CN101312136B - Solder ball printing device - Google Patents
Solder ball printing device Download PDFInfo
- Publication number
- CN101312136B CN101312136B CN200810090988XA CN200810090988A CN101312136B CN 101312136 B CN101312136 B CN 101312136B CN 200810090988X A CN200810090988X A CN 200810090988XA CN 200810090988 A CN200810090988 A CN 200810090988A CN 101312136 B CN101312136 B CN 101312136B
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- Prior art keywords
- soldered ball
- printing
- silk screen
- substrate
- ball
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Abstract
The invention provides a solder ball printing device for high efficiently and feasibly filling and printing minute solder ball and forming salient point, comprising: a flux printing device for printing flux on an electrode bonding pad of a substrate, a solder ball filling/printing part for supplying the solder ball on the electrode printed with the flux, and a detecting/repairing part for detecting the printing state of the solder ball and repairing according to the bad condition, also comprising a detecting camera for observing the condition at a silk screen open of the printing part after printing, for comparing the images shot by the detecting camera and the images of the standard model recorded in advance, and judging whether the printing is bad from the condition at the silk screen open of the printing part.
Description
Technical field
The present invention relates to silk-screen printing device, especially relate to and be used for soldered ball is printed onto solder ball printing apparatus on the real estate.
Background technology
The print process of the salient point (diameter is 80～100 μ m) of formation 180～150 μ m spacings is as follows,, utilizes well-known high-precision silk-screen printing device that is, makes the paste solder reflow after printing, forms soldered ball.An example as silk-screen printing device, have substrate entrance conveyor, substrate exit conveyor, have elevating mechanism workbench portion, as peristome have transfer graphic mask, scraper plate, have the scraper head of flight elevater structure and horizontal direction travel mechanism and the control device of controlling these mechanisms.
From conveyer belt portion with the substrate input unit in after, with the interim positioning and fixing of substrate in print station portion, afterwards, utilize camera identification substrate and have mask (silk screen) mark corresponding to the both sides of the peristome of circuit pattern, side-play amount to both sides is carried out position correction, after with substrate and silk screen contraposition, print station is risen so that substrate contacts with silk screen, utilize scraper plate simultaneously to make silk screen and substrate contacts one side paste such as paste scolder are filled into the peristome of silk screen, then, descend separating base plate and silk screen (version is separated) by making workbench, paste is transferred on the substrate, then, by being taken out of from device, substrate finishes printing.
Also have the soldered ball dial-in method, soldered ball is dialled in carried out tiny perforate processed mould accurately, the spacing arrangement with regulation directly moves on on the substrate, places the back and forms soldered ball by refluxing.
And, according to patent documentation 1, have swing or vibration mask and with soldered ball be filled into the method for the opening of regulation, in the formed method of operation that heats after filling by the motion of going forward side by side that utilizes brush etc.And, according to patent documentation 2, have with soldered ball be placed on the pallet, with the method that recharges electrode pad after the pipe absorption.
Patent documentation 1: TOHKEMY 2000-49183 communique
Patent documentation 2: TOHKEMY 2003-309139 communique
Summary of the invention
The print process of using the paste scolder can once form a large amount of salient points because equipment cost is low, therefore has production capacity height, advantage of low manufacturing cost.But print process has following problem,, is difficult to guarantee the uniformity of transfer printing volume that is, handles the solder bump pressurization after refluxing, makes the highly processing of smoothing by flutter, and operation is many, equipment cost is high.And, under the situation approaching towards 150～120 μ m spacings etc., have the printing problem that qualification rate is low, production efficiency is low along with the densification of equipment, precise treatment.
And the soldered ball dial-in method is by guaranteeing the effectiveness of classification of soldered ball, can form high stability salient point, but owing to use high-precision soldered ball to adsorb mould (smelting tool), utilize manipulator that soldered ball is once filled, therefore, has following problem, that is, the productive temp increase under the situation of precise treatment, mould, equipment price improve, and the cost that causes forming salient point increases.
And, at swing or vibration silk screen, fill in the method for patent documentation 1 of soldered ball to the opening of regulation, pathization along with the particle diameter of soldered ball, has the problem that can not be filled into mask open portion with taking place by driving fit phenomenon or the caused adsorption phenomena of static that interparticle Van der Waals for caused.Similarly, the fillings carried out such as the motion of going forward side by side by scraper plate and brush also have same problem.
And, in the method for patent documentation 2, even can repair, the possibility that remaining solder flux amount reduces is also very big, when once refluxing under the situation of the wettability difference of scolder, even the soldered ball fusing also may take place not enough moistening bad of the soldering of electrode pad portion.
The purpose of this invention is to provide when forming the salient point of ultraprecise spacing, can resemble and once form salient point in a large number the print process, and can as the soldered ball dial-in method, form high stability salient point, but low price, at a high speed, soldered ball that the production efficiency of printing expeditiously, filling is high fills with printing equipment and method for forming bump.
To achieve these goals, the present invention is a kind of solder ball printing apparatus, have: printing the solder flux Printing Department of solder flux on the electrode pad of substrate, supply with the soldered ball fill portion of soldered ball and check the state of the substrate that has printed soldered ball and the inspection/repairing portion of repairing according to defective mode on the electrode that has printed described solder flux, solder flux Printing Department has: the silk screen that opening is set according to a plurality of electrode pads position; Mounting substrate and the workbench of fixing; For the contraposition of carrying out substrate and silk screen to the location that telltale mark is taken camera; Observe the inspection camera of the situation of the screen openings portion after printing; Clearing apparatus, cleaning remove that screen openings portion mesh stops up or solder flux attached to the pollution at the silk screen back side; Judgment means, audit by comparison judges that with the image of camera and the image of the prior master pattern that writes down printing is bad; And print bad generating means, and be substrate is sent into next operation or to discharge according to judged result, the decision of judgment means from streamline, under the situation of discharging, send the indication of cleaning silk screen.
And, on the print head that is arranged at soldered ball fill portion, fill assembly is set, soldered ball case and vibrating device that the fill assembly setting is made of framework, lid and mesh-like body, vibrating device in the bottom of described soldered ball case, with mesh-like body devices spaced apart the incision-like body is set, vibrate described mesh-like body described covering by support component, change the size that is arranged on the opening on the mesh-like body, supply with soldered ball to the incision-like body.
According to the present invention,, can enhance productivity by in the operation in front the solder flux as the bad essential factor of the filling of soldered ball being printed the bad early time treatment of carrying out.
And,,, therefore can enhance productivity owing to can improve the charging efficiency of soldered ball, filling, the printing of shortening productive temp and carrying out the soldered ball of high fill-ratio according to the present invention.
And, can improve running efficiency, shortening productive temp from each device of solder flux printing～soldered ball filling～inspection/repairing, therefore, the height-precision height of soldered ball can once, low price form a large amount of stable soldered balls at high speed.And the formation of device is simple, also can reduce the cost of equipment.
Description of drawings
Fig. 1 is that solder flux printing and soldered ball are filled, the synoptic diagram of printing process.
Fig. 2 is the example that the salient point of soldered ball printing forms device.
Fig. 3 is the flow chart that the salient point of present embodiment forms.
Fig. 4 is the summary pie graph of silk-screen printing device.
Fig. 5 is the action specification figure of silk-screen printing device.
Fig. 6 is the open state figure of the silk screen after the solder flux printing.
Fig. 7 is the structure chart of soldered ball print head.
Fig. 8 is the figure of horizontal vibration mechanism of the mesh-like body of expression soldered ball incorporating section.
Fig. 9 is the figure of the horizontal hunting mechanism of expression soldered ball print head.
Figure 10 is the key diagram of soldered ball print head with the doctor-like body.
Figure 11 is the key diagram of soldered ball print head with air curtain.
Figure 12 is the key diagram of the state example of the silk screen after the soldered ball printing.
Figure 13 is a key diagram of repairing soldered ball.
Figure 14 is the key diagram that soldered ball prints bad shape body.
Figure 15 is the summary description figure of inspection/repair apparatus.
Embodiment
Followingly describe with reference to the preferred implementation of accompanying drawing with regard to printing equipment of the present invention and method for forming bump.
Fig. 1 is the synoptic diagram of the printing process of solder flux Printing Department and soldered ball fill portion.Fig. 1 (a) is the solder flux printing process, (b) is soldered ball fill situation.
In Fig. 1 (a), solder flux be placed on according to the shape that is arranged on the electrode pad 22 on the substrate 21 in advance be provided with on the silk screen 20 of peristome, by mobile scraper 3, on the electrode pad 22 of substrate 21 solder flux 23 of printing ormal weight.
In the present embodiment, silk screen 20 is silk screens of solder flux printing usefulness, uses the woven wire that utilizes additive process to make, and can guarantee high-precision graph position precision.But any in scraper plate 3 user's scraper plates, tip scraper plate or the flat scraper plate.Setting is corresponding to the viscosity/thixotropic silk screen gap and the coining of solder flux 23 and scrape slurry speed, prints action.If the number to be printed of solder flux 23 is very few, when then filling soldered ball 24, can not make ball attach at electrode pad 22.
And, as the backflow of the back operation after the soldered ball printing time, become the moistening bad main cause of scolder, can not form the solder bump of beautiful shape, also become the main cause that height is bad or the scolder bonding strength is not enough of solder bump.And if the amount of solder flux 23 is too much, then when the fill soldered ball, solder flux 23 is attached to being arranged on the peristome on the silk screen 20 etc., and wherein, this silk screen is used for supplying with soldered ball 24 on electrode pad 22.In case solder flux 23 is attached to screen openings portion, then soldered ball 24 is attached to screen openings, and generation can not be transferred to the problem on the electrode pad 22.Like this, for the soldered ball filling quality, the solder flux printing is the operation with greatest factor.
Shown in Fig. 1 (b), utilize soldered ball fill portion, fill soldered ball 24 on the electrode pad 22 of the substrate 21 that has printed solder flux 23 with fill assembly 60 (with reference to Fig. 7).Be used for the silk screen 20b that soldered ball 24 is filled on the electrode pad 22 is used the woven wire that utilizes additive process to make, can guarantee high-precision graph position precision.
In order to prevent that soldered ball 24 from falling between substrate 21 and the silk screen 20, formation residual solder balls defective products, this soldered ball is filled with the material of silk screen 20b and is used the magnetic material that can carry out magnetic attraction from the magnet objective table (print station 10) of mounting substrate, and the gap that makes substrate 21 and silk screen 20 is zero.
And, when the driving fit of the back side (with the contact side of substrate 21) of the substrate 21 that has printed solder flux 23 and silk screen 20b,, resin or metal tiny pillar 20a are set in order to prevent the oozing out of solder flux 23 attached to around the screen openings portion.The discharge portion of oozing out by such formation solder flux 23.Below the combination of silk screen 20b and pillar 20a is called the silk screen 20 of soldered ball printing usefulness.
And,, telltale mark (not having diagram) is set at four angles of substrate 21 for soldered ball 24 is supplied with to the electrode pad 22 of assigned position accurately.Also telltale mark is set accordingly with the telltale mark that is arranged on substrate 21 sides in silk screen 20 sides.By these telltale marks of CCD camera 15 (with reference to Fig. 4) visual identity, carry out high-precision contraposition, the telltale mark position of the telltale mark position that is arranged on silk screen 20 sides and substrate 21 sides is coincide.In the present embodiment, by being moved in the horizontal direction, the print station 10 that is equipped with substrate 21 carries out contraposition.
After contraposition finishes, dwindle the interval of substrate 21 and silk screen 20, silk screen 20 contact with substrate 21, fill assembly 60 is moved, from the peristome of the silk screen 20 electrode pad 22 supply soldered balls 24 on 21 of substrates that has printed solder flux 23.The lower side of supplying with the fill assembly 60 (with reference to Fig. 7) of usefulness at soldered ball is provided with incision-like body 63, by making fill assembly 60 swings, carrying out forward motion, promotes soldered ball 24 and rolls, makes its rotation, vibration, fills soldered ball 24 to screen openings portion.
Fig. 2 represents an embodiment of solder ball printing apparatus.Device shown in this figure is the device that solder flux Printing Department, soldered ball fill portion and inspection/repairing portion is formed one.Also each position can be constituted as independent device.In this device, at first, utilize solder flux Printing Department (screen printing mode) on each electrode pad 22 on the substrate, to print solder flux 23.Afterwards by transport conveyer belt (see it is exit conveyor from solder flux Printing Department side, see it is the substrate entrance conveyor), supply with soldered ball via solder flux to electrode pad 22 in soldered ball fill portion from soldered ball fill portion.
Solder flux Printing Department and the soldered ball fill portion very big part of difference is the printing head, and solder flux Printing Department is a blade structure, and soldered ball fill portion is made of the fill assembly that is used to supply with soldered ball.The printing head of inspection/repairing portion forms the attraction/supply header structure that distributes type.And, owing to need not to use silk screen, therefore the chase support of silk screen installation usefulness etc. is not set in inspection/repairing portion.
Fig. 3 is the flow chart that the salient point of present embodiment forms.(after the step 1), the solder flux of ormal weight is printed on (step 2) on the electrode pad at input substrate.Then, the screen openings situation (step 3) behind the inspection printing solder flux.Checking out under the underproof situation, substrate is being outputed to defective substrate storage portion, utilizing negative clearing apparatus 45 to clean (step 4) automatically.Replenish as required afterwards and supply with solder flux.
And, for defective substrate,, when sending defective signal, on the conveyer belt of back operation, carry out standby in order not enter soldered ball printing operation afterwards, outside streamline, discharge.Also can form defective substrate stocker by using series connection etc., once discharge the formation of charging tray.After the operation of defective substrate outside streamline cleaned, can be used for the solder flux printing once more.
Then, carry out the fill (step 5) of soldered ball.After the fill of soldered ball, carrying out above silk screen, checking the filling situation (step 6) of soldered ball in screen openings before version is separated.Fill not enough position if check result has, then before version is separated, carry out the fill action (step 7) of soldered ball once more.By improving the filling rate of soldered ball like this.
After step 6 is no problem, carries out version and separate (step 8).Then, utilize the inspection/repair apparatus inspection after soldered ball is filled to fill situation (step 9).In the inspection of filling situation is under the underproof situation, on the basis of supplying with solder flux, supplies with soldered ball (step 10) once more to the electrode pad portion that does not conform to lattice point.Under the situation of the situation of filling passed examination, utilize reflux to melt soldered ball once more, finish solder bump.
Fig. 4 represents that the summary of silk-screen printing device of the present invention (mainly being solder flux Printing Department) constitutes.Fig. 4 (a) is the formation of seeing from the front of silk-screen printing device, (b) is system's pie graph.Fig. 5 (a) and (b) are action specification figure of silk-screen printing device.
No illustrated chase support is set on body frame 1, and mask is installed on the chase support, and mask will be located on the chase 20c (with reference to Fig. 6) as 20 on the silk screen that peristome has a printed pattern.In this figure, the print head 2 with scraper plate 3 is set above silk screen 20.
In solder flux Printing Department, the scraper plate 3 of urethanes system is installed on print head 2.In soldered ball fill portion, the fill assembly 60 that formation such as incision-like body 63 is installed on print head 2 replaces scraper plate 3.Print head 2 can move in the horizontal direction by print head travel mechanism 6, can move up and down by print head elevating mechanism 4.By changing scraper plate 3 into fill assembly 60, fill assembly 60 can utilize print head elevating mechanism 4 to move at above-below direction.
Below silk screen 20, relatively be provided for mounting with silk screen 20, keep print station 10 as the substrate 21 of printing object thing.This print station 10 has in the horizontal direction (XY θ direction) moving substrate 21 and receives substrate 21 and make substrate 21 come close to or in contact with the platform elevating mechanism 12 of 20 on silk screen with the XY θ platform 11 of silk screen 20 contrapositions with from entrance conveyor 25.
Substrate is set on print station 10 receives conveyer belt 26, will receive on the print station 10, after printing finishes, discharge substrate 21 to substrate exit conveyor 27 by the substrate 21 of substrate entrance conveyor 25 inputs.
Silk-screen printing device has the function of carrying out silk screen 20 and substrate 21 contrapositions automatically.That is, CCD camera 15 is taken the contraposition mark that is separately positioned on silk screen 20 and the substrate 21, is carrying out obtaining position offset after the image processing, drives XY θ platform 11 and revises this side-play amount, carries out contraposition.
In addition, printing machine control part 30 has the printing control unit 36 that is made of the drive control part of version separating controlling portion 39 and each one etc., handles the image input part 37 from the picture signal of CCD camera 15.This printing machine control part 30 is arranged on the inside of printing machine body frame, is used to rewrite control with data or change the data input part 50 of printing condition etc. and be used to monitor printed state etc. or 40 outsides that are arranged on printing machine of display part of the identification mark of income.
Printing machine control part 30 has the printing control unit 36 that is used to control fill assembly 60, according to the kind of the different and employed metal mask of the spacing of the salient point of manufacturing or soldered ball particle diameter, can select to set suitable fill pattern simply.
Also have according to input picture calculate correlation correlation value calculation section 31, infer portion 32, obtain the position coordinates operational part 33 and the size calculating part 34 of position coordinates based on the image of income or from the shape that the data of dictionary 38 are obtained shape, the data of taking according to CCD camera 15, obtain position offset, based on the instruction of XY θ platform control part, drive XY θ platform 11 and carry out contraposition based on the position recognition mark that is arranged on substrate 21 and the silk screen 20.
Below be the action that example illustrates printing equipment with soldered ball fill portion.Receive conveyer belt 26 by substrate entrance conveyor 25 to substrate and supply with the substrate 21 that forms solder bump.In case substrate 21 is transported to the position of print station 10, rise by making print station 10, substrate 21 is received conveyer belt 26 from substrate be handed off on the print station 10.Be handed off to the assigned position that substrate 21 on the print station 10 is fixed on print station 10.After substrate 21 is fixed, move CCD camera 15 to the base plate mark position that prior catalogue is set.This situation is shown in Fig. 5 (a).
Then, the location recognition that 15 pairs in CCD camera is arranged on substrate 21 and the silk screen 20 is taken with mark (not having diagram), and sends it to printing machine control part 30.Image input part 37 in the printing machine control part, obtain the position offset of silk screen 20 and substrate 21 according to view data, printing machine control part 30 is used in XY θ platform control part 35 actions that print station 10 moves based on this result, to substrate 21 with respect to the position of silk screen 20 revise, contraposition.
Situation after Fig. 5 (b) expression is finished bit motion.At first, CCD camera 15 carries out the action of keeping out of the way of ormal weight, keeps out of the way not the position of interfering with print station 10.After CCD camera 15 was kept out of the way end, print station 10 rose, and substrate 21 is contacted with mask 20.Under this state, make 4 actions of print head elevating mechanism, scraper plate (expression is scraper plate 3 in the drawings, but is the incision-like body 63 of the front end of fill assembly 60 in the soldered ball filling work procedure) is contacted with the silk screen face.Then, one surface vibration, swing incision-like body 63 one sides drive the motor 2g that print head drives usefulness by rotation moves horizontally it on the silk screen face, soldered ball 24 is filled into 22 ones of the electrode pads of substrate 21 by the opening that is arranged on the silk screen face from the opening of incision-like body 63.
In addition, as mentioned above, on substrate 21 and silk screen 20, identification contraposition mark more than two is set at relatively identical position.Discern both sides' mark by special CCD camera 15 with two visuals field of above-below direction, mark from following identification silk screen 20, mark from above-identified substrate 21, read all position coordinateses of the mark that is arranged on the regulation position, side-play amount to substrate 21 relative silk screens 20 is carried out position computing, correction, makes substrate 21 and silk screen 20 contrapositions.
Fig. 6 represents the open state of the silk screen after the solder flux printing.The state of Fig. 6 (a) expression silk screen integral body, (b) expression is provided with the situation of the opening of an electrode group, (c) situation of the peristome after 23 printings of expression solder flux.The opening situation of the common silk screen 20 after 23 printings of Fig. 6 (c) expression solder flux.By setting suitable silk screen gap (interval of silk screen and substrate) and coining (scraper plate is to the pressing force of silk screen) and scraper velocity, solder flux 23 fully is filled into the opening 20k portion of silk screen 20, when scraper plate 3 passes through, substrate 21 carries out version with silk screen 20 to be separated, thereby solder flux 23 can be transferred to 22 ones of the electrode pads of substrate 21 effectively.In addition, silk screen 20 is fixed on the chase 20c.
Be subjected to the tiny influence of diameter of the viscosity, thixotropy of the solder flux 23 that silk screen printing uses with the opening 20k of silk screen 20, under normal printing state, the situation of the opening 20k portion of the silk screen 20 after the printing is that solder flux 23 is not to disappear but the formation film in opening fully.
If because the oozing out of solder flux 23, disperse, drying etc. is former thereby cause the opening 20k mesh of silk screen 20 to stop up, version separates or the transfer printing variation, then will form the uneven situation of print result.Can not judge by the silk screen 20 of confirming printing usefulness whether this printing state is qualified even do not confirm substrate 21 yet.The state that whole meshes stop up is represented in state, (3) that the normal condition of Fig. 6 c (1) expression screen openings portion, (2) expression generating unit divide mesh to stop up.To the many parts of the transfer printing amount of substrate-side, the solder flux amount of open side that remains in silk screen is few, and on the contrary, to the few part of the transfer printing amount of substrate-side, the solder flux amount of open side that remains in silk screen is many.That is, can be at the opposite state of silk screen 20 sides observation to the printing state of substrate 21.
Whether the open state of judging silk screen 20 as described below is qualified.The open state that CCD camera 15 is taken silk screen 20, and the image that will take is sent into printing machine control part 30 by image input part 37.Then, be stored in the image of the open state of the image of master pattern of open state of the silk screen 20 in the dictionary 38 and the above-mentioned silk screen of sending into 20 more in advance, judge it is " normally " or " bad (defective) " at size calculating part 34.In judged result, " normally " expression screen openings portion is a normal condition, and the state that mesh stopped up or all took place the mesh obstruction takes place in a part of screen openings of " bad (defective) " expression portion.
Behind (2) of Fig. 6 (c) and (3) the expression printing solder flux, be judged as the open state of the silk screen 20 of " bad (defective) ".(2) be that printing is inhomogeneous fully, figure forms mottled.This detection can be judged simply by the figure coupling of grayscale camera.
On the other hand, under the underproof situation of (3), solder flux 23 is not printed onto on the substrate 21, much remains in the opening 20k portion of silk screen 20.Owing to can judge the degree that solder flux is residual by the depth of color, therefore also can judge simply by the deep or light progressive series of greys model that movement images is handled.Perhaps, also can utilize the aberration that has used color camera relatively to wait judges.
When the CCD camera 15 that utilizes location usefulness is confirmed the situation of peristome of silk screens 20, to throw light on upward from the bottom of silk screen 20, the method for utilizing the CCD camera of the top that is arranged on silk screen 20 to confirm can obtain stable image.Also can take the method for throwing light on downwards from the top of silk screen 20.CCD camera 15 is owing to have camera (shoot part) up and down, therefore, when using with camera as the specifically labelled location of shooting, use up and camera down, when the inspection of the situation of the peristome of the silk screen 20 after printing as observation is used with camera, use the camera on top.
Behind the state of checking silk screen 20, as check result, under the situation of adhering to defective signals such as pollution of mesh obstruction of sending screen openings portion from size calculating part 34 or solder flux, instruction according to printing machine control part 30, the negative clearing apparatus 45 (with reference to Fig. 5) that has in the printing equipment cleans automatically, supplies with as required and replenishes solder flux 23.And, in order defective substrate not to be carried out operation after the soldered ball printing, when sending defective signal, make its standby on the conveyer belt of back operation according to the instruction of printing machine control part 30, outside streamline, discharge.Defective substrate stocker that also can be by using series connection etc., once discharge charging tray.After the operation of defective substrate outside streamline cleaned, can be used for the solder flux printing once more.
Fig. 7 represents the structure of soldered ball print head (fill assembly 60).Fill assembly 60 is made of soldered ball case and incision-like body 63, and the soldered ball case is that soldered ball 24 is accommodated in the space that is formed by framework 61, lid 64 and mesh-like body 62; Incision-like body 63 has the relative mesh-like body 62 in compartment of terrain and is provided with.Mesh-like body 62 is formed by the metallic plate as thin as a wafer with cancellous opening or continuous openings such as rectangular otch, coincide with the diameter of the soldered ball 24 of supplying with object.In the bottom of mesh-like body 62 incision-like body 63 is set, makes incision-like body 63 carry out face and contact with silk screen 20.
Can not carry out inching to incision-like body 63 and exposure level, the gap of silk screen 20 by there being illustrated print head elevating mechanism 4.Incision-like body 63 uses the magnetic materials, is formed by the metallic plate as thin as a wafer with cancellous opening or continuous openings such as rectangular otch, with identical as the opening size of the diameter of the soldered ball 24 of object and silk screen 20.
Fig. 8 is a horizontal vibration mechanism, and vibration in the horizontal direction is arranged on as the mesh-like body 62 on the soldered ball case of soldered ball incorporating section.On lid 64 top support component 70 is set, this support component 70 is installed in position with soldered ball case parallel sided with vibrating device 65.Constitute according to this, vibrating device 65 is by vibrating mesh-like body 62 from the vibration of soldered ball case side.By making 62 vibrations of mesh-like body, the diameter of the aperture efficiency soldered ball 24 of the incision-like that is arranged on the mesh-like body 62 is opened biglyyer.
By like this, the soldered ball 24 that is accommodated in the soldered ball case is fallen on the incision-like body 63 from the notch of mesh-like body 62.By the vibrational energy that changes vibrating device 65 can adjust the soldered ball of falling on the incision-like body 63 24 amount, be the quantity delivered of soldered ball 24.
Vibrating device 65 shown in this figure uses the revolving vibrator of air, by digital control compressed air pressure is carried out inching, thus controllable frequency.By compressed air require is changed, also can make frequency change.And mesh-like body 62 and soldered ball case make soldered ball 24 vibrations that are accommodated in the soldered ball case by vibrating device 65, offset, are dispersed in the attraction of the Van der Waals for formation of effect between the soldered ball 24.According to above-mentioned dispersion effect, can adjust according to production efficiency, prevent because the influence of the temperature of the material of soldered ball 24 or production environment, humidity changes the quantity delivered of soldered ball.
Fig. 9 represents the horizontal hunting mechanism of fill assembly 60.Incision-like body 63 is formed by magnetic material.Owing to use magnetic material, by the magnetic force from the objective table that is built-in with magnet (print station 10), incision-like body 63 can be adsorbed on the silk screen 20 of magnetic material formation.As shown in Figure 9, constitute horizontal hunting mechanism as described below.On the top of support component 70 linear guide spare 67 is set, moves, the fill assembly support component 71 with linear track is set in order to make above-mentioned linear guide spare 67.Drive motor 68 is arranged on this fill assembly support component 71, is mounted on the eccentric cam 66 on this drive motor axle, by the rotation of eccentric cam 66, make support component to the left and right direction move.
That is, horizontal hunting mechanism makes eccentric cam rotation by drive motor 68 in the horizontal direction, makes incision-like body 63 carry out wobbling action with path increment arbitrarily.Because incision-like body 63 carries out wobbling action with the state that is adsorbed on by magnetic force on the silk screen 20, therefore, does not have the space between incision-like body 63 and silk screen 20, and soldered ball 24 is rolled.And according to the openings of sizes of incision-like body 63, an opening towards incision-like body 63 replenishes soldered ball 24 effectively, one side is carried out high efficiency filling action.By drive motor 68 is carried out speed control, can change the circulation rate with the wobbling action of silk screen 20 arbitrarily, can be according to the balance of streamline, set the productive temp of filling soldered ball 24.And, by being adjusted to and the material category of soldered ball 24, the opening of silk screen 20 and the circulation rate that environmental condition is coincide, may command filling rate.
Figure 10 is the pie graph that the doctor-like body is set on filling head.At fill assembly 60 after supplying with soldered ball 24 on the substrate 21, when making silk screen 20 leave 21 of substrates, carry out that version is separated and on substrate during the transfer printing soldered ball, if soldered ball 24 remains on the space of a whole page of silk screen 20, then soldered ball 24 opening that passes silk screen 20 is fallen on the substrate 21, becomes the too much underproof reason of soldered ball.Therefore, in the present embodiment, in the direction of advance of fill assembly 60, have the compartment of terrain with respect to the soldered ball case and be provided with and the highly roughly the same doctor-like body 69 of incision-like body 63.With the state that front end grinds to form as thin as a wafer, smooth precision is very high of doctor-like body 69, prevent that with state soldered ball 20 from overflowing to the outside of fill assembly 60 with silk screen 20 driving fits.
And doctor-like body 69 uses the magnetic material, owing to similarly utilize magnetic force to be adsorbed on the silk screen 20 with incision-like body 63, therefore can prevent that soldered ball 24 from overflowing to the outside of fill assembly 60.In addition, also doctor-like body 69 can be arranged on the whole peripheral part of soldered ball case.
Figure 11 is illustrated in the pie graph that fill assembly portion is provided with air curtain.Utilize doctor-like body 69 that soldered ball is remained on the space of a whole page of silk screen 20 hardly.But, might cause soldered ball residual because of the infinitesimal deflection of the space of a whole page of silk screen 20.Therefore, in the present embodiment, in order to eliminate the bad air curtain that is provided with that causes because of too much soldered ball fully.That is, on the motor support component that supports an elevating mechanism (moving up and down motor) 4 that constitutes print head 2, air ejiction opening 75 is set, around fill assembly, forms air curtain.Do not supply with compressed air from there being illustrated compressed air supply source to this ejiction opening 75.
By this air curtain, when the substrate end-face direction moved, the soldered ball that compressed air promotes to overflow did not remain on the space of a whole page soldered ball to fill assembly direction of action side roll at fill assembly.
Figure 12 is the key diagram that the occupied state of the silk screen behind the butt welding ball indentation brush is checked.Figure 12 (a) and (b) are identical with Fig. 6, therefore omit explanation.
After the soldered ball fill, soldered ball to the occupied state of silk screen 20 shown in Figure 12 (c) (1) to (3).Shown in (1), can be observed the opening that soldered ball 24 all is filled into silk screen 20.(2) be the state that soldered ball is not exclusively filled.(3) be when filling a plurality of soldered balls 24 mutually absorption two soldered ball states and on the space of a whole page of silk screen the residual state that unnecessary soldered ball is arranged.
Carry out version and separate under the state of above-mentioned (2), (3), even substrate is moved to the back operation, what produce also is defective item.Therefore, before carrying out the version separation,, utilize fill assembly 60 to carry out the fill action again, defective item can be modified to qualified product by the filling situation on the space of a whole page of checking silk screen 20.This inspection can be judged by the figure coupling that compares with the qualified product model.After soldered ball was filled, printed, utilizing the streamline sensor camera that is installed in the print head side was that unit ground is once discerned with the zone.Under underproof situation, carry out soldered ball once more and fill, print.Under qualified situation, carry out an edition separating action, operation is discharged substrate 21 backward.
Figure 13 is after filling soldered ball, the key diagram of the repairing work that carries out in inspection/repairing portion.Figure 14 is the key diagram of the filling undesirable condition behind the filling soldered ball.As shown in figure 14, the filling of soldered ball is bad except having or not soldered ball, two soldered ball, displacement soldered ball shrivel, and also has bad modes such as soldered ball is too much.
After filling, the printing of soldered ball finished, inspection/repairing radicals by which characters are arranged in traditional Chinese dictionaries utilized the filling situation on the CCD camera affirmation substrate earlier.Then, in case detect badly, then obtain the position coordinates of bad position.Except two soldered balls, the displacement soldered ball, shrivel, under condition of poor such as soldered ball is too much, make and attract the vacuum suction nozzle 86 of usefulness to move to the position of soldered ball, carry out vacuum suction, move, have and be used for making that soldered ball falls, discarded discarded case by vacuum breaking to the discarded position of bad soldered ball.
And, under the situation that detects the electrode pad portion that does not supply with soldered ball 24 owing to undersupply, adsorb the normal soldered ball 24 that is accommodated in the soldered ball incorporating section 84 by distributor 87, the distributor 87 that is adsorbing soldered ball 24 is moved to the solder flux 23 that is stored in solder flux supply unit 85, by soldered ball 24 is immersed in the solder flux 23, add solder flux 23 to soldered ball 24.The distributor 87 that is adsorbing the soldered ball 24 that has added solder flux 23 is moved to the defective part of substrate,, finish repairing work by supplying with soldered ball to defective part.
In addition, removed in the inspection in front under the situation of bad soldered balls such as the soldered ball that shrivels, displacement soldered ball, can utilize above-mentioned repairing work repair-deficiency.
Figure 15 is that the summary of inspection/repair apparatus constitutes key diagram.In this figure, will check in addition ,/repairing portion represents as an independent device.
Check that object substrate 82 is from being transported on the inspection portion conveyer belt 90 towards the hollow arrow direction on the input side conveyer belt 88.On the top of inspection portion conveyer belt 90 a font frame 80 is set, on the input side conveyer belt 88 of door font frame 80, streamline transducer 81 is arranged on and the rectangular direction of substrate throughput direction (hollow arrow direction).Detect the state of the soldered ball 24 on the electrode pad 22 that is printed onto on the substrate 21 by this streamline transducer 81.
Take in the soldered ball incorporating section 84 and the solder flux supply unit 85 of normal soldered ball in a side's who supports door font frame 80 base portion side setting.Base portion side the opposing party is provided with discarded case.At door font framework portion, setting can by the linear motor move left and right, be used to the distributor 87 that attracts to remove the vacuum suction nozzle 86 of bad soldered ball and be used to repair the defective on the substrate.Vacuum suction nozzle 86 and distributor 87 can move to the hachure direction of arrow.
Inspection portion conveyer belt 90 can move back and forth to the hollow arrow direction.Can be according to the defective locations of substrate, make defective locations aim at distributor or vacuum suction nozzle location.And the substrate of finish inspection, repairing is taken out of by exit conveyor 89, is transported to reflux.By forming above-mentioned formation, can utilize action illustrated in fig. 14 to check, repair.
As mentioned above, can realize the printing equipment that correctly to supply with soldered ball to the electrode pad portion of substrate and can prevent to produce defective products as far as possible.
Claims (6)
1. solder ball printing apparatus, have: printing the solder flux Printing Department of solder flux on the electrode pad of substrate, on the electrode that has printed described solder flux, supply with the soldered ball fill portion of soldered ball and checking the state of the substrate that has printed soldered ball and the inspection/repairing portion of repairing according to defective mode
It is characterized in that, in described soldered ball fill portion, be provided with and soldered ball is installed supplies with the print head of the fill assembly of usefulness, the horizontal hunting mechanism that makes above-mentioned fill assembly horizontal hunting, soldered ball and fill and use silk screen,
Described fill assembly has the soldered ball case that is made of framework, lid and mesh-like body; With described mesh-like body devices spaced apart be arranged on the incision-like body of the bottom of described soldered ball case; Vibrating device, this vibrating device vibrates described mesh-like body in the horizontal direction described covering by support component, changes the size that is arranged on the incision-like opening on the mesh-like body, supplies with soldered ball to described incision-like body,
By vibrating fill assembly in the horizontal direction, simultaneously, fill assembly on filling with silk screen, is swung by soldered ball, supply with soldered ball from described incision-like body via the electrode pad of described silk screen on substrate.
2. solder ball printing apparatus as claimed in claim 1 is characterized in that, described solder flux Printing Department has: the silk screen that opening is set according to a plurality of electrode pads position; Described substrate of mounting and the workbench of fixing; For the contraposition of carrying out substrate and silk screen to the location that telltale mark is taken camera; Observe the inspection camera of the situation of the screen openings portion after printing; Clearing apparatus, cleaning remove that screen openings portion mesh stops up or solder flux attached to the pollution at the silk screen back side; Judgment means, more described inspection judges that with the image of camera and the image of the prior master pattern that writes down printing is bad; And print bad generating means, and be substrate is sent into next operation or to discharge according to judged result, the decision of described judgment means from streamline, under the situation of discharging, send the indication of cleaning silk screen.
3. solder ball printing apparatus as claimed in claim 2, it is characterized in that, in described soldered ball fill portion the soldered ball occupied state is set and confirms device, after supplying with soldered ball to the electrode pad on the substrate, carrying out the version separating action of silk screen before, check and confirm filling, the printed state of soldered ball to screen openings portion.
4. solder ball printing apparatus as claimed in claim 1 is characterized in that, has the doctor-like body that is formed by the magnetic material around the soldered ball case of described fill assembly.
5. solder ball printing apparatus as claimed in claim 4 is characterized in that, is provided for forming around described soldered ball case the compressed-air actuated ejiction opening of air curtain on described fill assembly.
6. solder ball printing apparatus as claimed in claim 5, it is characterized in that, described inspection/repairing portion is provided with: check that the soldered ball of confirming the soldered ball occupied state confirms device, fills the repair apparatus and the scavenge unit of soldered ball once more on the electrode pad of not filling soldered ball, soldered ball and the plural soldered ball that on electrode pad exist or the soldered ball diameter soldered ball that be greater than or less than given size of this scavenge unit adsorption removal on the position beyond the electrode pad.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007134257 | 2007-05-21 | ||
| JP2007134257A JP5098434B2 (en) | 2007-05-21 | 2007-05-21 | Solder ball printing device |
| JP2007-134257 | 2007-05-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101312136A CN101312136A (en) | 2008-11-26 |
| CN101312136B true CN101312136B (en) | 2011-09-21 |
Family
ID=40100695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810090988XA Expired - Fee Related CN101312136B (en) | 2007-05-21 | 2008-04-08 | Solder ball printing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5098434B2 (en) |
| KR (1) | KR100998279B1 (en) |
| CN (1) | CN101312136B (en) |
| TW (1) | TW200922422A (en) |
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| JP5141521B2 (en) * | 2008-12-03 | 2013-02-13 | 株式会社日立プラントテクノロジー | Solder ball printing machine |
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| JP5251699B2 (en) * | 2009-04-23 | 2013-07-31 | 株式会社日立プラントテクノロジー | Solder ball printing apparatus and solder ball printing method |
| DE102009053575B4 (en) * | 2009-11-06 | 2016-06-30 | Ekra Automatisierungssysteme Gmbh | Method and device for printing a substrate, in particular a printed circuit board, with a printing paste |
| EP2719497B1 (en) * | 2011-06-13 | 2017-07-26 | Senju Metal Industry Co., Ltd. | Printing method by solder paste |
| CN102990183B (en) * | 2011-09-09 | 2014-10-01 | 中国航天科工集团第三研究院第八三五七研究所 | Method for transferring paste soldering flux in process of repairing ball grid array (BGA) device |
| JP5808229B2 (en) * | 2011-11-14 | 2015-11-10 | 株式会社日立製作所 | Solder ball printing machine |
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| JP2014011231A (en) * | 2012-06-28 | 2014-01-20 | Hitachi Ltd | Solder ball printing mounting device |
| KR101388787B1 (en) * | 2012-07-25 | 2014-04-23 | 삼성전기주식회사 | Solder ball mounting apparatus, solder ball mounting system and method for mounting solder ball using the same |
| CN103687328A (en) * | 2012-09-26 | 2014-03-26 | 光宝电子(广州)有限公司 | A soldering tin detecting and automatically-repairing system and a method thereof |
| TWI476884B (en) * | 2012-11-21 | 2015-03-11 | All Ring Tech Co Ltd | A Method and Device for Filling Ball Grid Array Fixture |
| KR101442350B1 (en) * | 2012-11-22 | 2014-09-17 | 삼성전기주식회사 | Solderball repair apparatus |
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| JP6109609B2 (en) * | 2013-03-14 | 2017-04-05 | Ａｉメカテック株式会社 | Solder ball printing machine and solder ball printing method |
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| JP6813772B2 (en) * | 2016-10-14 | 2021-01-13 | 澁谷工業株式会社 | Micro ball mounting device |
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| US10879102B2 (en) * | 2017-08-07 | 2020-12-29 | Boston Process Technologies, Inc | Flux-free solder ball mount arrangement |
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| EP3482934B1 (en) * | 2017-11-10 | 2021-06-30 | Exentis Group AG | 3d screen printing system for printing three dimensionally shaped structures |
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| JP3254459B2 (en) * | 1994-03-04 | 2002-02-04 | 株式会社日立製作所 | Micro solder supply method and micro solder supply device |
| JP3360435B2 (en) * | 1994-10-14 | 2002-12-24 | 株式会社日立製作所 | Manufacturing method of electronic circuit device |
| JP3619410B2 (en) * | 1999-11-18 | 2005-02-09 | 株式会社ルネサステクノロジ | Bump forming method and system |
| JP3770496B2 (en) * | 2003-03-10 | 2006-04-26 | 日立金属株式会社 | Method and apparatus for mounting conductive ball |
| JP4560683B2 (en) * | 2005-05-10 | 2010-10-13 | 澁谷工業株式会社 | Conductive ball array device |
| JP5018062B2 (en) * | 2006-12-15 | 2012-09-05 | 株式会社日立プラントテクノロジー | Solder ball printing device |
-
2007
- 2007-05-21 JP JP2007134257A patent/JP5098434B2/en not_active Expired - Fee Related
-
2008
- 2008-03-14 TW TW097109091A patent/TW200922422A/en not_active IP Right Cessation
- 2008-04-08 CN CN200810090988XA patent/CN101312136B/en not_active Expired - Fee Related
- 2008-05-15 KR KR1020080045068A patent/KR100998279B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI351905B (en) | 2011-11-01 |
| CN101312136A (en) | 2008-11-26 |
| JP5098434B2 (en) | 2012-12-12 |
| KR20080102963A (en) | 2008-11-26 |
| KR100998279B1 (en) | 2010-12-03 |
| TW200922422A (en) | 2009-05-16 |
| JP2008288515A (en) | 2008-11-27 |
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