First, with reference to Fig. 1, the structure of element mounting production line 1 is described.Element mounting production line 1 has by welding electronic component is arranged on to substrate to manufacture the function of installation base plate, connects a plurality of electronic component apparatus for mounting and forms.At this, it is the structure of tandem printing device M1, printing inspection apparatus M2, element fixing apparatus M3 and reflux M4.
Below, the structure of each device is described.Printing equipment M1 has the function that on the substrate of mounting object printed electronic element engages the soldering paste of use, at the upper surface of base station 2A, disposes the substrate of mounting object 4 along the substrate conveying mechanism 3 of board carrying direction carrying and the substrate 4 of carry is positioned to the substrate orientation portion 5 of maintenance.Above substrate orientation portion 5, dispose the half tone mask 15 that is deployed in mask frame 14, in addition, above half tone mask 15, dispose and scrape unit 13 by Y-axis workbench 11 and the screen painting portion of the structure of horizontal drive by what be held in moving beam 12.
Make to supply with (substrate 4 that arrow a) is also located by substrate orientation portion 5 and the lower surface butt of half tone mask 15 from upstream side, drive Y-axis workbench 11 so that scrape unit 13 in the upper surface slide of supplying with the half tone mask 15 of soldering paste, thereby the electrode that connects use at the element that is formed at substrate 4 is via the pattern hole Printing Paste of being located at half tone mask 15.Printing inspection apparatus M2 has the substrate 4 of accepting by after printing equipment M1 execution presswork, the function checking being printed in the printing state of the soldering paste of substrate 4.
Upper surface at the base station 2B of printing inspection apparatus M2 disposes substrate conveying mechanism 3 and the substrate orientation portion 6 linking with printing equipment M1.In addition, above substrate orientation portion 6, dispose the video camera 17 of the inspection use that the video camera travel mechanism by consisting of Y-axis workbench 11, moving beam 16 moves horizontally.By actuated camera travel mechanism, video camera 17 along continuous straight runs above substrate 4 moves, and the optional position of substrate 4 is taken.And, by image recognition portion, this shooting results is carried out to identifying processing, identifying processing result is carried out to determination processing by check processing portion, thereby carry out print inspection.
To being disposed at the structure of element fixing apparatus M3 in the downstream of printing inspection apparatus M2, describe.In the central authorities of base station 2C, along board carrying direction (directions X), dispose substrate conveying mechanism 18.Substrate conveying mechanism 18 carryings are transmitted the substrate 4 coming and are positioned at for carry out the erecting bed of element installation exercise by component mounter structure from printing inspection apparatus M2.In a side (being downside) of substrate conveying mechanism 18, dispose the element installation portion M3A of installing electronic elements on the substrate 4 after print solder in Fig. 1, in opposite side (in Fig. 1 for upside) and element installation portion M3A subtend, dispose the M3B of installation check portion, the substrate 4 that the M3B of this installation check portion be take after installation elements carries out the inspection about the regulation of installment state as object.
At element installation portion, M3A is provided with component feeding portion 22, in component feeding portion 22, has been arranged side by side a plurality of tape feeders 23.Tape feeder 23 carries out pitch feeding by maintenance being installed on to the carrier band of the electronic component on substrate 4, thereby electronic component is supplied to component pick-up position.End in the directions X side of base station 2C disposes Y-axis travelling table 19, is separately installed with mounting head 21, checks 24 on two X-axis travelling table 20A, 20B with 19 combinations of Y-axis travelling table.By Fig. 3, Fig. 4, the detailed functions of element installation portion M3A, the M3B of installation check portion is described.
In the downstream of element fixing apparatus M3, dispose the reflux M4 of the structure of placement substrate carrying mechanism 28 and reflow ovens 29 on base station 2D.The substrate 4 being undertaken after element installation the inspection of execution based on the M3B of installation check portion by element installation portion M3A passes through substrate conveying mechanism 28 in the interior carrying of reflow ovens 29, thereby, the heating of heating rules according to the rules of substrate 4, make thus scolding tin melting and solidification with by welding electronic elements on substrate 4.Substrate 4 after welding is taken out of to downstream (arrow b), becomes the object checking after refluxing.
Then, with reference to Fig. 2, to becoming the form of substrate 4 of the manipulating object of element mounting production line 1, describe.As shown in Figure 2 (a) shows, substrate 4 is for to make the monolithic substrates 40 such as polylith resin substrate remain on the structure on substrate supporting plate 4a.As shown in Fig. 2 (b), on monolithic substrate 40, be set with a plurality of for installing electronic elements 42(with reference to Fig. 3, Fig. 4) component installation location 40a, on each component installation location 40a, the form of corresponding each component type, is formed with the electrode 41 for soldering of electronic components.In the presswork of being undertaken by printing inspection apparatus M2, Printing Paste S on electrode 41.In addition, as the structure of substrate 4, also can be for polylith monolithic substrate (submounts) being embedded to the structure of mother substrate.
Below, with reference to Fig. 3, to the detailed structure of element installation portion M3A and by the job content that element installation portion M3A carries out, describe.As shown in Fig. 3 (a), mounting head 21 possesses a plurality of units transfer 25, by being installed on the suction nozzle 25a of constituent parts transfer 25, electronic component is kept via vacuum suction.By driving Y-axis travelling table 19 and X-axis travelling table 20A, mounting head 21 moves horizontally along directions X, Y-direction.Thus, mounting head 21 is adsorbed and takes out electronic component from the tape feeder 23 of component feeding portion 22 respectively, and electronic element transferring is carried to the substrate 4 being positioned after the print solder of erecting bed of substrate conveying mechanism 18.
Y-axis travelling table 19, X-axis travelling table 20A, mounting head 21 forms by mounting head 21 and keeps and pick up electronic component from 22 absorption of component feeding portion, transfers lift-launch to the component mounter structure being printed with on the substrate 4 of scolding tin.Lower surface at X-axis travelling table 20A is provided with the substrate identification video camera 26 moving with mounting head 21 one, above substrate 4, mobile 26 pairs of substrates 4 of substrate identification video camera are taken together with mounting head 21, by this shooting results is carried out to identifying processing, identify the component installation location on substrate 4.
Mobile route in mounting head 21 from component feeding portion 22 to substrate 4 is provided with component recognition video camera 27.By keeping the mounting head 21 of electronic component to move above component recognition video camera 27, component recognition video camera 27 is taken from below to the electronic component being kept by mounting head 21, by this shooting results is carried out to identifying processing, to being held in the dislocation of electronic component of the state of mounting head 21, detect.
Fig. 3 (b), (c), (d) represent the operation of being carried out by the component mounter structure of said structure.First, the element installation action that the monolithic substrate 40 that Fig. 3 (b) expression be take after print solder is object.That is, mounting head 21 is moved and suction nozzle 25a by m unit's transfer 25 takes out electronic components 42 from tape feeder 23 to component feeding portion 22, electronic component 42 is transferred and carried to each component installation location 40a that forms the monolithic substrate 40 of substrate 4.And the substrate 4 after installation elements becomes the object checking afterwards in installation illustrated in fig. 4.
In addition, as shown in Figure 3 (c), the monolithic substrate 40 after installation elements is covered to the shielding element installation action of shielding element 43.; similarly; mounting head 21 is moved to component feeding portion 22, and the suction nozzle 25a by unit transfer 25 takes out shielding element 43 from holding the loader of shielding element 43, on the monolithic substrate 40 after installation elements, cover electronic component 42 is installed installed surface so that shielding element 43 to be installed.
In addition, as shown in Fig. 3 (d), component mounter structure carries out being judged to be in installation checks afterwards the operation that the mark use element 44 that represents that this substrate is bad substrate is installed on bad substrate.At this, show in a plurality of electronic components 42, an electronic component 42* is detected to bad example.; similarly; mounting head 21 is moved to component feeding portion 22; suction nozzle 25a by unit transfer 25 takes out element 44 for mark from holding mark with the loader of element 44; on monolithic substrate 40 after having covered shielding element 43, mark is arranged on the bonding agent in the outside that defaults in shielding element 43 with element 44.Mark is supplied with and is taken out by mounting head 21 by component feeding portion 22 with element 44.Bonding agent needs only as mark can be bonded in to the material on monolithic substrate 40 with element 44, but is preferably the adhesivess such as adhesive tape or scolding tin.The in the situation that of the bonding agent adhesives such as be adhesive tape, even after reflow process described later, also can easily mark be unloaded to good work from monolithic substrate 40 with element 44.In addition, in the situation that bonding agent is scolding tin, when above-mentioned print solder, be not only the electrode that element connects use, and in the position of bonding agent also print solder together, therefore, save the trouble that bonding agent is set, good work.In addition, at this moment, also can replace the upper surface that shielding element 43 is arranged on to monolithic substrate 40, mark is arranged on to the upper position adjacent with this monolithic substrate 40 of substrate supporting plate 4a of substrate 4 with element 44.
Below, with reference to Fig. 4, to the detailed structure of the M3B of installation check portion and by the job content that the M3B of installation check portion carries out, describe.As shown in Figure 4 (a), on the X-axis travelling table 20B with 19 combinations of Y-axis travelling table, along directions X, move the inspection 24 that built-in camera is installed freely.By driving Y-axis travelling table 19 and X-axis travelling table 20B, check that 24 move horizontally along directions X, Y-direction.
Thus, check 24 after installation elements to be positioned substrate conveying mechanism 18 erecting bed substrate 4 above move, as shown in Figure 4 (b), to the monolithic substrate 40 of electronic component 42 is installed, take.And the camera data obtaining carries out identifying processing by identifying processing portion 30, its recognition result is carried out to check processing according to the pre-stored inspection data of check processing portion 31, thus, check the quality of the installment state on this monolithic substrate 40.Check 24 and Y-axis travelling table 19, X-axis travelling table 20B form inspection body.
And check result is passed to control part 32, control part 32 is based on this check result, take the operation action that this monolithic substrate 40 should carry out as Object Selection carry out according to default action policy.That is, the M3B of installation check portion becomes following structure: have by checking 24 pairs with the component mounter structure subtend setting of element installation portion M3A and the inspection body that the monolithic substrate 40 of electronic component 42 checks being installed.
Below, along with the flow process of Fig. 5, with reference to each figure, the element installation process that substrate 4 is object of take of being carried out by element mounting production line 1 is described.First, after element installation process starts (ST1), will keep the substrate 4 of a plurality of monolithic substrates 40 to move into printing equipment M1, take these a plurality of monolithic substrates 40 is object, carries out in the lump the printing (ST2) of tin cream.Thus, as shown in Figure 6 (a), on monolithic substrate 40, be formed at half tone Printing Paste S on each electrode 41 of component installation location 40a.Then, the substrate 4 after printing is moved into printing inspection apparatus M2, at this, print rear inspection (ST3), the substrate 4 of check result OK of take is object, carries out the installation (ST4) of electronic component.
; as shown in Figure 6 (b); repeatedly carry out following installation procedure: in element installation portion M3AShang Shi unit transfer 25, between component feeding portion 22 and substrate 4, move back and forth (arrow d), electronic component 42 is transferred successively simultaneously and carried to the component installation location 40a that is printed with soldering paste S.Then, the substrate 4 of take after installation is object, carries out rear check (ST5) is installed.That is, as shown in Figure 6 (c), on the M3B of installation check portion, make to check that 24 move (arrow d) to the top of each monolithic substrate 40, to the monolithic substrate 40 of electronic component 42 is installed, take.And, by the recognition result after the camera data obtaining is identified, carry out check processing, judge the quality of installment state.
At this, if check result is OK, for electronic component 42 is welded on monolithic substrate 40, carry out reflow process (ST7).At this, in the present embodiment, become in the electronic component of the mounting object based on element installation portion M3A and comprise the shielding element 43 that electromagnetic shielding is used, being arranged on of shielding element 43 carried out before refluxing.That is, as shown in Figure 7 (a), by unit transfer 25 absorption, keep shielding element 43, under the form that covers all electronic components 42 of installing, be arranged on (arrow e) on monolithic substrate 40.
In addition, the in the situation that check result being NG in (ST5), carry out the installation (ST6) of the mark use element 44 as shown in Fig. 3 (d).Fig. 8 (a) represents the example that check result is NG, the state being expressed as follows: the component installation location 40a that is printed with soldering paste S at electrode 41 carries under the state of electronic component 42, the center C1 of relative soldering paste S, the center C2 of electronic component 42 misplaces to surpass the magnitude of misalignment D of license amount.In this case, as shown in Figure 7 (b) shows, mark is arranged on to (arrow f) on this monolithic substrate 40 with element 44.
And, by completing to take after element that all monolithic substrates 40 are object is installed and installed, check, as shown in Fig. 7 (c), become and on substrate 4, maintain the state that check result is respectively the monolithic substrate 40 of OK, NG.And, in the reflow process of (ST7), move into the substrate 4(arrow g of this state).Thus, even can not carry out the visualization of installed surface in the situation that cover shielding element 43, after reflow process, also can distinguish reliably in this monolithic substrate 40 and comprise the situation that is judged to be the bad electronic component of installment state.
That is, in the present embodiment, after reflow process, if take out of substrate 4 from reflux M4, by the visual mark element 44(ST8 that judged whether).At this, NO(is unmarked with element 44 if), mean under the good state of the installment state of all electronic components 42 and carried out backflow, be judged as and carried out well welding and finished element installation process (ST10).
In addition, if having element 44 for mark at (ST8) for YES(), mean and have the element refluxing under the bad state of installment state.In this case, carry out according to checking (ST9) after the backflow of X-ray examination.Thus, even can not carry out the visualization of installed surface in the situation that cover shielding element 43, to individual other electronic component 42, also can judge the quality of welded condition.
Fig. 8 (b) represents by the detected welded condition of X-ray examination.At this, (A) be expressed as follows example: by the capillary autoregistration effect of the melting scolding tin based in reflow process, electronic component 42 is pulled to the center C1 of soldering paste S, and bad the improving of installment state (arrow h) being caused by lift-launch dislocation as shown in Figure 8 (a).At this, the magnitude of misalignment D before backflow reduces to License Value with interior magnitude of misalignment D* by this autoregistration effect, in this case, is judged to be the rear OK of inspection that refluxes.
On the other hand, Fig. 8 (b) is expressed as follows example in (B): in scolding tin melting process, act on the external force that some surpass the attraction of the center position based on autoregistration effect, one distolateral (in this case lower end side) of electronic component 42 moves (arrow i) to the direction away from soldering paste S, in this case, be judged to be the rear NG of inspection that refluxes.And, in checking after this refluxes, if OK element installation process finish (ST10), in addition the in the situation that of NG, this monolithic substrate 40 is judged to be bad substrate and becomes the object (ST11) of waste treatment.
As described in the foregoing description, element mounting production line shown in present embodiment and component mounting method are in possessing the element mounting production line 1 of element fixing apparatus M3, in the situation that be judged to be bad according to the result checking, to show that the mark that this substrate is bad substrate is arranged on this monolithic substrate 40 and is taken out of to reflux M4 by element installation portion M3A with element 44, described element fixing apparatus M3 has the element installation portion M3A of installing electronic elements on the monolithic substrate 40 after print solder and the M3B of installation check portion of the inspection that the monolithic substrate 40 of take after installation elements is stipulated as object.
Thus, can effectively solve the test mode used in the element mounting production line of prior art, at each, check operation fixed configurations operator and to being judged to be bad substrate, carry out the wrong problem producing in judging the test mode of judgement by operator.That is, mistake is judged the whether suitable proficiency left and right that is largely subject to operator of the judgement of judgement, may not be usually suitable judgement.Therefore can become following result: at each, check in operation, even if the mistake after fixed configurations operator checks whole execution is judged judgement, not only do not contact directly with the assurance of installation quality, and cause the increase of the labour cost that causes due to fixed configurations operator, reduce productivity ratio.
On the other hand, in the present embodiment, even if be judged to be according to check result bad in the situation that, also need not carry out mistake and judge judgement, and on this monolithic substrate 40 adjustment notch with element 44 and take out of to reflux M4, the object that only will check after refluxing with the monolithic substrate 40 of element 44 with mark.Thus, in checking after backflow, need not all check, can obtain correct fine or not result of determination, can take into account the raising with productivity ratio of guaranteeing of installation quality.
In addition, in the present embodiment, for passing through element installation portion M3A adjustment notch on monolithic substrate 40 of element fixing apparatus M3, use the structure of element 44, described element fixing apparatus M3 has the element installation portion M3A of installing electronic elements on the substrate after print solder and the M3B of installation check portion of the inspection that the substrate of take after installation elements is stipulated as object, but structure is not limited to this.Also the element fixing apparatus of installing electronic elements on the substrate after print solder can be configured in to the downstream of the installation check device of the inspection that the substrate of take after installation elements stipulates as object, by this element fixing apparatus element 44 for adjustment notch on monolithic substrate 40.
Element fixing apparatus of the present invention and component mounting method have the effect with the raising of productivity ratio of guaranteeing that can take into account installation quality, useful to manufacture the field of installation base plate to elements such as installing electronic elements on substrate.