JP5106460B2 - 半導体装置及びその製造方法、並びに電子装置 - Google Patents

半導体装置及びその製造方法、並びに電子装置 Download PDF

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JP5106460B2
JP5106460B2 JP2009077033A JP2009077033A JP5106460B2 JP 5106460 B2 JP5106460 B2 JP 5106460B2 JP 2009077033 A JP2009077033 A JP 2009077033A JP 2009077033 A JP2009077033 A JP 2009077033A JP 5106460 B2 JP5106460 B2 JP 5106460B2
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semiconductor device
electrode
pad
electronic component
electrode pad
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JP2010232333A (ja
JP2010232333A5 (enExample
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淳 大井
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to US12/730,455 priority patent/US8669653B2/en
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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