JP6069723B2 - Repair equipment for workpieces with small balls - Google Patents

Description

  The present invention relates to an improvement of a repair device for a microball-mounted workpiece that detects and corrects a mounting error in a workpiece in which a microball is mounted on each of a plurality of mounting locations formed in a predetermined pattern on the upper surface by a mounting means. .

  As a means for mounting a minute ball on each of a plurality of mounting portions formed in a predetermined pattern on the upper surface of a work, a mounting device as described in Patent Document 1 is known. And as an apparatus which repairs the workpiece | work with which the microball was mounted by such a mounting means, or an apparatus which detects a mounting mistake, the apparatus as described in patent documents 2-5 is known. All of the apparatuses described in Patent Documents 2 to 5 detect a mounting error using an image from one camera and perform repair.

  In recent years, however, the pitch and diameter of microballs have become narrower, so the image of the entire workpiece captured by a single camera is insufficient in resolution, and sufficient mounting error location information is required to perform highly accurate repairs. There was a problem that it was difficult to obtain. In order to avoid the problem, when an image obtained by capturing the entire image with a higher resolution is used, another problem has occurred in that it takes too much time to detect a mounting error.

Japanese Patent Laid-Open No. 2008-153336 Japanese Patent No. 3271461 Japanese Patent Laid-Open No. 2009-177015 Japanese Patent Laid-Open No. 2006-349441 Japanese Patent Laid-Open No. 2008-251983

The present invention is intended to solve the above-described problem. The mounting error inspection unit includes a first inspection unit that acquires approximate position information from the entire image, and a predetermined region that includes a mounting error point detected by the first inspection unit. In combination with a second inspection unit that acquires detailed position information from a predetermined region image, a fine mounting error position information is acquired without taking time, and a correction unit that corrects the mounting error is further The mounting apparatus corrects the mounting error based on the detailed position information acquired by the inspection means, and is a repair device that enables highly accurate repair even for a work in which minute balls are arranged narrowly.

In order to solve the above-mentioned problem, the first invention employs the following means in a repair device for a work with a small ball mounted thereon.
1stly, while conveying the workpiece | work with which the microball was mounted in each of the some mounting location formed in the predetermined pattern on the upper surface by the mounting means, and imaging the workpiece | work on the said conveyance means, the imaged image Mounting error inspection means for detecting the presence or absence of a mounting error of the minute ball at the mounting position of the workpiece and acquiring positional information of the mounting error, and based on the inspection result of the mounting error inspection means, the mounting error is detected. A repair apparatus for a work mounted on a microball provided with a correcting means for correcting.

Second, the mounting error inspection means captures the entire upper surface of the workpiece, detects a mounting error from the captured whole image, and acquires approximate position information about the mounting error; and Based on the approximate position information acquired by the first inspection means, the predetermined area including the mounting error detected by the first inspection means on the upper surface of the workpiece is imaged, and the mounting error is detected from the captured predetermined area image. And second inspection means for acquiring detailed positional information .
Thirdly, the correction means corrects the mounting error based on the detailed position information acquired by the second inspection means.
Fourthly, the transfer means includes a plurality of transfer stages and transfer means for transferring a workpiece between the transfer stages.
Fifth, the first inspection means is provided on an upstream conveyance stage among the plurality of conveyance stages.
Sixth, the second inspection means and the correction means are provided on a transport stage downstream of the transport stage on which the first inspection means is provided.

According to a first aspect of the present invention, the mounting error inspection means detects a mounting error from the entire image of the workpiece and acquires approximate position information about the mounting error. Based on the approximate position information , the mounting error is detected. By capturing with a second inspection means that captures a predetermined area including the image and captures detailed position information about the mounting error from the captured predetermined area image, the detailed position information is acquired for all Compared to a short time, it is possible to acquire detailed positional information of mounting errors.

In addition, the correcting means for correcting the mounting error is capable of repairing even a work in which minute balls are arranged narrowly by correcting the mounting error based on the detailed position information acquired by the second inspection means. Became possible.

Further , the first inspection means is provided on the upstream conveyance stage among the plurality of conveyance stages, and the second inspection means and the correction means are provided on the conveyance stage downstream of the conveyance stage on which the first inspection means is provided. Thus, the first inspection means and the second inspection means can be moved simultaneously, and the processing capability of the apparatus can be increased.

Schematic plan view of the work for repairing workpieces with small balls Front explanatory view showing the repair station of the repair device Illustration of imaging range of line camera Illustration of imaging range of area camera It is explanatory drawing which shows the mounting mistake of a solder ball, (a) shows a missing ball, (b) shows a double ball, (c) shows an extra ball, (d) shows a size error ball.

Hereinafter, embodiments will be described together with illustrated examples.
FIG. 1 is a schematic plan view of a repair device for a work loaded with microballs, and FIG. 2 is a front view showing a repair station of the repair device. Reference numeral 1 in FIG. 1 denotes a repair device. The repair device 1 includes a wafer supply station 2, a first inspection station 3 in which a first inspection unit according to the present invention is disposed, and a second inspection according to the present invention. A repair station 4 in which means and correction means are arranged, and a wafer discharge station 34 are provided.

  The wafer supply station 2 includes a supply cassette 5, an aligner 6, and a first wafer robot 7. In the supply cassette 5, a plurality of wafers 8, which are workpieces in which microballs are collectively mounted on each of a plurality of mounting portions formed in a predetermined pattern on the upper surface by the mounting means, are stored in a horizontal state in a vertical arrangement. . The stored wafer 8 becomes a mounting error inspection target.

  The aligner 6 detects notches or orientation flats of the wafer 8 transferred from the supply cassette 5 and aligns the wafer 8 in a predetermined direction.

  The first wafer robot 7 transfers the wafer 8 from the supply cassette 5 to the aligner 6 and moves from the aligner 6 to the transfer table 9 waiting at the start position of the first transfer stage 30 of the first inspection station 3. Included.

The first inspection station 3 is a station for acquiring information on a mounting error on the wafer 8 and its approximate position 41, and includes a first transfer stage 30 having a transfer table 9, an alignment camera 10, and a line sensor 11. ing. Information of approximate position 41 in this case is the approximate location information in the present invention.

  The first transfer stage 30 serving as the upstream transfer stage in the present invention is provided with a Y-axis moving mechanism for moving the transfer table 9 on which the wafer 8 is placed in the Y-axis direction (vertical direction in FIG. 1). The transport table 9 has a rotation mechanism that rotates in the θ-axis direction (rotation direction). The alignment camera 10 is a camera having a two-dimensional field of view, images a mark such as an alignment mark on the wafer 8, and acquires posture information of the wafer 8.

  The line sensor 11 is a first inspection unit according to the present invention, which images the entire upper surface of the wafer 8 and detects a mounting error from the captured whole image 40 to obtain information on the approximate position 41 regarding the mounting error. get. The entire image 40 captured by the line sensor 11 is an image at an approximate level where mounting errors can be detected.

  Specifically, the line sensor 11 is a field-of-view sensor in which one pixel is arranged in a line, and the field length is about 4 minutes of the entire width of the wafer 8 in the X direction (left-right direction in FIG. 3) as shown in FIG. 1 and the first inspection station 3 reciprocates the transfer table 9 of the first transfer stage 30 in the Y-axis direction (vertical direction in FIG. 3), and the position of the line sensor 11 in the X-axis direction every time it passes. The entire image 40 is captured by dividing into four divided images.

  The image processing of the line sensor 11 detects a mounting error by comparing the solder ball 14 in the captured image with the solder ball in the reference image registered in advance.

  Between the first inspection station 3 and the repair station 4, a second wafer robot 12 serving as transfer means in the present invention is provided. The second wafer robot 12 transfers the wafer 8 that has passed through the first inspection station 3 to the repair station 4. Specifically, the transfer is performed from the transfer table 9 of the first transfer stage 30 in the first inspection station 3 to the transfer table 24 of the second transfer stage 31 in the repair station 4.

  The repair station 4 is a station that acquires information on the detailed position 42 of the mounting error and repairs the mounting error location. As shown in FIGS. 1 and 2, the repair station 4 includes the repair station 4 in the present invention. An area camera 13 that also serves as second inspection means, a repair head 15 that serves as correction means in the present invention, a flux transfer head 18, a mounting miss ball removal head 19, a ball supply unit 20, a flux tray 21, and a removal ball placement unit 23 , And a second transfer stage 31 serving as a downstream transfer stage in the present invention.

  The second transfer stage 31 is provided with a transfer table 24 on which the wafer 8 is placed and a Y-axis moving mechanism for moving the transfer table 24 in the Y-axis direction (vertical direction in FIG. 1). , A rotating mechanism for rotating in the θ-axis direction and a lifting mechanism.

  Above the middle of the second transfer stage 31, a lateral movement device 25 that crosses in a direction orthogonal to the transfer direction of the second transfer stage 31 is disposed. The lateral movement device 25 is equipped with a first lateral movement body 26 and a second lateral movement body 27, and the area camera 13 and the repair head 15 are attached to the first lateral movement body 26 so as to be movable up and down. A flux transfer head 18 and a mounting miss ball removing head 19 are attached to the laterally movable body 27 so as to be movable up and down. The area camera 13 is connected to a control unit 28 provided in the repair station 4 via a cable 29.

  A ball supply unit 20 in which a repairing solder ball is stored is installed in the moving range of the first horizontal moving body 26, and the flux tray 21 and the removal ball are mounted in the moving range of the second horizontal moving body 27. A placement unit 23 is installed.

  The area camera 13 attached to the first lateral moving body 26 is a camera having a two-dimensional field of view, and is used for acquiring wafer posture information, acquiring detailed position information of mounting errors, and confirming the success or failure of repair. . Acquisition of wafer orientation information is performed by imaging a mark such as an alignment mark on the wafer 8 placed on the transfer table 24 at the start position of the second transfer stage 31 of the repair station 4.

The acquisition of the information on the detailed position 42 of the mounting error which is the detailed position information in the present invention is performed as follows. First, the area camera 13 images a predetermined region 43 including a mounting error detected by the line sensor 11 on the upper surface of the wafer 8 based on the information of the approximate position 41 acquired by the line sensor 11 as the first inspection means. To do.

  The captured image is a high-resolution image capable of acquiring position information necessary for correction. From the captured image of the predetermined area 43, information on the detailed position 42 regarding the mounting error is acquired.

  The repair head 15 attached to the first laterally moving body 26 is constituted by a nozzle that holds one solder ball 14 by suction. The repair head 15 moves in the left-right direction (lateral direction) in FIGS. 1 and 2 by the movement of the first lateral moving body 26, stops at a necessary position, and performs an operation of mounting the repairing solder balls 14.

  The flux transfer head 18 attached to the second lateral moving body 27 performs an operation of transferring the flux to the land 16 of the repaired wafer 8 using the transfer pin 17 at the tip.

  The mounting miss ball removing head 19 attached to the second laterally movable body 27 is provided with an adhesive portion at the tip of a rod-shaped metal member. Adhere and remove from the repair location.

  The mounting ball removal head 19 and the flux transfer head 18 move in the left and right direction (lateral direction) in FIGS. 1 and 2, stop at necessary positions, and perform various operations such as removal of mounting balls and transfer of flux. I do.

  The ball supply unit 20 installed in the moving range of the first lateral moving body 26 cuts out the repairing solder balls 14 one by one so that the repair head 15 can pick up one solder ball 14.

  The flux tray 21 installed in the moving range of the second lateral moving body 27 stores the flux. The tip of the transfer pin 17 is dipped into the flux stored in the flux tray. The removal ball mounting portion 23 installed in the movement range of the second lateral moving body 27 further removes the solder balls 14 removed by the mounting miss ball removal head 19.

  A wafer discharge station 34 is disposed downstream of the repair station 4. The wafer discharge station 34 is provided with a discharge cassette 33 and a third wafer robot 32. The third wafer robot 32 is means for storing the repaired wafer 8 and the wafer 8 that is determined to have no mounting error and is discharged from the repair station 4 in the discharge cassette 33.

Hereinafter, the operation of the repair device 1 in the present embodiment will be described.
First, in the wafer supply station 2, the unprocessed wafer 8 is taken out from the supply cassette 5 by the first wafer robot 7 and transferred to the aligner 6 to detect the notch or orientation flat of the wafer 8 and position it in a predetermined direction. After the alignment, the wafer 8 is transferred onto the transfer table 9 (indicated by the dotted line in FIG. 1) of the first transfer stage 30.

  In the first inspection station 3, the transfer table 9 to which the wafer 8 is transferred moves to the position where the alignment camera 10 and the line sensor 11 are arranged, moves the alignment camera 10 to the X axis, and moves the alignment camera 10. The wafer 8 is imaged by 10 to recognize the posture of the wafer 8. At this time, the position of the wafer 8 in the θ-axis direction is adjusted by the transfer table 9.

  Thereafter, the wafer 8 is scanned by the line sensor 11 of the first inspection station 3 to capture the entire image 40, and the entire image 40 is subjected to image processing to identify the location where the mounting error occurs. That is, the line sensor 11 captures the entire upper surface of the wafer 8, detects a mounting error from the captured entire image 40, and acquires information on the approximate position 41 regarding the mounting error.

  In the image processing, first, the entire image is binarized, the mounted object is extracted, and the area and shape (roundness) of the mounted object are calculated. As a result, an area that is excessive or small, or that does not satisfy a predetermined roundness is determined as a mounting error, and its position coordinates are acquired as the approximate position 41. By this processing, the double ball 14A and the size error ball 14C are detected.

  Next, a reference image registered in advance is superimposed on the entire image 40 based on the attitude of the wafer 8, and the correspondence between the reference ball in the reference image and the solder ball 14 in the entire image 40 is checked. By this process, the missing ball and extra ball 14B are detected.

  At this stage, if the number of mounting errors is zero, it is determined that repair is not necessary, and the repair station 4 is passed. As shown in FIG. 5 (a), the missing ball is one in which the solder ball 14 does not exist on the land 16 to be mounted, and the double ball 14A has two or more as shown in FIG. 5 (b). The solder ball 14 and the solder ball 14A are connected, and the extra ball 14B is a solder ball 14B mounted on a place other than a land to be mounted as shown in FIG. The error ball 14C is a solder ball 14C having a different size as shown in FIG. 5 (d).

  When the inspection at the first inspection station 3 is completed, the transfer table 9 of the first transfer stage 30 moves in the Y axis and transfers the wafer 8 to the end position. The transferred wafer 8 is transferred to the transfer table 24 of the second transfer stage 31 in the repair station 4 by the second wafer robot 12.

  In the repair station 4, the wafer 8 is positioned below the area camera 13 by the movement of the transfer table 24 and the first laterally moving body 26, and marks such as alignment marks on the wafer 8 are imaged by the area camera 13. 8 posture information is acquired. At this time, the position of the wafer 8 in the θ-axis direction is adjusted. Thereafter, the area camera 13 captures an enlarged image of the predetermined area 43 in which the mounting error discovered by the line sensor 11 of the first inspection station 3 is located at the center of the visual field, and acquires information on the detailed position 42.

  The following description is divided into three cases: a missing ball, a double ball 14A, a size error ball 14C, and an extra ball 14B.

The processing of the missing ball is performed by superimposing a reference image registered in advance on the enlarged image of the predetermined region 43 based on the attitude of the wafer 8 acquired by the area camera 13, and soldering the reference ball in the reference image and the solder in the enlarged image. The correspondence with the ball 14 is checked to re-recognize that it is a missing ball, and the position information ( detailed position information ) of the land 16 on which the repairing solder ball 14 is mounted is acquired. Of those extracted by binarization, a land 16 having a predetermined area and roundness is determined.

  Next, the transfer pin 17 is positioned above the flux tray 21 by moving the second lateral moving body 27, the tip of the transfer pin 17 is dipped on the flux tray 21, and the flux is applied to the tip of the transfer pin 17. Adhere. Further, the transfer pin 17 is positioned above the flux transfer portion of the land 16 recognized by the area camera 13 and the flux is applied to the land 16 to be repaired.

  The repair head 15 takes out one repair solder ball 14 from the ball supply unit 20 and, based on the information on the detailed position 42 calculated from the enlarged image of the predetermined area 43 imaged by the area camera 13, the land 16 to be repaired. A solder ball 14 for repair is mounted on the board. Thereafter, the area camera 13 obtains an enlarged image with the repair location as the center of the visual field, and confirms the success or failure of the repair by comparing it with the reference image.

The processing of the double ball 14A and the size error ball 14C is performed by superimposing a pre-registered reference image on the enlarged image of the predetermined region 43 based on the posture of the wafer 8 acquired by the area camera 13, and the reference ball in the reference image And the correspondence between the solder ball 14 in the enlarged image, and after confirming the area and shape (roundness) of the solder ball 14 again, the area is too large or too small, and the shape does not satisfy the predetermined roundness. It is determined that the object is a double ball 14A or a size error ball 14C that is a mounting error, and coordinate information ( detailed position information ) of a mounting ball that is to be removed is acquired.

  After removing the mismounted double ball 14A or the size error ball 14C with the mounting miss ball removing head 19, the area camera 13 captures an image again to check whether the removal is successful. That is, an enlarged image centering on the field to be removed is acquired by the area camera 13 and compared with a reference image registered in advance. If missing, it is determined that removal is successful.

  The removed solder ball with the mounting mistake removed is placed on the removal ball placing portion 23 by the mounting mistake ball removing head 19. In the removal, there is a possibility that the regular ball is also removed by the removal pin. In this case, it is determined as a missing ball. The position information of the missing ball is acquired, the solder ball 14 is mounted at the position by the repair head 15, and the image is picked up again by the area camera 13, and the success or failure of the repair is confirmed.

  The processing of the extra ball 14B is performed by superimposing a pre-registered reference image on the enlarged image of the predetermined area 43 based on the attitude of the wafer 8 acquired by the area camera 13, and the reference ball in the reference image and the enlarged image in the enlarged image. The correspondence with the solder ball is checked to reconfirm that it is the extra ball 14B, and the position information of the extra ball 14B is acquired.

  After the extra ball 14B is removed by the mounting miss ball removal head 19, as in the case of the double ball 14A and the size error ball 14C, an image is picked up again by the area camera 13, and it is confirmed whether or not the removal is successful. There is a possibility that the regular solder ball 14 is also removed by the mounting miss ball removing head 19 at the time of removal. In this case, since it is determined as a missing ball by comparison with the reference image, the repair head 15 performs remounting. .

  The wafer 8 that has been processed at the repair station 4 and has been transferred to the end of the second transfer stage 31 is accommodated in the discharge cassette 33 by the third wafer robot 32.

DESCRIPTION OF SYMBOLS 1 ... ・ ・ ・ ・ ・ Repair apparatus 2 ......... Wafer supply station 3 ... ・ ・ ・ ・ ・ First inspection station 4 ... ・ ・ ・ ・ ・ Repair station 5 .... ············································ 6 ··········································································・ Transfer table 10 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Alignment camera 11 ・ ・ ・ ・ ・ ・ ・ ・ Line sensor 12 ・ ・ ・ ・ ・ ・ ・ ・ Second wafer robot 13 ・ ・ ・ ・ ・ ・ ・ ・ Area camera 14 ・ ・ ・ ・... Solder balls 15 ... Repair head 16 ... Land 17 ... Transfer pin 18 ... Flux transfer head 19 ... ... Mounted ball removal head 20 ... Ball supply unit 21 ... ··· Flux tray 23 ························································ Transport table 25 Body 27... Second laterally moving body 28... Controller 29... Cable 30... First transport stage 31. ... Second transfer stage 32 ... Third wafer robot 33 ... Eject cassette 34 ... Eject wafer discharge station 40 ... Image 41 ·················································································································· 14B .... Size error ball

Claims (1)

A transporting means for transporting a work in which microballs are mounted on each of a plurality of mounting locations formed in a predetermined pattern on the upper surface by the mounting means;
A mounting error inspection unit that captures an image of the workpiece on the transport unit, detects presence / absence of a mounting error of the microball at the mounting position of the workpiece from the captured image, and acquires position information of the mounting error,
In a repair apparatus for a work mounted with a micro ball, comprising a correcting means for correcting the mounting error based on the inspection result of the mounting error inspection means,
The mounting error inspection means is
A first inspection unit that images the entire upper surface of the workpiece, detects a mounting error from the captured whole image, and acquires approximate position information about the mounting error;
Based on the approximate position information acquired by the first inspection means, the predetermined area including the mounting error detected by the first inspection means on the upper surface of the workpiece is imaged, and the mounting error is detected from the captured predetermined area image. Second inspection means for obtaining detailed position information about
The correction means corrects the mounting error based on the detailed position information acquired by the second inspection means ,
The transfer means is composed of a plurality of transfer stages and a transfer means for transferring a workpiece between the transfer stages, and the first inspection means is provided on an upstream transfer stage of the plurality of transfer stages. The apparatus for repairing a microball mounted work , wherein the second inspection means and the correction means are provided on a transfer stage downstream of the transfer stage on which the first inspection means is provided .

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