200945978 六、發明說明： 【發明所屬之技術領域】 本發明關於網版印刷裝置，特別關於將錫球印刷於基 板面上的錫球印刷裝置。 【先前技術】 100〜180μιη間距之球凸塊形成（直徑 50〜ΙΟΟμιη) 〇 之中’習知有使用周知之高精確度網版印刷裝置，印刷錫 膏（Solder Cream )之後施予回流，而實施錫球形成的印 刷法。作爲網版印刷裝置之一例，係具備：基板搬入輸送 帶’基板搬出輸送帶，具備升降機構的平台部，具有轉印 圖案作爲開口部的遮罩，刮膠刀（squeegee )，具備刮膠 刀升降機構及水平方向移動機構的刮膠刀頭，及控制彼等 機構的控制裝置。 基板由基板搬入輸送帶被搬入裝置內之後，將基板暫 © 時定位、固定於印刷平台部，之後，使基板與具有對應於 電路圖案之開口部的遮罩（網版）雙方之標記（mark )以 攝影機辨識，進行雙方位移量之位置補正，將基板定位於 網版之後，使基板接觸於網版而上升印刷平台部，藉由刮 膠刀使網版接觸基板之同時，使錫膏等之焊接糊（paste) 塡充於網版之開口部，之後，使平台部下降，使基板與網 版分離（版分離）而將焊接糊轉印至基板上之後，由裝置 搬出基板而完成印刷。 又，將錫球撥入以高精確度、被施予微細開孔加工而 -5- 200945978 成的治具’以特定間距整齊排列直接移載於基板上，載置 之後，施予回流而完成錫球形成的錫球撥入法爲習知者。 另外，依據專利文獻1揭示，使遮罩搖動或振動而將 錫球塡充至特定開口的方法、或藉由刷取（brush )之並 行前進運動等施予塡充之後，進行加熱工程的方法。另外 ，依據專利文獻2揭示，使錫球載置於托盤上，以管子吸 附對電極焊墊進行再度塡充的方法。 專利文獻1 :特開2000-491 83號公報 _ 專利文獻2:特開2003-309139號公報 【發明內容】 (發明所欲解決之課題） 錫膏印刷法之設備成本低，可以整批形成大量之凸塊 ，具有作業效率高、製造成本低之優點。但是，印刷法對 於轉印體積之均勻性確保困難，顫動處理引起之，進行回 流後之錫球凸塊（solder bump )之按壓，進行高度之平滑 化處理，工程數變多，需要花費設備成本之問題存在。另 外，伴隨裝置之高密度化，進展至1〇〇〜15〇μιη間距等之 微細化（fine )實，印刷良品率變差，生產性不佳之問題 存在。 另外，錫球撥入法係藉由錫球之分級精確度確保可以 進行穩定之高度之凸塊形成，但是使用高精確度之錫球吸 附治具，藉由機器人整批塡充，超細化時之加工時間（ tact )之增大，治具、設備價格上升將導致凸塊形成成本 -6 - 200945978 增大之問題。 另外，如專利文獻1揭示之使網版搖動或振動而將錫 球塡充至特定開口的方法之中’伴隨錫球粒徑之小徑化’ 會發生粒子間之范德瓦爾斯力（Vander Waals Force)引 起之密接現象或靜電氣引起之吸附現象’導致無法對遮罩 開口部進行塡充之問題存在。另外’同樣’藉由刮膠刀或 刷取之並行前進運動等之塡充亦存在同樣問題。 φ 另外，於專利文獻2之方法，雖可修補’但殘存之助 焊劑之量變少之可能性極大’整批回流時，焊錫之潤濕性 變差即使錫球溶解，對於電極焊墊部之焊接變爲不完全’ 有可能發生潤濕不良之情況。 本發明目的在於解決上述課題，提供一種錫球塡充用 印刷裝置，其係於助焊劑印刷後，藉由檢測助焊劑之狀態 ，進行修補，如印刷法般使整批大量之凸塊形成爲可能’ 而且，如錫球撥入法般使均勻之高度之凸塊形成爲可能’ 〇 便宜、可以高速有效印刷、塡充的，可以形成高生產性之 超微細間距之凸塊。 (用以解決課題的手段） 爲達成上述目的，本發明之錫球印刷裝置’係由以下 構成：助焊劑印刷部，將助焊劑印刷於基板之電極焊墊上 :錫球塡充·印刷部，對被印刷有上述助焊劑的電極上供 給錫球；及檢測·修補部，檢測被印刷有錫球之基板之狀 態，對應於不良狀態而進行修補；其特徵爲：在上述助焊 200945978 劑印刷部與上述錫球塡充.印刷部之間，設置助焊劑檢測 •修補部，用於檢測被印刷有助焊劑之基板之狀態，對應 於不良狀態而進行修補；上述錫球塡充.印刷部，係具備 :對上述基板供給錫球的網版（screen);及印刷手段， 具有縫隙狀體用於對上述網版塡充錫球。 另外，上述錫球塡充·印刷部，係具備：載置基板、 帶有磁性的印刷平台；接觸於上述基板、對該基板之電極 上供給錫球的具有開口部之金屬製之上述網版；配置於上 q 述網版之上方，對上述網版之開口部塡充錫球的，金屬製 之具有上述縫隙狀體之印刷手段；將上述印刷平台與上述 網版之磁氣吸引力設爲大於上述網版與上述縫隙狀體之磁 氣吸引力。 另外，上述印刷平台具有鈸（Nd)製磁鐵，上述網版 係由鎳形成，上述印刷手段之縫隙狀體係由SUS 3 04形成 〇 另外，上述印刷平台與上述網版間之磁氣吸引力設爲 © 10〜lOOgf/cm2，上述網版與上述縫隙狀體間之磁氣吸引力 設爲 0.1 〜10gf/cm2。 另外，於上述印刷平台被設置有表面磁通密度500〜 2000G之銨製磁鐵。 【實施方式】 以下參照圖面說明本發明之印刷裝置及凸塊形成方法 之較佳實施形態。圖1爲助焊劑印刷部及錫球塡充·印刷 -8- 200945978 部中之印刷工程之槪要’圖1(a)表示助焊劑印刷工程’ (b)表示錫球塡充·印刷之狀況° 於圖1 (a)，在和事先設於基板21的電極焊墊22之 位置與形狀對應而設有開口部的助焊劑印刷用網版20上 載置助焊劑，藉由移動刮膠刀3而於基板21的電極焊墊 22上印刷特定量的助焊劑23。 本實施形態中，網版20係助焊劑印刷用之網版，使 ❹ 用以能確保高精確度圖案的方式，藉由加成法（additive )製作之金屬網版。刮膠刀3係使用角形刮膠刀、劍形刮 膠刀或扁平型刮膠刀。對應於助焊劑23之黏度/觸變性而 設定網版間隙與印壓及刮膠刀速度而進行印刷動作。助焊 劑23之印刷量太少時，塡充錫球24時錫球無法附著於電 極焊墊22上，亦成爲錫球印刷後之後工程、亦即回流時 成爲焊接潤濕不良之主要原因’無法形成漂亮形狀之錫球 凸塊，成爲錫球凸塊高度不良或焊接強度不足的主要原因 ❹ 助焊劑2 3之印刷量太多時’錫球塡充·印刷時，助 焊劑23有可能附著於’使錫球24供給至電極焊墊22上 的後述說明之網版20b上被設置的開口部2〇d等。助焊劑 23附著於網版開口部時，錫球24會附著於網版之開口部 2〇d，而發生無法轉印至電極焊墊22上的問題。如上述說 明，助焊劑印刷，乃錫球塡充品質中具有最重要因素的工 程。 之後，如圖1 ( b )所示，藉由具備塡充單元6〇 (印 -9- 200945978 刷手段）（參照圖7)的錫球塡充·印刷部之主要部份’ 在印刷有助焊劑23的基板21之電極焊塾22上’進行24 之塡充.印刷。爲將1個個錫球24供給至各電極焊墊22 ，網版20b具有開口部20d ’將該開口部20d定位於電極 焊墊22上的狀態下進行供給。因此，可以保障高精確度 之圖案位置精確度，以加成法製作的金屬網版。 錫球24不致於潛入基板21與網版20b之間，不會成 爲多餘之錫球不良’而使基板21與網版20b之間隙大略 成爲〇的方式，使用銨製磁鐵作爲載置基板21的印刷平 台1〇(磁鐵平台），該錫球塡充用之網版2 0b之材質’係 以被來自印刷平台1 〇之磁力吸引的方式，作爲磁性體材 料而使用鎳。 另外，於網版2 0b之背面（和基板21接觸之側）， 在助焊劑23被印刷完成後之基板21密接時，使助焊劑23 之溢出部分不會附著於網版開口部20d之周圍，而使鎳製 之微小的多數個支柱（柱部構造）20a和網版20b成形爲 —體。據此而構成助焊劑23之溢出部分之逃離部。另外 ，即使構成該逃離部，藉由印刷平台1〇之磁氣吸附力， 基板2 1與網版20b之背面間之間隙和錫球直徑比較變爲 極小，而使錫球不致於滲入予以近接者。 又，爲以高精確度對特定位置之電極焊墊22供給錫 球24，於基板21之4個角部設置定位標記（未圖示）。 對應於基板2 1側設置之定位標記，於網版20b側亦設置 定位標記。彼等定位標記藉由CCD攝影機15(參照圖4 -10- 200945978 )之視覺辨識，使網版20b側設置之定位標記之位置’與 基板21側設置之定位標記之位置一致’而實施高精確度 之定位。於本實施形態中，定位係使搭載基板2 1的印刷 平台10移動於水平方向而進行。 定位結束後，窄化基板21與網版2〇b間之間隔，使 網版20b接觸於基板21’作動塡充單元（印刷手段）60’ 將錫球24塡充於網版20b之開口部20d，由此而對助焊劑 φ 23被印刷完成的基板21面上之電極焊墊22供給。於錫球 供給用之塡充單元60 (參照圖7)之下部側設有縫隙狀體 63，藉由塡充單元60之搖動、前進動作，按壓、轉動錫 球24賦予旋轉、振動，而塡充於網版之開口部2〇d。 圖2爲錫球印刷裝置之之一實施形態之工程說明圖。 圖示之裝置，係將助焊劑印刷部1 〇 1、助焊劑檢測·修補 部1 02、錫球塡充.印刷部1 〇3、錫球搭載檢測·修補部 104構成爲一體者。但是亦可將上述各部位構成爲單獨裝 ❹ 置。另外，亦可將助焊劑檢測·修補功能附加於錫球搭載 檢測.修補部而構成。本裝置中’首先’藉由助焊劑印刷 部（網版印刷方式）1 〇 1對基板21之各電極焊墊2 2印刷 助焊劑2 3。之後，介由搬送輸送帶（由助焊劑印刷部側看 爲搬出輸送帶，由錫球塡充·印刷部看爲基板搬入輸送帶 )，藉由錫球塡充·印刷部103介由網版20b對電極焊墊 22供給錫球24。 又，助焊劑印刷部1 〇 1與錫球塡充.印刷部1 03之大 爲不同部分在於印刷頭部’助焊劑印刷部1 ο 1 ’係由刮膠 -11 - 200945978 刀構造，錫球塡充·印刷部l〇3係由供給錫球的塡充單元 60構成。檢測.修補部1〇2、104之印刷頭部成爲分散型 之吸引·供給頭部構造。另外，於檢測·修補無須使用網 版，因此未設置網版安裝用之版框承受器等。 圖3爲本實施形態中之凸塊形成之流程。基板搬入（ STEP1 )後，於電極焊墊22上印刷特定量之助焊劑（ STEP2 )。之後，檢測助焊劑印刷後之電極焊墊表面狀態 (STEP3)。檢測不良（NG)時，對NG部分再度供給助 焊劑進行修補之同時，將NG資訊回授至助焊劑印刷部 101，藉由版下清掃裝置45自動實施網版清掃（STEP4) 成爲NG之上述，不實施錫球印刷以後之工程，而送 將NG信號之同時，於後續工程之輸送帶上待機而可以排 出生產線外。輸出線上之NG基板自動倉儲等整箱整批予 以排出而構成亦可。NG基板於生產線外之工程實施洗淨 後，可以再度使用於助焊劑印刷。 © 之後，實施錫球塡充·印刷（STEP5 )。錫球塡充· 印刷後，版分離之前由網版上方對網版開口內之錫球塡充 狀況進行檢測（STEP6 )。檢測結果存在塡充不足之處時 ，在版分離之前再度執行錫球塡充·印刷動作（STEP7 ) 。如此則，可以提升錫球塡充率。 於STEP 6，結果爲ΟΚ (狀況良好）時執行版分離（ STEP8)。之後，於錫球塡充後之檢測·修補裝置1〇4檢 測塡充狀況（STEP9 )。塡充狀況檢測爲NG時，助焊劑 -12- 200945978 供 ) 球 之 ❹ 受 張 圖 膠 刮 Φ 手 平 〇 由 用 10 方 給之上、對NG點之電極焊墊部再度供給錫球（STEP10 。塡充狀況檢測爲OK時，於回流裝置（未圖示）使錫 再溶融，而完成錫球凸塊。 圖4爲本發明之網版印刷裝置（主要爲助焊劑印刷部 之槪略構成圖。圖4(a)爲由網版印刷裝置正面看之圖 (b)爲系統構成圖。圖5(a) 、（b)爲網版印刷裝置 動作說明圖。 於本體框架1設置版框承受器（未圖示）。於版框承 器被設定，以印刷圖案作爲開口部而持有的網版20被 貼於版框20c(參照圖6)而成的遮罩’如此而構成。 中，於網版20之上方，配置設有刮膠刀3的印刷頭部2 助焊劑印刷部1 0 1時，於印刷頭部2安裝尿烷製之刮 刀3。錫球塡充·印刷部1 〇 3時，於印刷3頭部2取代 膠刀3改爲安裝縫隙狀體63等構成之塡充單元（印刷 段）6 0。印刷頭部2，係藉由印刷頭部移動機構6朝水 方向，藉由印刷頭部升降機構4朝上下可以移動而構成 藉由將刮膠刀3替換爲塡充單元6〇 ’塡充單元60可藉 印刷頭部升降機構4朝上下方向可以移動。 於網版20之下方’和網版20呈對向設置印刷平台10 於載置、保持印刷對象物、亦即基板21 °該印刷平台 具備：ΧΥΘ平台11，用於使基板21朝水卒方向（ΧΥΘ 向）移動而進行與網版20間之定位；及平台升降機構 ，用於由搬入輸送帶25受取基板21’且使基板21近接 -13- 12 200945978 或接觸網版20面。 於印刷平台10之上面設置基板受取輸送帶26，使搬 入輸送帶25所搬入之基板21傳遞至印刷平台1 0上，印 刷結束後將基板21排出至基板搬出輸送帶27。 於網版印刷裝置具備自動進行網版20與基板21之定 位的功能。亦即，藉由CCD攝影機1 5攝取分別設於網版 20與基板21之定位標記，進行影像處理求出位置偏移量 ，驅動ΧΥΘ平台11以補正該偏移量而進行定位。 另外，版分離控制部39或各部之驅動控制部等所構 成之印刷控制部36，或具備用於處理CCD攝影機15之影 像信號之影像輸入部37的印刷機控制部30，係設於印刷 機本體框架內部，控制用資料之改寫、或印刷條件變更等 之進行之資料輸入部50，或監控印刷狀況等或取入之辨識 標記的顯示部40，係配置於印刷機外側。 於印刷機控制部30具有印刷控制部36用於控制塡充 單元60，可依據生產之凸塊之間距或錫球粒徑差異及使用 之金靥遮罩種類，簡單選擇、設定適宜之塡充·印刷模態 〇 另外，具備：對應於輸入影像計算相關値的相關値計 算部31;或依據取入之影像或來自辭典38的資料來計算 形狀的形狀推定部32;求出位置座標的位置座標運算部 33;及尺寸計算部34;由CCD攝影機15攝影之資料，依 據設於基板21與網版20之位置辨識標記，統合算出位置 偏移量’依據ΧΥΘ平台控制部之指令驅動ΧΥΘ平台1 i而 200945978 進行定位之構成。 以下以錫球塡充.印刷部爲例說明印刷裝置之動作。 形成有錫球凸塊的基板21，係藉由搬入輸送帶25被供給 至基板受取輸送帶26。基板21被搬送至印刷平台10之位 置後’上升印刷平台10，由基板受取輸送帶26將基板21 傳送至印刷平台1 0上。傳送至印刷平台1 0的基板21，係 被固定於印刷平台10之特定位置。基板21固定後，使 Q C CD攝影機15移動至事先登錄設定之基板標記位置。該 狀況如圖5 ( a )所示。 之後’ CCD攝影機15攝取設於基板21與網版20之 位置辨識標記（未圖示），傳送至印刷機控制部3 0。於印 刷機控制部內之影像輸入部，由影像資料算出網版20與 基板2 1間之位置偏移量，依該結果，印刷機控制部3 0作 動ΧΥΘ平台控制部35而使印刷平台10移動，進行基板 21對網版20之位置修正、定位。200945978 VI. Description of the Invention: [Technical Field] The present invention relates to a screen printing apparatus, and more particularly to a solder ball printing apparatus which prints a solder ball on a surface of a substrate. [Prior Art] Ball bump formation (diameter 50 to ΙΟΟμιη) of 100 to 180 μm pitch is known to use a well-known high-precision screen printing apparatus to apply reflow after printing solder paste (Solder Cream). A printing method for forming a solder ball. An example of a screen printing apparatus includes a substrate loading conveyance belt 'substrate carry-out conveyor belt, a platform portion including an elevating mechanism, a mask having a transfer pattern as an opening portion, and a squeegee blade having a squeegee blade The scraping heads of the lifting mechanism and the horizontal moving mechanism, and the control devices for controlling the mechanisms. After the substrate is carried into the apparatus by the substrate, the substrate is positioned and fixed to the printing platform portion, and then the substrate and the mask (screen) having the opening corresponding to the circuit pattern are marked (mark According to the camera identification, the position of both displacements is corrected, the substrate is positioned on the screen, the substrate is brought into contact with the screen and the printing platform is raised, and the screen is brought into contact with the substrate by the squeegee to make the solder paste, etc. The solder paste is applied to the opening of the screen, and then the platform portion is lowered, and the substrate and the screen are separated (plate separation), and the solder paste is transferred onto the substrate, and then the substrate is carried out by the device to complete the printing. . In addition, the solder ball is transferred to the substrate with a high precision and subjected to micro-opening processing, and the tooling of the -5-200945978 is directly transferred to the substrate at a specific pitch, and after being placed, it is returned by reflow. The solder ball dialing method formed by the solder ball is a well-known person. Further, according to Patent Document 1, a method of heating a project after a mask is shaken or vibrated to fill a tin ball to a specific opening, or a parallel advance motion by a brush or the like is applied. . Further, according to Patent Document 2, a method in which a solder ball is placed on a tray and a counter electrode pad is refilled by a tube is attached. Patent Document 1: Japanese Laid-Open Patent Publication No. 2000-309139 (Patent Document 2: JP-A-2003-309139) SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) The solder paste printing method has low equipment cost and can be formed in a large number in batches. The bump has the advantages of high work efficiency and low manufacturing cost. However, the printing method ensures difficulty in the uniformity of the transfer volume, and is caused by the chattering process, and the solder bump after the reflow is performed, and the height is smoothed, and the number of engineering is increased, which requires equipment cost. The problem exists. In addition, with the increase in the density of the device, the progress to the fineness of the pitch of 1 〇〇 15 15 μm, etc., the printing yield is deteriorated, and the problem of poor productivity is present. In addition, the solder ball dialing method ensures that a stable height of bump formation can be achieved by the classification accuracy of the solder ball, but the high-precision solder ball adsorption jig is used, and the robot is fully replenished and super-fineized. When the processing time (tact) increases, the increase in the price of fixtures and equipment will lead to an increase in the cost of bump formation -6 - 200945978. Further, as disclosed in Patent Document 1, the method of causing the screen to be shaken or vibrated to fill the tin ball to a specific opening is accompanied by a small diameter of the particle diameter of the solder ball, and a van der Waals force between the particles occurs. The adhesion caused by the Waals Force or the adsorption phenomenon caused by the electrostatic gas has caused a problem that the opening of the mask cannot be filled. In addition, the same problem is also caused by the squeegee of the squeegee or the parallel advancement movement of the brush. φ Further, in the method of Patent Document 2, it is possible to repair 'but the possibility that the amount of the remaining flux is small is large'. When the entire batch is reflowed, the wettability of the solder is deteriorated even if the solder ball is dissolved, and the electrode pad portion is Welding becomes incomplete' There is a possibility of poor wetting. An object of the present invention is to solve the above problems and to provide a solder ball printing apparatus which is capable of repairing a flux by detecting the state of a flux after printing, and forming a large number of bumps in a batch like a printing method. ' Moreover, as a solder ball dialing method, it is possible to form a bump of uniform height, which is cheap, can be efficiently printed and filled at a high speed, and can form a bump of ultra-fine pitch with high productivity. (Means for Solving the Problem) In order to achieve the above object, the solder ball printing apparatus of the present invention comprises a flux printing unit that prints a flux on an electrode pad of a substrate: a solder ball filling and printing unit. The solder ball is supplied to the electrode on which the flux is printed; and the detecting and repairing portion detects the state of the substrate on which the solder ball is printed, and repairs it in accordance with the defective state; and is characterized in that the soldering is performed on the soldering 200945978 Between the solder ball and the printing unit, a flux detecting and repairing unit is provided for detecting the state of the substrate on which the flux is printed, and repairing is performed in accordance with the defective state; the solder ball filling and printing unit The screen includes: a screen for supplying a solder ball to the substrate; and a printing means having a slit-like body for filling the screen with a solder ball. Further, the solder ball charging and printing unit includes a mounting substrate and a magnetic printing platform, and the screen having a metal having an opening in contact with the substrate and supplying a solder ball to the electrode of the substrate a printing means for arranging the solder ball on the opening of the screen, and having the slit-shaped body made of metal; and the magnetic attraction of the printing platform and the screen is set at a position above the screen It is a magnetic attraction attraction larger than the above-mentioned screen and the slit-like body. Further, the printing platform has a neodymium (Nd) magnet, the screen is made of nickel, and the slit-like system of the printing means is formed of SUS 3 04. Further, the magnetic attraction between the printing platform and the screen is set. The magnetic attraction force between the above-mentioned screen and the slit-like body is set to 0.1 to 10 gf/cm 2 as ©10 to 100 gf/cm2. Further, an ammonium magnet having a surface magnetic flux density of 500 to 2000 G is provided on the printing platform. [Embodiment] Hereinafter, preferred embodiments of the printing apparatus and the bump forming method of the present invention will be described with reference to the drawings. Figure 1 is a summary of the printing process in the flux printing section and the solder ball filling and printing -8- 200945978. Figure 1 (a) shows the flux printing project. (b) shows the situation of solder ball filling and printing. In FIG. 1(a), the flux printing screen 20 having an opening portion corresponding to the position and shape of the electrode pad 22 provided in advance on the substrate 21 is placed on the flux, and the squeegee is moved by the squeegee blade 3. A specific amount of flux 23 is printed on the electrode pads 22 of the substrate 21. In the present embodiment, the screen 20 is a screen for flux printing, and a metal screen produced by an additive method for ensuring a high-precision pattern. The squeegee 3 uses an angled squeegee, a sword-shaped squeegee or a flat-type squeegee. The printing operation is performed by setting the screen gap, the printing pressure, and the speed of the doctor blade in accordance with the viscosity/thiism of the flux 23. When the amount of printing of the flux 23 is too small, the solder ball cannot adhere to the electrode pad 22 when the solder ball 24 is filled, and it becomes a main cause of poor soldering wetness after the solder ball is printed, that is, when the solder is reflowed. Forming a beautiful shape of the solder ball bump, which is a cause of poor solder bump height or insufficient soldering strength. When the flux of the flux 2 3 is too large, the flux 23 may adhere to the solder ball during printing. The solder ball 24 is supplied to the electrode pad 22, and the opening portion 2〇d or the like provided on the screen 20b described later. When the flux 23 adheres to the opening of the screen, the solder ball 24 adheres to the opening portion 2〇d of the screen, and the problem that the solder ball 22 cannot be transferred to the electrode pad 22 occurs. As described above, flux printing is the most important factor in the quality of solder balls. After that, as shown in Fig. 1 (b), the main part of the solder ball filling and printing section with the charging unit 6 (printing -9-200945978) (see Fig. 7) is helpful in printing. The electrode pad 22 of the substrate 21 of the flux 23 is 'charged and printed 24'. In order to supply one solder ball 24 to each electrode pad 22, the screen 20b has an opening 20d' to supply the opening 20d in a state where it is positioned on the electrode pad 22. Therefore, it is possible to secure a highly accurate pattern positional accuracy, and a metal screen made by an additive method. The solder ball 24 does not sink between the substrate 21 and the screen 20b, and does not become a redundant solder ball defect, and the gap between the substrate 21 and the screen 20b is substantially 〇, and an ammonium magnet is used as the mounting substrate 21. The printing platform 1 (magnet platform), the material of the screen 20b used for the solder ball filling is used as a magnetic material to attract nickel by the magnetic force from the printing platform 1 。. Further, on the back surface of the screen 20b (on the side in contact with the substrate 21), when the substrate 21 after the flux 23 is printed is adhered, the overflow portion of the flux 23 is not adhered to the periphery of the screen opening portion 20d. On the other hand, a plurality of pillars (column structure) 20a and screen 20b which are made of nickel are formed into a body. Accordingly, the escape portion of the overflow portion of the flux 23 is formed. Further, even if the escape portion is formed, the gap between the substrate 21 and the back surface of the screen 20b and the diameter of the solder ball are extremely small by the magnetic attraction force of the printing platform 1〇, so that the solder ball is not infiltrated and is closely connected. By. Further, in order to supply the solder balls 24 to the electrode pads 22 at a specific position with high accuracy, positioning marks (not shown) are provided at the four corners of the substrate 21. Positioning marks are also provided on the side of the screen 20b corresponding to the positioning marks provided on the side of the substrate 2 1 . The positioning marks are visually recognized by the CCD camera 15 (refer to FIG. 4 - 200945978), and the position of the positioning mark set on the side of the screen 20b is 'corresponding to the position of the positioning mark set on the side of the substrate 21' to achieve high precision. Positioning. In the present embodiment, the positioning is performed by moving the printing stage 10 on which the substrate 2 1 is mounted in the horizontal direction. After the positioning is completed, the gap between the substrate 21 and the screen 2b is narrowed, and the screen 20b is brought into contact with the substrate 21' to actuate the charging unit (printing means) 60'. The solder ball 24 is filled in the opening of the screen 20b. 20d, thereby supplying the electrode pad 22 on the surface of the substrate 21 on which the flux φ 23 is printed. The slit-shaped body 63 is provided on the lower side of the charging unit 60 (see FIG. 7) for supplying the solder ball, and the solder ball 24 is pressed and rotated to impart rotation and vibration by the shaking and forward movement of the charging unit 60. Filled with the opening of the screen version 2〇d. Fig. 2 is an explanatory view of an embodiment of an embodiment of a solder ball printing apparatus. In the device shown in the figure, the flux printing unit 1 〇 1, the flux detecting and repairing unit 102, the solder ball filling, the printing unit 1 〇3, and the solder ball mounting detecting/repairing unit 104 are integrated. However, each of the above parts may be constructed as a separate unit. In addition, the flux detection and repair function can be added to the solder ball mounting test and repair unit. In the apparatus, the flux 2 3 is printed on the electrode pads 2 2 of the substrate 21 by the flux printing portion (screen printing method) 1 首先 1 . After that, the conveyor belt (the conveyor belt is seen as the flux printing unit side, and the substrate is carried into the conveyor belt by the solder ball charging and printing unit), and the screen is printed by the solder ball charging/printing unit 103. 20b supplies the solder ball 24 to the electrode pad 22. Further, the flux printing unit 1 〇1 and the solder ball .. The printing unit 203 is different in part from the printing head 'flux printing unit 1 ο 1 ' is made of squeegee-11 - 200945978 knife structure, solder ball The charging/printing unit 10 is composed of a charging unit 60 that supplies a solder ball. The printing heads of the repairing portions 1 and 2, 104 are distributed and have a suction/supply head structure. In addition, it is not necessary to use the screen for detection and repair, so the frame acceptor for screen installation is not provided. Fig. 3 is a flow chart showing the formation of bumps in the embodiment. After the substrate is loaded (STEP1), a specific amount of flux (STEP2) is printed on the electrode pad 22. Thereafter, the electrode pad surface state after the flux printing is detected (STEP 3). In the case of poor detection (NG), the NG portion is again supplied with the flux for repair, and the NG information is fed back to the flux printing unit 101, and the screen cleaning device 45 automatically performs the screen cleaning (STEP4) to become the NG. The project after the solder ball printing is not carried out, and the NG signal is sent at the same time, and it can be discharged on the conveyor belt of the subsequent project and can be discharged outside the production line. It is also possible to arrange the whole batch of NG substrates, such as automatic storage, on the output line. After the NG substrate is cleaned in the project outside the production line, it can be reused for flux printing. © After that, the solder ball is charged and printed (STEP5). After the solder ball is filled and printed, the solder ball filling condition in the screen opening is detected by the top of the screen before the separation (STEP6). When there is a shortage of detection results, the solder ball charging/printing operation (STEP7) is performed again before the separation of the plates. In this way, the solder ball charge rate can be increased. In STEP 6, the result is ΟΚ (good condition) when the version is separated (STEP8). After that, the detection/repair device 1〇4 after the tin ball is filled is used to detect the charge condition (STEP 9). When the detection status is NG, the flux is -12-200945978.) 球 ❹ ❹ ❹ ❹ ❹ 胶 胶 手 手 手 手 手 手 手 手 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( When the detection of the charge condition is OK, the tin is re-melted in a reflow device (not shown) to complete the solder ball bump. Fig. 4 is a screen printing device of the present invention (mainly a composition of the flux printing portion) Fig. 4(a) is a front view of the screen printing apparatus, and Fig. 5(a) and Fig. 5(b) are diagrams showing the operation of the screen printing apparatus. A susceptor (not shown) is configured such that the screen 20 held by the printing pattern as the opening is attached to the stencil 20c (see FIG. 6). In the upper portion of the screen 20, when the printing head portion 2 provided with the doctor blade 3 is provided with the flux printing portion 1 0 1 , the turret blade 3 is attached to the printing head portion 2. The solder ball filling and printing portion At the time of 1 〇3, in place of the printing head 3, the rubber blade 3 is replaced with a charging unit (printing section) 60 which is formed by attaching the slit-shaped body 63. The portion 2 is formed by the printing head moving mechanism 6 in the water direction, by the printing head lifting mechanism 4 moving up and down, by replacing the squeegee blade 3 with the squeezing unit 6 〇 'the charging unit 60 The printing head lifting mechanism 4 is movable in the vertical direction. The lower side of the screen 20 is disposed opposite to the screen 20 to mount and hold the printing object, that is, the substrate 21°. The printing platform includes: The cymbal platform 11 is configured to move the substrate 21 in the direction of the water stroke to perform positioning with the screen 20; and the platform lifting mechanism for receiving the substrate 21' by the loading conveyor 25 and bringing the substrate 21 into proximity - 13- 12 200945978 or contact screen 20 surface. The substrate receiving conveyor belt 26 is disposed on the upper surface of the printing platform 10, and the substrate 21 carried in the loading conveyor 25 is transferred to the printing platform 10, and the substrate 21 is discharged after the printing is completed. The substrate carries out the transport belt 27. The screen printing apparatus has a function of automatically positioning the screen 20 and the substrate 21. That is, the CCD camera 15 picks up the positioning marks provided on the screen 20 and the substrate 21 to perform image formation. At The positional shift amount is obtained, and the target platform 11 is driven to correct the offset to perform positioning. The print control unit 36 including the plate separation control unit 39 or the drive control unit of each unit or the like is provided with a CCD camera for processing. The printer control unit 30 of the video input unit 37 of the image signal of 15 is installed in the inside of the printing machine main body frame, the data input unit 50 for rewriting the control data, changing the printing conditions, or the like, or monitoring the printing status or the like. The display unit 40 for taking in the identification mark is disposed outside the printing machine. The printing machine control unit 30 has a printing control unit 36 for controlling the charging unit 60, which can be based on the difference in the pitch of the bumps or the difference in the size of the solder balls. And the type of the metal mask used, the simple selection and the setting of the appropriate charging/printing mode, and the correlation calculation unit 31 corresponding to the input image calculation; or the image according to the taken in or from the dictionary 38 The shape estimation unit 32 for calculating the shape; the position coordinate calculation unit 33 for obtaining the position coordinates; and the size calculation unit 34; the data photographed by the CCD camera 15 is based on the basis 21 and the position of the identifying mark of the screen 20, the position offset advantageous system 'and drive 200 945 978 1 i ΧΥΘ platform configured for positioning of the control unit based on the instruction ΧΥΘ internet. Hereinafter, the operation of the printing apparatus will be described by taking a solder ball charging and printing unit as an example. The substrate 21 on which the solder ball bumps are formed is supplied to the substrate receiving and transporting belt 26 by the carry-in conveyor 25. After the substrate 21 is transported to the position of the printing platform 10, the printing platform 10 is raised, and the substrate receiving conveyor 26 conveys the substrate 21 to the printing platform 110. The substrate 21 transferred to the printing platform 10 is fixed to a specific position of the printing platform 10. After the substrate 21 is fixed, the Q C CD camera 15 is moved to the substrate mark position registered in advance. This situation is shown in Figure 5 (a). Thereafter, the CCD camera 15 picks up a position identification mark (not shown) provided on the substrate 21 and the screen 20, and transmits it to the printer control unit 30. The image input unit in the printing machine control unit calculates the positional shift amount between the screen 20 and the substrate 21 from the image data. According to the result, the printer control unit 30 operates the platform control unit 35 to move the printing platform 10. The position correction and positioning of the substrate 21 to the screen 20 are performed.
Θ 位置定位完成後之狀況圖示於圖5(b)。首先，CCD 攝影機15退避特定量直至不干涉印刷平台10之位置。 C CD攝影機15退避完成後，印刷平台10上升，基板21 與遮罩20接觸。於此狀態下，作動印刷頭部升降機構4 使刮膠刀（圖中雖表示刮膠刀3，但於錫球塡充工程成爲 塡充單元60之前端之縫隙狀體63)接觸網版面。之後， 振動、搖動縫隙狀體63之同時，藉由旋轉驅動印刷頭部 驅動馬達2g使網版面上水平移動，由縫隙狀體63之開口 介由設於網版面的開口對基板21之電極焊墊22塡充錫球 -15- 200945978 24。 印刷頭部2於水平方向進行一定距離行程後上升。之 後，印刷平台1〇下降，網版20與基板21分離，塡充於 網版20之開口部的錫球24被轉印至基板21。之後，錫球 24被印刷完成的基板21係經由基板搬出輸送帶27搬送至 次一工程。 又，如上述說明，於網版20與基板21係在相對之同 一位置設置2個以上之辨識定位標記。針對該雙方之標記 q ，藉由具有上下方向2視野的特殊CCD攝影機15，網版 20之標記由下方被辨識，基板21之標記由上方被辨識， 讀取設於特定位置之標記全部位置座標，進行基板21對 於網版20之偏移量之位置運算、修正，進行基板21對於 網版20之定位。 圖6爲助焊劑印刷後之網版之開口狀態。圖6(a)表 示網版全體之狀態，圖6(b)表示設有1個電極群之開口 部之狀況，圖6(c)表示助焊劑23印刷後之開口部之狀 〇 況。圖6 ( C )表示助焊劑23印刷後之通常之網版20之開 口狀況。藉由適宜之網版間隙（網版與基板之間隔）與印 壓（刮膠刀對網版之按壓力）及刮膠刀速度之設定，助焊 劑23可以充分被塡充於網版20之開口部20k，和刮膠刀 3之通過之同時，基板21與網版20被施予版分離，如此 而使助焊劑23被確實轉印至基板21之電極焊墊22部。 又，網版20係被固定於版框20c。 網版印刷用助焊劑23之黏度、觸變性性、及網版20 -16- 200945978 之開口部20k之口徑爲細間距（fine pitch )之影響，印刷 後之網版20之開口部20k之狀況，於正常之印刷狀態下 由開口部內並非完全無助焊劑23，而是出現薄的披膜之狀 況。 助焊劑23之滲透、飛散、乾燥等原因，導致網版20 之開口部2 0k之開口堵塞、版分離或轉印性變差，成爲印 刷結果不均勻之狀況，該印刷狀態即使不確認基板亦可藉 Q 由確認印刷用之網版20來判斷合格否。圖6(C)之（1) 表示網版開口部正常之狀態，（2)表示一部分引起堵塞 之狀態，（3 )表示全體引起堵塞之狀態。基板側之轉印 量多的部分網版開口部側之助焊劑殘留量變少，相反地， 基板側之轉印量少的部分網版開口部側之助焊劑殘留量變 多。亦即，反轉基板2 1之印刷狀態的狀態可由網版20側 進行觀察。 網版20之開口狀態良否之判斷細如下進行。以CCD ® 攝影機15攝取網版20之開口狀態之影像，該影像介由影 像輸入部37被取入印刷機控制部30。之後，將事先記億 於辭典38的網版20之開口狀態之基本模型之影像，與上 述被取入之網版20之開口狀態之影像進行比較，於尺寸 計算部34進行「正常」或「NG (不良）」之判斷。判斷 結果，「正常」表示網版開口狀態爲正常之狀態，「NG (不良）」表示網版開口部之一部分引起堵塞之狀態或全 體引起堵塞之狀態。 助焊劑印刷後，判斷爲NG (不良）之網版20之開口 -17- 200945978 狀態表示於圖6(c)之（2)及（3) 。（2)爲印刷完全 不均句、模樣成爲斑點。該檢測可藉由黑白攝影機之圖案 匹配簡單判斷。 (3)之NG (不良）時，助焊劑23未被印刷至基板 21，大多殘留於網版20之開口部20k。因此，助焊劑殘留 之程度可由色濃度差異予以判斷’因此，藉由影像處理引 起之濃淡灰階縮尺模型之比較可以簡單判斷。或者藉由彩 色攝影機之色差比較等可以判斷。 又，網版20之開口部狀況以定位用CCD攝影機15 予以確認時，由網版20之下部朝上方進行照明，藉由配 置於網版20上方之CCD攝影機15予以確認的方法可以 取入穩定之影像。亦可採用由網版20之上方朝下方進行 照明的方法。CCD攝影機15’係於上下具有攝影部，因 此，作爲攝影位置辨識標記的定位用攝影部使用時，係使 用上部與下部之攝影部，作爲印刷後之網版20之開口部 狀況觀測的檢測用攝影部使用時，係使用上部之攝影部。 網版20之狀態檢測後，由尺寸計算部34發出檢測結 果爲網版開口部堵塞或助焊劑之附著污染等NG信號時， 依據印刷機控制部3 0之指令，藉由印刷裝置內具備之版 下清掃裝置45 (參照圖5)自動實施清掃，必要時補充供 給助焊劑23。又，成爲NG之基板，係不實施錫球印刷以 後之工程，藉由NG信號連同印刷機控制部3 0之指令使 待機於後續工程之輸送帶上而排出線外。藉由使用線上之 NG基板自動倉儲（stocker )等整箱整批予以排出亦可。 200945978 NG基板係於線外工程洗淨實施後’可以再度使用於助焊 劑印刷。 圖7爲使用內徑側照明之攝影機進行之焊塾表面檢測 方法之說明圖。被印刷、轉印至電極焊墊22部的助焊劑 23,在藉由反射光方式之顯微鏡觀測中’照明光容易通過 助焊劑23，因此助焊劑23之有無之辨識困難。被轉印的 助焊劑23之直徑大於電極焊墊22之徑時’或者產生轉印 ϋ 位置偏移而被轉印至電極焊墊22外時’藉由反射光方式 之顯微鏡觀測雖課辨識助焊劑23之有無’但是電極焊墊 22上被形成之助焊劑23之有無辨識爲困難，因此無法判 斷轉印面積之適宜否。 其中如圖7之最下圖所示，藉由使用內徑側照明15L 之CCD攝影機15進行之檢測方法中，對於被轉印之助焊 劑23並非由上方，而是對助焊劑23之外周方向進行照明 ，藉由被轉印體之上浮效應，使助焊劑23之辨識成爲可 φ 能，關於自動檢測亦和上述同樣，使CCD攝影機15具備 之照明由下部照明切換爲內徑側照明1 5L即可對應。 另外，於具有內徑照明之CCD攝影機15，並用在電 極焊墊22之垂直方向上下移動的機構與位置測定機構， 藉由測定助焊劑23之頂點部及底邊部之位置關係，可以 測定助焊劑23之高度及助焊劑23之量。 使用照明之波長即使於可視光區域之中設爲具有接近 紫外線區域側波長之藍光，其辨識性變爲良好。 另外，使助焊劑23含有螢光材料，藉由具有紫外線 -19- 200945978 區域波長之照明來觀測印刷結果，藉由來自助焊劑2 3含 有之螢光材料之光可以容易進行助焊劑23之辨識。 圖8爲錫球印刷頭部（印刷手段、塡充單元60 )之構 造。塡充單元60係由以下構成：在框體61與蓋部64與 濾網狀（sieve shape)體62所形成之空間收納錫球24的 錫球殼體；及對濾網狀體62由下方隔開間隔而被設置的 縫隙狀體63。濾網狀體62,係以適合供給對象之錫球24 之直徑的方式，由具有網目狀開口或連續之長方形狀之縫 @ 隙等開口的極薄之金屬板形成。於濾網狀體62之下部， 配置縫隙狀體63，縫隙狀體63係和網版20b呈面接觸而 構成。 藉由印刷頭部升降機構4(未圖示），可以進行縫隙 狀體63對網版20b之接觸狀況·間隙之微調。縫隙狀體 63，係使用磁性體材料，以適合對象之錫球24之直徑及 網版20之開口尺寸的方式，由具有網目狀開口或連續之 長方形狀之縫隙等開口的極薄之金屬板形成。 © 網版20b，係於印刷圖案部以鎳製一體形成具有支柱 (柱構造）20a之網版及支柱，在基板載置部設置敷設有 表面磁通密度500〜2000G之敉製薄片狀磁鐵而成的印刷 平台10。將網版20b與印刷平台10之磁力引起之吸附力 設爲10〜100gf/cm2，如此而使基板21之表面與網版20b 之間不存在錫球直徑以上間隙而可以呈近接。上述吸附力 太弱時網版2 0b之下部與基板21之表面會隔開間隙，成 爲錫球24潛入之不良之主要原因。 -20- 200945978 印刷結束後，基板21由網版20b分離時，藉由控制 印刷平台10之下降速度及加速度，使網版2 0b之剝離動 作由基板周圍朝中央部流動而進行，可實施均勻之版分離 。但是，上述磁力之吸附力相對於網版之張力太強時變爲 無法控制。 又，印刷手段（塡充單元）60之縫隙狀體63與網版 2 0b之磁氣吸附力，係藉由基板載置部敷設有表面磁通密 φ 度500〜2000G之敉製薄片狀磁鐵l〇s而成的印刷平台10 ，設定成爲〇·1〜l〇gf/cm2。構成印刷手段（塡充單元） 60之縫隙狀體63，及錫球回收用縫隙狀體設爲SUS3 04製 ，網版設爲鎳製，如此則，對於網版上之錫球’縫隙狀體 63藉由上述印刷平台1〇產生之磁力以垂直方向對網版 2 0b施予均勻、軟性作用，據此而使微小錫球保持於縫隙 狀體63之中之同時，部會給錫球帶來變形損傷’而可以 有效對網版之開口部2〇d進行塡充動作。 Φ 圖9爲對印刷手段之錫球收納部、亦即錫球殼體61 上設置之濾網狀體62，朝水平方向施加振動之水平振動機 構之圖。於蓋部64之上部設置’在錫球殼體側面之平行 位置安裝有振動施加手段65而成的支撐構件70°藉由該 構成，由錫球殻體側面側藉由振動施加手段65施加振動 使濾網狀體62產生振動。藉由濾網狀體62之振動’可使 設於濾網狀體62之縫隙狀開口成爲較錫球24之直徑大爲 開放。 如此則，收納於錫球殼體的錫球24會由濾網狀體62 -21 - 200945978 之縫隙部掉落縫隙狀體63上。掉落縫隙狀體63上的錫 24之量、亦即錫球24之供給量，可以藉由振動施加手 65之振動能量之變化予以調節。 圖示之振動施加手段65，係使用空氣旋轉式振動器 藉由數位控制進行壓縮空氣壓力之微調而可以控制振動 。壓縮空氣流量爲可變或振動數可變均可。另外，濾網 體62及錫球殼體係藉由振動施加手段65，對收納於錫 殼體之錫球24施予振動，藉由作用於錫球24間之范德 爾斯力力使吸附力互相抵消而予以分散。藉由上述分散 果，使錫球24之材料或生產環境中溫度、濕度之影響 會導致錫球供給量之變化，依此來考慮生產效率而可進 微調。 圖9表示塡充單元60之水平搖動機構。縫隙狀體 係使用磁性材料形成。藉由使用磁性材料，藉由磁鐵內 平台（印刷平台10 )之磁力，使縫隙狀體63可以吸附 以磁性材料形成的網版20。如圖9所示，水平搖動機構 下構成。於支撐構件70上部設置線性導軌67，以可移 線性導軌67的方式設置設有線性軌條的塡充單元支撐 件71。於該塡充單元支撐構件71設置驅動馬達68，於 驅動馬達軸設置、安裝偏蕊凸輪66，藉由偏蕊凸輪66 旋轉使支撐構件朝左右方向移動而構成。 亦即，水平方向之水平搖動機構，係如圖1 0所示 藉由驅動馬達68使偏蕊凸輪66旋轉，而可以任意之行 量對縫隙狀體63施予搖動動作。縫隙狀體63係在藉由 球 段 數 狀 球 瓦 效 不 行 63 藏 於 如 動 構 該 之 程 磁 -22- 200945978 力被吸附於網版2 0b的狀態下施予搖動動作’因此’在縫 隙狀體63與網版20b間不會空出間隙’可以確實轉動錫 球24。另外，藉由縫隙狀體63之開口尺寸，可使錫球24 確實補足縫隙狀體63之網版20b之同時’可以進行效率 良好的塡充動作。網版20與搖動動作之週期速度’可藉 由驅動馬達68之速度控制任意變更，可以考慮線上平衡 而設定錫球24之塡充加工時間（tact)。另外，依據錫球 H 24之材料種類、網版20b之開口部20d及環境條件來調整 週期速度，可以控制塡充效率。 圖11爲在塡充頭部設置刮刀狀體（spatula shape，錫 球回收手段）之構成。藉由塡充單元60對基板21上供給 錫球24之後，使網版20b由基板21面分離時，亦即進行 版分離將錫球轉印至基板21上時，在網版2 0b之版面狀 存在錫球24之殘留物時，錫球24會通過網版20b之開口 掉落至基板21上，成爲過多錫球之不良原因。因此，本 ❹ 實施形態中，於塡充單元60之進行方向對錫球殻體隔開 間隔，將刮刀狀體69設成和縫隙狀體63大略同一高度。 刮刀狀體69之前端係於極薄平坦精確度高之狀態下施予 硏磨，和網版20b密接狀態下使錫球24不會溢出塡充單 元60外部。如上述說明’藉由刮刀狀體69可以回收多餘 之錫球。 又’刮刀狀體6 9使用磁性材料時，和縫隙狀體6 3同 樣藉由磁力被吸附於網版2 0b，因此可使錫球24不會溢出 塡充單元60外部。 -23- 200945978 另外，使刮刀狀體69由具備較錫球直徑充分大的孔 之多孔室發泡體形成，如此則，可以有效補足錫球24之 同時，進行印刷。 圖12爲在塡充單元60設置氣幕（air curtain)之構 成圖。於刮刀狀體69，雖可使網版2 0b之版面上之錫球殘 留幾乎不存在，但是網版20b之版面之微小變位造成之錫 球殘留影響需要被考慮。因此，本實施形態中，爲使過剩 之錫球引起之不良成爲〇，而設置氣幕。亦即，在構成印 刷頭部2的印刷頭部升降機構（上下移動馬達）4之支撐 用的馬達支撐構件，設置空氣噴出口 75，而於塡充單元 60之周圍形成氣幕。於該噴出口 75，由壓縮空氣供給源 (未圖示）被供給壓縮空氣，如此而構成。 藉由該氣幕，在塡充單元朝基板端面方向移動時藉由 壓縮空氣，使溢出之錫球被押壓滾動朝向塡充單元動作方 向側。 圖1 3爲錫球印刷後之網版之塡充狀態檢測之說明圖 。圖13(a) 、（b)係和圖6相同者，因此省略其說明。 錫球塡充·印刷後對於網版20b之錫球塡充狀態被圖 示於圖13(c)之（1)〜（3)。網版20b之開口完全被 錫球24塡充之狀態係如（1 )所示被觀測。（2 )表示錫 球塡充不完全之狀態。（3)表示塡充時多數個錫球24彼 此間被吸附之雙錫球狀態及網版之版面上殘留過剩錫球之 狀態。 於上述（2) 、（3)之狀態下施予版分離’使基板流 -24 - i 200945978 至後續工程亦生產出不合格品。因此，在施予版分離動作 之前，藉由檢測網版20b之版面上之塡充狀態’藉由塡充 單元60再度嘗試塡充、印刷動作，則可以將不合格品修 正爲良品。該檢測可以藉由和良品模型比較之圖案匹配來 判斷。錫球塡充·印刷後藉由被安裝於印刷頭部側的線性 感側器攝影機依據區域單位進行整批辨識。NG時再度實 施錫球塡充·印刷。合格時實施版分離動作之後將基板21 @ 排出至後續工程。 圖14爲錫球塡充後檢測·修補部之修補作業之說明 圖。圖15爲錫球塡充後之塡充不良之狀況之說明圖。如 圖15所示，錫球塡充不良除無錫球、重疊錫球、位置偏 移錫球擠潰以外，另有過剩錫球等不良形態。 於檢測·修補部，首先，錫球塡充·印刷完了後，藉 由CCD攝影機確認基板上之塡充狀況。檢測出不良時， 求出不良處之位置座標，重叠錫球、位置偏移錫球、擠潰 φ 以外，過剩錫球等之不良時，具備將吸引用真空吸附噴嘴 86移動至錫球之位置，施予真空吸附並移動至不良錫球捨 去平台，藉由真空破壞使錫球掉落、廢棄用的廢棄箱。 另外，檢測出錫球24之供給不足而未被供給的電極 焊墊部時’藉由分配器87吸附收納於錫球收納部84的正 常錫球24’使吸附有錫球24的分配器87移動至助焊劑供 給部85所儲存的助焊劑23，使錫球24浸漬於助焊劑23 而對錫球2 4添加助焊劑2 3。使吸附添加助焊劑2 3後之錫 球24的分配器87移動至基板之缺陷部，對缺陷部供給錫 -25- 200945978 球24而完成修補作業。 又，於先前之檢測，除去擠潰錫球、位置偏移錫球等 不良錫球時，可藉由上述修補作業來修復缺陷。 圖16爲檢測·修補裝置之槪略構成。又，本圖中， 檢測·修補部以1個獨立之裝置予以圖示。 在搬入側輸送帶88上檢測對象印刷82於檢測部輸送 帶90上朝白色箭頭方向被搬送。於檢測部輸送帶90上部 設有門型框架80。於門型框架80之搬入側輸送帶88側， 在基板搬送方向（白色箭頭方向）之直角方向設置線性感 側器8 1。藉由線性感側器8 1可檢測出基板2 1上之電極焊 墊22被印刷之錫球24之狀態。 另外，在支撐門型框架80的一方之腳側設置：收納 正常錫球的錫球收納部84及助焊劑供給部85，在另一方 之腳側設置廢棄箱。於門型框架部設置：藉由線性馬達可 以左右移動，而吸引、除去不良錫球用的真空吸附噴嘴86 ，及基板上之缺陷修補用的分配器87。真空吸附噴嘴86 或分配器87可於斜線箭頭方向移動。 檢測部輸送帶90構成爲可於白色箭頭方向往復移動 ，對應於基板之缺陷位置，可於分配器87或真空吸附噴 嘴位置定位缺陷位置而構成。又，檢測·修補完成之基板 係藉由搬出輸送帶89被搬出、送至回流裝置。藉由上述 構成，依據圖14說明之動作可進行檢測·修補。 如上述說明，可實現對基板之電極焊墊部正確供給錫 球，而且可以盡量防止不良品發生的印刷裝置。 -26- 200945978 (發明效果） 依據本發明，錫球塡充不良之主要原因、亦即助焊劑 印刷不良’於先頭工程被早期處理，可提升生產性。另外 ’依據本發明，可提高錫球塡充效率，可實現縮短加工時 間（tact )以及塡充率高的錫球塡充.印刷，因此可提升 生產性。另外’可提高助焊劑印刷〜錫球塡充〜檢測.修 ® 補之間的各裝置之稼動效率，可縮短加工時間，可以大批 、便宜、高速形成錫球凸塊之高度精確度良好，穩定之大 量錫球凸塊。另外，裝置亦爲簡單之構成，設備成本可以 壓低。 【圖式簡單說明】 圖1爲本發明實施形態之助焊劑印刷及錫球塡充·印 刷工程之槪要圖。 © 圖2爲錫球印刷裝置之工程說明圖。 圖3爲凸塊形成之流程。 圖4爲網版印刷裝置之槪略構成圖。 圖5爲網版印刷裝置之動作說明圖。 圖6爲助焊劑印刷後之檢測·修補裝置之槪要說明圖 〇 圖7爲使用內徑側照明之攝影機進行之焊墊表面檢測 方法之說明圖。 圖8爲錫球印刷頭部之構造。 -27- 200945978 圖9爲對錫球收納部濾網狀體之水平振動機構之圖。 圖10爲錫球印刷頭部之水平搖動機構之圖。 圖11爲錫球印刷頭部用刮刀狀體之說明圖。 圖12爲錫球印刷頭部用氣幕之說明圖。 圖1 3爲錫球印刷後之網版狀態例之說明圖。 圖14爲錫球修補之說明圖。 圖15爲錫球印刷不良之狀況之說明圖。 圖16爲檢測·修補裝置之槪要說明圖。 【主要元件符號說明】 1 :印刷機 2 :印刷頭部 3 :刮膠刀 4 :印刷頭部升降機構 6 :印刷頭部移動機構 10、10b :印刷平台 l〇s :銨製磁鐵 1 1 : ΧΥΘ平台 1 2 :平台升降機構 1 5 .攝影機 16 :輸入部 20、20b :網版 2〇a :支柱 2〇d :開口部 -28- 200945978 21 :基板 22 :電極焊墊 23 :助焊劑 24 :錫球 25 :搬入輸送帶 26 :基板受取輸送帶 27 :基板搬出輸送帶 φ 3 0 :印刷機控制部 3 1 :相關値計算部 3 2 ·形狀推定部 3 3 :位置座標運算部 34 :尺寸計算部 35 : ΧΥΘ平台控制部 3 6 :印刷控制部 3 7 :影像輸入部 φ 38 :辭典 3 9 :版分離控制部 4 0 _顯不部 50 :資料輸入部 45 :清掃裝置 6 0 :印刷手段（塡充單元） 61 :框體 62 :濾網狀體 63 :縫隙狀體 -29 200945978 64 :蓋部 6 5 :振動施加手段 6 6 :偏蕊β輪 6 7 :線性導軌 6 8 :驅動馬達 69 :刮刀狀體 70 :支撐構件 71 :塡充單元支撐構件 7 5 :空氣噴出口 1 0 1 :助焊劑印刷部 102 :助焊劑檢測·修補部 103 :錫球塡充·印刷部 104 :檢測·修補部图 The status of the position after positioning is shown in Figure 5(b). First, the CCD camera 15 retreats by a certain amount until it does not interfere with the position of the printing platform 10. After the C-camera 15 is retracted, the printing platform 10 is raised, and the substrate 21 is in contact with the mask 20. In this state, the printing head elevating mechanism 4 is actuated to contact the screen surface by a squeegee (the squeegee 3 is shown in the figure, but the spheroidal body 63 at the front end of the squeezing unit 60 is soldered). Thereafter, while vibrating and shaking the slit-like body 63, the screen surface is moved horizontally by rotationally driving the printing head driving motor 2g, and the electrode of the substrate 21 is welded by the opening of the slit-shaped body 63 through the opening provided in the screen surface. Pad 22 塡 tin ball -15- 200945978 24. The printing head 2 is raised after a certain distance travel in the horizontal direction. Thereafter, the printing platform 1 is lowered, the screen 20 is separated from the substrate 21, and the solder balls 24 filled in the opening portion of the screen 20 are transferred to the substrate 21. Thereafter, the substrate 21 on which the solder balls 24 have been printed is transported to the next project via the substrate carry-out conveyor 27. Further, as described above, two or more identification positioning marks are provided on the screen 20 and the substrate 21 at the same position. For the mark q of the both sides, by the special CCD camera 15 having the field of view of the up and down direction 2, the mark of the screen 20 is recognized from below, the mark of the substrate 21 is recognized from above, and the coordinates of all the positions of the mark set at a specific position are read. The position calculation and correction of the offset of the substrate 21 with respect to the screen 20 are performed, and the substrate 21 is positioned on the screen 20. Figure 6 shows the open state of the screen after the flux is printed. Fig. 6(a) shows the state of the entire screen, Fig. 6(b) shows the state in which the opening of one electrode group is provided, and Fig. 6(c) shows the state of the opening after the flux 23 is printed. Fig. 6(C) shows the opening condition of the usual screen 20 after the flux 23 is printed. The flux 23 can be fully loaded on the screen 20 by a suitable screen gap (interval between the screen and the substrate) and printing (the pressing force of the squeegee to the screen) and the speed of the squeegee. Simultaneously with the passage of the opening portion 20k and the doctor blade 3, the substrate 21 and the screen 20 are separated from each other, so that the flux 23 is surely transferred to the electrode pad 22 portion of the substrate 21. Further, the screen 20 is fixed to the frame 20c. The viscosity of the flux 23 for screen printing, the thixotropic property, and the diameter of the opening 20k of the screen 20 -16-200945978 are the influence of the fine pitch, and the condition of the opening 20k of the screen 20 after printing In the normal printing state, the inside of the opening is not completely free of the flux 23, but a thin film is present. The reason why the flux 23 is infiltrated, scattered, dried, or the like causes the opening of the opening portion 20 0 of the screen 20 to be clogged, the plate separation or the transfer property is deteriorated, and the printing result is uneven, and the printing state does not confirm the substrate. It can be judged whether it is qualified or not by the confirmation screen 20 for printing. (1) of Fig. 6(C) shows a state in which the screen opening portion is normal, (2) indicates a state in which a part of the screen is blocked, and (3) indicates a state in which the entire blockage is caused. The amount of flux remaining on the portion of the screen opening portion where the amount of transfer on the substrate side is large decreases, and conversely, the amount of flux remaining on the side of the screen opening portion where the amount of transfer on the substrate side is small increases. That is, the state in which the printing state of the substrate 2 1 is reversed can be observed from the screen 20 side. The judgment of the opening state of the screen 20 is as follows. The image of the open state of the screen 20 is taken by the CCD ® camera 15, and the image is taken into the printer control unit 30 via the image input unit 37. Thereafter, the image of the basic model of the open state of the screen 20 of the dictionary 38 is compared with the image of the open state of the taken-in screen 20, and the size calculation unit 34 performs "normal" or " NG (bad) judgment. As a result of the judgment, "normal" indicates that the screen opening state is normal, and "NG (bad)" indicates a state in which one of the opening portions of the screen plate is blocked or the entire body is blocked. After the flux is printed, it is judged that the NG (bad) screen 20 opening -17- 200945978 state is shown in (2) and (3) of Fig. 6(c). (2) It is a completely uneven sentence printed, and the appearance becomes a spot. This detection can be easily judged by the pattern matching of the black and white camera. (3) In the case of NG (defective), the flux 23 is not printed on the substrate 21, and is often left in the opening 20k of the screen 20. Therefore, the degree of flux residue can be judged by the difference in color density. Therefore, the comparison of the gradation scale model caused by image processing can be easily judged. Or it can be judged by the color difference comparison of the color camera. Further, when the position of the opening of the screen 20 is confirmed by the positioning CCD camera 15, the lower portion of the screen 20 is illuminated upward, and the CCD camera 15 disposed above the screen 20 can be confirmed to be stable. Image. It is also possible to use a method in which the upper side of the screen 20 is illuminated downward. The CCD camera 15' has a photographing unit on the upper and lower sides. Therefore, when the photographing unit for positioning is used as the photographing position recognizing mark, the photographing unit of the upper portion and the lower portion is used as the detection portion for observing the condition of the opening portion of the screen 20 after printing. When the photography department uses it, the upper photography unit is used. When the NG signal such as the clogging of the screen opening or the adhesion of the flux is detected by the size calculating unit 34 after the state detection of the screen 20, the printing unit 30 is provided by the printing apparatus control unit. The plate cleaning device 45 (see Fig. 5) automatically performs cleaning, and supplies the flux 23 as necessary. Further, the substrate to be NG is a project in which the solder ball printing is not performed, and the NG signal is commanded by the printing machine control unit 30 to stand by the conveyor belt of the subsequent process and to be discharged outside the line. It can also be discharged in whole batch by using the NG substrate automatic stocker (stocker) on the line. 200945978 NG substrate can be reused for flux printing after the off-line engineering cleaning. Fig. 7 is an explanatory view showing a method of detecting a soldered surface by using a camera with an inner side illumination. The flux 23 which is printed and transferred to the electrode pad 22 is easily observed by the microscope in the form of reflected light. The illumination light is easily passed through the flux 23, so that the presence or absence of the flux 23 is difficult to recognize. When the diameter of the transferred flux 23 is larger than the diameter of the electrode pad 22, or when the transfer ϋ position is shifted and transferred to the outside of the electrode pad 22, the microscope observation by the reflected light method is helpful. Whether or not the flux 23 is present 'but the presence or absence of the flux 23 formed on the electrode pad 22 is difficult to recognize, and therefore it is impossible to judge whether or not the transfer area is appropriate. As shown in the lowermost diagram of Fig. 7, in the detection method by the CCD camera 15 using the inner side illumination 15L, the flux 23 to be transferred is not from the top but on the outer circumference of the flux 23. By illuminating, the identification of the flux 23 is made φ by the floating effect of the transferred body, and the illumination of the CCD camera 15 is switched from the lower illumination to the inner diameter side illumination in the same manner as described above. Can correspond. Further, in the CCD camera 15 having the inner diameter illumination, the mechanism for moving up and down in the vertical direction of the electrode pad 22 and the position measuring mechanism can measure the positional relationship between the apex portion and the bottom portion of the flux 23. The height of the flux 23 and the amount of the flux 23. The wavelength of the illumination is set to be good even if it is set to have a blue light having a wavelength close to the ultraviolet region side in the visible light region. Further, the flux 23 is made of a fluorescent material, and the printing result is observed by illumination having a wavelength of ultraviolet -19-200945978. The flux of the fluorescent material contained in the self-flux 2 3 can be easily identified by the flux 23. Fig. 8 shows the construction of a solder ball printing head (printing means, charging unit 60). The charging unit 60 is configured by a tin ball housing that houses the solder balls 24 in a space formed by the frame 61 and the lid portion 64 and the sieve shape body 62; and the filter mesh 62 is below A slit-shaped body 63 provided at intervals. The mesh body 62 is formed of an extremely thin metal plate having a mesh-like opening or a continuous rectangular opening such as a slit, so as to be suitable for the diameter of the solder ball 24 to be supplied. The slit-like body 63 is disposed in the lower portion of the mesh body 62, and the slit-like body 63 is formed in surface contact with the screen 20b. By the printing head elevating mechanism 4 (not shown), it is possible to finely adjust the contact state and the gap of the slit-like body 63 to the screen 20b. The slit-like body 63 is made of a magnetic material, and is formed of a very thin metal plate having a mesh-like opening or a continuous rectangular slit such as a diameter suitable for the diameter of the solder ball 24 of the object and the opening size of the screen 20. form. © Screen 20b, a screen and a pillar having a pillar (column structure) 20a are integrally formed of nickel in a printed pattern portion, and a sheet-like magnet having a surface magnetic flux density of 500 to 2000 G is placed on the substrate mounting portion. The printing platform 10 is formed. The adsorption force by the magnetic force of the screen 20b and the printing platform 10 is set to 10 to 100 gf/cm2, so that the gap between the surface of the substrate 21 and the screen 20b is not present in the gap between the surface of the substrate 21 and the screen 20b. When the above adsorption force is too weak, a gap is formed between the lower portion of the screen 20b and the surface of the substrate 21, which is a major cause of the intrusion of the solder ball 24. -20- 200945978 When the substrate 21 is separated by the screen 20b after printing, by controlling the falling speed and acceleration of the printing platform 10, the peeling operation of the screen 20b is carried out from the periphery of the substrate toward the center portion, and uniformity can be performed. The version is separated. However, the above-mentioned magnetic force adsorption force becomes uncontrollable when the tension of the screen is too strong. Further, the magnetic gas adsorption force of the slit-like body 63 of the printing means (filling unit) 60 and the screen type 20b is a sheet-like magnet having a surface magnetic flux density of 500 to 2000 G by the substrate mounting portion. The printing platform 10 made of l〇s is set to 〇·1~l〇gf/cm2. The slit-shaped body 63 constituting the printing means (filling unit) 60, and the slit-shaped body for collecting the solder ball are made of SUS3 04, and the screen is made of nickel. Thus, the solder ball on the screen is a slit-like body. 63. The magnetic force generated by the printing platform 1〇 applies a uniform and soft effect to the screen 20b in the vertical direction, thereby holding the tiny solder balls in the slit-like body 63, and the part will give the solder ball In order to deform the damage, it is possible to effectively perform the charging operation on the opening portion 2〇d of the screen. Φ Fig. 9 is a view showing a horizontal vibration mechanism that applies vibration to the horizontal direction to the solder ball housing portion of the printing means, that is, the mesh body 62 provided on the solder ball housing 61. A support member 70 having a vibration applying means 65 attached to a parallel position of the side surface of the solder ball housing is provided on the upper portion of the lid portion 64. With this configuration, vibration is applied by the vibration applying means 65 from the side surface side of the solder ball housing. The mesh body 62 is caused to vibrate. The slit-like opening provided in the mesh body 62 can be made larger than the diameter of the solder ball 24 by the vibration of the mesh body 62. In this manner, the solder balls 24 accommodated in the solder ball housing are dropped from the slit portion of the mesh-like body 62 - 21 - 200945978 onto the slit-like body 63. The amount of the tin 24 dropped on the slit 63, i.e., the supply amount of the solder ball 24, can be adjusted by the change in the vibration energy of the vibration applying hand 65. The illustrated vibration applying means 65 controls the vibration by finely adjusting the compressed air pressure by digital control using an air rotary vibrator. The compressed air flow rate is variable or the number of vibrations is variable. Further, in the mesh body 62 and the solder ball housing, the solder balls 24 housed in the tin case are vibrated by the vibration applying means 65, and the adsorptive force is caused by the van der Waals force acting on the solder balls 24. Distribute and disperse. By the above dispersion, the influence of the temperature and humidity in the material of the solder ball 24 or the production environment causes a change in the supply amount of the solder ball, and the production efficiency can be finely adjusted accordingly. FIG. 9 shows the horizontal rocking mechanism of the charging unit 60. The slit-like body is formed using a magnetic material. By using a magnetic material, the slit-like body 63 can adsorb the screen 20 formed of a magnetic material by the magnetic force of the platform (printing stage 10) in the magnet. As shown in Fig. 9, the horizontal rocking mechanism is constructed. A linear guide 67 is provided on the upper portion of the support member 70, and a splicing unit support 71 provided with a linear rail is disposed in such a manner as to move the linear guide 67. The squeezing unit support member 71 is provided with a drive motor 68, and is provided on the drive motor shaft, and the yoke cam 66 is attached, and the support member is moved in the left-right direction by the rotation of the yoke cam 66. That is, the horizontal rocking mechanism in the horizontal direction rotates the biasing cam 66 by the drive motor 68 as shown in Fig. 10, and the slit-shaped body 63 can be oscillated in an arbitrary amount. The slit-like body 63 is swayed by the ball-shaped ball-shaped ball, and is held in a state where the magnetic force is applied to the screen plate 20b. There is no gap between the body 63 and the screen 20b, and the solder ball 24 can be surely rotated. Further, by the opening size of the slit-like body 63, the solder ball 24 can be surely complemented by the screen 20b of the slit-shaped body 63, and an efficient charging operation can be performed. The cycle speed of the screen 20 and the shaking operation can be arbitrarily changed by the speed control of the drive motor 68, and the charging time (tact) of the solder ball 24 can be set in consideration of the line balance. Further, the charging efficiency can be controlled by adjusting the cycle speed in accordance with the material type of the solder ball H 24, the opening portion 20d of the screen 20b, and environmental conditions. Fig. 11 is a view showing a configuration in which a blade shape (a solder ball collecting means) is provided in the filling head. After the solder ball 24 is supplied to the substrate 21 by the charging unit 60, when the screen 20b is separated from the surface of the substrate 21, that is, when the solder ball is transferred to the substrate 21 by plate separation, the layout of the screen 20b is performed. When the residue of the solder ball 24 is present, the solder ball 24 is dropped onto the substrate 21 through the opening of the screen 20b, which is a cause of excessive solder balls. Therefore, in the embodiment, the solder ball housings are spaced apart from each other in the direction in which the charging unit 60 is moved, and the blade-shaped body 69 is provided at substantially the same height as the slit-shaped body 63. The front end of the blade body 69 is honed in a state in which the extremely thin flatness is high, and the solder ball 24 does not overflow the outside of the charging unit 60 in a state of being in close contact with the screen 20b. As described above, the excess solder ball can be recovered by the blade body 69. Further, when the magnetic material is used as the blade-shaped body 69, the same as the slit-like body 63 is adsorbed to the screen 20b by the magnetic force, so that the solder ball 24 can be prevented from overflowing the outside of the charging unit 60. -23- 200945978 Further, the blade-shaped body 69 is formed of a porous chamber foam having a hole having a diameter sufficiently larger than that of the tin ball. Thus, the solder ball 24 can be effectively filled and printed. Fig. 12 is a view showing a configuration in which an air curtain is provided in the charging unit 60. In the blade-like body 69, although the solder ball residue on the plate surface of the screen 20b is hardly present, the influence of the tin ball residual caused by the slight displacement of the screen of the screen 20b needs to be considered. Therefore, in the present embodiment, a gas curtain is provided in order to cause a defect caused by an excessive tin ball to become a flaw. In other words, the motor supporting member for supporting the printing head elevating mechanism (up and down moving motor) 4 constituting the printing head 2 is provided with an air ejection port 75 to form an air curtain around the refill unit 60. The discharge port (75) is supplied with compressed air from a compressed air supply source (not shown). By the air curtain, the compressed solder ball is pressed and pressed toward the operation side of the charging unit by the compressed air when the charging unit moves toward the end surface of the substrate. Figure 13 is an explanatory diagram of the detection of the state of the screen after the solder ball is printed. 13(a) and (b) are the same as those in Fig. 6, and therefore their description will be omitted. The state of solder ball filling for the screen 20b after solder ball filling and printing is shown in (1) to (3) of Fig. 13 (c). The state in which the opening of the screen 20b is completely filled with the solder ball 24 is observed as shown in (1). (2) indicates that the tin ball is not fully charged. (3) indicates the state in which the majority of the solder balls 24 are adsorbed in the double-tin ball state and the excess solder balls remain on the screen surface of the screen. The plate separation was carried out in the state of (2) and (3) above, and the substrate flow -24 - i 200945978 to the subsequent work also produced a defective product. Therefore, before the application of the plate separation operation, by detecting the charge state on the layout of the screen 20b, the charge unit 60 can again attempt the charge and print operation, and the defective product can be corrected as a good product. This detection can be judged by pattern matching compared to the good model. After the solder ball is filled and printed, the linear sensor side camera mounted on the printing head side performs batch identification based on the area unit. In the case of NG, the solder ball is charged and printed again. When the plate separation operation is performed, the substrate 21 @ is discharged to the subsequent process. Fig. 14 is an explanatory view showing the repairing operation of the solder ball after the detection and repair of the solder ball. Fig. 15 is an explanatory view showing a state in which the solder ball is poorly charged after charging. As shown in Fig. 15, the solder ball is poorly filled except for the tin ball, the overlapping solder ball, and the positional shifting solder ball, and there are other undesirable forms such as excess solder balls. In the detection/repairing section, first, after the solder ball is filled and printed, the CCD camera confirms the state of charge on the substrate. When a defect is detected, the position coordinates of the defective portion are obtained, and when the solder ball is overlapped, the positional shift solder ball, and the crushing φ, and the excess solder ball or the like, the vacuum suction nozzle 86 is moved to the position of the solder ball. , vacuum-adsorbed and moved to the poor solder ball to go to the platform, and the vacuum ball is used to drop the solder ball and discard the discarded waste box. When the electrode pad portion that is not supplied with the solder ball 24 is detected and is not supplied, the normal solder ball 24' accommodated in the solder ball housing portion 84 is sucked by the dispenser 87 to cause the dispenser 87 to which the solder ball 24 is adsorbed. The flux 23 is moved to the flux 23 stored in the flux supply unit 85, and the solder ball 24 is immersed in the flux 23 to add the flux 23 to the solder ball 24. The dispenser 87 of the solder ball 24 after the adsorption of the flux 2 3 is moved to the defective portion of the substrate, and the tin - 25 - 200945978 ball 24 is supplied to the defective portion to complete the repair work. Further, in the prior detection, when the defective solder ball such as the crushed solder ball or the positionally offset solder ball is removed, the defect can be repaired by the above-mentioned repairing operation. Fig. 16 is a schematic diagram showing the configuration of the detecting and repairing device. In addition, in this figure, the detection/repair part is shown by one independent apparatus. The inspection target print 82 is conveyed on the conveyance side conveyance belt 88 on the detection portion conveyance belt 90 in the direction of the white arrow. A door frame 80 is provided on the upper portion of the detecting portion conveyor belt 90. On the side of the carry-in conveyor belt 88 of the door frame 80, the line side slider 8 1 is disposed in the direction perpendicular to the substrate conveyance direction (the direction of the white arrow). The state of the solder ball 24 on which the electrode pad 22 on the substrate 2 is printed can be detected by the line side slider 81. Further, on the one leg side of the support door frame 80, a solder ball accommodating portion 84 and a flux supply portion 85 for accommodating a normal solder ball are provided, and a waste box is provided on the other leg side. The door type frame portion is provided with a linear suction motor that can move left and right to attract and remove the vacuum suction nozzle 86 for the defective solder ball and the dispenser 87 for defect repair on the substrate. The vacuum adsorption nozzle 86 or the distributor 87 can be moved in the direction of the diagonal arrow. The detecting portion conveyor belt 90 is configured to be reciprocally movable in the direction of the white arrow, and is configured to position the defect position at the dispenser 87 or the vacuum suction nozzle position in accordance with the defect position of the substrate. Further, the substrate that has been inspected and repaired is carried out by the carry-out conveyor 89 and sent to the reflow device. According to the above configuration, the operation described with reference to Fig. 14 can be detected and repaired. As described above, it is possible to realize a printing apparatus in which the solder ball is accurately supplied to the electrode pad portion of the substrate and the defective product can be prevented as much as possible. -26- 200945978 (Effect of the Invention) According to the present invention, the main cause of poor solder ball filling, that is, flux printing failure, is processed early in the first stage, and productivity can be improved. Further, according to the present invention, it is possible to improve the solder ball charging efficiency, and it is possible to shorten the processing time (tact) and the solder ball filling and printing with high charge rate, thereby improving productivity. In addition, it can improve the flux printing, tin ball charging, and inspection. The efficiency of each device between the repair and repair can shorten the processing time, and the solder ball bumps can be formed in large quantities, cheaply and at high speed with high accuracy and stability. A large number of tin ball bumps. In addition, the device is also simple in construction, and the equipment cost can be lowered. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a flux printing and a solder ball charging/printing process according to an embodiment of the present invention. © Figure 2 shows the engineering diagram of the solder ball printing unit. Figure 3 shows the flow of bump formation. Figure 4 is a schematic block diagram of a screen printing apparatus. Fig. 5 is an explanatory view of the operation of the screen printing apparatus. Fig. 6 is a schematic view showing the detection and repairing apparatus after the flux printing. Fig. 7 is an explanatory view showing a method of detecting the surface of the bonding pad by using a camera with an inner side illumination. Figure 8 shows the construction of a solder ball print head. -27- 200945978 Figure 9 is a diagram showing the horizontal vibration mechanism of the filter mesh of the solder ball housing. Figure 10 is a diagram of the horizontal rocking mechanism of the solder ball print head. Fig. 11 is an explanatory view of a blade body for a solder ball printing head. Fig. 12 is an explanatory view of an air curtain for a solder ball printing head. Fig. 13 is an explanatory view showing an example of the state of the screen after the solder ball is printed. Fig. 14 is an explanatory view of solder ball repair. Fig. 15 is an explanatory view showing a state in which solder ball printing is defective. Fig. 16 is a schematic explanatory view of the detecting and repairing apparatus. [Description of main component symbols] 1 : Printing machine 2 : Printing head 3 : Squeegee knife 4 : Printing head lifting mechanism 6 : Printing head moving mechanism 10 , 10b : Printing platform l〇s : Ammonium magnet 1 1 : ΧΥΘPlatform 1 2 : Platform lifting mechanism 1 5 . Camera 16 : Input unit 20 , 20b : Screen 2 〇 a : Pillar 2 〇 d : Opening -28 - 200945978 21 : Substrate 22 : Electrode pad 23 : Flux 24 : solder ball 25 : carry-in conveyor 26 : substrate receiving conveyance belt 27 : substrate carry-out conveyance belt φ 3 0 : printing press control unit 3 1 : correlation 値 calculation unit 3 2 · shape estimation unit 3 3 : position coordinate calculation unit 34 : Dimensional calculation unit 35: ΧΥΘ platform control unit 3 6 : print control unit 3 7 : video input unit φ 38 : dictionary 3 9 : version separation control unit 4 0 _ display unit 50 : data input unit 45 : cleaning device 6 0 : Printing means (refilling unit) 61: frame 62: mesh body 63: slit-like body -29 200945978 64: cover portion 6 5 : vibration applying means 6 6 : yoke β wheel 6 7 : linear guide 6 8 : Drive motor 69: blade body 70: support member 71: sump unit support member 7 5 : air ejection port 1 0 1 : flux printing Part 102: Flux detection and repairing unit 103: Tin ball filling and printing unit 104: Detection and repairing unit