CN101494181B - Solder ball printing device - Google Patents
Solder ball printing device Download PDFInfo
- Publication number
- CN101494181B CN101494181B CN2009100021295A CN200910002129A CN101494181B CN 101494181 B CN101494181 B CN 101494181B CN 2009100021295 A CN2009100021295 A CN 2009100021295A CN 200910002129 A CN200910002129 A CN 200910002129A CN 101494181 B CN101494181 B CN 101494181B
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- China
- Prior art keywords
- solder ball
- silk screen
- substrate
- printing
- scaling powder
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Abstract
The invention provides a solder ball printing device, which can efficiently and reliably fill/print solder ball, and form a bump. The solder ball printing device of the invention comprises a flux printing part for printing flux on an electrode pad of a substrate; a solder ball filling/printing part for providing solder ball on the electrode printed with the flux; and a check/repair part for checking the condition of the substrate printed with the solder ball and repairing according to bad condition. A flux checking/repairing part, for checking the condition of the substrate printed with the flux and repairing according to bad condition, is arranged between the flux printing part and the solder ball filling/printing part, while the solder ball filling/printing part comprises a printing unit having a mesh for providing solder ball for the substrate and a slit-like body for filling solder ball to the mesh.
Description
Technical field
The present invention relates to a kind of silk-screen printing device, particularly a kind of solder ball printing device that is used for print solder ball on substrate surface.
Background technology
In pitch is in the formation of spherical projection (diameter 50 μ m～100 μ m) of 100～180 μ m, and the known high-precision silk screen printing device of use is arranged, and refluxes the printing process of the formation of enforcement solder ball after printing pulpous state scolder.An example as silk-screen printing device comprises: substrate move into conveyer, substrate take out of conveyer, have elevating mechanism platform portion, have mask, scraper (squeegee), have the scraper head of scraper elevating mechanism and horizontal direction mobile device and the control device of controlling these parts as the pattern transferring of peristome.
With substrate after move into conveyer portion and move in the device, locate temporarily and be fixed on substrate in the print station portion, utilize camera to substrate with have with the two mark of the mask (silk screen) of circuit pattern corresponding opening portion and discern subsequently, departure to both is carried out position correction, after with substrate and silk screen position alignment, promote print station so that substrate contacts with silk screen, utilize scraper to fill pastes such as pulpous state scolder to the peristome of silk screen while making silk screen touch substrate, print station is descended, make substrate separate (misplacing of stencil) with silk screen, thereby paste is transferred on the substrate, from device, takes out of substrate then, finish printing.
In addition, knownly in the anchor clamps of having implemented fine perforate processing with high accuracy, deposit solder ball in, with the pitch proper alignment of regulation and directly shift mounting to substrate, and after mounting, form the ball transfer printing of solder ball by backflow.
In addition, according to patent documentation 1, shake in addition or vibrate mask in the opening of regulation, to fill the method for solder ball and to be included in the method for the operation that heats after the fillings such as translational motion that utilize brush.In addition,, have solder ball is positioned on the pallet, utilize pipe absorption and recharge method on the electrode pad according to patent documentation 2.
Patent documentation 1: TOHKEMY 2000-49183 communique
Patent documentation 2: TOHKEMY 2003-309139 communique
Owing to utilize the print process equipment cost of pulpous state scolder cheap, can form a large amount of projections in batches, so throughput height, advantage of low manufacturing cost are arranged.But print process is utilized smooth processing that the back solder projection that refluxes is pushed owing to the uniformity that is difficult to guarantee the transfer printing volume and to highly carrying out the processing of smoothing, is therefore had the problem that operation quantity is many, equipment cost is high.In addition, along with the densification of device under the situation of the development that becomes more meticulous of 100～150 μ m pitches etc., have printing finished product rate variance, the bad problem of productivity ratio.
On the other hand, the solder ball transfer printing can form high stability projection by the effectiveness of classification of guaranteeing solder ball, but owing to use high-precision solder ball suction jig, fill solder ball in batches by automation, so under situation about becoming more meticulous, exist productive temp increase, anchor clamps/equipment price to improve caused projection and form the problem that cost increases.
In addition, shaking or vibrate silk screen at patent documentation 1 in the opening of regulation, to fill in the method for solder ball, pathization along with the solder ball particle diameter, understand the adsorption phenomena of connecting airtight phenomenon or causing that generation is caused by Van der Waals for, thereby produce the problem in the peristome that can not be filled into mask by static.In addition, similarly, in the filling that translational motion that utilizes scraper or brush etc. is carried out, also there is same problem.
Have again, in the method for patent documentation 2, though can remedy, but the possibility that the quantitative change of residue scaling powder is few is very big, when refluxing in batch under the situation of the wettability difference of scolder, even the solder ball fusion also may take place the incomplete infiltration of the welding of electrode pad portion bad.
Summary of the invention
In order to address the above problem, the object of the present invention is to provide a kind of solder ball to fill and use printing equipment, after the scaling powder printing, by checking and repair the state of scaling powder, can as print process, form a large amount of projections in batches, and, can as the solder ball transfer printing, form high stability projection, can form can be with the projection of low cost and the hyperfine pitch of rapidly and efficiently printing/filling, productivity ratio is high.
To achieve these goals, the present invention is a kind of solder ball printing device, comprising: the scaling powder Printing Department of print fluxing on the electrode pad of substrate; Provide the solder ball of solder ball fill portion on the electrode of described scaling powder being printed with; And check the state of the substrate be printed with solder ball and the inspection/reparation portion of repairing according to defective mode, it is characterized in that, between described scaling powder Printing Department and described solder ball fill portion the state of checking the substrate that is printed with scaling powder and the scaling powder inspection/reparation portion of repairing according to defective mode are set, described solder ball fill portion comprises having to described substrate to be provided the silk screen of solder ball and fills the printing element of the slit-shaped body of solder ball to described silk screen.
In addition, described solder ball fill portion has: the mounting substrate also has the print station of magnetic; Contact, have peristome, metal described silk screen that solder ball is provided on the electrode of this substrate with described substrate; And be configured in described silk screen the top, fill printing element solder ball, that have metal described slit-shaped body to the peristome of described silk screen, wherein, described print station is set greatlyyer than the polarity of described silk screen and described slit-shaped body with the polarity of described silk screen.
In addition, described print station has neodymium system magnet, and described silk screen is formed by nickel, and the slit-shaped body of described printing element is formed by SUS304.
Have again, the polarity of described print station and described silk screen is set at 10～100gf/cm
2, the polarity of described silk screen and described slit-shaped body is set at 0.1～10gf/cm
2
In addition, described print station is provided with the neodymium system magnet that surface magnetic flux density is 500～2000G.
According to the present invention, by in the operation of beginning in advance to fill bad processing of silk screen printing of bad very big reason as solder ball, can boost productivity.In addition, according to the present invention, owing to can improve the solder ball charging efficiency, can shorten productive temp and realize the fill of the solder ball that filling rate is high, so can boost productivity.Have, owing to can improve and be screen-printed to the operational efficiency that solder ball is filled into each device of inspections/reparations, the shortening productive temp is so low cost and form good, the stable a large amount of solder ball of height-precision of solder ball at high speed in batches again.In addition, the structure of device is also simple, thereby also can reduce equipment cost.
Description of drawings
Fig. 1 is the scaling powder printing of the embodiment of the invention and the synoptic diagram of solder ball fill operation.
Fig. 2 is the specification figure of solder ball printing device.
Fig. 3 is the flow chart that projection forms.
Fig. 4 is the figure of the schematic configuration of expression silk-screen printing device.
Fig. 5 is the action specification figure of silk-screen printing device.
Fig. 6 is the summary description figure of the inspection/prosthetic device after the scaling powder printing.
Fig. 7 is the key diagram that utilize to use the bond pad surface inspection method that the camera of internal side diameter illumination carries out.
Fig. 8 is the figure of the structure of expression solder ball printing head.
Fig. 9 is the figure to the horizontal vibration mechanism of solder ball accommodation section mesh-like body.
Figure 10 is the figure of the horizontal head motion of expression solder ball printing head.
Figure 11 is an expression solder ball printing head key diagram of scraping plates.
Figure 12 is the key diagram of solder ball printing head with air curtain.
Figure 13 is the key diagram of the example of the silk screen state behind the solder ball printing.
Figure 14 is the key diagram about the reparation of solder ball.
Figure 15 is the key diagram of the bad state of solder ball printing.
Figure 16 is the key diagram of the summary of inspection/prosthetic device.
(description of reference numerals)
1: printing machine; 2: print head; 3: scraper; 10,10b: print station; 10s: neodymium system magnet; 11:XY θ platform; 15: camera; 20,20b: silk screen; 20a: pillar; 20d: peristome; 21: substrate; 30: the printing machine control part; 34: the size calculating part; 45: clearing apparatus; 60: printing element (filler cells); 63: the slit-shaped body; 65: add the unit that shakes; 69: scrape plates; 101: scaling powder Printing Department; 102: scaling powder inspection/reparation portion; 103: solder ball fill portion; 104: inspection/reparation portion
Embodiment
Below, with reference to accompanying drawing, the preferred implementation of printing equipment of the present invention and projection formation method is described.Fig. 1 represents the summary of the printing process in scaling powder Printing Department and the solder ball fill portion.Fig. 1 (a) expression scaling powder printing process, (b) situation of expression solder ball fill.
In Fig. 1 (a), place scaling powder in the scaling powder printing that consistently is provided with peristome with the position and the shape that set in advance at the electrode pad on the substrate 21 22 on silk screen 20, mobile scraper 3, in view of the above, the scaling powder 23 of printing ormal weight on the electrode pad 22 of substrate 21.
In the present embodiment, silk screen 20 is silk screens of scaling powder printing usefulness, uses the woven wire made from addition process, so that can ensure the pattern with high precision positional precision.As scraper 3, any one of user's scraper, sword scraper or flat scraper.Viscosity/thixotropy corresponding silk screen gap and the squeegee pressure and the scraper speed of setting and scaling powder 23 are printed action.If the number to be printed of scaling powder 23 is very few, then when filling solder ball 24 just can not with solder ball attached to electrode pad 22 on.In addition, during the backflow of the subsequent handling behind solder ball printing, can become pad and soak into bad main cause, can not form the perfect solder projection of shape, thereby also become the main cause of the bad and scolder bonding strength deficiency of solder projection height.
In addition, if the amount of scaling powder 23 is too much, then when the solder ball fill, scaling powder 23 provides the peristome 20d etc. of solder ball to locate on electrode pad 22 attached to being arranged on being used on the silk screen 20b described later sometimes.If scaling powder 23 is attached to screen openings portion, solder ball 24 then can take place can not be transferred to problem on the electrode pad 22 attached to the 20d of screen openings portion.Like this, the scaling powder printing is in the operation that has most important factor aspect the solder ball filling quality.
Next, shown in Fig. 1 (b), utilize the major part of solder ball fill portion, fill 24 on the electrode pad 22 of the substrate 21 that is printed with scaling powder 23 with filler cells 60 (printing element) (with reference to Fig. 7).In order respectively to provide 1 solder ball 24 to each electrode pad 22, silk screen 20b has peristome 20d, and provides under the state that makes position alignment on this peristome 20d and the electrode pad 22.Like this, use the woven wire made from addition process, to ensure the pattern with high precision positional precision.
To slip into the excess solder ball that causes between substrate 21 and the silk screen 20b bad for solder ball 24 does not take place, in the print station 10 (magnet objective table) of bearing substrate 21, use neodymium system magnet, the material of the silk screen 20b of this solder ball filling usefulness uses the nickel as magnetic material, being attracted by magnetic force from print station 10, thus make substrate 21 and silk screen 20b the gap be zero substantially.
In addition, at the back side of silk screen 20b (side that contacts with substrate 21), be provided with small a plurality of pillars (column structure) 20a of nickel system integratedly with silk screen 20b, with when the substrate 21 with the printing of having finished scaling powder 23 connects airtight, the scaling powder 23 that oozes out can be attached to around the 20d of screen openings portion.Thus, constituted the effusion portion of the scaling powder 23 that oozes out.In addition, should effusion portion even constituted, because the polarity of print station 10, the gap between the back side of substrate 21 and silk screen 20b is compared very little with the diameter of solder ball, and approaching not have the mode that solder ball enters.
In addition, for the electrode pad 22 to assigned position accurately provides solder ball 24, be provided with telltale mark (not shown) at 4 angles of substrate 21.Corresponding to the telltale mark that is arranged on substrate 21 sides, also be provided with telltale mark in silk screen 20b side.Utilize CCD camera 15 (with reference to Fig. 4) to come these telltale marks of visual identity,, implement high-precision aligning in the mode of the specifically labelled position consistency of the specifically labelled position that is arranged on silk screen 20b side and substrate 21 sides.In the present embodiment, aligning is to be undertaken by moving the print station 10 that carries on substrate 21 in the horizontal direction.
After aiming at end, dwindle the interval of substrate 21 and silk screen 20b, silk screen 20b is contacted with substrate 21, filler cells (printing equipment) 60 is moved, in the peristome 20d of silk screen 20b, fill solder ball 24, and be provided to the electrode pad 22 on the face that is printed with scaling powder 23 of substrate 21 thus.Provide the lower side of the filler cells 60 (with reference to Fig. 7) of usefulness at solder ball, be provided with slit-shaped body 63,, promote solder ball 24 and apply rotation/vibration, fill to the peristome 20d of silk screen by shaking/forward motion of filler cells 60.
The specification figure that has represented an embodiment of solder ball printing device among Fig. 2.Device shown in the figure is with scaling powder Printing Department 101, scaling powder inspection/reparation portion 102, solder ball fill portion 103, carries the device that inspection/reparation portion 104 forms up to ball.But, also described each position can be constituted self-contained unit.In addition, can also carry the function that has scaling powder inspection/reparation in the inspection/reparation portion in the lump at solder ball.In this device, at first, utilize each electrode pad 22 print fluxings 23 on 101 pairs of substrates 21 of scaling powder Printing Department (screen printing mode).Afterwards, utilize solder ball fill portion 103 to provide solder ball 24 to electrode pad 22 by conveyance conveyer (be seen as take out of conveyer from scaling powder Printing Department side, be seen as substrate from solder ball fill portion side and move into conveyer) via silk screen 20b.
In addition, remarkable different piece is that scaling powder Printing Department 101 is a blade construction at the printing head in scaling powder Printing Department 101 and the solder ball fill portion 103, and solder ball fill portion 103 is then by being used to provide the filler cells 60 of solder ball to constitute.The attraction that distributes type/provide header structure is provided the printing head of inspection/reparation portion 102,104.In addition, owing to do not need to use silk screen, so do not need to be provided with the chase supporter etc. of silk screen installation usefulness in inspections/reparation portion.
Fig. 3 represents the flow chart that the projection in the present embodiment forms.Moving into substrate (STEP1) afterwards, the scaling powder (STEP2) of printing ormal weight on electrode pad 22.Then, the surface state (STEP3) of the electrode pad behind the inspection print fluxing.By checking, provide scaling powder reparation once more to NG portion, and to scaling powder Printing Department 101 feedback NG information, utilization version clearing apparatus 45 is down carried out silk screen cleaning (STEP4) automatically under the situation of NG (bad).
The substrate of NG can not carry out the later operation of ball indentation brush and with the standby and being discharged to outside the production line on the conveyer of subsequent handling of NG signal.Also can be by using online NG substrate bunker etc., the structure of discharging in stock's mode in batches.After implementing in the operation of NG substrate outside production line to clean, can be used for the scaling powder printing once more.
Next carry out solder ball fill (STEP5).After the solder ball fill, before misplacing of stencil, check above the silk screen solder ball occupied state (STEP6) in the screen openings.When check result is to exist under the situation at position of lack of fill, before misplacing of stencil, carry out solder ball fill action (STEP7) once more.Thus, can improve the filling rate of solder ball.
If be OK (qualified) in STEP6, then carry out misplacing of stencil (STEP8).Then, utilize the inspection/prosthetic device 104 after solder ball is filled to check filling situation (STEP9).When the inspection of filling situation is under the situation of NG, providing on the basis of scaling powder, provide solder ball (STEP10) to the electrode pad portion that NG is ordered once more.In the filling situation is checked is under the situation of OK, utilizes reflux (not shown) fusion weld pellet once more, finishes solder projection.
Fig. 4 represents the schematic configuration of the silk-screen printing device (mainly being scaling powder Printing Department) among the present invention.Fig. 4 (a) is the structure of seeing from the front of silk-screen printing device, (b) the expression system construction drawing.In addition, Fig. 5 (a) and (b) represent to be used to illustrate the figure of the action of silk-screen printing device.
Under the situation of scaling powder Printing Department 101, the scraper 3 of polyurethane system is installed in the print head 2.Under the situation of solder ball fill portion 103, filler cells (printing equipment) 60 rather than the scraper 3 that constitute with slit-shaped body 63 grades are installed in the print head 2.Print head 2 constitutes and can utilize print head travel mechanism 6 along continuous straight runs to move, and utilizes print head elevating mechanism 4 to move along the vertical direction.By scraper 3 is replaced as filler cells 60, filler cells 60 can utilize print head elevating mechanism 4 to move along the vertical direction.
Below silk screen 20, with silk screen 20 opposed modes, be provided with and be used to carry and keep print station 10 as the substrate 21 of printing object thing.This print station 10 has: XY θ platform 11, its in the horizontal direction (XY θ direction) go up moving substrate 21, to carry out and the aiming at of silk screen 20; Platform elevating mechanism 12, it is used for receiving substrate 21 from moving into conveyer 25, and makes substrate 21 come close to or in contact with the surface of silk screen 20.
On print station 10, be provided with substrate and receive conveyer 26, will move into the substrate 21 that conveyer 25 moves into by substrate and receive on the print station 10, and when printing finishes, substrate 21 is discharged to substrate and takes out of on the conveyer 27.
Silk-screen printing device has the function of aiming at of carrying out silk screen 20 and substrate 21 automatically.That is, utilize CCD camera 15 to take the position alignment mark that is separately positioned on silk screen 20 and the substrate 21, carry out image processing and obtain the position deviation amount, drive XY θ platform 11 and aim at this departure of revisal.
In addition, have printing control unit 36 that drive control part by misplacing of stencil control part 39 and each several part etc. constitutes and the printing machine control part 30 of the image input part 37 handled from the picture signal of CCD camera 15 is arranged on the inside of printing machine main body frame, and be used to control with the data input part 50 of the rewriting of data and the change of printing condition etc. and be used to monitor that the printed state etc. and the display part 40 of the identification mark that is taken into are configured in the outside of printing machine.
The printing control unit 36 that has control filler cells 60 in printing machine control part 30 can select to set suitable fill pattern simply according to the kind of the interval of the projection that will produce and the different of solder ball particle diameter and the metal mask that will use.
In addition, also have according to input picture calculate correlation correlation value calculation section 31, ask the shape of shape to infer portion 32, ask the position coordinates operational part 33 and the size calculating part 34 of position coordinates based on the image that is taken into or from the data of dictionary 38, data according to 15 shootings of CCD camera, based on the position recognition mark that is arranged on substrate 21 and the silk screen 20, ask for position offset, based on the instruction of XY θ platform control part and drive XY θ platform 11 and aim at.
Next, portion is an example with the solder ball fill, and the action of printing equipment is described.Be formed with the substrate 21 of solder projection, moved into conveyer 25 by substrate and offer substrate reception conveyer 26.After substrate 21 is arrived the position of print station 10 by conveyance, print station 10 is risen, substrate 21 is transported on the print station 10 from substrate reception conveyer 26 in view of the above.The substrate 21 that is transported on the print station 10 is fixed on the assigned position of print station 10.After fixing base 21, CCD camera 15 is moved to the base plate mark position that registration is in advance set.Fig. 5 (a) represents this situation.
Then, CCD camera 15 is taken the location recognition mark (not shown) that is arranged on substrate 21 and the silk screen 20, and sends printing machine control part 30 to.Utilize the image input part 37 in the printing machine control part, ask the position deviation amount of silk screen 20 and substrate 21 according to view data, printing machine control part 30 moves the XY θ platform control part 35 of mobile printing platform 10 based on this result, and substrate 21 is revised/position alignment with respect to the position of silk screen 20.
Situation after the alignment actions of Fig. 5 (b) expression completing place.At first, 15 actions of CCD camera are also measured in accordance with regulations and are kept out of the way the position of not conflicting with print station 10.CCD camera 15 finish keep out of the way after, print station 10 rises, and substrate 21 is contacted with silk screen 20.In this state, make 4 actions of print head elevating mechanism so that scraper (expression has scraper 3 among the figure, but is the slit-shaped body 63 of filler cells 60 front ends) contact silk screen face in the solder ball filling work procedure.Then, add the slit-shaped body 63 that shakes/shake on one side, drive the motor 2g that print head drives usefulness by rotation on one side, thereby slit-shaped body 63 is moved horizontally on the silk screen face, by being arranged on the opening on the silk screen face, fill solder ball 24 from the opening of slit-shaped body 63 to 22 ones of the electrode pads of substrate 21.
In addition, as previously mentioned, on substrate 21 and silk screen 20, be provided with recognizing site more than 2 to mutatis mutandis mark in relative same area.Each mark to this two side, utilization has the special CCD camera 15 of two visual fields of above-below direction, mark from below identification silk screen 20, mark from top identification substrate 21, read the position coordinates of the whole marks that are arranged on the regulation position, substrate 21 is carried out position computing/revisal with respect to the departure of silk screen 20, thereby make substrate 21 with respect to silk screen 20 position alignment.
Fig. 6 represents the open state of the silk screen after the print fluxing.The situation of Fig. 6 (a) expression silk screen integral body, Fig. 6 (b) expression is provided with the state of the peristome of an electrode group, the state of the peristome after Fig. 6 (c) expression print fluxing 23.The open state of the common silk screen 20 after Fig. 6 (c) expression print fluxing 23.By setting suitable silk screen gap (interval of silk screen and substrate) and squeegee pressure (scraper is to the pressing force of silk screen) and scraper speed, peristome 20k to silk screen 20 fills scaling powder 23 fully, side by side make substrate 21 and silk screen 20 misplacings of stencil what scraper 3 passed through, in view of the above can be reliably to 22 transfer printing scaling powders 23 of electrode pad of substrate 21.In addition, silk screen 20 is fixed in the chase 20c.
The influence that become more meticulous by the diameter of opening 20k of viscosity, thixotropy and the silk screen 20 of the scaling powder 23 that silk screen printing uses, the situation of the peristome 20k of the silk screen 20 after the printing is the situation that possible produce thin tunicle, rather than the situation that scaling powder 23 disappears in the peristome fully under normal printing state.
If because the oozing out of scaling powder 23, disperse, main cause such as drying, cause that the peristome 20k of silk screen 20 stops up etc., or cause misplacing of stencil or transfer printing bad, will produce the uneven situation of print result.This printing state, it is qualified just to judge whether by the silk screen 20 of confirming printing usefulness, and need not confirm substrate 21.The normal state of (1) expression screen openings portion of Fig. 6 (c), (2) expression is the state of generation obstruction partly, and the state of obstruction all takes place in (3) expression.To the many parts of the transfer printing amount of substrate-side, the less residue of the scaling powder of the open side of silk screen, on the contrary, to the few part of the transfer printing amount of substrate-side, the residual quantity of the scaling powder of the open side of silk screen is many.That is, can observe the state reversed to the printing state of substrate 21 in silk screen 20 sides.
Whether qualified the open state of judging silk screen 20 in such a way is.The open state of utilizing CCD camera 15 to take silk screen 20 is taken into this captured image in the printing machine control part 30 by image input part 37.Then, will be stored in the image of benchmark model of the open state of the silk screen 20 in the dictionary 38 in advance, compare, utilize size calculating part 34 to judge that " normally " still is " bad (NG) " with the image of the open state of the above-mentioned silk screen that is taken into 20.Judged result " normally " expression screen openings portion is in normal condition, and state that partly stops up or the state that whole obstructions have taken place have been taken place in " bad (NG) " expression screen openings portion.
(2) of Fig. 6 (c), (3) are illustrated in has printed the open state that is judged as the silk screen 20 of bad (NG) after the scaling powder.(2) seem that spot appears in the fully inhomogeneous and pattern of printing.This detection also can be judged simply by the pattern match of utilizing grayscale camera.
On the other hand, as the NG situation of (3), scaling powder 23 is not printed onto on the substrate 21 but much all remains in the opening 20k portion of silk screen 20.Therefore, can judge the degree of welding assisted agent residuals, so relatively the coming of depth grey level model that can be by image processing judged simply by the depth difference of color.Perhaps, also can relatively wait and judge by the aberration that uses color camera.
In addition, when confirming the situation of peristome of silk screens 20 for the CCD camera 15 that utilizes location usefulness, throw light on upward from the bottom of silk screen 20, the method for utilizing the CCD camera of the top that is configured in silk screen 20 to confirm can obtain stable image.Also can adopt the method for throwing light on downwards from the top of silk screen 20.CCD camera 15 is because all have camera (image pickup part) up and down, so, as taking the camera that uses when use with camera specifically labelled location up and down, when using with camera, the status detection of the peristome of the silk screen 20 after conduct observation printing uses the camera on top.
Behind the state of having checked silk screen 20, send under the situation of check result for NG signals such as screen openings portion stop up, silk screen adheres to spot from size calculating part 34, utilize the instruction of printing machine control part 30 to clean automatically by the following clearing apparatus 45 (with reference to Fig. 5) of version that is arranged in the printing equipment, and the additional as required scaling powder 23 that provides.In addition, the substrate of NG no longer carries out the later operation of solder ball printing, with the NG signal according to the instruction of printing machine control part 30 standby and outside production line, discharging on the conveyer of subsequent handling.Also can discharge in stock's mode in batches by using online NG substrate bunker etc.After cleaning in the operation of NG substrate outside production line, can be used for the scaling powder printing once more.
Next, the bond pad surface detection method to the camera of use internal side diameter illumination among Fig. 7 describes.About being transferred to the scaling powder 23 of 22 ones of electrode pads, because in the microscopic examination of reverberation mode, illumination light has or not scaling powder 23 easily by scaling powder 23 so be difficult to identification.The diameter of the scaling powder 23 of transfer printing than the big situation of the diameter of electrode pad 22 under and the transfer position deviation is taking place and be transferred under the situation outside the electrode pad 22, can utilize the microscopic examination of reverberation mode to differentiate and have or not scaling powder 23, but have or not the scaling powder 23 that is formed on the electrode pad 22 owing to be difficult to differentiate, so can not judge the whether suitable of transfer printing area.
Therefore, shown in the nethermost figure of Fig. 7, if adopt the detection method of the CCD camera 15 that uses internal side diameter illumination 15L, then the scaling powder 23 with respect to institute's transfer printing is not from the top, but by throwing light on to the peripheral direction of scaling powder 23, the effect of the body that is taken is appeared in utilization in one's mind, can carry out the differentiation of scaling powder 23.About automatic detection, with above-mentioned situation in the same manner, can switch to internal diameter illumination 15L from downward illumination by the illumination that will be in the CCD camera 15 be provided with and deal with.
In addition, use mechanism and the position measurement mechanism that on direction, moves up and down by merging perpendicular to electrode pad 22 for CCD camera 15 with internal diameter illumination, can measure the amount of the height and the scaling powder 23 of scaling powder 23 by the apex of measurement scaling powder 23 and the position relation of bottom side portion.
Even the wavelength that uses illumination is in the visible light zone, if be made as the blue light of the wavelength with close ultraviolet region, then identification is also good.
In addition, make in the scaling powder 23 to comprise fluorescent material, and utilize the illumination of wavelength to observe print result, can utilize the light that fluorescent material sent that is included in the scaling powder 23 and easily distinguish scaling powder 23 with ultraviolet range.
Fig. 8 represents the structure of solder ball printing head (printing element, filler cells 60).Filler cells 60 by solder ball 24 is contained in the space that forms by framework 61 and lid 64 and mesh-like body 62 the ball case and with respect to mesh-like body 62 below the slit-shaped body 63 of devices spaced apart ground setting constitute.Mesh-like body 62 to be being suitable for the mode as the diameter of the solder ball 24 of supplying with object, formed by the metallic plate as thin as a wafer with cancellous opening or continuous openings such as rectangular slit.In the bottom of mesh-like body 62, dispose slit-shaped body 63, and constitute with the mode that silk screen 20b face contacts with slit-shaped body 63.
Utilize the print head elevating mechanism of not putting down in writing among the figure 4, can finely tune with respect to exposure level/gap of silk screen 20b slit-shaped body 63.Slit-shaped body 63 uses magnetic materials, being fit to and mode as the opening size of the diameter of the solder ball 24 of object and silk screen 20, is formed by the metallic plate as thin as a wafer with cancellous opening or continuous openings such as rectangular slit.
Finish metacoxal plate 21 when silk screen 20b leaves in printing,, draw the stripping action around substrate, can realize uniform misplacing of stencil with what the mode of propagating to mid portion was carried out silk screen 20b by the decrease speed and the acceleration of control print station 10.But, if the above-mentioned gravitation that is produced by magnetic force just can not be controlled with respect to the hypertonia of silk screen.
In addition, utilization is laid with the print station 10 of flaky magnet 10s that surface magnetic flux density is the neodymium system of 500～2000G in substrate-placing portion, the slit-shaped body 63 of printing element (filler cells) 60 is set to 0.1～10gf/cm with the gravitation that is produced by magnetic force of silk screen 20b
2By make the printing that constitutes printing element (filler cells) 60 with slit-shaped body 63 and ball recovery with the slit-shaped body be the SUS304 system, to make silk screen be nickel system, at the solder ball on the silk screen, the magnetic force that slit-shaped body 63 utilizes above-mentioned print station 10 to produce on one side evenly mildly acts on the direction perpendicular to silk screen 20b, in slit-shaped body 63, to keep small ball, Yi Bian efficiently not cause the mode of deformation damage to carry out the action of in the peristome 20d of silk screen, filling to ball.
Fig. 9 is illustrated in horizontal direction the mesh-like body 62 on the ball case 61 of the solder ball accommodation section that is arranged on printing element is added the horizontal vibration mechanism of shaking.Top at lid 64 is provided with support component 70, and support component 70 is equipped with in the position that is parallel to ball case side and adds the unit 65 that shakes.Utilize this structure, utilization adds the unit 65 that shakes and applies vibration from ball case side, mesh-like body 62 is added shake thus.By the netted body 62 of vibrating screen, can make the opening that is arranged on the slit-shaped on the mesh-like body 62 open greatlyyer than the diameter of solder ball 24.
Thus, the solder ball 24 that is contained in the ball case is fallen on the slit-shaped body 63 from the slit portion of mesh-like body 62.Fall the solder ball 24 on the slit-shaped body 63 amount, be the energy adjustment of shaking that adds that the quantity delivered of solder ball 24 can add the unit 65 that shakes by change.
Adding shown in the figure unit 65 that shakes, use the Pneumatic rotary vibrator, utilize the digital control compressed-air actuated pressure of finely tuning, thereby can control vibration number.Also can change vibration number by changing compressed air require.In addition, mesh-like body 62 and ball case are by adding the unit 65 that shakes, and the solder ball 24 in being contained in the ball case applies vibration, and the attraction that by Van der Waals force caused of negative function between solder ball 24 makes it to disperse.Can utilize above-mentioned dispersion effect to pay close attention to the adjustment of production efficiency, so that the quantity delivered of solder ball is not subjected to the influence of the material of solder ball 24 and the temperature and humidity in the production environment and changes.
Fig. 9 represents the horizontal head motion of filler cells 60.Slit-shaped body 63 uses magnetic material to form.By using magnetic material, can be used to the magnetic force of objective table (print station 10), to the silk screen 20 absorption slit-shaped bodies 63 that form with magnetic material from built-in magnet.As shown in Figure 9, the structure of horizontal head motion is as follows.On the top of support component 70 linear guide apparatus 67 is set, and is provided with filler cells support component 71 with linear guides in the mode that described linear guide apparatus 67 can move.This filler cells support component 71 is provided with drive motor 68, and the eccentric cam 66 that is arranged on this drive motor axle is installed, by the rotation of eccentric cam 66, at the right and left support component that moves up.
That is, as shown in figure 10, in the horizontal direction, horizontal head motion utilizes drive motor 68 to come rotating eccentricity cam 66, shakes action thereby with the amount of waving arbitrarily slit-shaped body 63 is applied.Slit-shaped body 63 is owing to shake action under the state that is adsorbed onto silk screen 20b by magnetic force, so Spin welding pellet 24 and very close to each other between slit-shaped body 63 and silk screen 20b reliably.In addition, can utilize the opening size of slit-shaped body 63, in the peristome 20d of slit-shaped body 63, supply solder ball 24 reliably, fill action simultaneously efficiently.Silk screen 20 can change arbitrarily by drive motor 68 is carried out speed control with the period velocity that shakes action, can set the filling beat of the solder ball 24 of having considered line of balance.In addition, can control filling rate by being adjusted into the material category that is suitable for solder ball 24, the peristome 20d of silk screen 20b and the period velocity of environmental condition.
Figure 11 is illustrated in the figure that is provided with the structure of scraping plates (solder ball retracting device) in the filling head.After on substrate 21, providing solder ball 24 by filler cells 60, make silk screen 20b when substrate 21 faces leave, promptly carrying out misplacing of stencil and on substrate 21 during the transfer printing solder ball, if the residual of solder ball 24 arranged on the space of a whole page of silk screen 20b, then solder ball 24 is fallen on the substrate 21 by the opening of silk screen 20b, thereby becomes the reason that causes this bad phenomenon of excess solder ball.Therefore, in the present embodiment, on the direct of travel of filler cells 60, vacate at interval, will scrape plates 69 and be arranged on and slit-shaped body 63 essentially identical height places with respect to the ball case.Scrape the state that front end grinds to form as thin as a wafer and smooth precision is high of plates 69, and become the state that is fitted into silk screen 20b, be exposed to the outside of filler cells 60 to avoid solder ball 24.Thus, just can utilize and scrape plates 69 and reclaim unnecessary solder ball.
In addition, use magnetic materials if scrape plates 69, then with slit-shaped body 63 similarly because of magnetic force is adsorbed to silk screen 20b, thereby can not allow solder ball 24 escape into the outside of filler cells 60.In addition, can also in the whole zone of the periphery of ball case 61, be provided with and scrape plates 69.
Have again,, can when supplying solder ball 24 efficiently, print by forming and scrape plates 69 to have porous foamed body than the abundant big hole of solder ball diameter.
Figure 12 is illustrated in the figure that the structure of air curtain is set in the filler cells 60.Though utilize and to scrape plates 69 and can accomplish on the space of a whole page of silk screen 20b, not have substantially ball residual, consider the residual influence of ball that the small change in location by the space of a whole page of silk screen 20b causes.Therefore, in the present embodiment,, be provided with air curtain for the bad phenomenon that the excess solder ball is caused is reduced to zero.That is, on the motor support parts that support an elevating mechanism (moving up and down motor) 4 that constitutes print head 2, air ejiction opening 75 is set, thereby around filler cells, forms air curtain.Provide compressed air by not shown compressed air supply source to this ejiction opening 75.
By this air curtain is set, when the substrate end-face direction moves, utilizes compressed air to roll the ball that exposes at filler cells, thereby accomplish on the space of a whole page, not have ball residual to the thruster of filler cells direction of action.
Figure 13 represents to illustrate the figure that the occupied state of the silk screen behind the solder ball printing is checked.So Figure 13 (a) and (b) have omitted explanation owing to identical with Fig. 6 at this.
The solder ball occupied state of silk screen 20b after (1) of Figure 13 (c)～(3) the expression solder ball fill.Can shown in (1), observe the state in the opening that solder ball 24 all is filled into silk screen 20b.(2) the expression solder ball is filled incomplete state.The two spherical attitude that is attached together each other between the solder ball 24 when (3) expression is filled and on the space of a whole page of silk screen the residual state that unnecessary solder ball is arranged.
Misplacing of stencil under the state of described (2), (3) forwards flow of substrates to subsequent handling and will produce substandard product.Therefore, before carrying out the misplacing of stencil action,, utilize filler cells 60 to carry out the fill action again, substandard product can be repaired into qualified products by the occupied state on the space of a whole page of checking silk screen 20b.In this detection, can utilize the pattern match that compares with the qualified products model to judge.After the solder ball fill, utilizing the linear transducer camera that is installed in the print head side is that unit gathers identification with the zone.If be NG then carry out the solder ball fill once more.If qualified, then implementing misplacing of stencil action back to subsequent handling discharge substrate 21.
Figure 14 represents to be used to illustrate the figure of solder ball filling back in the repair of inspection/reparation portion.Figure 15 represents to illustrate the figure of the filling undesirable condition after solder ball is filled.As shown in figure 15, in the solder ball filling is bad, except no ball, two ball, position deviation/broken ball, also have bad patterns such as unnecessary ball.
In inspection/reparation portion, at first, after the solder ball fill is finished, utilize the filling situation on the CCD camera affirmation substrate.If check out badly, then obtain the position coordinates of bad position.Except two balls, position deviation ball, crushing, under unfavorable conditions such as unnecessary ball, the waste material box is set, be used for the vacuum suction nozzle 86 of absorption usefulness is moved to the solder ball position, vacuum suction also abandons the station to bad ball and moves, and ball is fallen and discarded by vacuum breaking.
In addition, under the situation that detects the electrode pad portion that is not supplied to owing to the undersupply of solder ball 24, utilize distributor 87 to adsorb the normal solder ball 24 that is contained in the solder ball accommodation section 84, provide the scaling powder 23 in the portion 85 to move to being stored in scaling powder in the distributor 87 that is adsorbing solder ball 24, by solder ball 24 is immersed in the scaling powder 23, on solder ball 24, add scaling powder 23.Rejected region to substrate moves the distributor 87 that is adsorbing the solder ball 24 that is added with scaling powder 23, finishes repair by solder ball is provided to rejected region.
In addition,, got rid of under the situation of bad balls such as broken ball, position deviation ball, can come repair-deficiency by above-mentioned repair when by previous inspection.
Figure 16 represents to illustrate the figure of the schematic configuration of inspection/prosthetic device.In addition, represented among the figure that inspection/reparation portion is a self-contained unit.
Moving on the side conveyer 88 on the hollow arrow direction, object substrate 82 is checked in conveyance on the inspection portion conveyer 90.Be provided with a type framework 80 on the top of inspection portion conveyer 90, door type framework 80 move into side conveyer 88 sides, on direction, linear transducer 81 is set perpendicular to substrate transferring direction (hollow arrow direction).Utilize this linear transducer 81 to detect the state of the solder ball 24 on the electrode pad 22 that is printed onto substrate 21.
In addition, a pin side supporting door type framework 80 is provided with the solder ball accommodation section 84 and the scaling powder supply unit 85 that hold normal solder ball.Be provided with discarded box in another pin side.On door type frame section, be used to the distributor 87 that attracts to remove the vacuum suction nozzle 86 of bad solder ball and be used for the defective on the repairing substrate can utilize the mode of linear motor move left and right, to be provided with.In view of the above, vacuum suction nozzle 86 and distributor 87 can move having on the hatched direction of arrow.
As previously discussed, can realize can be exactly solder ball being provided and doing one's utmost to prevent the printing equipment of the generation of bad product to the electrode pad portion of substrate.
Claims (5)
1. a solder ball printing device comprises: the scaling powder Printing Department of print fluxing on the electrode pad of substrate; Provide the solder ball of solder ball fill portion on the electrode of described scaling powder being printed with; And check the state of the substrate that is printed with solder ball and the inspection/reparation portion of repairing according to defective mode, it is characterized in that:
Between described scaling powder Printing Department and described solder ball fill portion, the state of checking the substrate that is printed with scaling powder and the scaling powder inspection/reparation portion of repairing according to defective mode are set,
Described solder ball fill portion comprises: the silk screen that solder ball is provided to described substrate; The slit-shaped body that provides solder ball to fill on one side to described silk screen on one side is provided, and has the printing element that makes its driving mechanism that shakes/advance,
Wherein,, then remove bad solder ball, after having adsorbed new solder ball, make scaling powder, supply to above-mentioned bad part attached on this solder ball if in above-mentioned inspection/reparation portion, detect the bad of solder ball.
2. solder ball printing device according to claim 1 is characterized in that,
Described solder ball fill portion has: the mounting substrate also has the print station of magnetic; Contact, have peristome, metal described silk screen that solder ball is provided on the electrode of this substrate with described substrate; And be configured in described silk screen the top, fill printing element solder ball, that have metal described slit-shaped body to the peristome of described silk screen,
Wherein, described print station is set greatlyyer than the polarity of described silk screen and described slit-shaped body with the polarity of described silk screen.
3. solder ball printing device according to claim 2 is characterized in that,
Described print station has neodymium system magnet, and described silk screen is formed by nickel, and the slit-shaped body of described printing element is formed by SUS304.
4. according to claim 2 or 3 described solder ball printing devices, it is characterized in that,
The polarity of described print station and described silk screen is set at 10～100gf/cm
2, the polarity of described silk screen and described slit-shaped body is set at 0.1～10gf/cm
2
5. solder ball printing device according to claim 4 is characterized in that,
Described print station is provided with the neodymium system magnet that surface magnetic flux density is 500～2000G.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008015215A JP5076922B2 (en) | 2008-01-25 | 2008-01-25 | Solder ball printing device |
| JP2008-015215 | 2008-01-25 | ||
| JP2008015215 | 2008-01-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101494181A CN101494181A (en) | 2009-07-29 |
| CN101494181B true CN101494181B (en) | 2010-10-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100021295A Expired - Fee Related CN101494181B (en) | 2008-01-25 | 2009-01-15 | Solder ball printing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5076922B2 (en) |
| KR (1) | KR101027491B1 (en) |
| CN (1) | CN101494181B (en) |
| TW (1) | TW200945978A (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5018062B2 (en) * | 2006-12-15 | 2012-09-05 | 株式会社日立プラントテクノロジー | Solder ball printing device |
| US8424748B2 (en) * | 2009-12-21 | 2013-04-23 | Intel Corporation | Solder in cavity interconnection technology |
| CN103717339B (en) * | 2011-09-12 | 2015-12-23 | 欧姆龙株式会社 | Inspection fixture |
| JP6069723B2 (en) | 2012-06-06 | 2017-02-01 | 澁谷工業株式会社 | Repair equipment for workpieces with small balls |
| JP6109609B2 (en) * | 2013-03-14 | 2017-04-05 | Ａｉメカテック株式会社 | Solder ball printing machine and solder ball printing method |
| CN104090505B (en) * | 2014-04-10 | 2017-02-15 | 广东骏亚电子科技股份有限公司 | High-precision circuit board small-gap automatic filling correction method |
| CN105789086B (en) * | 2014-12-24 | 2019-03-05 | 北京中电科电子装备有限公司 | A kind of device of chip double-side scaling powder coating |
| JP6475030B2 (en) * | 2015-01-30 | 2019-02-27 | Ａｉメカテック株式会社 | Substrate processing system and substrate processing method |
| JP6567290B2 (en) * | 2015-02-20 | 2019-08-28 | Ａｉメカテック株式会社 | Substrate processing apparatus, substrate processing system, and substrate processing method |
| DE112015006471T5 (en) * | 2015-04-20 | 2017-12-28 | Yamaha Hatsudoki Kabushiki Kaisha | Viscous fluid supply device and component mounting device |
| KR101935518B1 (en) * | 2016-02-15 | 2019-01-04 | 주식회사 이오테크닉스 | Laser soldering repair process, laser soldering process and laser soldering system |
| US10973161B2 (en) | 2017-01-13 | 2021-04-06 | Raytheon Company | Electronic component removal device |
| KR20210058962A (en) | 2018-09-28 | 2021-05-24 | 보스턴 프로세스 테크놀로지스, 아이엔씨. | Multi-module chip manufacturing device |
| KR102406310B1 (en) * | 2018-10-31 | 2022-06-13 | 마이크로·텍 가부시끼가이샤 | Vibration device, vibration method, and vibration transfer device |
| TW202110544A (en) * | 2019-04-30 | 2021-03-16 | 日商迪睿合股份有限公司 | Method for supplying or removing sliding treatment material to or from surface of sliding workpiece |
| JP6939950B1 (en) * | 2020-06-01 | 2021-09-22 | 住友金属鉱山株式会社 | Inspection equipment and inspection method |
| CN112687570B (en) * | 2020-12-28 | 2023-02-28 | 中国电子科技集团公司第十三研究所 | Test method for testing welding performance of welding pad of ceramic shell |
| JP7107601B1 (en) | 2021-01-27 | 2022-07-27 | Ａｉメカテック株式会社 | Bump forming apparatus, bump forming method, solder ball repair apparatus, and solder ball repair method |
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| JP3635068B2 (en) * | 2002-03-06 | 2005-03-30 | 株式会社日立製作所 | Bump forming device |
| JP3822834B2 (en) * | 2002-04-12 | 2006-09-20 | 新日本製鐵株式会社 | Repair method and apparatus |
| JP2006066413A (en) * | 2004-08-24 | 2006-03-09 | Hitachi Metals Ltd | Method and device for loading conductive ball and method and device for forming bump |
| JP4683326B2 (en) | 2005-04-19 | 2011-05-18 | 日立金属株式会社 | Conductive ball mounting device |
| JP2008004775A (en) * | 2006-06-22 | 2008-01-10 | Athlete Fa Kk | Ball mounting device and its control method |
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- 2008-01-25 JP JP2008015215A patent/JP5076922B2/en active Active
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- 2009-01-15 CN CN2009100021295A patent/CN101494181B/en not_active Expired - Fee Related
- 2009-01-16 KR KR1020090003660A patent/KR101027491B1/en not_active IP Right Cessation
- 2009-01-20 TW TW098102044A patent/TW200945978A/en not_active IP Right Cessation
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| JP特开2003-309139A 2003.10.31 |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20090082112A (en) | 2009-07-29 |
| TWI378750B (en) | 2012-12-01 |
| TW200945978A (en) | 2009-11-01 |
| KR101027491B1 (en) | 2011-04-06 |
| JP2009177015A (en) | 2009-08-06 |
| CN101494181A (en) | 2009-07-29 |
| JP5076922B2 (en) | 2012-11-21 |
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