CN1670939A - Labeling method, labeling device and detecting device - Google Patents

Labeling method, labeling device and detecting device Download PDF

Info

Publication number
CN1670939A
CN1670939A CN 200510055195 CN200510055195A CN1670939A CN 1670939 A CN1670939 A CN 1670939A CN 200510055195 CN200510055195 CN 200510055195 CN 200510055195 A CN200510055195 A CN 200510055195A CN 1670939 A CN1670939 A CN 1670939A
Authority
CN
China
Prior art keywords
circuit
objective
substrate
mark
positional information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200510055195
Other languages
Chinese (zh)
Inventor
矢泽雅彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004077896 priority Critical
Priority to JP2004077896A priority patent/JP2005268486A/en
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN1670939A publication Critical patent/CN1670939A/en
Pending legal-status Critical Current

Links

Abstract

The object of this invention is to put a mark with uniform size promptly to a prescribed position on a substrate. A test device is provided with a microscope 1 and a marking apparatus 2. The marking apparatus 2 comprises a stage 21 for supporting a substrate W1 in which two or more circuits W2 are formed, an ink application means 22 for putting a mark to a circuit W2 determined as failure, and a control unit 24 for controlling the stage 21 and the ink application means 22. The control unit 24 memorizes the position of the stage 21 of the circuit W2 determined as failure by the microscopic examination, and controls the ink application means 22 and the position of the stage 21 in response to this position.

Description

Labeling method and labelling apparatus and testing fixture
Technical field
The present invention relates to specific inspection object is carried out the labeling method and the labelling apparatus of mark and the testing fixture that comprises this labelling apparatus.
The application advocates priority to Japan's patent application 2004-077896 number of application on 03 18th, 2004, and with its content quotation in this.
Background technology
In the manufacturing process of semiconductor circuit etc., in its finishing operation, the circuit that is formed on the wafer is carried out electric checking and visual examination, to being judged as bad circuit, use ink additional marking (symbol).Like this, by additional marking, can be by the image processing screening qualified product and the defective item of wafer surface, so after wafer is cut by circuit, can automatically only take out qualified product by enough chip mounters.
Herein, in order to carry out the screening according to image processing reliably, the size of preferred mark and shape are wanted evenly.In addition, if quantity of ink is big, when drying wafer after inspection, produce under the ink droplet, ink is sometimes attached on other circuit.In addition,, can not discern, might be considered as qualified product to defective item by image processing if quantity of ink is few.Therefore, in labelling apparatus in the past, on the China ink seal device of some ink on the circuit, pressure sensor is being set, and is being controlled to and utilizes identical contact pressure that a plurality of circuit are carried out mark (for example, opening the 0011st~0013 section of 2000-269274 communique with reference to the spy of Japan).In addition, in having the device of electric checking with probe and Mo Yinqi, image unit is set, take the probe when checking, store its imaging conditions in focus, when carrying out mark, move Mo Yinqi so that under this imaging conditions China ink seal device (for example, open the 0016th~0020 section of flat 7-297242 communique) in focus with reference to the spy of Japan.
But in order to detect the contact pressure of China ink seal device and circuit, existence need be used for the problem of the new mechanism of detected pressures.In addition, need adjust the relevant of contact pressure and mark size in advance.And wafer is sometimes because of forming the circuit warpage or because of the conservation condition deflection, but under the bigger situation of this warpage or deflection, can not accurately measure contact pressure.
On the other hand, be provided with under the situation of image unit, needing new image unit.And, must be according to the position of imaging conditions computing objective table, probe and Mo Yinqi, handling needs the long time.In addition, have at wafer under the situation of warpage and deflection, adjusting the position by circuit is very difficult thing.
Summary of the invention
The present invention proposes in view of these problems, and its purpose is, to the uniform mark of the rapid additional magnitude of the ad-hoc location on the substrate.
Labeling method of the present invention is, the substrate that is formed with a plurality of circuit is remained on the objective table, result according to check circuit, to being judged to be bad particular electrical circuit additional marking, it is characterized in that the positional information of the described objective table when described particular electrical circuit is checked in storage, to described particular electrical circuit additional marking the time, according to described positional information, adjust the position of described substrate, then additional marking about described particular electrical circuit.
Also can adjust the position of the substrate of checking the back according to the positional information that the substrate of checking is earlier measured.
And labelling apparatus of the present invention according to the check result that is formed at a plurality of circuit on the substrate, to being judged to be bad particular electrical circuit additional marking, is characterized in that having: keep described substrate and be configured to transportable objective table; When using described objective table to check circuit on the described substrate, the memory cell of the positional information of the described objective table when described particular electrical circuit is checked in storage; Mark extra cell to described particular electrical circuit additional marking; When additional marking, adjust the control device of the position of described objective table according to described positional information.
In addition, testing fixture of the present invention is checked a plurality of circuit that are formed on the substrate, to being judged to be bad particular electrical circuit additional marking, it is characterized in that having: keep described substrate and be configured to transportable objective table; Use the inspection unit of described objective table check circuit; When using described objective table to check circuit on the described substrate, the memory cell of the positional information of the described objective table when described particular electrical circuit is checked in storage; Mark extra cell to described particular electrical circuit additional marking; When additional marking, adjust the control device of the position of described objective table according to described positional information.
Also can be described inspection unit as optical viewing arrangement, described cell stores is equivalent to the position of described objective table of the focal position of described optical viewing arrangement.
Description of drawings
Fig. 1 is the schematic diagram of structure of the testing fixture of expression embodiments of the present invention.
Fig. 2 is the figure that flow process is checked in expression.
Fig. 3 is the schematic diagram of an example of the stage position of expression when utilizing microscope to carry out visual examination.
The schematic diagram of one example of the stage position when Fig. 4 is the expression additional marking.
Fig. 5 is the figure that flow process is checked in expression.
Embodiment
Below, the preferred implementation that present invention will be described in detail with reference to the accompanying.
At first, the 1st execution mode of the present invention is described.
As shown in Figure 1, testing fixture comprises: microscope 1 is used for visual examination and is formed at a plurality of circuit W2 on the substrate W1; To being judged to be the labelling apparatus 2 of bad circuit W2 additional marking.Wherein, as substrate W1, can enumerate semiconductor wafer or resin substrate, the ceramic substrates such as glass substrate, glass epoxy resin and phenolic resins of silicon etc.And circuit W2 constitutes and comprise wiring that the semiconductor technology of using regulation and printing technology are made and element etc. on substrate W1.And circuit W2 is formed with a plurality of on a substrate W1.In Fig. 1, illustrate 9 circuit W21~W29 as an example.In addition, in the operation of back, substrate W1 is cut by circuit W2, and forming a plurality of circuit substrates is chip.
Microscope 1 as inspection unit has main body 11, and the transducer (revolver) 13 that rotates freely is installed on main body 11, and a plurality of object lens 12 are installed on the transducer 13.In addition, the eyepiece 14 of observing circuit W2 is installed on main body 11.In addition, this microscope 1 also can use CCD (Charged Coupled Device: charge coupled device) etc. image unit (not shown) replaces eyepiece 14, also can use eyepiece 14 and image unit simultaneously.Microscope 1 during these situations also has the monitor of the picture that shows image unit.That is, inspection unit is that optical viewing arrangement gets final product, and preferably has automatic focusing mechanism.
Labelling apparatus 2 comprises: the objective table 21 that keeps substrate W1 from downside; Mark extra cell 22 to particular electrical circuit W2 additional marking; Input unit 23; Control device 24; Memory cell 25.In addition, in this embodiment, objective table 21 and microscope 1 are shared.
Objective table 21 has: the substrate maintaining part 31 of absorption and maintenance substrate W1; Make substrate maintaining part 31 at the mobile lifting unit 32 of above-below direction (the Z direction among Fig. 1); Make lifting unit 32 with the mobile portion that moves horizontally 33 of both direction (directions X among Fig. 1 and Y direction) of above-below direction quadrature.In addition, said Z direction is to adjust the optical axis direction of focus in microscope 1.
Mark extra cell 22 has the print cartridge 34 of storage ink, in the lower end of print cartridge 34 tubular nozzle 35 is installed.In this nozzle 35, be inserted with syringe needle (needle) 36.The part of syringe needle 36 is also inserted in the print cartridge 34.In addition, syringe needle 36 can freely be advanced and retreat from the terminal of nozzle 35 by the drive division 37 that is made of solenoid coil etc.
Input unit 23 be to control device 24 input will mark the device of circuit W2, for example comprise that the operator is with the button of finger manipulation etc.And, be also included within and be used to make switch that objective table 21 moves in directions X, Y direction, Z direction etc. when checking.
Control device 24 is connecting the lifting unit 32 of microscope 1, objective table 21 and is moving horizontally the drive division 37 and the memory cell 25 of portion 33, mark extra cell 22.This control device 24 is by formations such as CPU (central arithmetic unit) and memories, and the position of control basal plate W1 is adjusted and the timing of additional marking etc.
The information (positional information) of the substrate position during memory cell 25 memory by using microscopes 1 check circuit W2.Herein, positional information is made of the position (X coordinate) of the directions X of objective table 21, the position (Y coordinate) of Y direction and the position (Z coordinate) of Z direction.Obtain the signal that each coordinate can be exported when control device 24 instruction objective tables 21 move.And, when FEEDBACK CONTROL is carried out in the position of objective table 21, can from the determination data that is installed in lifting unit 32 and the position-detection sensor (not shown) that moves horizontally portion 33, obtain.Wherein, said X coordinate and Y coordinate are that the center with substrate W1 is the value of benchmark.Like this, can utilize X coordinate and Y coordinate to determine circuit W2.In addition, general, mark is to carry out at the center of circuit (chip after the cutting) W2, so the center of this circuit W2 is stored as X coordinate and Y coordinate.
Below, the effect of this execution mode is described with reference to Fig. 1~Fig. 4.
At first, as shown in Figure 1, the substrate W1 absorption that is formed with a plurality of circuit W2 is remained on the objective table 21, make the center of substrate W1 consistent with the center of objective table 21.The X coordinate at the objective table 21 of this moment and the center of substrate W1 and Y coordinate all are zero.
Under this state, as shown in Figure 2, one side makes objective table 21 move at directions X and Y direction, and one side moves on the optical axis of microscope 1 (step S1) the circuit W2 that will check.For example shown in Figure 3, when check circuit W22, objective table 21 is moved to the minus side of directions X, circuit W22 is configured on the optical axis of object lens 12.
Behind the mobile end of objective table 21, the inspector operates the not shown focusing portion of microscope 1, makes on circuit W22 (the step S2) in focus of microscope 1.
Herein, when finding to have defective such as wiring deficiency in circuit W22, the inspector operates input unit 23, and circuit W22 is registered as bad circuit (step S3).Thus, the X coordinate of objective table 21, Y coordinate, Z coordinate are input to control device 24 from objective table 21.After in control device 24, obtaining information,, X coordinate, Y coordinate, the Z coordinate of the objective table 21 of this moment are stored in the memory cell 25 as the positional information of bad circuit W2 from input unit 23.
And, finish in the inspection of other circuit W2, and after the registration of bad circuit (for example circuit W22) end, change marking procedures over to.That is, objective table 21 is moved horizontally, move to from observation place shown in Figure 1 can mark position (step S4).For example shown in Figure 4, make the positive side shifting of objective table 21 to directions X, circuit W22 is configured in the below of the syringe needle 36 of mark extra cell 22.The amount of movement of the objective table 21 of this moment carries out computing by control device 24.That is, control device 24 is read the positional information of the circuit W22 that is stored in the record cell 38, respectively from the X coordinate of the end of syringe needle 36 and X coordinate and the Y coordinate that the Y coordinate deducts circuit W22, makes objective table 21 only move the distance that is equivalent to this difference.
Below syringe needle 36, make should additional marking particular electrical circuit (circuit W22) move after, the Z coordinate that comprises in the control device 24 read-out position information makes lifting unit 32 move at above-below direction, adjusts the height (step S5) of objective table 21.Like this, after the adjustment of the position of directions X, Y direction and Z direction finished, control device 24 was to mark extra cell 22 output drive signals.Then, mark extra cell 22 makes the only outstanding predetermined amount of syringe needle 36.At this moment, the end of syringe needle 36 contacts the circuit W22 that has been adjusted the position with the contact pressure of regulation, at its surface-coated ink.Then, syringe needle 36 is pulled in the nozzle 35, forms mark (step S6) on circuit W22.
,, only got a circuit W22 herein, but when a plurality of bad circuit was arranged, the positional information of relevant all bad circuit was registered in the memory cell 25 as particular electrical circuit that should additional marking.And when carrying out mark, control device 24 begins to call over from the positional information of first registration, to the position of each bad circuit adjustment objective table 21, all bad circuit is carried out mark in proper order.Then, after all finishing necessary mark, finish processing herein.In addition, the substrate W1 that has finished inspection is cut into each circuit W2, only takes out qualified product.
According to this execution mode, utilizing inspection unit (microscope 1) when carrying out the inspection of circuit W2, the position that the position that is judged to be bad circuit W2 is comprised short transverse in stored in memory cell 25, adjust mark position according to this position, when so even substrate W1 exists warpage and deflection, also can adjust from mark extra cell 22 to the distance of circuit W2 almost fixed.Therefore, can be controlled to be almost fixed to the shape of mark and size.Even particularly at relative substrate W1, the diameter of the substrate maintaining part 31 of objective table 21 is less, under the situation of the easy deflection of substrate W1, also can be equably to bad circuit additional marking.
And, special entities such as pressure sensor needn't be set on mark extra cell 22, can carry out mark equably.In addition, under the situation that a large amount of bad circuit W2 are arranged, also can promptly carry out mark.
And, each circuit W2 is adjusted between mark extra cell 22 and the circuit W2 apart from the time, the focal position (operating distance) of the positional information of adjust using,, can obtain the precision good information easily so compare during with the position of mechanically measuring objective table 21 as microscope 1.
In addition, shared objective table when inspection and mark is so can carry out rapidly from judge the operation of mark based on the bad circuit of visual examination.
Below, the 2nd execution mode of the present invention is described.In addition, give same-sign to the inscape identical with the 1st execution mode.And, omit repeat specification.
The feature of this execution mode is, in having the testing fixture of structure shown in Figure 1, do not have under warpage and deflection or the almost negligible situation at substrate, obtains positional information along the straight line of substrate, carries out the position adjustment of mark according to this positional information.
Below, the situation when main flowchart text substrate W1 with reference to Fig. 5 is toroidal.
At first, obtain the positional information (step S11) of the circuit W2 on the radius of substrate W1.For example, as shown in Figure 1, objective table 21 is moved at directions X from the center of the substrate W1 hold mode consistent with the center of objective table 21, and order is represented from the circuit W21~W25 of substrate center on the straight line (radius) of a radius of circumference in focus.And the position of the objective table 21 when carrying out in focus on each circuit W21~W25 is stored in the memory cell 25 from input unit 23 as primary importance information.
Obtained after the primary importance information of the radius of substrate W1, then made the portion that moves horizontally 33 actions of objective table 21, the circuit W2 that will check moves on the optical axis of microscope 1 (step S12).In addition, make lifting unit 32 actions of objective table 21, with in focus on the circuit W2 that will check (step S13).And, according to the visual result of microscope 1, the circuit W2 in the visual field is being judged to be when bad, use input unit 23 that the X coordinate of this circuit W2 and Y coordinate are stored in (step S14) in the memory cell 25.Memory cell 25 is stored as X coordinate and Y coordinate the positional information (second place information) of bad circuit.
And, after the positional information registration of all bad circuit finishes, make objective table 21 move to mark position, bad circuit is carried out mark.At this moment, in the second place information of determining bad circuit, do not comprise the information of Z coordinate, so control device 24 according to the primary importance information that a radius along substrate W1 obtains, is set the Z coordinate of bad circuit.For example, be under the situation of bad circuit at circuit W27 shown in Figure 1, calculate from the center of substrate W1 to the distance of circuit W27 according to second place information.And, extract in the primary importance information of obtaining along the radius of substrate W1 Z coordinate out near the positional information of this distance, this coordinate is made as the Z coordinate of this bad circuit.
According to this execution mode, even the Z coordinate of all bad circuit of non-registration also can be adjusted the position to each specific bad circuit, so can the uniform mark of additional magnitude.When continuous review has a plurality of substrate W1 of same structure, can use the information of the substrate W1 that checks earlier, adjust the mark position of the substrate W1 that checks the back, so can check fast.Herein, the substrate W1 that obtains positional information along radius can be the substrate of preparing for the information of locating.
More than, preferred implementation of the present invention has been described, but has the invention is not restricted to these execution modes, can extensive use.Can carry out appending, omit, replace and other changes of structure without departing from the spirit and scope of the present invention.The present invention is not subjected to the qualification that illustrates previously, the qualification of the claims that only added.
For example, mark extra cell 22 also can be to utilize laser beam irradiation to carry out the unit of mark, makes syringe needle contact circuit W2 carry out the unit of mark with replacement.And, also can be to utilize the unit that carries out mark from nozzle ejection ink.When the ejection ink, if variable in distance from nozzle to circuit W2, then the size of mark also changes, but execution mode is such as the aforementioned, positional information when obtaining the focus of adjusting microscope 1, according to the distance of this positional information control it is maintained fixed, can makes the size of mark and shape even thus from the end of nozzle to circuit W2.
And, also can constitute microscope 1 and labelling apparatus 2 respectively.Also control device 24 and memory cell 25 can be constituted one.
In addition, the inspection unit that is provided with testing fixture also can be the probe unit that carries out electric checking, to replace visual examination microscope 1.During this situation, X coordinate, Y coordinate and Z coordinate during the assigned position of probe contact circuit W2 are stored as positional information.
And, also can when circuit W2 of every inspection, carry out mark, can also when the circuit of the adjacent specified quantity of every inspection, carry out mark.
In addition, when adjusting mark position, also can location information proofread and correct.For example under the situation of microscope as inspection unit, focal length (operating distance) is according to the multiplying power of object lens 12 and difference so control device 24 obtains the multiplying power information of the object lens 12 that use when checking, is proofreaied and correct the Z coordinate according to the multiplying power of object lens 12.
And, also can under the chip status after the cutting, check, check under the state that is formed with a plurality of circuit W2 with replacement.During this situation, objective table 21 is used to keep chip.
Labeling method of the present invention remains on the substrate that is formed with a plurality of circuit on the objective table, result according to check circuit, to being judged to be bad particular electrical circuit additional marking, the positional information of the described objective table when described particular electrical circuit is checked in storage, to described particular electrical circuit additional marking the time, according to the described positional information of described particular electrical circuit, additional marking behind the position of adjusting described substrate.
In this case, can adjust the position of the substrate of checking the back according to the positional information that the substrate of checking is earlier measured.
According to this labeling method, mark position is adjusted according to this position in the position of the objective table when it is checked to the circuitry stores that needs mark, so when even the height of substrate changes because of the position, also can make the shape of mark and size evenly.Herein, when the continuous review same substrate, if the information of common location information, particularly short transverse can shorten the review time.
And labelling apparatus of the present invention according to the check result that is formed at a plurality of circuit on the substrate, to being judged to be bad particular electrical circuit additional marking, has: keep described substrate and be configured to transportable objective table; When using described objective table to check circuit on the described substrate, the memory cell of the positional information of the described objective table when described particular electrical circuit is checked in storage; Mark extra cell to described particular electrical circuit additional marking; When additional marking, adjust the control device of the position of described objective table according to described positional information.
According to this labelling apparatus, the positional information of the objective table when it is checked to the circuitry stores that needs mark, adjust mark position according to this positional information, so even the height of substrate because of the position not simultaneously, also can make fixed distance from circuit to the mark extra cell.Thus, when utilizing the mark extra cell to the circuit additional marking, the shape of this mark and size are evenly.
In addition, testing fixture of the present invention is checked a plurality of circuit that are formed on the substrate, to being judged to be bad particular electrical circuit additional marking, has: keep described substrate and be configured to transportable objective table; Use the inspection unit of described objective table check circuit; When using described objective table to check circuit on the described substrate, the memory cell of the positional information of the described objective table when described particular electrical circuit is checked in storage; Mark extra cell to described particular electrical circuit additional marking; When additional marking, adjust the control device of the position of described objective table according to described positional information.
During this situation, as optical viewing arrangement, described memory cell also can be stored the position of the described objective table of the focal position that is equivalent to described optical viewing arrangement described inspection unit.
According to this testing fixture, use identical objective table to check and mark, so can check continuously and mark.Can be to be judged to be the quick additional marking of bad circuit particularly to check result.At this moment, the positional information of the objective table during according to inspection is adjusted mark position, so the shape of mark and size are evenly.If inspection unit is used as optical viewing arrangement, according to the positional information of aiming at focus mark position is carried out the optics adjustment, herein, so can use existing autofocus mechanism.

Claims (5)

1. a labeling method remains on the substrate that is formed with a plurality of circuit on the objective table, according to the result of check circuit,, it is characterized in that being judged to be bad particular electrical circuit additional marking,
The positional information of the described objective table when described particular electrical circuit is checked in storage to described particular electrical circuit additional marking the time, according to the described positional information about described particular electrical circuit, is adjusted the position of described substrate, then additional marking.
2. labeling method according to claim 1 is characterized in that,
According to the positional information that the substrate of checking is earlier measured, adjust the position of the substrate of checking the back.
3. labelling apparatus is formed at the result of a plurality of circuit on the substrate according to inspection, to being judged to be bad particular electrical circuit additional marking, it is characterized in that having:
Keep described substrate and be configured to transportable objective table;
When using described objective table to check circuit on the described substrate, the memory cell of the positional information of the described objective table when described particular electrical circuit is checked in storage;
Mark extra cell to described particular electrical circuit additional marking;
When additional marking, adjust the control device of the position of described objective table according to described positional information.
4. a testing fixture is checked a plurality of circuit that are formed on the substrate, to being judged to be bad particular electrical circuit additional marking, it is characterized in that having:
Keep described substrate and be configured to transportable objective table;
Use the inspection unit of described objective table check circuit;
When using described objective table to check circuit on the described substrate, the memory cell of the positional information of the described objective table when described particular electrical circuit is checked in storage;
Mark extra cell to described particular electrical circuit additional marking;
When additional marking, adjust the control device of the position of described objective table according to described positional information.
5. testing fixture according to claim 4 is characterized in that,
Described inspection unit is an optical viewing arrangement, and described cell stores is equivalent to the position of described objective table of the focal position of described optical viewing arrangement.
CN 200510055195 2004-03-18 2005-03-16 Labeling method, labeling device and detecting device Pending CN1670939A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004077896 2004-03-18
JP2004077896A JP2005268486A (en) 2004-03-18 2004-03-18 Marking method, marking apparatus and test device

Publications (1)

Publication Number Publication Date
CN1670939A true CN1670939A (en) 2005-09-21

Family

ID=35042092

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510055195 Pending CN1670939A (en) 2004-03-18 2005-03-16 Labeling method, labeling device and detecting device

Country Status (2)

Country Link
JP (1) JP2005268486A (en)
CN (1) CN1670939A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100436145C (en) * 2005-10-31 2008-11-26 京元电子股份有限公司 Multishaft type ink distributor
CN103635074A (en) * 2012-08-21 2014-03-12 松下电器产业株式会社 Component installation apparatus and component installation method
CN106053488A (en) * 2016-07-06 2016-10-26 康代影像科技(苏州)有限公司 Expandable dotting marking method and device
CN108369331A (en) * 2015-12-10 2018-08-03 佳能株式会社 Microscopic system and its control method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017508142A (en) * 2014-02-04 2017-03-23 エヌエスケイ アメリカズ インコーポレイテッド Apparatus and method for inspecting steering column assembly with intermediate length supported
JP6384371B2 (en) * 2015-03-19 2018-09-05 三菱電機株式会社 Marking device and marking method
CN104889964B (en) * 2015-05-11 2018-09-28 池州华宇电子科技有限公司 A kind of semiconductor inspection automatic marking device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100436145C (en) * 2005-10-31 2008-11-26 京元电子股份有限公司 Multishaft type ink distributor
CN103635074A (en) * 2012-08-21 2014-03-12 松下电器产业株式会社 Component installation apparatus and component installation method
CN103635074B (en) * 2012-08-21 2017-12-12 松下知识产权经营株式会社 Element fixing apparatus and component mounting method
CN108369331A (en) * 2015-12-10 2018-08-03 佳能株式会社 Microscopic system and its control method
CN106053488A (en) * 2016-07-06 2016-10-26 康代影像科技(苏州)有限公司 Expandable dotting marking method and device
CN106053488B (en) * 2016-07-06 2019-02-05 康代影像科技(苏州)有限公司 It is a kind of expansible to get labeling method ready and get labelling apparatus ready

Also Published As

Publication number Publication date
JP2005268486A (en) 2005-09-29

Similar Documents

Publication Publication Date Title
KR100248569B1 (en) Probe system
KR100272190B1 (en) Apparatus for examining target objects
JP5038191B2 (en) Electronic component inspection method and apparatus used therefor
CN1670939A (en) Labeling method, labeling device and detecting device
JP2007183193A (en) Probing apparatus
JP2010239041A (en) Test-condition data generating method and testing system of semiconductor-wafer visual testing apparatus
JP2005049197A (en) Nozzle tip position measuring device and spotting device using it
KR100954360B1 (en) Automated optical inspection system
CN100401014C (en) Wire width measuring device
KR102024562B1 (en) Automatic inspection system of soldering state of Voice Coil Motor type lens actuator and High Temperature Co-fired Ceramic board
JP2010169651A (en) Substrate inspecting apparatus and inspecting tool
JPH0682801A (en) Defect inspecting and correcting device
US7170075B2 (en) Inspection tool with a 3D point sensor to develop a focus map
KR100820752B1 (en) Probe test apparatus of flat pannel display and probe test method using it
US20200393233A1 (en) Method and system for measuring geometric parameters of through holes
JP2007183194A (en) Probing apparatus
KR20200052027A (en) Probe station
JP6193028B2 (en) Inspection device
JP2010204122A (en) Method of processing information about probe card, and method of testing energization inspecting object using processed information
JP3248136B1 (en) Probe method and probe device
JP2019033150A (en) Probing station
JP2913609B2 (en) Probing apparatus, probing method and probe card
JP3902747B2 (en) Probe device
KR102213026B1 (en) A high-throughput measurement system for mechanical and electrical properties of thin films
JP2002057196A (en) Method and device for probe

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
WD01 Invention patent application deemed withdrawn after publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)