JP5098434B2 - ハンダボール印刷装置 - Google Patents

ハンダボール印刷装置 Download PDF

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Publication number
JP5098434B2
JP5098434B2 JP2007134257A JP2007134257A JP5098434B2 JP 5098434 B2 JP5098434 B2 JP 5098434B2 JP 2007134257 A JP2007134257 A JP 2007134257A JP 2007134257 A JP2007134257 A JP 2007134257A JP 5098434 B2 JP5098434 B2 JP 5098434B2
Authority
JP
Japan
Prior art keywords
solder ball
printing
screen
filling
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007134257A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008288515A5 (zh
JP2008288515A (ja
Inventor
真 本間
猪佐雄 阿部
範昭 向井
章雄 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Priority to JP2007134257A priority Critical patent/JP5098434B2/ja
Priority to TW097109091A priority patent/TW200922422A/zh
Priority to CN200810090988XA priority patent/CN101312136B/zh
Priority to KR1020080045068A priority patent/KR100998279B1/ko
Publication of JP2008288515A publication Critical patent/JP2008288515A/ja
Publication of JP2008288515A5 publication Critical patent/JP2008288515A5/ja
Application granted granted Critical
Publication of JP5098434B2 publication Critical patent/JP5098434B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2007134257A 2007-05-21 2007-05-21 ハンダボール印刷装置 Expired - Fee Related JP5098434B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007134257A JP5098434B2 (ja) 2007-05-21 2007-05-21 ハンダボール印刷装置
TW097109091A TW200922422A (en) 2007-05-21 2008-03-14 Solder ball printing device
CN200810090988XA CN101312136B (zh) 2007-05-21 2008-04-08 焊球印刷装置
KR1020080045068A KR100998279B1 (ko) 2007-05-21 2008-05-15 땜납볼 인쇄장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007134257A JP5098434B2 (ja) 2007-05-21 2007-05-21 ハンダボール印刷装置

Publications (3)

Publication Number Publication Date
JP2008288515A JP2008288515A (ja) 2008-11-27
JP2008288515A5 JP2008288515A5 (zh) 2009-10-08
JP5098434B2 true JP5098434B2 (ja) 2012-12-12

Family

ID=40100695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007134257A Expired - Fee Related JP5098434B2 (ja) 2007-05-21 2007-05-21 ハンダボール印刷装置

Country Status (4)

Country Link
JP (1) JP5098434B2 (zh)
KR (1) KR100998279B1 (zh)
CN (1) CN101312136B (zh)
TW (1) TW200922422A (zh)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5141521B2 (ja) * 2008-12-03 2013-02-13 株式会社日立プラントテクノロジー ハンダボール印刷機
JP5206572B2 (ja) * 2009-04-23 2013-06-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法
DE102009053575B4 (de) * 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
WO2012173059A1 (ja) * 2011-06-13 2012-12-20 千住金属工業株式会社 ソルダペースト
CN102990183B (zh) * 2011-09-09 2014-10-01 中国航天科工集团第三研究院第八三五七研究所 一种bga器件返修过程中转移膏状助焊剂的方法
JP5808229B2 (ja) * 2011-11-14 2015-11-10 株式会社日立製作所 ハンダボール印刷機
CN103418872A (zh) * 2012-05-15 2013-12-04 深圳市木森科技有限公司 一种焊接微型引脚的方法和装置
JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
KR101388787B1 (ko) * 2012-07-25 2014-04-23 삼성전기주식회사 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법
CN103687328A (zh) * 2012-09-26 2014-03-26 光宝电子(广州)有限公司 焊锡检测及自动修补系统及其方法
TWI476884B (zh) * 2012-11-21 2015-03-11 All Ring Tech Co Ltd A Method and Device for Filling Ball Grid Array Fixture
KR101442350B1 (ko) * 2012-11-22 2014-09-17 삼성전기주식회사 솔더볼 리페어 장치
JP2014165455A (ja) * 2013-02-27 2014-09-08 Shibuya Kogyo Co Ltd 導電性ボールの搭載状態検査装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Ａｉメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
KR101452963B1 (ko) * 2013-05-02 2014-10-22 (주) 피토 반도체 리볼링 장치
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
SG11201703854TA (en) * 2014-11-11 2017-06-29 Shinkawa Kk Flux reservoir device
CN104668695B (zh) * 2015-02-03 2017-01-18 河北科瑞达仪器科技股份有限公司 一种对电子产品整机进行焊点检测并进行焊锡的方法
CN104889520B (zh) * 2015-04-14 2017-08-22 东莞市合易自动化科技有限公司 一种智能化aoi选焊系统及其方法
JP6616981B2 (ja) * 2015-08-05 2019-12-04 アスリートＦａ株式会社 ボール検査リペア装置
JP6545085B2 (ja) * 2015-11-13 2019-07-17 アスリートＦａ株式会社 導電性ボールを搭載するシステム
TWI555601B (zh) * 2015-12-21 2016-11-01 矽品精密工業股份有限公司 打線裝置及排除不良銲線之方法
JP6813772B2 (ja) * 2016-10-14 2021-01-13 澁谷工業株式会社 微小ボール搭載装置
EP3554207B1 (en) * 2016-12-12 2021-11-24 Fuji Corporation Component mounting machine
US10973161B2 (en) 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device
US10879102B2 (en) * 2017-08-07 2020-12-29 Boston Process Technologies, Inc Flux-free solder ball mount arrangement
KR102004824B1 (ko) * 2017-11-08 2019-07-29 (주)비와이텍 터치스크린용 고효율 인쇄장치
EP3482934B1 (de) * 2017-11-10 2021-06-30 Exentis Group AG 3d-siebdrucksystem zum drucken dreidimensional geformter strukturen
CN109014553A (zh) * 2018-06-26 2018-12-18 江苏米研工业设备有限公司 一种锂电池全自动超声波焊接机用定位识别焊接系统
JP7109076B2 (ja) * 2018-09-26 2022-07-29 アスリートＦａ株式会社 基板吸着固定ステージ及びボール搭載装置
KR102012977B1 (ko) * 2018-10-30 2019-10-21 위재우 미세 솔더볼 리워크 피커 모듈
CN109413889A (zh) * 2018-12-17 2019-03-01 东莞市凯格精密机械有限公司 一种pcb板印刷的装置及其控制方法
JP6939950B1 (ja) * 2020-06-01 2021-09-22 住友金属鉱山株式会社 検査装置および検査方法
WO2022079850A1 (ja) 2020-10-15 2022-04-21 株式会社小森コーポレーション ボール搭載方法およびボール搭載装置
US11949053B2 (en) * 2020-12-14 2024-04-02 Lumileds Llc Stencil printing flux for attaching light emitting diodes
CN112338307B (zh) * 2021-01-08 2021-03-19 四川赛狄信息技术股份公司 一种高精密电路板封装芯片中心引脚补差焊接方法及装置
JP7107601B1 (ja) 2021-01-27 2022-07-27 Ａｉメカテック株式会社 バンプ形成装置、バンプ形成方法、ハンダボールリペア装置、及び、ハンダボールリペア方法
KR102606828B1 (ko) * 2021-08-30 2023-11-29 에스케이하이닉스 주식회사 검사 및 리페어 장치를 포함하는 반도체 제조 시스템, 그 구동 방법 및 이를 이용한 반도체 패키지의 제조방법
CN113766823B (zh) * 2021-09-10 2023-06-02 上海无线电设备研究所 一种基于smt返修台的bga植球装置及方法
WO2023177347A1 (en) * 2022-03-15 2023-09-21 Capcon Holdings (Beijing) Limited A system and method for placement of at least one conductor pin

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3254459B2 (ja) * 1994-03-04 2002-02-04 株式会社日立製作所 微小ハンダ供給方法及び微小ハンダ供給装置
JP3360435B2 (ja) * 1994-10-14 2002-12-24 株式会社日立製作所 電子回路装置の製造方法
JP3619410B2 (ja) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP3770496B2 (ja) * 2003-03-10 2006-04-26 日立金属株式会社 導電性ボールの搭載方法および搭載装置
JP4560683B2 (ja) * 2005-05-10 2010-10-13 澁谷工業株式会社 導電性ボール配列装置
JP5018062B2 (ja) * 2006-12-15 2012-09-05 株式会社日立プラントテクノロジー ハンダボール印刷装置

Also Published As

Publication number Publication date
TW200922422A (en) 2009-05-16
KR20080102963A (ko) 2008-11-26
CN101312136B (zh) 2011-09-21
CN101312136A (zh) 2008-11-26
KR100998279B1 (ko) 2010-12-03
TWI351905B (zh) 2011-11-01
JP2008288515A (ja) 2008-11-27

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