SG11201703854TA - Flux reservoir device - Google Patents

Flux reservoir device

Info

Publication number
SG11201703854TA
SG11201703854TA SG11201703854TA SG11201703854TA SG11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA
Authority
SG
Singapore
Prior art keywords
reservoir device
flux reservoir
flux
reservoir
Prior art date
Application number
SG11201703854TA
Inventor
Kohei Seyama
Shoji Wada
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201703854TA publication Critical patent/SG11201703854TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
SG11201703854TA 2014-11-11 2015-08-26 Flux reservoir device SG11201703854TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014229026 2014-11-11
PCT/JP2015/074104 WO2016075982A1 (en) 2014-11-11 2015-08-26 Flux reservoir device

Publications (1)

Publication Number Publication Date
SG11201703854TA true SG11201703854TA (en) 2017-06-29

Family

ID=55954077

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703854TA SG11201703854TA (en) 2014-11-11 2015-08-26 Flux reservoir device

Country Status (7)

Country Link
US (1) US10137519B2 (en)
JP (1) JP6286729B2 (en)
KR (1) KR101995771B1 (en)
CN (1) CN107107227B (en)
SG (1) SG11201703854TA (en)
TW (1) TWI564105B (en)
WO (1) WO2016075982A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093232A1 (en) * 2017-11-09 2019-05-16 株式会社新川 Flux collecting device
US20200391530A1 (en) 2019-06-13 2020-12-17 Illinois Tool Works Inc. Multi-functional print head for a stencil printer
US11318549B2 (en) 2019-06-13 2022-05-03 Illinois Tool Works Inc. Solder paste bead recovery system and method
US11247286B2 (en) 2019-06-13 2022-02-15 Illinois Tool Works Inc. Paste dispensing transfer system and method for a stencil printer
WO2023162105A1 (en) * 2022-02-24 2023-08-31 株式会社Fuji Liquid transfer device and method for forming liquid film

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5176312A (en) * 1991-08-12 1993-01-05 Brian Lowenthal Selective flow soldering apparatus
JP2001345543A (en) 2000-05-31 2001-12-14 Sanyo Electric Co Ltd Flux transfer apparatus
US7032807B2 (en) * 2003-12-23 2006-04-25 Texas Instruments Incorporated Solder contact reworking using a flux plate and squeegee
JP4841967B2 (en) * 2006-02-17 2011-12-21 Ｊｕｋｉ株式会社 Flux film forming apparatus and flux transfer apparatus
JP5037084B2 (en) * 2006-10-12 2012-09-26 Ｊｕｋｉ株式会社 Flux deposition system
JP5098434B2 (en) * 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー Solder ball printing device
JP2009113104A (en) * 2007-11-09 2009-05-28 Juki Corp Flux film forming device
KR20110030759A (en) * 2009-09-18 2011-03-24 한미반도체 주식회사 Flux supplying apparatus for manufacturing semiconductor packages
JP2012199326A (en) * 2011-03-18 2012-10-18 Hitachi High-Tech Instruments Co Ltd Flux transfer device
CN102990183B (en) * 2011-09-09 2014-10-01 中国航天科工集团第三研究院第八三五七研究所 Method for transferring paste soldering flux in process of repairing ball grid array (BGA) device
JP6225334B2 (en) * 2014-01-29 2017-11-08 パナソニックＩｐマネジメント株式会社 Component mounting apparatus and component mounting method
JP6324772B2 (en) * 2014-03-14 2018-05-16 ファスフォードテクノロジ株式会社 Die bonder dipping mechanism and flip chip bonder

Also Published As

Publication number Publication date
US10137519B2 (en) 2018-11-27
CN107107227B (en) 2019-11-05
JP6286729B2 (en) 2018-03-07
KR20170082597A (en) 2017-07-14
TWI564105B (en) 2017-01-01
US20170297131A1 (en) 2017-10-19
WO2016075982A1 (en) 2016-05-19
CN107107227A (en) 2017-08-29
TW201622861A (en) 2016-07-01
KR101995771B1 (en) 2019-07-03
JPWO2016075982A1 (en) 2017-08-31

Similar Documents

Publication Publication Date Title
HUE043106T2 (en) Device
SG11201606340WA (en) Device
GB2530866B (en) Securing device
PT3120042T (en) Attachment device
TWI563230B (en) Air-exchanging device
SG11201701129PA (en) Electronic-component-mounting device
HK1243154A1 (en) Motor-integrated tank-cleaning device
SG11201607462YA (en) Device
HUE051981T2 (en) Soldering device
PL3013201T3 (en) Food-comminuting device
HRP20190510T1 (en) Device for posturography
SG11201606421RA (en) Intermittent-bubbling device
GB201409223D0 (en) Positioning device
SG11201703854TA (en) Flux reservoir device
GB2532862B (en) Animal-trapping device
HK1206552A2 (en) Wetting device
HRP20181335T1 (en) Improved fodder-dispensing device
GB201420436D0 (en) Device
GB201411628D0 (en) Device
SG11201702864QA (en) Cell-capturing device
GB201701582D0 (en) Securing device
GB201419857D0 (en) Device
TWM490602U (en) Extending device
LU92619B1 (en) Sinterstrand-charging device
GB2534344B (en) Frenotomy device