CN111742625B

CN111742625B - Component transfer apparatus, component transfer method, and component mounting apparatus

Info

Publication number: CN111742625B
Application number: CN201880086938.6A
Authority: CN
Inventors: 春日大介
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2018-02-27
Filing date: 2018-02-27
Publication date: 2021-06-18
Anticipated expiration: 2038-02-27
Also published as: CN111742625A; KR102387058B1; JPWO2019167110A1; KR20200086331A; JP6884494B2; WO2019167110A1

Abstract

The component is accurately inspected in parallel with the component being conveyed to the destination. The inspection device is provided with an outline information acquisition unit (111) for acquiring outline information of the component (Wp) on the basis of the component image (I1), an inspection region determination unit (112) for determining an inspection region (K) of the component (Wp) on the basis of the outline information, and a component inspection unit (113) for inspecting whether or not an abnormality of the component (Wp) has occurred in the inspection region (K), and the inspection of the component (Wp) is performed in parallel with at least one of the correction of the movement destination and the movement of the suction nozzle (421) to the corrected movement destination.

Description

Component transfer apparatus, component transfer method, and component mounting apparatus

Technical Field

The present invention relates to a component transfer apparatus and a component transfer method for picking up a component from a component storage such as a tray or a tape or a diced wafer and transferring the component to a predetermined transfer destination, and a component mounting apparatus for transferring the component by the component transfer apparatus and mounting the component on a substrate.

Background

Conventionally, various component supply methods have been used. For example, in the device described in patent document 1, a bare chip is picked up as a component from a diced wafer held on a wafer stage and mounted on a substrate to mount the component. In this component mounting apparatus, a suction nozzle provided in the mounting head sucks and holds a component (die) which is taken out from the wafer by the wafer head and supplied. In this case, since the suction variation may occur, the holding state of the component by the suction nozzle is photographed, and the suction variation of the component is obtained based on the component image obtained by the photographing. After such component recognition, the movement destination of the suction nozzle is corrected based on the suction variation, and after the suction nozzle is further moved to the corrected movement destination to complete component transfer, the component is mounted on the substrate. In this way, mounting of the component to the substrate is performed.

Here, even if the element mounted on the substrate includes an abnormality such as a crack, a defect, or a damage, it is difficult to detect the abnormality in a subsequent step (for example, a molding step) of mounting the element.

Therefore, it is conceivable to apply the component conveying technique described in patent document 2 to the component mounting apparatus. In the apparatus described in patent document 2, the position measurement and recognition are performed based on a component image obtained by imaging the lower surface of a component (die) picked up from a wafer, the movement destination of the nozzle is corrected, and at the same time, chip defect recognition is performed based on the component image to check whether the component is good or not.

Documents of the prior art

Patent document 1: japanese patent laid-open publication No. 2017-17348

Patent document 2: japanese patent laid-open publication No. 2012-199321

Disclosure of Invention

Problems to be solved by the invention

In patent document 2, the device is inspected for the quality based on the device image, but a specific method thereof is neither disclosed nor suggested, and if, for example, a portion of the wafer to be cut (that is, a dicing line) is displaced from a set position, the following problem may occur. For example, a region to be inspected (hereinafter referred to as "inspection region") in the element is set in advance on the premise that dicing of the wafer is performed at a predetermined position. However, in general, when a wafer is divided into a plurality of dies by dicing, variations in the positions where the dies are separated (in the above case, "dicing lines" correspond to these) cannot be avoided. Therefore, if the inspection region is determined to be outside the element due to the variation, an error is detected (see the column of "false detection" in fig. 6 described later). Further, if the inspection region is determined within a functional region having a functional portion (a portion where wiring, an electrode, a circuit, and the like are provided) of the element, the inspection itself of the inspection region may not be performed.

Such a problem also occurs in other component supply systems, for example, in an apparatus in which components (hereinafter, referred to as "housed components") housed in advance in component housings such as trays and tapes are transported by suction nozzles provided in a mounting head. In various scenes such as during a so-called setup work or during conveyance of component containers, there are cases where there are abnormalities such as cracking, chipping, and damage to the components, but there are cases where the inspection area for the components cannot be appropriately specified, making it difficult to perform a satisfactory inspection.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a component conveying technique capable of accurately inspecting a component in parallel with the conveyance of the component to a destination, and a component mounting apparatus incorporating the component conveying technique.

Means for solving the problems

A first aspect of the present invention is a component transfer apparatus including: a suction nozzle that receives and holds the component supplied from the component supply section; an imaging unit that images the component held by the suction nozzle; and a nozzle driving unit that moves the nozzle holding the component from the component supply unit, wherein the component transfer apparatus, after correcting a movement destination of the nozzle based on a component image captured by the imaging unit, moves the nozzle to the corrected movement destination by the nozzle driving unit to transfer the component, and the component transfer apparatus is characterized by comprising: an outline information acquiring unit configured to acquire outline information of the component based on the component image; an inspection area specifying unit that specifies an inspection area of the component based on the outline information; and a component inspection unit that inspects whether or not an abnormality of the component has occurred in the inspection area, and performs the inspection of the component in parallel with at least one of the correction of the movement destination and the movement of the suction nozzle to the corrected movement destination.

In addition, a second aspect of the present invention is a component conveying method including the steps of: a component holding step of receiving and holding a component by a suction nozzle; an imaging step of imaging the component held by the suction nozzle; a movement destination correction step of correcting a movement destination of the suction nozzle based on the component image acquired by the execution of the imaging step; a nozzle moving step of moving the nozzle holding the component to the corrected moving destination; an outline information acquisition step of acquiring outline information of the component based on the component image; an inspection area specifying step of specifying an inspection area of the component based on the external shape information; and an inspection step of inspecting whether or not an abnormality of the component has occurred in the inspection region in parallel with at least one of the movement destination correction step and the nozzle movement step.

A third aspect of the present invention is a component mounting apparatus including: a component supply unit that supplies components; the above-mentioned component conveying apparatus; and a control unit configured to mount the component on a substrate by using the suction nozzle moved to the movement destination when the component inspection unit determines that the component is not abnormal, and to suspend mounting of the component on the substrate when the component inspection unit determines that the component is abnormal.

In the invention thus constituted, the suction nozzle is moved to a movement destination corrected based on the component image captured by the imaging unit, and the component is conveyed. Further, the inspection of the component based on the component image is performed in parallel with at least one of the correction of the movement destination and the movement of the suction nozzle to the movement destination. Therefore, while the component is accurately conveyed to a desired destination of movement, the inspection area is accurately determined based on the profile information of the component being conveyed, and the occurrence of an abnormality in the inspection area is favorably inspected.

In the component mounting apparatus, mounting of the component on the substrate is stopped for the component determined to have an abnormality in the component upon receiving the inspection result. Therefore, the mounting of defective elements is avoided and the manufacturing yield of the substrate is improved.

Here, the components include, for example, a die supplied from a wafer divided into a plurality of dies by dicing by a component supply section, a housed component supplied from a component housing body housing a plurality of housed components by a component supply section, and the like.

Further, the external shape information acquiring unit may be configured to acquire a plurality of pieces of external shape information different from each other, thereby accurately obtaining the inspection region and further improving the inspection accuracy.

In the case where the element has an N-sided shape in a plan view (where N is a natural number of 3 or more), the external shape information acquisition unit may be configured to be able to acquire, as the external shape information, an external shape center coordinate of the element in a plan view and a corner coordinate of one corner of a plurality of corners included in the element. By preparing a plurality of pieces of profile information in this way, it is possible to cope with various inspection regions, and it is possible to inspect the component in various ways as will be described later. As a result, a high-precision inspection can be performed.

The outline center coordinates can be obtained from, for example, N side portions or N corner portions in a plan view of the N-side shaped element, and the outline center coordinates can be obtained with high accuracy. Therefore, the inspection region can be accurately obtained, and the inspection accuracy can be further improved.

In this case, the outline information acquiring unit may select either one of the outline center coordinates and the corner coordinates as the outline information for each inspection region, and the inspection region specifying unit may specify the inspection region based on the outline information selected by the outline information acquiring unit. With such a configuration, it is possible to specify a plurality of inspection regions with high accuracy, and to improve inspection accuracy.

Effects of the invention

According to the invention configured as described above, even if the position of the dicing wafer is changed, the component can be accurately inspected while the component is accurately conveyed to the movement destination.

Drawings

Fig. 1 is a plan view schematically showing a component mounting apparatus equipped with an embodiment of the component transfer apparatus of the present invention.

Fig. 2 is a block diagram showing a main electrical configuration of the component mounting apparatus shown in fig. 1.

Fig. 3 is a flowchart showing an operation of the component mounting apparatus of fig. 1.

Fig. 4 is a view schematically showing a main process of the mounting cycle.

Fig. 5 is a flowchart showing a component inspection action performed in the mounting cycle.

Fig. 6 is a diagram schematically showing the influence of variation in the cutting position in the case where the inspection region is determined with the bump reference.

Fig. 7 is a diagram schematically showing an outline of a determination algorithm for determining an examination region.

Fig. 8 is a diagram schematically showing an example of the inspection area.

Detailed Description

Fig. 1 is a plan view schematically showing a component mounting apparatus equipped with an embodiment of the component transfer apparatus of the present invention. Fig. 2 is a block diagram showing a main electrical configuration of the component mounting apparatus shown in fig. 1. As shown in fig. 1, XYZ orthogonal coordinate axes including a transport direction X, a width direction Y, and a vertical direction Z are appropriately used in the present specification. The conveyance direction X and the width direction Y are parallel to and orthogonal to the horizontal direction, and the vertical direction Z is orthogonal to the conveyance direction X and the width direction Y.

The component mounting apparatus 10 mounts components on a substrate B carried in from the upstream side in the transport direction X and carries out to the downstream side in the transport direction X. A plurality of mounting target points (not shown) are provided on the substrate B, and the control unit 100 provided in the component mounting apparatus 10 controls each part of the component mounting apparatus 10 to mount one component Wp on each mounting target point. Each element Wp is a bare chip formed in a lattice shape on the wafer W by dicing the wafer W, and has the same structure as each other. In this element Wp, a circuit structure such as a bump is formed on one main surface. Each element Wp has a rectangular shape in plan view (N of the present invention is 4).

The component mounting apparatus 10 includes a conveying unit 2 for conveying a substrate B in a conveying direction X. The conveying section 2 includes a standby conveyor 21, a mounting conveyor 22, a standby conveyor 23, a mounting conveyor 24, and a carry-out conveyor 25 arranged in this order in the conveying direction X, and these conveyors 21 to 25 can cooperate to convey the substrate B in the conveying direction X. The standby conveyor 21 is provided at the standby position P1, and is configured to cause the substrate B carried in from the outside of the component mounting apparatus 10 to stand by at the standby position P1 or to be handed over to the mounting conveyor 22. The mounting conveyor 22 is provided at a mounting position P2 located downstream of the standby position P1 in the conveyance direction X, and fixes the substrate B received from the standby conveyor 21 at the mounting position P2 or hands over the substrate B to the standby conveyor 23. The standby conveyor 23 is provided at a standby position P3 located on the downstream side of the mounting position P2 in the conveyance direction X, and is configured to cause the substrate B received from the mounting conveyor 22 to stand by at the standby position P3 or to be handed over to the mounting conveyor 24. The mounting conveyor 24 is provided at a mounting position P4 located downstream of the standby position P3 in the conveyance direction X, and fixes the substrate B received from the standby conveyor 23 at the mounting position P4 or delivers the substrate B to the carry-out conveyor 25. The carry-out conveyor 25 is provided at a position downstream of the mounting position P4 in the conveying direction X, and carries out the substrate B received from the mounting conveyor 24 to the outside of the component mounting apparatus 10. In this way, in the conveying section 2, the M mounting positions P2, P4 are arranged in the conveying direction X. Here, M is an integer of 2 or more, and in the example of fig. 1, M is 2.

The component mounting apparatus 10 further includes a component supply unit 3 that supplies components Wp. The device supplying section 3 includes a wafer storage section 31 capable of storing a plurality of wafers W and a wafer pull-out section 33 for pulling out the wafers W from the wafer storage section 31 to the wafer supply position Pp. The wafer storage unit 31 can move up and down in the vertical direction Z a rack that stores a plurality of wafer boat whs that respectively hold wafers W in an aligned manner in the vertical direction Z, thereby positioning the wafer boat Wh at a height at which the wafer pull-out unit 33 can receive the wafers W and pushing out the wafer boat Wh to the wafer pull-out unit 33.

The wafer pull-out unit 33 includes a wafer support table 331 for supporting the wafer holder Wh, a fixed rail 332 for movably supporting the wafer support table 331 in the width direction Y, a ball screw 333 provided along the width direction Y and attached to the wafer support table 331, and a Y-axis motor 334 for driving the ball screw 333. Therefore, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332 by rotating the ball screw 333 by the Y-axis motor 334. As shown in fig. 1, the wafer storage section 31 and the wafer supply position Pp are disposed so as to sandwich the transfer section 2 in the width direction Y, and the wafer support table 331 passes below the transfer section 2. The wafer support table 331 receives the wafer boat Wh from the wafer storage 31 at a receiving position adjacent to the wafer storage 31, and moves to a wafer supply position Pp that is farther from the wafer storage 31 in the width direction Y than the receiving position, thereby pulling out the wafer W to the wafer supply position Pp.

The element supply unit 3 further includes an element extraction unit 35 for extracting the element Wp from the wafer supply position Pp. The element pickup portion 35 has a pickup head 36 for picking up the element Wp from the wafer supply position Pp, and the pickup head 36 can be driven in the XY direction. That is, the component pickup unit 35 includes a support member 351 for movably supporting the pickup head 36 in the conveyance direction X and an X-axis motor 352 for driving a ball screw provided along the conveyance direction X and attached to the pickup head 36, and the pickup head 36 can be moved in the conveyance direction X by driving the ball screw by the X-axis motor 352. The element extraction unit 35 includes a fixed rail 353 for movably supporting the support member 351 in the width direction Y, a ball screw 354 provided along the width direction Y and attached to the fixed rail 353, and a Y-axis motor 355 for driving the ball screw 354. Therefore, the ball screw 354 is driven by the Y-axis motor 355, and the extraction head 36 can be moved in the width direction Y together with the support member 351.

The pickup head 36 includes a carriage 361 extending in the conveyance direction X and two suction nozzles 362 rotatably supported by the carriage 361. Each nozzle 362 rotates about a rotation axis parallel to the transport direction X and is located at any one of a downward suction position and an upward transfer position (position in fig. 1). Further, the carriage 361 can be lifted and lowered together with each suction nozzle 362.

In the component supply unit 3, the nozzle 362 at the suction position is moved downward to contact the component Wp after the nozzle 362 at the wafer supply position Pp is moved upward to face the component Wp. The component supply unit 3 supplies a negative pressure to the suction nozzle 362 to raise the suction nozzle 362, thereby sucking the component Wp from the wafer supply position Pp. The component supply unit 3 supplies the components Wp by positioning the suction nozzles 362 at the transfer positions.

The component mounting apparatus 10 includes mounting

portions

4A and 4B for mounting the components Wp supplied from the component supply portion 3 on the substrate B. In particular,

M mounting portions

4A and 4B are provided in a one-to-one correspondence relationship with the M mounting positions P2 and P4 (as described above, M is 2 in the example of fig. 1). That is, the mount portion 4A is provided corresponding to the mount position P2, and the mount portion 4B is provided corresponding to the mount position P4. The mounting

portions

4A and 4B include a support member 41 movable along a fixed rail provided on the ceiling of the component mounting device 10 in the width direction Y, a mounting head 42 supported by the support member 41 so as to be movable in the conveying direction X, and a head driving portion (not shown) for moving the mounting head 42 in the XY direction. In addition, the mounting head 42 has two suction nozzles 421 facing downward, and the suction nozzles 421 can be moved in the XY direction by the movement of the mounting head 42 based on the head driving part.

When the component Wp is sucked, recognized, and mounted, the mounting

portions

4A and 4B are moved upward of the pickup head 36, respectively, the suction nozzles 421 are moved from above toward the component Wp held by the suction nozzle 362 located at the transfer position, and then the suction nozzles 421 are lowered to come into contact with the component Wp. Next, the component supply unit 3 releases the negative pressure of the suction nozzle 362, and the mounting

units

4A and 4B supply the negative pressure to the suction nozzle 421 to raise the suction nozzle 421. Thus, the suction nozzle 421 receives the component Wp from the component supply portion 3 and suction-holds the component Wp. Then, by the movement of the mounting head 42 by the head driving unit, the suction nozzle 421 holding the component Wp is moved to a desired destination via the position above the component recognition camera 5, and the component Wp is positioned above the board B at the mounting positions P2 and P4. In this way, in the present embodiment, the component Wp is conveyed from the component supply unit 3 to the transfer destination by the mounting head 42 in a state of being held by the suction nozzle 421. The component Wp thus conveyed to the destination of movement, that is, to a position above the mounting target point is mounted on the substrate B by the suction nozzle 421, and is mounted thereon.

The component recognition cameras 5 and 5 are fixed at predetermined positions, pick up images of the component Wp sucked and held by the suction nozzle 421 and the suction nozzle 421, and output signals of the picked-up images (hereinafter referred to as "component images") to the image processing unit 150. This component image is used not only when the holding state of the component Wp by the suction nozzle 421 is recognized during the movement of the suction nozzle 421 and the movement destination is corrected, but also when the component Wp is inspected as described in detail later.

The component mounting apparatus 10 is provided with a display unit 7 (fig. 2) that functions as an interface with an operator. The display unit 7 is connected to the control unit 100, and has a function of an input terminal which is configured by a touch panel and receives an input from an operator, in addition to a function of displaying an operation state of the component mounting apparatus 10.

Next, the configuration of the control unit 100 will be described with reference to fig. 2. The control Unit 100 is provided at an appropriate position inside the apparatus main body, and includes a known CPU (Central Processing Unit) that performs logical operations, a ROM (Read Only Memory) that stores initial settings and the like, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like.

The control unit 100 functionally includes an arithmetic processing unit 110, a storage unit 120, a motor control unit 130, an external input/output unit 140, an image processing unit 150, and the like. The motor control unit 130 controls the driving of the conveyors 21 to 25, the wafer pull-out unit 33, the pick-up head 36, and a motor provided in the head drive unit. The external input/output unit 140 inputs signals from various sensors provided in the component mounting apparatus 10, and outputs signals to various actuators provided in the component mounting apparatus 10. The image processing unit 150 receives the image signal from the component recognition camera 5, and performs various image processing on the component image to generate a component image suitable for component recognition or component inspection.

The storage unit 120 stores a program for performing component mounting processing, mounting data indicating a substrate position, a mounted component, a mounting position, and the like in each mounting cycle, and a component image.

The arithmetic processing unit 110 has an arithmetic function such as a CPU, and controls the motor control unit 130 and the image processing unit 150 in accordance with a program and mounting data stored in the storage unit 120, thereby repeating a series of operations (hereinafter, referred to as a "mounting cycle") including moving the component supply unit 3 by the suction nozzle 421, sucking and holding the component Wp supplied from the component supply unit 3 by the suction nozzle 421, moving the suction nozzle 421 holding the component Wp to a destination, recognizing the component based on an image of the component captured by the component recognition camera 5 during the movement, moving the suction nozzle 421 holding the component Wp to the destination, and mounting the component Wp on the substrate B. The arithmetic processing unit 110 performs inspection of the components Wp in parallel during execution of the mounting loop. In this component inspection, as described in detail below, outline information of the component Wp is acquired based on the component image (outline information acquisition step), an inspection area of the component Wp is specified based on the outline information (inspection area specifying step), and it is inspected whether or not an abnormality of the component Wp occurs in the inspection area (inspection step). These steps are performed by the arithmetic processing unit 110, and the arithmetic processing unit 110 functions as an outline information acquisition unit 111, an inspection region specification unit 112, and a device inspection unit 113.

Next, the operation of the component mounting apparatus 10 configured as described above will be described with reference to fig. 3 to 8. Fig. 3 is a flowchart showing an operation of the component mounting apparatus of fig. 1. Fig. 4 is a view schematically showing a main process of the mounting cycle. In the component mounting apparatus 10, the arithmetic processing unit 110 controls each unit of the apparatus as follows according to the program stored in the storage unit 120, and repeats a mounting cycle for each of the mounting

units

4A and 4B. Further, component inspection is performed while the component Wp is held by the suction nozzle 421 and is conveyed from the component supply unit 3 to a destination of movement, that is, to a position above the mounting target point. Therefore, in order to clearly distinguish the inspection step associated with the component inspection from the mounting step associated with the component mounting, a point is referred to as a reference for the inspection step, and hereinafter, the mounting step of the mounting portion 4A other than the inspection step will be described first, and then the inspection step will be described in detail. Since the mounting step and the inspection step by the mounting portion 4B are also basically the same, the description thereof is omitted here.

Mounting data for executing a mounting cycle of the mounting portion 4A is generated (step S1), and the following mounting cycle is executed in accordance with the mounting data. The mounting head 42 of the mounting portion 4A moves toward the component supply portion 3 (step S2), and receives and suction-holds the component Wp supplied from the component supply portion 3 (step S3). The number of times the component holding operation is performed by the number of the suction nozzles 421. Here, in order to facilitate understanding of the contents of the invention, the description will be continued assuming that the held element Wp is sucked by only one suction nozzle 421.

After the suction holding of the component Wp by the suction nozzle 421 is completed, the mounting head 42 moves to above the substrate B via the upper position of the component recognition camera 5 (step S4). While the suction nozzle 421 is moving, the component recognition camera 5 captures an image of the component Wp held by the suction nozzle 421 and the suction nozzle 421, and stores a component image I1, for example, as shown in the column (a) of fig. 4, in the storage unit 120 (step S5). In the figure, reference symbol Id denotes an overall image of the die constituting the element Wp, and reference symbol Ib denotes an image of the bump BP (see fig. 4) formed on one main surface of the die.

Next, the reference element image I0 functioning as a template, which is acquired in advance and stored in the storage unit 120, is read out, and as shown in the column (b) of fig. 4, the X-direction component dx, the Y-direction component dy, and the rotation direction component dr of the suction deviation of the element Wp are derived by comparing the reference element image I0 with the element image I1, and the movement destination of the nozzle 421 is corrected based on these components (step S6). More specifically, in this embodiment, as shown in the column (c) of fig. 4, the component Wp is finally mounted on the substrate B so that the bump BP is accurately in contact with the wiring WR on the substrate B, and therefore, the coordinate positions of the bump images Ib in the component image I1 are obtained, and the X-direction component dx, the Y-direction component dy, and the rotation-direction component dr are derived by comparing these with the coordinate positions of the bump images Ib in the reference component image I0, and are used for correcting the destination. Therefore, the destination of movement and the rotation angle of the nozzle 421 holding the component Wp are adjusted by the correction, and as shown in the column (c) of fig. 4, the component Wp is positioned at a position above the mounting target point in an appropriate component posture (step S9), and then the component Wp is mounted on the substrate B from the nozzle 421 (step S10). Thus, the bump BP is accurately positioned with respect to the wiring WR formed in advance on the substrate B and mounted on the substrate B.

Next, an inspection step associated with the component inspection will be described. While the mounting cycle is being performed as described above, the inspection of the component (step S7), the determination of the inspection result (step S8), and the discarding of the defective component (step S11) are performed. More specifically, the component inspection is executed in parallel with the correction of the destination and the movement of the suction nozzle 421 to the corrected destination (step S7).

Fig. 5 is a flowchart showing a component inspection action performed in the mounting cycle. In this component inspection, a component image I1 is read from the storage unit 120 (step S701), and based on this component image I1, it is examined whether or not there is an abnormality such as a crack, a defect, or a damage at the edge portion or the corner portion of the component Wp. In the present embodiment, the edge portion and the corner portion of the element Wp are set as the inspection regions. Here, since the coordinate position of the bump BP is obtained in the component recognition, it is conceivable to specify the inspection area based on the coordinate position. However, since the variation of the dicing position is unavoidable as described above, the position of the inspection region K with respect to the entire image Id of the die differs depending on the dicing position as shown in fig. 6. Therefore, when the inspection area K is determined according to the rule that the position of the inspection area K separated from the mounting bump BP by a predetermined distance is the inspection area K, as shown in, for example, a column (a) of fig. 6, by inspecting the inspection area K, abnormality such as a crack, a defect, or a damage may be inspected. However, when the position of the bump BP in the element Wp is displaced due to the variation in the cutting position, the inspection region K may be deviated from the entire image Id as shown in the column (b) of the figure and may be erroneously detected or may be brought close to a circuit structure such as the bump BP and may not be detected as shown in the column (c) of the figure, as long as the above-described rule is satisfied.

Thus, in the present embodiment, by executing the series of processing shown in fig. 5, it is possible to accurately and appropriately specify the inspection region K and inspect the abnormality of the component Wp in the inspection region K without being affected by the variation in the cutting position. In many cases, the examination region K is a plurality of regions and is different in type. Therefore, the examination region K is preferably determined in various ways. In the present embodiment, as shown in fig. 7, three kinds of determination algorithms for determining the inspection regions are prepared, and the eight inspection regions KC1 to KC4 and KE1 to KE4 shown in fig. 8 are determined in combination with the determination algorithms, respectively, to inspect the element Wp.

Fig. 7 is a diagram schematically showing an outline of a determination algorithm for determining an examination region. In column (a) of the figure, a first determination algorithm and a second determination algorithm are shown. In these algorithms, the outline center coordinates (xd, yd) of the element Wp are obtained from the entire image Id of the die as "outline information" and "outline center information" in the present invention. Further, the outline center coordinates (xd, yd) and the X-direction distance Lx and the Y-direction distance Ly from the outline center coordinates (xd, yd) are obtained as determination information for determining the center coordinates (xk, yk) of the examination region K, and are stored in the storage unit 120. The first and second determination algorithms are different only in the method of deriving the outline center coordinates (xd, yd), and are otherwise the same. Specifically, while the first determination algorithm is derived based on the edge information of the four sides of the entire image Id, the second determination algorithm is derived based on the edge information of the four corners of the entire image Id.

On the other hand, a third determination algorithm is shown in column (b) of the figure. Here, the corner coordinates (xc, yc) of one of the corners included in the overall image Id of the die are obtained as "profile information" of the present invention, and the corner coordinates (xc, yc) and the X-direction distance Lx and the Y-direction distance Ly from the corner coordinates (xc, yc) are obtained as determination information for determining the center coordinates (xk, yk) of the inspection region K, and stored in the storage unit 120. As described above, in the present embodiment, selection can be made from among three determination algorithms.

The description returns to fig. 5 to continue the component inspection operation (step S7). In the next step S702, one of the examination regions KC1 to KC4, KE1 to KE4 is selected as an examination subject, and a determination algorithm for determining the selected examination subject is selected from the above-described three determination algorithms. Then, it is determined whether or not the identification information is already obtained and registered in the storage unit 120 according to the selected identification algorithm (step S703), and steps S704 to S706 are executed based on the determination result. For example, when the specification information is not registered (no in step S703), the specification information for specifying the examination region is obtained in accordance with the selected specification algorithm (step S704), and is registered in the storage unit 120 (step S705). On the other hand, when the specific information is already registered (yes in step S703), the registered specific information is read from the storage unit 120 and acquired (step S706).

After acquiring the identification information corresponding to the inspection area by the execution of the above steps S703 to S706, the inspection area is identified based on the identification information. That is, the position offset by the X-direction distance Lx and the Y-direction distance Ly from the outline center coordinates (xd, yd) or the corner coordinates (xc, yc) is the center coordinates of the inspection region, and the image data corresponding to the inspection region in the component image I1 is extracted as the inspection data (step S707). Then, it is checked whether or not an abnormality such as a crack, a defect, or a damage is included in the inspection region based on the inspection data (step S708). When an abnormality is found in step S708, the inspection of the component is not performed in the other inspection region, and it is immediately determined that the component Wp is a defective component (step S710), and the inspection of the component is terminated (step S7).

On the other hand, in the case where no abnormality is found in step S708, it is determined whether or not the element inspection is performed for all of the inspection regions KC1 to KC4, KE1 to KE4 (step S711). Here, while there is an unchecked check area (no in step S711), the series of processing described above is repeatedly executed (steps S702 to S709). If no abnormality is detected in all of the inspection regions KC1 to KC4 and KE1 to KE4 (yes in step S711), it is determined that the component Wp is good (step S712), and the inspection of the component is terminated (step S7).

After the component inspection is thus completed, as shown in fig. 3, it is determined whether the result of the component inspection is a good product or a defective product before the mounting head 42 reaches the transfer destination (step S8). Here, when it is determined that the component Wp sucked and held by the suction nozzle 421 is a good product, the movement of the mounting head 42 is continued to perform positioning of the component Wp (step S9) and mounting of the component Wp on the substrate B (step S10). On the other hand, when it is determined that the component Wp sucked and held by the suction nozzle 421 is a defective product, the mounting of the component Wp is suspended, and the component Wp is discarded to a defective product collection unit (not shown) (step S11).

Since the mounting cycle is completed in this way, the process returns to step S1 to repeatedly execute the next mounting cycle.

As described above, according to the present embodiment, the moving destination of the suction nozzle 421 is corrected based on the component image I1 captured by the component recognition camera 5, the mounting accuracy of the component Wp on the board B is improved, and the component Wp is inspected. Since the recognition for mounting the component (derivation of the X-direction component dx, the Y-direction component dy, and the rotation direction component dr of the adsorption deviation) and the recognition for inspecting the component (determination of the inspection regions KC1 to KC4 and KE1 to KE4 and acquisition of the inspection data) can be performed at once in this manner, a beat loss does not occur, and a decrease in yield can be prevented. Further, since the inspection regions KC1 to KC4 and KE1 to KE4 are specified based on the outer shape information of the elements Wp for the element inspection, even if the position of dicing on the wafer W varies, the inspection regions KC1 to KC4 and KE1 to KE4 can be reliably specified, and the occurrence of an abnormality in the respective inspection regions KC1 to KC4 and KE1 to KE4 can be favorably inspected.

In addition, three determination algorithms different from each other are prepared, and one of the three kinds of shape information can be selectively acquired with respect to the same element Wp. In this way, the outline information is selectively acquired for each of the examination regions KC1 to KC4 and KE1 to KE4, and the examination regions are determined based on the acquired outline information. Therefore, the inspection regions KC1 to KC4 and KE1 to KE4 can be accurately obtained, and the inspection accuracy can be further improved. In addition, by selecting the three determination algorithms and determining the examination regions KC1 to KC4 and KE1 to KE4, examination data with high robustness can be obtained. Therefore, the inspection of the element Wp can be stably performed.

In addition, in the present embodiment, since the presence or absence of the occurrence of the abnormality is checked in the plurality of inspection regions KC1 to KC4 and KE1 to KE4, the determination as to whether the components Wp are good or not can be performed with high accuracy, and only the components Wp that are good can be mounted on the substrate B with defective products reliably removed, thereby providing a highly reliable product.

As described above, in the present embodiment, the component recognition camera 5 and the head driving unit correspond to examples of the "imaging unit" and the "nozzle driving unit" of the present invention, respectively, and the combination of these with the mounting head 42 and the control unit 100 functions as the "component conveying device" of the present invention. Steps S3, S5, and S6 in fig. 3 correspond to examples of the "element holding step", the "imaging step", and the "movement destination correcting step" in the present invention, respectively, and steps S4 and S9 correspond to examples of the "nozzle moving step" in the present invention. Steps S703 to S706 in fig. 5 correspond to an example of the "outline information acquisition step" of the present invention, and steps S707 and S708 correspond to an example of the "inspection region specifying step" and the "inspection step" of the present invention, respectively.

The present invention is not limited to the above embodiments, and various modifications can be made to the above embodiments without departing from the spirit of the invention. For example, in the above-described embodiment, the case where the die having a rectangular shape in a plan view is the element Wp, that is, the case where "N" of the present invention is 4 has been described, but the present invention can also be applied to the case where the die having N of 3, 5, 6, and … is the element Wp.

In the above embodiment, the eight inspection regions KC1 to KC4 and KE1 to KE4 were inspected, but the number, shape, position, and the like of the inspection regions were arbitrary.

In the above embodiment, three specifying algorithms are used, but the number of specifying algorithms is not limited to this, and is arbitrary.

In the above embodiment, the component recognition camera 5 is fixed and the component is imaged when the mounting head 42 passes above the component recognition camera 5, but a so-called scanning camera may be attached to the mounting head 42 and a component image may be acquired by the scanning camera while the mounting head 42 is moving.

In the above embodiment, the component inspection is performed in parallel with the movement destination correction operation and the movement operation of the suction nozzle 421 to the corrected movement destination (step S7), but the component inspection may be performed only in parallel with the correction operation or the movement operation (step S7).

In the above embodiment, the present invention is applied to the component mounting device 10 including the two mounting

portions

4A and 4B, but the number of the mounting portions is not limited thereto and is arbitrary.

In the above embodiment, the component Wp supplied from the component supply unit 3 is directly conveyed to the position above the substrate B, but the component conveying apparatus of the present invention (the mounting head 42+ the component recognition camera 5+ the head driving unit + the control unit 100) may be applied to a component mounting apparatus that mounts and mounts a component onto a substrate after being conveyed to the upper position of the substrate via the flux applying unit. The application target of the component transfer device is not limited to this, and the device can be applied to a chip handler described in patent document 2, for example.

In the above-described embodiment, the present invention is applied to a device in which a die supplied from a wafer divided into a plurality of dies by dicing is used as an element, but the application object of the present invention is not limited to this. For example, the present invention can be applied to a component conveying apparatus that conveys a housed component housed in a component housing body such as a tray or a tape in advance, and a component mounting apparatus provided with the component conveying apparatus. That is, the external shape information of the housing component may be acquired based on the component image of the housing component, the inspection area of the housing component may be specified based on the external shape information, and then whether or not the abnormality of the housing component has occurred may be inspected in the inspection area. Thus, the inspection area of the housing element can be reliably determined, and the occurrence of an abnormality in each inspection area can be satisfactorily inspected.

Industrial applicability

The present invention can be applied to all component transfer techniques for picking up a component and transferring the component to a predetermined destination of movement and a component mounting technique for transferring a component and mounting the component on a substrate using the component transfer technique.

Description of the reference numerals

3 … parts supply part

4A, 4B … mounting part

5 … component recognition camera (shooting part)

10 … element mounting device

42 … mounting head

421 … suction nozzle

100 … control part

111 … external form information acquiring unit

112 … inspection area determining part

113 … element inspection part

B … base plate

I1 … element image

K. KC 1-KC 4 and KE 1-KE 4 … examination areas

Distance in Lx … X direction

Ly … Y direction distance

W … wafer

Wp … element.

Claims

1. A component conveying apparatus, comprising: a suction nozzle that receives and holds the component supplied from the component supply section; an imaging unit that images the component held by the suction nozzle; and a nozzle driving unit that moves the nozzle holding the component from the component supply unit, wherein the component transfer apparatus transfers the component by moving the nozzle to a destination of movement corrected by the nozzle driving unit after correcting the destination of movement of the nozzle based on the component image captured by the imaging unit,

the component conveying apparatus is characterized by comprising:

an outline information acquisition unit configured to acquire outline information of the component based on the component image;

an inspection region determining section that determines an inspection region of the component based on the shape information; and

a component inspection unit that inspects whether or not an abnormality of the component has occurred in the inspection region,

performing the inspection of the component in parallel with at least one of the correction of the destination of movement and the movement of the suction nozzle to the corrected destination of movement,

the inspection area determining section determines a part of the element as the inspection area based on the shape information.

2. The component delivery apparatus according to claim 1,

the external shape information acquiring unit may acquire a plurality of pieces of external shape information different from each other.

3. The component delivery apparatus according to claim 2,

when the element has an N-sided shape in a plan view, wherein N is a natural number of 3 or more,

the shape information acquiring unit may acquire, as the shape information, center coordinates of an outer shape of the element in a plan view and corner coordinates of one corner of a plurality of corners included in the element.

4. The component delivery apparatus according to claim 3,

the outline information acquisition unit acquires the outline center coordinates from N side portions or N corner portions of the N-side shaped element in a plan view.

5. The component delivery apparatus according to claim 3,

in the presence of a plurality of inspection regions of the component,

the contour information acquisition unit selects either one of the contour center coordinates and the corner coordinates as the contour information for each of the inspection regions,

the inspection area specifying unit specifies the inspection area based on the external shape information selected by the external shape information acquiring unit.

6. The component delivery apparatus according to claim 4,

in the presence of a plurality of inspection regions of the component,

7. The component conveying apparatus according to any one of claims 1 to 6,

the component is the die supplied from a wafer divided into a plurality of dies by dicing by the component supply section.

8. The component conveying apparatus according to any one of claims 1 to 6,

the component is the housed component supplied from a component housing that houses a plurality of housed components by the component supply section.

9. A component conveying method is characterized by comprising the following steps:

a component holding step of receiving and holding a component by a suction nozzle;

an imaging step of imaging the component held by the suction nozzle;

a movement destination correction step of correcting a movement destination of the suction nozzle based on the component image obtained by the imaging step;

a nozzle moving step of moving the nozzle holding the component to the corrected movement destination;

an outline information acquisition step of acquiring outline information of the component based on the component image;

an inspection region determining step of determining an inspection region of the component based on the outline information, and determining a part of the component as the inspection region based on the outline information; and

an inspection step of inspecting whether or not an abnormality of the component has occurred in the inspection region in parallel with at least one of the destination correction step and the nozzle movement step.

10. The component conveying method according to claim 9,

the inspection area determining step is a step of determining a part of the element as the inspection area based on the shape information.

11. A component mounting apparatus is characterized by comprising:

a component supply unit that supplies components;

a component delivery device as claimed in any one of claims 1 to 8; and

and a control unit configured to mount the component on a substrate by using the suction nozzle moved to the movement destination when the component inspection unit determines that the component is not abnormal, and to suspend mounting of the component on the substrate when it determines that the component is abnormal.