JP2012199326A - Flux transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form an efficiently uniform flux transfer face when a flux transfer face is formed by a flux transfer device.SOLUTION: A squeegee unit of a flux transfer device has a squeegee and a scraper. A flux is supplied by a flux supply path opened in the scraper, to move a plate. A flux transfer face is formed on the plate by a lower edge of the squeegee, to move the plate in an opposite direction and stop and recover the flux by the scraper. Here, a flux flow plate is mounted to a top of the scraper, and a lower part of the flux flow plate has a convex shape in a direction of the plate, and has a flux storage indented in the direction of the scraper for storing the flux. Intervals are provided between an appropriate number of flux flow holes, a lower end of the flux flow plate and the plate to flow the flux.

Description

  The present invention relates to a flux transfer device, and is suitable for uniformly forming a flux application surface when flux is adhered to a solder bonding portion of an electronic component when the electronic component is automatically mounted by the electronic component mounting device. The present invention relates to a flux transfer apparatus.

  When an electronic component is mounted on a printed circuit board, it is common to improve the solder wettability by attaching a flux (flux) to the solder bonding portion to remove surface oxides.

  At this time, when an electronic component is automatically mounted by an electronic component mounting device that mounts the electronic component on a printed circuit board, a flux transfer surface is automatically formed by the flux transfer device as a pre-process and mounted. There is known a technique in which a semiconductor bump is attached to a solder bump, which is a solder bonding portion of an electronic component sucked out by a suction nozzle of the head, and then mounted on a substrate.

  Patent Document 1 discloses a technique for forming a flux transfer surface on a rotating disk with a squeegee having a unique shape in such a flux transfer apparatus.

  Patent Document 2 discloses a flux transfer apparatus that forms a flux transfer surface by moving a rectangular transfer table and a squeegee unit relative to each other and moving the squeegee up and down.

JP 2007-294777 A JP 2007-305726 A

  When the flux transfer surface is formed by the flux transfer device described above, it is necessary to uniformly form the transfer surface to be attached to the solder pump.

In general, a mixture of oxides such as Ca, Mg, Al, and Mn is often used as the flux. However, in any case, it is difficult to form a uniform film because the viscosity is high. In the flux transfer apparatus having such a type of transfer table, the transfer table has to be reciprocated many times, and there is a problem in that the efficiency of forming the flux transfer surface is poor. The purpose of the present invention is to provide a flux transfer apparatus capable of efficiently forming a uniform flux transfer surface when forming a flux transfer surface to be attached to a solder bonding portion. .

  The flux transfer device of the present invention is a flux transfer device that attaches flux to a solder connection portion with a substrate of an electronic component before the electronic component is mounted on the substrate by the electronic component mounting device, and includes a base, a squeegee, A squeegee unit having a scraper, a plate, means for supplying flux to the squeegee unit, and means for raising and lowering the squeegee are provided.

  The plate is attached so as to move relative to the base, the squeegee unit is fixedly attached to the base, and the squeegee and scraper are parallel to one side of the plate, and the two are spaced apart from each other. , Fixedly placed on the plate.

  As the operation of the flux transfer device, the means for supplying the flux to the squeegee unit supplies the flux to the surface between the scraper and the blade through the flux supply path opened in the scraper. Next, the means for raising and lowering the squeegee is used to lower the squeegee and move the plate in a first direction perpendicular to one side of the plate relative to the base, and the flux transfer surface is placed between the lower edge of the squeegee and the plate. Form. When the transfer of the flux to the solder joint of the electronic component is completed, the squeegee is lifted by means of raising and lowering the squeegee, the plate is moved in the second direction opposite to the first direction with respect to the base, and the scraper is moved. Damping the flux.

  A flux outflow plate is attached to the upper part of the scraper, and the lower part of the flux outflow plate has a convex shape in the direction of the plate, and has a flux reservoir for accumulating the concaved flux in the direction of the scraper. An appropriate number of flux outflow holes and a space between the lower end of the flux outflow plate and the plate are provided so that the flux stored in

  ADVANTAGE OF THE INVENTION According to this invention, when forming the flux transfer surface made to adhere to a solder adhesion part, the flux transfer apparatus which can form a uniform flux transfer surface efficiently can be provided.

It is a top view of the electronic component mounting apparatus which mounts the flux transfer apparatus which concerns on one Embodiment of this invention. It is a block diagram of the electronic component mounting apparatus which concerns on one Embodiment of this invention. It is a figure explaining the process of making a flux adhere to the soldering connection part of an electronic component with a flux transcription | transfer apparatus. It is a top view of the flux transfer device concerning one embodiment of the present invention. FIG. 5 is a cross-sectional view taken along line AB in FIG. 4 of the flux transfer apparatus according to an embodiment of the present invention. 3 is an enlarged perspective view of a main part of an A-B cross section of the squeegee unit 10. FIG. It is a figure which shows the shape of a flux outflow board. It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 1). It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 2). It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 3). It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 4). It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 5). It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 6). It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 7). It is a figure explaining operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 8). It is a figure explaining the operation | movement of the flux transfer apparatus which concerns on one Embodiment of this invention (the 9).

Hereinafter, a flux transfer apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 8I.
First, the structure of an electronic component mounting apparatus on which a flux transfer device according to an embodiment of the present invention is mounted and a flux transfer process to the electronic component will be described with reference to FIGS.
FIG. 1 is a top view of an electronic component mounting apparatus on which a flux transfer apparatus according to an embodiment of the present invention is mounted.
FIG. 2 is a block diagram of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 3 is a diagram illustrating a process of attaching flux to the solder connection portion of the electronic component by the flux transfer device.

  As shown in FIG. 1, the electronic component mounting apparatus according to this embodiment includes a component supply unit 13 that supplies various electronic components one by one to a component take-out portion (component suction position) on a base 12. Are arranged side by side. A supply conveyor 14, a positioning unit 15, and a discharge conveyor 16 are provided between the opposed component supply unit 13 groups. The supply conveyor 14 transports the printed circuit board P received from the upstream device to the positioning unit 15, and after the electronic component is mounted on the printed circuit board P positioned and fixed by the positioning mechanism (not shown) in the positioning unit 15. , And conveyed to the discharge conveyor 16.

  The flux transfer device 0 is mounted so as to face the component supply unit 13 group. The flux transfer device 0 automatically forms a flux transfer surface used for attaching the flux to the solder connection portion of the electronic component when the component is mounted.

  The pair of beams 18 </ b> A and 18 </ b> B are elongated in the X direction, rotate the screw shaft 17 by driving the Y-axis motor 19, and perform components of the printed circuit board P and the component supply unit 13 along the pair of left and right guides 21. The position above the take-out position (part suction position) is individually moved in the Y direction.

  Each of the beams 18A and 18B has a mounting head 51 that is rotated by a θ-axis motor (not shown) on a mounting body 50 that moves along a guide (not shown) by a Y-axis motor 19 in the longitudinal direction, that is, the X direction. It is provided to be movable. Each mounting head 51 is equipped with a vertical axis motor 23 for vertically moving any of n (n is an integer of 1 or more) suction nozzles, and a θ-axis motor 24 is mounted. . Therefore, each suction nozzle of the mounting head 51 can move in the X direction and the Y direction (plane direction), can rotate about a vertical line, and can move up and down.

  The component recognition camera 26 is a camera that captures an image of the electronic component sucked and held by the suction nozzle from below.

The board recognition camera 28 is attached to the mounting head 51, and is a camera that images a positioning mark attached to the printed circuit board P. Also, a functional block of the electronic component mounting apparatus of the present embodiment is shown in FIG. Come to show. Each part of the electronic component mounting apparatus is controlled in response to an instruction from a CPU (Central Processing Unit) 30. A ROM (Read Only Memory) 31 storing a program related to this control and a RAM (Random Access Memory) 32 storing various data are connected via a bus line 33. Further, a monitor 34 for displaying an operation screen and the like, and a touch panel switch 35 as input means formed on the display screen of the monitor 34 are connected to the CPU 30 via an interface 36. A Y-axis motor 19, an X-axis motor 22, a vertical axis motor 23, a θ-axis motor 24, a squeegee lifting / lowering motor 95, and a plate drive motor 92 are connected to the CPU 30 via a drive circuit 38 and an interface 36. Among these, the squeegee lifting motor 95 and the plate drive motor 92 are motors related to the operation of the flux transfer device 0.

  Further, a flux detection sensor 7 for detecting the flux supply state of the flux transfer device 0 is connected via an interface 36.

  Further, a flux supply valve 71 for controlling the flux supply of the flux transfer device 0 is connected via the interface 36.

  The RAM 32 stores mounting data for each type of printed circuit board P related to component mounting. For each mounting order (step number), the X direction of the mounting coordinates of each electronic component in the printed circuit board P, Y direction and angle information, arrangement number information of each component supply unit 13, and the like are stored. The RAM 32 stores information on the type of each electronic component corresponding to the component supply unit arrangement number of each component supply unit 13 and component arrangement data, and further includes shape data, recognition data, control data, and components. Parts library data consisting of supply data is stored. The RAM 32 also stores management data for the electronic component mounting apparatus.

  The image recognition processing device 37 is connected to the CPU 30 via the interface 36, and the image recognition processing device 37 performs recognition processing of an image captured and captured by the component recognition camera 16. The processing result is sent out. That is, the CPU 30 outputs an instruction to the image recognition processing device 37 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 16, and the recognition processing result is output from the image recognition processing device 37. It is what you receive.

  Next, the outline | summary of the mounting | wearing operation | movement of the electronic component which has a solder bump of the electronic component mounting apparatus which concerns on this embodiment, and the flux transfer operation | movement of an electronic component is demonstrated.

  First, the production operation of the printed circuit board P is started, and when the printed circuit board P is inherited from an upstream device (not shown) and exists on the supply conveyor 14, the printed circuit board P on the supply conveyor 14 is transferred to the positioning unit 15. Move and fix the positioning. The mounting data stored in the memory, that is, the XY coordinate position to be mounted on the printed circuit board P, the rotation angle position around the vertical axis, the FDR number (arrangement number of each component supply unit 13), etc. are specified. According to the data, in the Y direction, the Y axis motor 19 is driven to move the beam 18A or 18B along the pair of guides 21, and in the X direction, the X axis motor 22 is driven to attract the corresponding mounting head 51. One of the nozzles 52 is moved above a predetermined component supply unit 13 for supplying an electronic component to be mounted, the vertical axis motor 23 is driven, the suction nozzle is lowered, and the electronic component is sucked and taken out.

  At this point, the flux transfer device 0 has already formed a flux transfer surface for transferring the flux to the solder connection portion of the electronic component (detailed operation for forming the flux transfer surface will be described later).

  In the electronic component mounting apparatus, the mounting head 51 is moved above the flux transfer device 0 and then lowered (FIG. 3A), and the electronic component semiconductor is placed on the flux transfer surface FF formed by the flux transfer device 0. A solder pump 81 under the package 80 is brought into contact with the flux F to adhere (FIGS. 3B and 3C). At this time, approximately 1/3 of the lower diameter of the solder pump 81 is used for the flux F.

  Further, the electronic component held and picked up is imaged (fly imaged) while moving the suction nozzle above the component recognition camera 26, and image recognition processing is performed, and the beam 18A or 18B is moved above the printed circuit board P to print the printed circuit board. The positioning mark attached to P is imaged by the substrate recognition camera 18, and the amount of displacement is recognized. Based on the result, the substrate P is moved again above the mounting position of the substrate P, and the suction nozzle mounts the mounting coordinates of the mounting data. In addition, all the electronic components sucked and held by the suction nozzles 52 of the mounting head 51 are mounted on the printed circuit board P while correcting the positional deviation by taking both recognition results into consideration.

  In this manner, the extraction, recognition, and mounting of the electronic components are repeated until all the electronic components to be mounted on one printed circuit board P are completed. When all the electronic components are completed, the printed circuit board is transferred from the positioning unit 15 to the discharge conveyor 16. P is transported, component mounting related to electronic component mounting on the first printed circuit board P is completed, and component mounting on the second printed circuit board P is performed.

  After mounting the electronic component, although not shown, the printed circuit board P is transferred to the reflow soldering apparatus and enters a reflow soldering process.

Next, the structure of the flux transfer apparatus according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 4 is a top view of a flux transfer apparatus according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view taken along line AB in FIG. 4 of the flux transfer apparatus according to an embodiment of the present invention.

  As shown in FIGS. 4 and 5, the flux transfer apparatus according to an embodiment of the present invention includes a base 40, a squeegee unit 10, and a plate 60, and the plate 60 includes the squeegee unit 10 and the squeegee unit. The flux transfer surface FF is formed on the plate 60 by relative movement in the Y-axis direction of FIG.

  The base 40 and the squeegee unit 10 are fixed, and the rail 41 provided on the upper surface of the base 40 and the slider 61 of the plate 60 are engaged with each other. The plate 60 is fixed to a part of the belt 91 placed on the lower surface of the base 40 by the block 63, and the drive wheels 90a and 90b are rotated by the plate drive motor 92 according to the instruction of the CPU 30 shown in FIG. By moving the belt 91, the slider 91 moves on the rail 41 of the base 40.

  The squeegee unit 10 is provided with a squeegee 1, a scraper 3, and a horizontal frame 5 when viewed from the A direction in the X-axis direction of FIG. 4, and the flux outflow plate 2 is attached to the scraper 3 in the squeegee 1 direction. ing.

  The squeegee 1, the scraper 3 and the horizontal frame 5 are connected by a vertical frame 6.

  The horizontal frame 5 and the scraper 3 are respectively provided with flux supply paths 5 a and 3 a in the center, and the flux F is supplied from a flux supply syringe 70 attached to the scraper 3.

  Flux F pressurized by compressed air of a compressor (not shown) is supplied from the flux supply paths 5a and 3a. The flux F hits the flux outflow plate 2 attached to the flux outflow plate 2 and is stored in a flux reservoir 201 (described later). The flux F leaks from the outflow hole 202 (described later). Thereby, the flux F is supplied onto the surface of the plate 60 in the space S1 between the scraper 3 and the squeegee 1. In this state, the plate 60 is moved in the positive direction of the Y axis in FIG. 4, so that the lower part of the squeegee 1 scrapes off the flux F and forms a flux transfer surface FF on the plate 60.

  The state of the flux F in the squeegee unit 10 and the plate 60 and the operation of the plate 60 will be described in detail later.

  Flux detection sensors 7 are respectively attached to the pair of horizontal frames 6 and detect the state of the flux F on the space S1. When the CPU 30 shown in FIG. 2 determines that the flux F in the space S1 is insufficient, the flux supply valve 71 attached to the flux supply syringe 70 is opened at an appropriate timing to pressurize the flux supply syringe 70. Supplied flux F is supplied.

  Further, the squeegee 1 can be moved up and down through a lever 96 by rotating a squeegee lifting motor 95 according to a command from the CPU 30.

  In the process of forming the flux transfer surface FF of the squeegee 1, the CPU 30 lowers it to a position where the target thickness of the flux transfer surface FF is formed, and the scraper 3 raises the flux F when the scraper 3 collects the flux F. To avoid contact with the flux F on the plate 60. This will also be described in detail later.

Next, the principal part of the squeegee unit 10 of the flux transfer apparatus according to an embodiment of the present invention will be described with reference to FIGS. 6 and 7.
FIG. 6 is an enlarged perspective view of the main part of the A-B cross section of the squeegee unit 10.
FIG. 7 is a diagram showing the shape of the flux outflow plate.

  As shown in FIG. 6, the flux outlet plate 2 is screwed to the scraper 3. Members such as the squeegee 1, the scraper 3, the horizontal frame 5, the vertical frame 6, and the plate 60 are made of metal such as stainless steel, but the flux outflow plate 2 is a synthetic resin such as fluororesin (PTFE: polytetrafluoroethylene). Is used.

  The lower part of the scraper 3 is in close contact with the plate 60 in order to collect the flux F, but the lower part of the flux outflow plate 2 allows the flux F to flow out in the direction of the squeegee 1 and also flows into the flux reservoir 201 portion. As shown in FIG. 6, a constant interval α is provided.

  The lower part of the squeegee 1 is provided with a gap β in order to form the flux transfer surface FF on the plate 60. In the process of collecting the flux F, the squeegee 1 is lifted until the distance γ is formed between the lower portion of the squeegee 1 and the plate 60 so as not to contact the flux FF.

  The squeegee 1 has a sharp edge 1a at the bottom, and the cross section has a pentagonal shape as shown in FIG.

  The flux outflow plate 2 has a shape as shown in FIG. 7, and has a mounting portion 205 at the upper portion and a convex portion 204 that protrudes in the squeegee direction at the lower portion.

  7A is a front view seen from the scraper 3, FIG. 7B is a front view seen from the squeegee 1, FIG. 7C is a side view, and FIG. d) is a perspective view seen from the scraper 3 side.

  Screw holes 203 for screwing to the scraper 3 are formed in the mounting portion 205 at equal intervals. Further, a flux reservoir 201 for receiving and accumulating the flux F supplied from the flux supply path 3a of the scraper 3 is provided at the lower part of the surface of the flux outflow plate 2 facing the scraper 3. The flux reservoir 201 is formed over substantially the entire lower surface of the flux outlet plate 2, and the central portion 203a is particularly large so that the flux F can be accumulated because the supply amount of the flux F is large. A reservoir portion is formed. Further, a plurality of flux outflow holes 202 through which the flux F flows out from the flux reservoir 201 are formed at equal intervals across the entire width of the flux outflow plate 2 at the lower part of the flux outflow plate 2. The size of the flux outflow holes 202 is equal, and the interval between the holes may be narrower at the side than the center of the flux outflow plate 2. The distance between the flux outflow holes 202 is equal, and the size of the holes is the flux outflow plate. You may enlarge the side part rather than the center part of 2.

Next, the operation of the flux transfer apparatus according to an embodiment of the present invention will be described with reference to FIGS. 8A to 8I.
8A to 8I are diagrams for explaining the operation of the flux transfer apparatus according to the embodiment of the present invention.

  In these drawings, upper (a) shows a top view of a flux transfer apparatus according to an embodiment, and lower (b) shows an A-B cross-sectional view in the top view.

  First, the CPU 30 opens the flux opening / closing valve 72 so that the flux F is supplied to the flux supply syringe 70. The flux F is pushed out by compressed air and is sent from the flux supply path 5a and the flux supply path 3a toward the flux reservoir 201 of the flux outflow plate 2. The extruded flux F first hits the central portion 203a and then diffuses to the periphery (FIG. 8A).

  At the same time, the CPU 30 controls the plate 60 to move in the positive direction of the Y axis. When the plate 60 is moved in the positive direction of the Y axis, the flux F leaks from the lower part of the interval α of the flux outflow plate 2. At this time, the squeegee 1 has an interval β in FIG. 6, and the flux F leaking from the lower portion of the interval α of the flux outflow plate 2 is applied to the plate 60 by the action of the edge 1 a at the lower portion of the squeegee 1. A flux transfer surface FF is formed (flux transfer surface formation process). FIG. 8B shows the stage where the plate 60 has just moved halfway. At this time, since the flux F is viscous, it does not spread on the plate 60 at once, but spreads from the central portion of the plate 60 to the periphery.

  Then, as shown in FIGS. 8C and 8D, when reaching the rightmost end where the plate 60 can move, the CPU 30 controls the plate 60 in the reverse direction to start moving in the negative direction of the Y axis. At the same time, the squeegee 1 is raised and widened to the interval γ in FIG. 6 so that the lower edge 1a of the flux F does not contact the flux transfer surface FF.

  FIG. 8E shows the stage where the plate 60 is moved leftward as indicated by the arrow in FIG. 8E and pushed back halfway. At this time, the flux F is returned in the direction of the scraper 3 from the lower part of the interval α of the flux outflow plate 2, accumulated in the flux reservoir 201, hits the scraper 3, and is guided to the flux outflow plate 2 to be flux. It diffuses to the peripheral portion of the reservoir 201 in the lateral direction (X direction) (flux recovery process).

  Next, when the plate 60 comes to the leftmost end where the plate 60 can move (FIG. 8F), that is, the position of the plate 60 is the same as that in FIG. 8A, but the flux F covers the entire region including the peripheral part of the flux reservoir 201. Almost filled and stored.

  As described above, when the flux reservoir 201 is almost filled with the flux, the flux in the flux reservoir 201 moves from the flux outlet hole 202 to the space S1 as the Y axis of the plate 60 moves in the negative direction. Evenly flowing out, the flux can be filled on the surface of the plate 60 in the space S1 over almost the entire width of the squeegee 1.

  Further, the CPU 30 moves the plate 60 in the positive direction of the Y axis.

  FIG. 8G shows a state in which the plate 60 is moved halfway to the right end, and FIG. 8H shows a state in which the plate 60 is further moved to the rightmost end to form the second flux transfer surface FF. The second time, compared with the first time, the flux F is accumulated over the entire region including the peripheral portion of the flux reservoir 201, so that a uniform flux transfer surface FF is quickly formed over the entire region of the plate 60. It becomes possible to do.

  Here, the plate 60 moves in the positive direction of the Y axis (in the direction of the arrow in FIG. 8G) with the flux accumulated on the upper portion of the convex portion 204 of the flux outflow plate 2 and on the plate 60 on the right side thereof. The flux immediately reaches below the squeegee 1. That is, the convex portion 204 allows the flux to reach the squeegee 1 quickly by bringing the flux accumulation position on the plate 60 on the right side of the flux outflow plate 2 closer to the squeegee 1, and also on the upper portion of the convex portion 204. Since the flux can be stored, the amount of flux stored between the flux outflow plate 2 and the squeegee 1 can be increased.

  When the flux transfer surface FF is formed over the entire surface of the plate 60 with a sufficiently uniform thickness, the flux F is applied to the solder pump 81 below the semiconductor package 80 by the head 51 as shown in FIG. Contact is made to transfer the flux F (flux transfer process).

  When the solder pump 81 at the lower part of the semiconductor package 80 is transferred to the flux F for a certain number of times, the flux transfer surface FF becomes rough as shown in FIG. 8I. Move in the direction and enter the flux recovery process. Hereinafter, similarly, the flux transfer surface formation process → flux transfer process → flux recovery process is repeated as one cycle by the reciprocating movement of the Y axis of the plate 60 and the vertical movement of the squeegee 1.

  Meanwhile, when the CPU 30 detects that the flux supply sensor 6 has a small amount of flux F supplied to the space S1 of the scraper 3 and the squeegee 1, the CPU 30 opens the flux supply valve 71 and supplies the flux F to the flux supply syringe 70. Supply.

  As described above, the flux transfer apparatus according to the present embodiment attaches the flux outflow plate 2 to the scraper 3 for recovering the flux, and in particular collects it in the flux reservoir 201 of the flux outflow plate 2 during the flux recovery process. Thus, a simple flux transfer surface can be formed efficiently, and the reciprocating motion of the plate can be stopped to a minimum number of times.

DESCRIPTION OF SYMBOLS 0 ... Flux transfer apparatus, 1 ... Squeegee, 2 ... Flux outflow plate, 3 ... Scraper, 10 ... Squeegee unit, 40 ... Base, 60 ... Plate, 70 ... Flux supply syringe, 80 ... Semiconductor package,
F: Flux, FF: Flux transfer surface.

Claims (2)

In the flux transfer device for attaching the flux to the solder connection portion of the electronic component with the substrate before mounting the electronic component on the substrate with the electronic component mounting device,
Base and
A squeegee unit having a squeegee and a scraper;
Plates,
Means for supplying flux to the squeegee unit;
Means for raising and lowering the squeegee,
The plate is mounted for relative movement on the base;
The squeegee unit is fixedly attached to the base,
The squeegee and the scraper are arranged on the plate so that the squeegee and the scraper are parallel to one side of the plate and are spaced apart from each other.
The means for supplying flux to the squeegee unit supplies the flux to the surface between the scraper and the blade through a flux supply path opened in the scraper,
The means for raising and lowering the squeegee lowers the squeegee and moves the plate in a first direction perpendicular to one side of the plate with respect to the base, and the flux between the lower edge of the squeegee and the plate Forming a transfer surface,
The means for raising and lowering the squeegee raises the squeegee, moves the plate in a second direction opposite to the first direction with respect to the base, and blocks the flux by the scraper,
A flux outflow plate is attached to the top of the scraper,
At the bottom of the flux outflow plate, there is a flux reservoir for accumulating flux recessed in the direction of the scraper, and a flux outflow hole,
A flux transfer apparatus, wherein a gap is provided between a lower end of the flux outflow plate and the plate so that the flux stored in the flux reservoir flows out.   2. The flux transfer device according to claim 1, wherein a lower portion of the flux outflow plate is convex in the direction of the plate.

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