001-11-22 | 2006-11-29 | 株式会社東芝 | 加工方法 |
| US7122482B2 (en) * | 2003-10-27 | 2006-10-17 | Molecular Imprints, Inc. | Methods for fabricating patterned features utilizing imprint lithography |
| JP5020459B2 (ja) * | 2004-03-29 | 2012-09-05 | 公益財団法人国際科学振興財団 | 樹脂成形機および樹脂成形方法 |
| JP4308739B2 (ja) * | 2004-09-22 | 2009-08-05 | 株式会社フューチャービジョン | 除電装置を備えた射出成形装置 |
| US20060081557A1 (en) * | 2004-10-18 | 2006-04-20 | Molecular Imprints, Inc. | Low-k dielectric functional imprinting materials |
| US7041989B1 (en) * | 2004-10-22 | 2006-05-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN2769065Y (zh) * | 2005-01-31 | 2006-04-05 | 伟诚实业(深圳)有限公司 | 凹印系统的全息印刷装置 |
| JP2006294602A (ja) * | 2005-03-15 | 2006-10-26 | X-Ray Precision Inc | 除電方法、除電装置、ガラス基板の帯電防止方法およびガラス基板の帯電防止装置 |
| JP3971429B2 (ja) * | 2005-03-25 | 2007-09-05 | Tdk株式会社 | 光ディスクの製造装置及び製造方法 |
| TWI280159B (en) | 2005-03-29 | 2007-05-01 | Li Bing Huan | Method for fabricating nano-adhesive |
| JP3958344B2 (ja) * | 2005-06-07 | 2007-08-15 | キヤノン株式会社 | インプリント装置、インプリント方法及びチップの製造方法 |
| JP5002211B2 (ja) | 2005-08-12 | 2012-08-15 | キヤノン株式会社 | インプリント装置およびインプリント方法 |
| JP2007098779A (ja) * | 2005-10-05 | 2007-04-19 | Nikon Corp | 樹脂の剥離方法及びパターン転写装置 |
| JP2008098266A (ja) * | 2006-10-10 | 2008-04-24 | Canon Inc | 近接場露光装置および近接場露光方法 |
-
2008
- 2008-03-13 JP JP2008064858A patent/JP5137635B2/ja not_active Expired - Fee Related
- 2008-03-17 CN CN2008800079745A patent/CN101632040B/zh not_active Expired - Fee Related
- 2008-03-17 KR KR1020097021307A patent/KR101114178B1/ko not_active Expired - Fee Related
- 2008-03-17 US US12/091,836 patent/US8828307B2/en not_active Expired - Fee Related
- 2008-03-17 EP EP08738738.7A patent/EP2126632B1/en not_active Not-in-force
- 2008-03-17 WO PCT/JP2008/055354 patent/WO2008114881A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10067420B2 (en) | 2013-12-10 | 2018-09-04 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090098688A1 (en) | 2009-04-16 |
| CN101632040B (zh) | 2012-05-30 |
| US8828307B2 (en) | 2014-09-09 |
| EP2126632A1 (en) | 2009-12-02 |
| JP2008260273A (ja) | 2008-10-30 |
| EP2126632B1 (en) | 2013-07-03 |
| KR20090130294A (ko) | 2009-12-22 |
| WO2008114881A1 (en) | 2008-09-25 |
| KR101114178B1 (ko) | 2012-02-22 |
| CN101632040A (zh) | 2010-01-20 |
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