WO2019167110A1

WO2019167110A1 - Component conveying apparatus, component conveying method and component mounting apparatus

Info

Publication number: WO2019167110A1
Application number: PCT/JP2018/007169
Authority: WO
Inventors: 大介春日
Original assignee: ヤマハ発動機株式会社
Priority date: 2018-02-27
Filing date: 2018-02-27
Publication date: 2019-09-06
Also published as: CN111742625A; JPWO2019167110A1; KR102387058B1; KR20200086331A; CN111742625B; JP6884494B2

Abstract

The purpose of the present invention is to inspect a component accurately in parallel with the conveyance of the component to the destination. The present invention provides a component conveying apparatus comprising: an external shape information acquisition unit 111 that acquires external shape information on a component Wp on the basis of a component image I1; an inspection area specifying unit 112 that specifies an inspection area K of the component Wp from the external shape information; and a component inspection unit 113 that inspects whether or not an abnormality of the component Wp occurs in the inspection area K, wherein the inspection of the component Wp is performed in parallel with at least one of the correction of the movement destination and the movement of a nozzle 421 to the corrected movement destination.

Description

Component conveying apparatus, component conveying method, and component mounting apparatus

The present invention relates to a component conveying apparatus and a component conveying method for picking up a component from a component container such as a tray or a tape or a diced wafer, and conveying the component to a predetermined destination, and a substrate by conveying the component by the component conveying device. The present invention relates to a component mounting apparatus to be mounted on the machine.

Conventionally, various parts supply methods have been adopted. For example, in the apparatus described in Patent Document 1, a die is picked up as a component from a diced wafer held on a wafer stage, and mounted on a substrate for component mounting. In this component mounting apparatus, a component (die) taken out from a wafer by a wafer head and supplied is sucked and held by a nozzle provided in the mounting head. At this time, a suction deviation may occur, so that the holding state of the part by the nozzle is imaged, and the part suction deviation is obtained based on the part image obtained by the imaging. After such component recognition, the movement destination of the nozzle is corrected according to the suction deviation, and after the nozzle has moved to the corrected movement destination and the component conveyance has been completed, the component is mounted on the substrate. In this way, the component is mounted on the board.

Here, even if an abnormality such as a crack, a chip or a scratch is included in a component mounted on the board, it is difficult to detect the abnormality in a subsequent process of the component mounting, for example, a molding process.

Therefore, it is considered to apply the component conveying technique described in Patent Document 2 to the component mounting apparatus. In the apparatus described in Patent Document 2, position measurement recognition is performed on the basis of a component image obtained by imaging the lower surface of a component (die) picked up from a wafer, and the nozzle movement destination is corrected at the same time. Chip defect recognition is performed based on the image to inspect the quality of the parts.

JP 2017-17348 A JP 2012-199321 A

In Patent Document 2, the quality of a component is inspected based on the component image, but the specific method is neither disclosed nor suggested. For example, a diced portion of a wafer, that is, a dicing line is set. When shifted from the position, the following problems may occur. For example, an area to be inspected (hereinafter referred to as “inspection area”) of the parts is set in advance on the assumption that dicing of the wafer is performed at a predetermined position. However, normally, when the wafer is diced and divided into a plurality of dies, fluctuations in the position at which the dies are separated (in this case, the “dicing line” corresponds to this) are unavoidable. For this reason, if the inspection region is specified to be outside the part due to the variation, an erroneous detection is performed (see the “false detection” column in FIG. 6 described later). In addition, if the inspection area is specified within a functional area having a functional part of a component (a part where wiring, electrodes, circuits, etc. are provided), the inspection for the inspection area itself may be impossible.

In addition, such a problem is caused by another component supply system, for example, a component (hereinafter referred to as a “storage component”) stored in a component storage body such as a tray or a tape is conveyed by a nozzle provided in the mounting head. It also occurs in the device. There are cases where abnormalities such as cracks, chippings and scratches occur in various situations such as during the so-called setup work or during transportation of the parts container, but it is possible to appropriately specify the inspection area of the stored parts In some cases, it was difficult to perform the inspection well.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a component transport technology capable of accurately inspecting a component in parallel with transporting a component to a destination, and a component mounting apparatus incorporating the component transport technology The purpose is to provide.

A first aspect of the present invention includes a nozzle that receives and holds a component supplied from a component supply unit, an imaging unit that captures an image of the component held by the nozzle, and a nozzle that moves the nozzle holding the component from the component supply unit And a drive unit that corrects the movement destination of the nozzle based on the component image captured by the imaging unit and then moves the nozzle to the corrected movement destination by the nozzle drive unit to convey the component. In addition, an outline information acquisition unit that acquires outline information of a part based on the part image, an inspection area specification part that specifies an inspection area of the part from the outline information, and whether or not an abnormality of the part has occurred in the inspection area And inspecting the component in parallel with at least one of the correction of the movement destination and the movement of the nozzle to the corrected movement destination.

A second aspect of the present invention is a component conveying method, which is obtained by performing a component holding step of receiving and holding a component by a nozzle, an imaging step of imaging the component held by the nozzle, and an imaging step. The movement destination correction step of correcting the movement destination of the nozzle based on the component image obtained, the nozzle movement step of moving the nozzle holding the component to the corrected movement destination, and acquiring the external information of the component based on the component image In parallel with at least one of the outline information acquisition process, the inspection area identification process that identifies the inspection area of the part from the outline information, the movement destination correction process, and the nozzle movement process, an abnormality in the inspection area occurs. And an inspection process for inspecting whether or not it is present.

Furthermore, a third aspect of the present invention is a component mounting apparatus, which moves when it is determined that no component abnormality has occurred by the component supply unit that supplies the component, the component conveying device, and the component inspection unit. A component is mounted on the substrate by the nozzle that has moved first, and a control unit that stops mounting the component on the substrate when it is determined that a component abnormality has occurred.

In the invention configured as described above, the nozzle moves to the movement destination corrected based on the component image captured by the imaging unit and conveys the component. In addition, a component inspection based on the component image is performed in parallel with at least one of the correction of the movement destination and the movement of the nozzle to the movement destination. Therefore, at the same time when the part is accurately transported to a desired destination, the inspection area is accurately specified based on the external shape information of the part being transported, and the occurrence of abnormality in the inspection area is inspected satisfactorily.

In addition, in the component mounting apparatus, the mounting on the board is stopped for the component that has been determined to have a component abnormality based on the inspection result. Therefore, mounting of defective parts is avoided and the manufacturing yield of the board is improved.

Here, examples of the component include a die supplied by a component supply unit from a wafer divided into a plurality of dies by dicing, and a storage component supplied by a component supply unit from a component storage body that stores a plurality of storage components. included.

Also, the outer shape information acquisition unit may be configured to be able to acquire a plurality of different outer shape information, whereby the inspection area can be accurately obtained, and the inspection accuracy can be further increased.

Further, when the part has an N shape (where N is a natural number of 3 or more) in a plan view, the outline information acquisition unit includes the outline center coordinates in the plan view of the part and the part as the outline information. It may be configured such that one corner coordinate of the plurality of corner portions can be acquired. By preparing a plurality of pieces of external shape information in this way, it is possible to deal with various inspection areas, and it is possible to inspect parts in a multifaceted manner as will be described later. As a result, highly accurate inspection is possible.

The outer shape center coordinates may be obtained from, for example, N sides or N corners in plan view of an N-shaped part, and the outer shape center coordinates can be obtained with high accuracy. Therefore, the inspection area can be obtained accurately, and the inspection accuracy can be further increased.

There may be a plurality of parts inspection areas. In such a case, the outline information acquisition unit selects one of the outline center coordinates and corner coordinates as outline information for each inspection area, and the inspection area. The specifying unit may be configured to specify the inspection region based on the outer shape information selected by the outer shape information acquiring unit. By adopting such a configuration, it is possible to specify various inspection regions with high accuracy, and to increase inspection accuracy.

According to the invention configured as described above, even if the position of dicing the wafer fluctuates, it is possible to accurately inspect the part at the same time that the part is accurately conveyed to the destination.

It is a top view which shows typically the component mounting apparatus equipped with one Embodiment of the component conveying apparatus which concerns on this invention. It is a block diagram which shows the main electrical structures of the component mounting apparatus shown in FIG. It is a flowchart which shows operation | movement of the component mounting apparatus of FIG. It is a figure which shows typically the main process of a mounting turn. It is a flowchart which shows the components test | inspection operation | movement performed during a mounting turn. It is a figure which shows typically the influence by the fluctuation | variation of a dicing position in the case of specifying a test | inspection area | region on bump reference | standard. It is a figure which shows typically the outline | summary of the specific algorithm which specifies a test | inspection area | region. It is a figure which shows an example of a test | inspection area | region typically.

FIG. 1 is a plan view schematically showing a component mounting apparatus equipped with an embodiment of a component conveying apparatus according to the present invention. FIG. 2 is a block diagram showing the main electrical configuration of the component mounting apparatus shown in FIG. As shown in FIG. 1, in this specification, XYZ orthogonal coordinate axes configured by a conveyance direction X, a width direction Y, and a vertical direction Z are appropriately used. The transport direction X and the width direction Y are parallel to the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the transport direction X and the width direction Y.

The component mounting apparatus 10 mounts components on the board B carried in from the upstream side in the transport direction X, and carries it out downstream in the transport direction X. The board B is provided with a plurality of mounting target points (not shown), and the control unit 100 provided in the component mounting apparatus 10 controls each part of the component mounting apparatus 10 so that each mounting target point has a component. One Wp is mounted at a time. Each component Wp is a die formed in a lattice shape on the wafer W by dicing the wafer W, and has the same configuration. In the component Wp, a circuit configuration such as a bump is formed on one main surface. Each component Wp has a rectangular shape in plan view (N = 4 in the present invention).

The component mounting apparatus 10 includes a transport unit 2 that transports the substrate B in the transport direction X. The transport unit 2 includes a standby conveyor 21, a mounting conveyor 22, a standby conveyor 23, a mounting conveyor 24, and an unloading conveyor 25 that are arranged in this order in the transport direction X, and these conveyors 21 to 25 cooperate in the transport direction. The substrate B can be transferred to X. The standby conveyor 21 is provided with respect to the standby position P1, and the board B loaded from the outside of the component mounting apparatus 10 is made to wait at the standby position P1 or is transferred to the mounting conveyor 22. The mounting conveyor 22 is provided with respect to the mounting position P2 located downstream of the standby position P1 in the transport direction X, and the substrate B received from the standby conveyor 21 is fixed to the mounting position P2 or transferred to the standby conveyor 23. The standby conveyor 23 is provided with respect to the standby position P3 located downstream of the mounting position P2 in the transport direction X, and waits for the substrate B received from the mounting conveyor 22 at the standby position P3 or transfers it to the mounting conveyor 24. The mounting conveyor 24 is provided with respect to the mounting position P4 located downstream of the standby position P3 in the transport direction X, and the substrate B received from the standby conveyor 23 is fixed to the mounting position P4 or transferred to the carry-out conveyor 25. The carry-out conveyor 25 is provided at a position downstream of the mounting position P4 in the transport direction X, and carries the board B received from the mounting conveyor 24 out of the component mounting apparatus 10. Thus, in the transport unit 2, M mounting positions P2 and P4 are provided side by side in the transport direction X. Here, M is an integer greater than or equal to 2, and M = 2 in the example of FIG.

In addition, the component mounting apparatus 10 includes a component supply unit 3 that supplies a component Wp. The component supply unit 3 includes a wafer storage unit 31 that can store a plurality of wafers W, and a wafer extraction unit 33 that pulls out the wafer W from the wafer storage unit 31 to the wafer supply position Pp. The wafer storage unit 31 raises and lowers the rack in which the plurality of wafer holders Wh each holding the wafer W are arranged in the vertical direction Z in the vertical direction Z so that the wafer extraction unit 33 can receive the wafer W. The wafer holder Wh can be positioned, and the wafer holder Wh can be pushed out to the wafer extraction portion 33.

The wafer pull-out unit 33 is provided on the wafer support table 331 provided in the width direction Y, a wafer support table 331 that supports the wafer holder Wh, a fixed rail 332 that supports the wafer support table 331 to be movable in the width direction Y, and the wafer support table 331. And a Y-axis motor 334 that drives the ball screw 333. Therefore, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332 by rotating the ball screw 333 by the Y-axis motor 334. As shown in FIG. 1, the wafer storage unit 31 and the wafer supply position Pp are arranged so as to sandwich the transfer unit 2 from the width direction Y, and the wafer support table 331 passes below the transfer unit 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at the reception position adjacent to the wafer storage unit 31 and moves from the reception position to the wafer supply position Pp away from the wafer storage unit 31 in the width direction Y. As a result, the wafer W is pulled out to the wafer supply position Pp.

Furthermore, the component supply unit 3 has a component take-out unit 35 for taking out the component Wp from the wafer supply position Pp. The component take-out unit 35 has a take-out head 36 that takes out the component Wp from the wafer supply position Pp, and can drive the take-out head 36 in the XY directions. That is, the component extraction unit 35 includes a support member 351 that supports the extraction head 36 so as to be movable in the conveyance direction X, and an X-axis motor 352 that is provided in the conveyance direction X and drives a ball screw attached to the extraction head 36. The take-out head 36 can be moved in the transport direction X by driving the ball screw by the X-axis motor 352. The component take-out unit 35 includes a fixed rail 353 that supports the support member 351 so as to be movable in the width direction Y, a ball screw 354 that is provided in the width direction Y and attached to the fixed rail 353, and a Y that drives the ball screw 354. A shaft motor 355. Therefore, by driving the ball screw 354 by the Y-axis motor 355, the take-out head 36 can be moved in the width direction Y together with the support member 351.

The take-out head 36 has a bracket 361 extending in the transport direction X and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 is positioned at either a suction position facing downward or a delivery position (position in FIG. 1) facing upward by rotating around a rotation axis parallel to the transport direction X. The bracket 361 can be moved up and down with each nozzle 362.

When the nozzle 362 positioned at the suction position is opposed to the component Wp on the wafer supply position Pp from above, the component supplier 3 lowers the nozzle 362 to contact the component Wp. Furthermore, the component supply unit 3 sucks the component Wp from the wafer supply position Pp by raising the nozzle 362 while applying a negative pressure to the nozzle 362. And the components supply part 3 supplies the components Wp by positioning the nozzle 362 in a delivery position.

The component mounting apparatus 10 includes mounting

units

4A and 4B that mount the component Wp thus supplied by the component supply unit 3 on the substrate B. In particular,

M mounting portions

4A and 4B are provided in a one-to-one correspondence with M mounting positions P2 and P4 (as described above, M = 2 in the example of FIG. 1). That is, the mounting portion 4A is provided corresponding to the mounting position P2, and the mounting portion 4B is provided corresponding to the mounting position P4. The mounting

portions

4A and 4B include a support member 41 movable along a fixed rail provided in the width direction Y on the ceiling of the component mounting apparatus 10, and a mounting head supported by the support member 41 so as to be movable in the transport direction X. 42 and a head drive unit (not shown) by moving the mounting head 42 in the XY directions. The mounting head 42 has two nozzles 421 facing downward, and the nozzle 421 can be moved in the XY directions by the movement of the mounting head 42 by the head driving unit.

When picking up, recognizing and mounting the component Wp, each of the mounting

portions

4A and 4B moves above the take-out head 36 and moves the nozzle 421 from above with respect to the component Wp held by the nozzle 362 located at the delivery position. When facing each other, the nozzle 421 is lowered and brought into contact with the component Wp. Subsequently, the component supply unit 3 releases the negative pressure of the nozzle 362, and the mounting

units

4A and 4B raise the nozzle 421 while applying a negative pressure to the nozzle 421. Thus, the nozzle 421 receives the component Wp from the component supply unit 3 and holds it by suction. Then, the movement of the mounting head 42 by the head drive unit causes the nozzle 421 holding the component Wp to move to a desired movement destination via the upper position of the component recognition camera 5, so that the component Wp moves to the mounting positions P 2 and P 4. Positioned above the substrate B. As described above, in the present embodiment, the component Wp is conveyed from the component supply unit 3 to the destination by the mounting head 42 while being held by the nozzle 421. In this way, the component Wp that has been conveyed to the movement destination, that is, the position above the mounting target point, is mounted on the substrate B by the nozzle 421, and component mounting is performed.

The

component recognition cameras

5 and 5 described above are fixed at predetermined positions. The component Wp and the nozzle 421 that are sucked and held by the nozzle 421 are imaged, and a signal of the captured image (hereinafter referred to as “component image”) is subjected to image processing. Output to the unit 150. This component image is used not only when the movement state of the component Wp is recognized by recognizing the holding state of the component Wp by the nozzle 421 during the movement of the nozzle 421, but also when the component Wp is inspected as will be described in detail later. Is also used.

Furthermore, the component mounting apparatus 10 is provided with a display unit 7 (FIG. 2) that functions as an interface with the operator. The display unit 7 is connected to the control unit 100 and has a function as an input terminal configured by a touch panel and receiving an input from an operator, in addition to a function of displaying an operation state of the component mounting apparatus 10.

Next, the configuration of the control unit 100 will be described with reference to FIG. The control unit 100 is provided at a proper position inside the apparatus main body, and is a well-known CPU (Central Processing Unit) for executing logical operations, a ROM (Read Only Memory) for storing initial settings, and various devices during operation of the apparatus. It is composed of RAM (Random Access Memory) that temporarily stores data.

Functionally, the control unit 100 includes an arithmetic processing unit 110, a storage unit 120, a motor control unit 130, an external input / output unit 140, an image processing unit 150, and the like. Among these, the motor control unit 130 controls driving of motors provided in the conveyors 21 to 25, the wafer drawing unit 33, the take-out head 36 and the head driving unit. The external input / output unit 140 inputs signals from various sensors mounted on the component mounting apparatus 10, and outputs signals to various actuators mounted on the component mounting apparatus 10. The image processing unit 150 receives an image signal from the component recognition camera 5 and performs various image processing on the component image to generate a component image suitable for component recognition and component inspection.

The storage unit 120 stores a program for performing component mounting processing, a board position in each mounting turn, mounting data indicating a mounted component and a mounting position, and a component image.

The arithmetic processing unit 110 has an arithmetic function such as a CPU and the like, and controls the motor control unit 130 and the image processing unit 150 in accordance with the program and mounting data stored in the storage unit 120, so that the nozzle 421 to the component supply unit 3, suction holding of the component Wp supplied from the component supply unit 3 by the nozzle 421, movement of the nozzle 421 holding the component Wp to the destination, and the component recognition camera 5 during the movement Component mounting by repeating a series of operations (hereinafter referred to as “mounting turn”) consisting of component recognition based on the captured component image, movement of the nozzle 421 holding the component Wp to the destination, and mounting of the component Wp on the board B I do. Further, the arithmetic processing unit 110 performs the inspection of the component Wp in parallel during the execution of the mounting turn. In this component inspection, as will be described in detail below, the outer shape information of the component Wp is acquired based on the component image (outer shape information acquisition step), and the inspection region of the component Wp is specified from the outer shape information (inspection region specifying step). ), Whether or not an abnormality of the component Wp has occurred in the inspection region is inspected (inspection process). These processes are performed by the arithmetic processing unit 110, and the arithmetic processing unit 110 functions as an outer shape information acquisition unit 111, an inspection region specifying unit 112, and a component inspection unit 113.

Next, the operation of the component mounting apparatus 10 configured as described above will be described with reference to FIGS. FIG. 3 is a flowchart showing the operation of the component mounting apparatus of FIG. FIG. 4 is a diagram schematically showing the main steps of the mounting turn. In the component mounting apparatus 10, the arithmetic processing unit 110 controls each part of the apparatus as follows according to the program stored in the storage unit 120, and repeats the mounting turn for each of the mounting

parts

4A and 4B. In addition, the component inspection is performed while the component Wp is held by the nozzle 421 and is conveyed from the component supply unit 3 to the movement destination, that is, the position above the mounting target point. Therefore, in order to clearly distinguish the inspection step related to the component inspection from the mounting step related to the component mounting, a dot is attached to the inspection step for reference, and in the following, first, by the mounting unit 4A excluding the inspection step. The mounting step will be described, and then the inspection step will be described in detail. Since the mounting step and the inspection step by the mounting unit 4B are basically the same, the description thereof is omitted here.

Mounting data for executing the mounting turn by the mounting unit 4A is created (step S1), and the following mounting turn is executed accordingly. The mounting head 42 of the mounting unit 4A moves to the component supply unit 3 (step S2), receives the component Wp supplied from the component supply unit 3, and holds it by suction (step S3). This component holding operation is executed for the number of nozzles 421. Here, in order to facilitate understanding of the content of the invention, the description will be continued assuming that the component Wp is sucked and held by only one nozzle 421.

When the suction holding of the component Wp by the nozzle 421 is completed, the mounting head 42 moves upward of the substrate B via the upper position of the component recognition camera 5 (step S4). While the nozzle 421 is moving, the component recognition camera 5 captures an image of the component Wp and the nozzle 421 held by the nozzle 421, and stores, for example, a component image I 1 as shown in the column (a) of FIG. 4 in the storage unit 120. (Step S5). In the figure, reference numeral Id indicates an overall image of the die constituting the component Wp, and reference numeral Ib indicates an image of a bump BP (see FIG. 4) formed on one main surface of the die.

Next, a reference component image I0 that functions as a template that has been acquired in advance and stored in the storage unit 120 is read out. As shown in the column (b) of FIG. 4, the reference component image I0 and the component image I1 are read out. And the X direction component dx, the Y direction component dy, and the rotation direction component dr of the suction deviation of the component Wp are derived, respectively, and based on these, the movement destination of the nozzle 421 is corrected (step S6). . More specifically, in this embodiment, as shown in the column (c) of FIG. 4, the component Wp is mounted on the substrate B so that the bumps BP are finally in contact with the wiring WR on the substrate B. Therefore, the coordinate position of each bump image Ib in the component image I1 is obtained, and these are compared with the coordinate position of each bump image Ib in the reference component image I0, whereby the X direction component dx, the Y direction component dy, and the rotation direction component dr. Are used to correct the movement destination. Accordingly, the movement destination and the rotation angle of the nozzle 421 holding the component Wp are adjusted by this correction, and the component Wp is positioned with the proper component posture above the mounting target point as shown in the column (c) of FIG. After that (step S9), the component Wp is mounted on the substrate B from the nozzle 421 (step S10). As a result, the bump BP is accurately positioned with respect to the wiring WR formed in advance on the substrate B and mounted on the substrate B.

Next, inspection steps related to component inspection will be described. While the mounting turn is performed as described above, component inspection (step S7), inspection result determination (step S8), and defective component disposal (step S11) are executed. More specifically, component inspection is performed in parallel with the correction of the movement destination and the movement of the nozzle 421 to the corrected movement destination (step S7).

FIG. 5 is a flowchart showing the component inspection operation executed during the mounting turn. In this component inspection, the component image I1 is read from the storage unit 120 (step S701), and based on the component image I1, whether there is an abnormality in the edge portion or corner portion of the component Wp, cracks, scratches, etc. You can check whether or not. In the present embodiment, the edge portion and the corner portion of the component Wp are used as the inspection region. Here, in the component recognition, since the coordinate position of the bump BP is obtained, it is conceivable to specify the inspection region based on the coordinate position. However, as described above, since the variation of the dicing position is unavoidable, the position of the inspection region K with respect to the entire die image Id differs depending on the dicing position, as shown in FIG. Therefore, when the inspection region K is specified according to the rule that the inspection region K is located at a predetermined distance from the bump BP, the inspection region K is, for example, as shown in the column (a) of FIG. By inspecting the region K, it may be possible to inspect abnormalities such as cracks, chips and scratches. However, if the position of the bump BP in the component Wp is displaced due to the variation of the dicing position, as long as the above rules are followed, the inspection region K is deviated from the entire image Id as shown in the column (b) of FIG. As shown in the column (c) of the figure, the inspection region K may become close to the circuit configuration such as the bump BP and become undetectable.

Therefore, in the present embodiment, by executing the series of processes shown in FIG. 5, the inspection region K is accurately and appropriately identified without being affected by fluctuations in the dicing position, and the parts Wp in the inspection region K are identified. An abnormality can be inspected. In many cases, there are a plurality of inspection areas K, and the types are also different. Therefore, it is desirable to specify the inspection region K by various approaches. Therefore, in this embodiment, three types of specific algorithms for specifying the inspection area are prepared as shown in FIG. 7, and the eight inspection areas KC1 to KC4 and KE1 to KE4 shown in FIG. 8 are combined with the above specific algorithm. The component Wp is identified and inspected.

FIG. 7 is a diagram schematically showing an outline of a specific algorithm for specifying an inspection region. In the (a) column of the figure, the first specifying algorithm and the second specifying algorithm are shown. In these, the outer shape center coordinates (xd, yd) of the part Wp are obtained as the “outer shape information” and “outer shape center information” of the present invention from the entire image Id of the die. Further, the X direction distance Lx and the Y direction distance Ly from the outer shape center coordinates (xd, yd) and the outer shape center coordinates (xd, yd) are obtained as specific information for specifying the center coordinates (xk, yk) of the inspection region K. And stored in the storage unit 120. The difference between the first specifying algorithm and the second specifying algorithm is only the method of deriving the outer shape center coordinates (xd, yd), and the other points are the same. Specifically, the first specific algorithm derives based on the edge information of the four sides of the entire image Id, whereas the second specific algorithm derives based on the edge information of the four corners of the entire image Id. doing.

On the other hand, the third specific algorithm is shown in the (b) column of FIG. Here, one corner coordinate (xc, yc) of the plurality of corners included in the overall image Id of the die is obtained as the “outer shape information” of the present invention, and the corner coordinate (xc, yc) and The X-direction distance Lx and the Y-direction distance Ly from the corner coordinates (xc, yc) are obtained as specific information for specifying the center coordinates (xk, yk) of the inspection region K and are stored in the storage unit 120. Thus, in this embodiment, it is possible to select from three specific algorithms.

Referring back to FIG. 5, the description of the component inspection operation (step S7) will be continued. In the next step S702, one of the inspection areas KC1 to KC4 and KE1 to KE4 is selected as an inspection target, and a specific algorithm for specifying the selected inspection target is selected from the above three specific algorithms. . Then, it is determined whether specific information has already been obtained and registered in the storage unit 120 according to the selected specific algorithm (step S703), and steps S704 to S706 are executed according to the determination result. For example, when the specific information is not registered (“NO” in step S703), specific information for specifying the examination region is obtained according to the selected specific algorithm (step S704) and registered in the storage unit 120. (Step S705). On the other hand, if the specific information is already registered (“YES” in step S703), the registered specific information is read from the storage unit 120 and acquired (step S706).

When the specific information corresponding to the inspection area is acquired by executing the above steps S703 to S706, the inspection area is specified based on the specific information. That is, the position offset from the outer shape center coordinates (xd, yd) and the corner coordinates (xc, yc) by the X-direction distance Lx and the Y-direction distance Ly is the center coordinates of the inspection region, and the inspection is performed in the part image I1. Image data corresponding to the region is extracted as inspection data (step S707). Then, based on the inspection data, it is inspected whether the inspection area includes an abnormality such as a crack, a chip or a scratch (step S708). If an abnormality is found in step S708, it is immediately determined that the part Wp is defective without inspecting the parts in other inspection areas (step S710), and the part inspection (step S7) is ended. To do.

On the other hand, if no abnormality is found in step S708, it is determined whether or not the parts have been inspected for all the inspection areas KC1 to KC4 and KE1 to KE4 (step S711). Here, while an uninspected inspection area exists (“NO” in step S711), the above-described series of processing (steps S702 to S709) is repeatedly executed. If no abnormality is found in all the inspection areas KC1 to KC4 and KE1 to KE4 (“YES” in step S711), it is determined that the component Wp is a non-defective product (step S712). This inspection (step S7) is completed.

When the component inspection is completed in this way, as shown in FIG. 3, before the mounting head 42 reaches the destination, it is determined whether the result of the component inspection is a non-defective product or a defective product (step S8). ). Here, when it is determined that the component Wp sucked and held by the nozzle 421 is a non-defective product, the mounting head 42 continues to move so that the component Wp is positioned (step S9) and mounted on the board B (step S9). S10) is executed. On the other hand, when it is determined that the component Wp sucked and held by the nozzle 421 is a defective product, the mounting of the component Wp is stopped and the component Wp is discarded in a defective product collection unit (not shown) ( Step S11).

Thus, since the mounting turn is completed, the process returns to step S1 and the next mounting turn process is repeatedly executed.

As described above, according to the present embodiment, on the basis of the component image I1 captured by the component recognition camera 5, the movement destination of the nozzle 421 is corrected to increase the mounting accuracy of the component Wp on the board B and the component. Wp inspection is performed. Thus, recognition for component mounting (derivation of X-direction component dx, Y-direction component dy and rotational direction component dr of suction deviation) and recognition for component inspection (identification of inspection regions KC1 to KC4, KE1 to KE4 and (Acquisition of inspection data) can be performed at a time, so that a decrease in yield can be prevented without causing tact loss. In addition, since the inspection areas KC1 to KC4 and KE1 to KE4 are specified based on the external shape information of the part Wp for the part inspection, even if the dicing position on the wafer W is changed, the inspection areas KC1 to KC1 KC4 and KE1 to KE4 can be reliably identified, and the occurrence of abnormality in each of the inspection areas KC1 to KC4 and KE1 to KE4 can be inspected satisfactorily.

Also, three different specific algorithms are prepared, and one of three types of external shape information can be selectively acquired for the same part Wp. As described above, the outer shape information is selectively acquired for each of the inspection areas KC1 to KC4 and KE1 to KE4, and then the inspection area is specified. Therefore, the inspection areas KC1 to KC4 and KE1 to KE4 can be accurately obtained, and the inspection accuracy can be further increased. Further, the inspection areas KC1 to KC4 and KE1 to KE4 are specified while selecting three specific algorithms in this way, so that inspection data with high robustness can be obtained. For this reason, the inspection of the component Wp can be performed stably.

In the present embodiment, since the presence / absence of occurrence of abnormality is inspected for a large number of inspection areas KC1 to KC4 and KE1 to KE4, the quality determination of the part Wp can be performed with high accuracy, and defective products can be reliably removed, Only the non-defective component Wp can be mounted on the substrate B, and a highly reliable product can be provided.

As described above, in the present embodiment, the component recognition camera 5 and the head driving unit correspond to examples of the “imaging unit” and the “nozzle driving unit” of the present invention, respectively. The combination functions as the “component conveying device” of the present invention. Also, steps S3, S5, and S6 in FIG. 3 correspond to examples of the “component holding process”, “imaging process”, and “movement destination correction process” of the present invention, respectively, and steps S4 and S9 correspond to the “nozzle of the present invention”. This corresponds to an example of the “movement process”. Further, steps S703 to S706 in FIG. 5 correspond to an example of the “external shape information acquisition process” of the present invention, and steps S707 and S708 correspond to examples of the “inspection area specifying process” and the “inspection process” of the present invention, respectively. doing.

The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention. For example, in the above-described embodiment, a case where a rectangular die in a plan view is used as the part Wp, that is, “N” in the present invention is 4, but dies with N = 3, 5, 6,. The present invention can also be applied to the case of the component Wp.

In the above embodiment, the eight inspection areas KC1 to KC4 and KE1 to KE4 are inspected, but the number, shape, position, etc. of the inspection areas are arbitrary.

In the above embodiment, three specific algorithms are used, but the number of specific algorithms is not limited to this and is arbitrary.

In the above-described embodiment, the component recognition camera 5 is fixed, and the component is imaged when the mounting head 42 passes above the component recognition camera 5, but a so-called scan camera is attached to the mounting head 42 and mounted. A component image may be acquired by a scan camera while the head 42 is moving.

In the above-described embodiment, the component inspection (step S7) is performed in parallel with the movement correction operation and the movement operation of the nozzle 421 to the corrected movement destination. It may be configured to execute the component inspection (step S7) only in parallel.

In the above embodiment, the present invention is applied to the component mounting apparatus 10 including the two mounting

portions

4A and 4B. However, the number of mounting portions is not limited to this and is arbitrary.

Moreover, in the said embodiment, although the components Wp supplied from the component supply part 3 are conveyed as it is to the upper position of the board | substrate B as it is, after conveying to the upper position of a board | substrate via a flux application part, the said component is carried out. The component conveying device (= mounting head 42 + component recognition camera 5 + head driving unit + control unit 100) according to the present invention may be applied to a component mounting apparatus that is mounted on a substrate and mounted. Further, the application target of the component conveying apparatus is not limited to this, and may be applied to a chip sorter described in Patent Document 2, for example.

Furthermore, in the above-described embodiment, the present invention is applied to an apparatus using a die supplied from a wafer divided into a plurality of dies by dicing as a component, but the application target of the present invention is not limited to this. Absent. For example, the present invention can also be applied to a component transport apparatus that transports stored components that are stored in advance in a component storage body such as a tray or a tape, and a component mounting apparatus that includes the component transport apparatus. In other words, the external information of the storage component is acquired based on the component image of the storage component, the inspection region of the storage component is specified from the external shape information, and then it is inspected whether the storage component has an abnormality in the inspection region. You may comprise. Accordingly, it is possible to reliably specify the inspection area of the storage component, and it is possible to satisfactorily inspect the occurrence of abnormality in each inspection area.

The present invention can be applied to general component conveying technology for picking up a component and conveying it to a predetermined destination, and component mounting technology for conveying a component using the component conveying technology and mounting it on a substrate.

3 ...

Component supply unit

4A, 4B ... Mounting unit 5 ... Component recognition camera (imaging unit)
DESCRIPTION OF SYMBOLS 10 ... Component mounting apparatus 42 ... Mounting head 421 ... Nozzle 100 ... Control part 111 ... External shape information acquisition part 112 ... Inspection area specific | specification part 113 ... Component inspection part B ... Board | substrate I1 ... Component image K, KC1-KC4, KE1-KE4 ... Inspection area Lx ... Distance in X direction Ly ... Distance in Y direction W ... Wafer Wp ... Parts

Claims

A nozzle that receives and holds a component supplied from a component supply unit, an imaging unit that images the component held by the nozzle, and a nozzle drive unit that moves the nozzle holding the component from the component supply unit Component transport that moves the nozzle to the corrected destination after correcting the nozzle destination based on the component image captured by the imaging unit and transports the component A device,
An external shape information acquisition unit for acquiring external information of the component based on the component image;
An inspection area specifying unit for specifying an inspection area of the component from the outer shape information;
A component inspection unit for inspecting whether or not an abnormality of the component has occurred in the inspection region;
The component conveying apparatus, wherein the component is inspected in parallel with at least one of the correction of the movement destination and the movement of the nozzle to the corrected movement destination.
The component conveying apparatus according to claim 1,
The external shape information acquisition unit is a component conveying device capable of acquiring a plurality of different external shape information.
The component conveying device according to claim 2,
When the part has an N shape (where N is a natural number of 3 or more) in a plan view,
The outer shape information acquisition unit can acquire, as the outer shape information, outer shape center coordinates in a plan view of the component and one corner coordinate of a plurality of corner portions included in the component. .
The component conveying device according to claim 3,
The outline information acquisition unit is a component conveying apparatus that acquires the outline center coordinates from N sides or N corners in plan view of the N-shaped part.
It is a component conveying apparatus of Claim 3 or 4,
When there are a plurality of inspection areas of the part,
The outline information acquisition unit selects one of the outline center coordinates and the corner coordinates as the outline information for each inspection region,
The inspection area specifying unit specifies the inspection area based on the outline information selected by the outline information acquisition unit.
The component conveying device according to any one of claims 1 to 5,
The component transport apparatus, wherein the component is the die that is supplied by the component supply unit from a wafer divided into a plurality of dies by dicing.
The component conveying device according to any one of claims 1 to 5,
The component is a component transport device that is the storage component supplied by the component supply unit from a component storage body that stores a plurality of storage components.
A component holding step for receiving and holding the component by the nozzle;
An imaging step of imaging the component held by the nozzle;
A movement destination correction step of correcting the movement destination of the nozzle based on the component image acquired by the execution of the imaging step;
A nozzle moving step of moving the nozzle holding the component to the corrected destination;
An outline information acquisition step of acquiring outline information of the part based on the part image;
An inspection area specifying step for specifying an inspection area of the component from the outer shape information;
A component comprising: an inspection step for inspecting whether or not an abnormality of the component has occurred in the inspection region in parallel with at least one of the movement destination correction step and the nozzle movement step. Transport method.
A component supply unit for supplying components;
The component conveying device according to any one of claims 1 to 7,
When it is determined by the component inspection unit that no abnormality of the component has occurred, it is determined that an abnormality of the component has occurred while the component is mounted on the board by the nozzle that has moved to the destination. And a controller for stopping the mounting of the component on the substrate.