CN103635074B - Element fixing apparatus and component mounting method - Google Patents

Element fixing apparatus and component mounting method Download PDF

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Publication number
CN103635074B
CN103635074B CN201310367561.0A CN201310367561A CN103635074B CN 103635074 B CN103635074 B CN 103635074B CN 201310367561 A CN201310367561 A CN 201310367561A CN 103635074 B CN103635074 B CN 103635074B
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China
Prior art keywords
substrate
mounting
installation
component
fixing
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CN201310367561.0A
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CN103635074A (en
Inventor
石本宪郎
石本宪一郎
木原正宏
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Panasonic Corp
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Panasonic Corp
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Priority to JP2012-182068 priority Critical
Priority to JP2012182068A priority patent/JP5927431B2/en
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Publication of CN103635074A publication Critical patent/CN103635074A/en
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Abstract

It is an object of the invention to provide a kind of element fixing apparatus and component mounting method for ensuring with the raising of productivity ratio that can take into account installation quality.A kind of element fixing apparatus(M3), composed component mounting production line(1), there is the single substrate after print solder(40)The element mounting portion of upper installation electronic component(M3A)With with the single substrate after installation elements(40)The defined installation check portion checked is carried out for object(M3B), wherein, in the case where being bad according to the result judgement of inspection, the single substrate will be shown(40)For the mark element of bad substrate(44)Pass through element mounting portion(M3A)Installed in single substrate(40)Go up and take out of to reflux.Thus, do not have to carry out whole inspections in inspection upon reflowing, as long as only with mark element(44)Single substrate(40)Quality is performed for object to judge, can take into account the raising ensured with productivity ratio of installation quality.

Description

Element fixing apparatus and component mounting method
Technical field
Electronic component is arranged on substrate to manufacture the element fixing apparatus of installation base plate and base the present invention relates to a kind of In the component mounting method of the element fixing apparatus.
Background technology
In the electronic component mounting system that electronic component is arranged on substrate, along series connection scolding tin printing equipment and member Multiple devices such as part erecting device and the element mounting production line carrying substrate formed, hold successively to the substrate moved into from upstream side The flow chart such as row solder printing and element installation, so as to manufacture installation base plate.Element mounting production line possesses audit function, with Substrate after each flow chart performs is object, and the quality that job result is carried out to defined inspection project judges(Referring for example to Patent document 1).It is provided with the first technology shown in the patent document example, in element fixing apparatus and is used to check installment state Inspection video camera, be judged as in inspection bad substrate located at downstream carrying conveyer stopping, turning into operator Carry out the object visually observed and placed under repair by handwork.
In the visual observation that above-mentioned operator is carried out, bad in inspection is determine whether to be appropriately determined and sentenced It is disconnected, i.e. to being determined as whether bad state is genuine eligible for repair be appropriately determined or although state for that need not repair Still it is determined as that bad mistake is judged(Referring for example to patent document 2).In the first skill shown in the patent document example In art, by the visual examination overhaul stand located at element mounting production line while with reference to inspection result on one side confirm material object, with Find out be appropriately determined or mistake judge.
Patent document 1:Japanese Unexamined Patent Publication 2011-82375 publications
Patent document 2:Japanese Unexamined Patent Publication 2004-214394 publications
But in the first technology comprising above-mentioned patent document example, in the audit function by element mounting production line And it is determined as the mistake of bad substrate and judges to generate the problem of following in judging.That is, mistake is judged by according to work The visual subjective judgement of dealer is carried out, therefore, judgement it is whether appropriate largely by proficiency of operator or so, often It is not necessarily often appropriate judgement.It is for example, somewhat inclined even in the scolding tin of the relative electrode for being printed in substrate, the installation site of element From and be determined as it is bad in the case of, sometimes through as in reflux course scolding tin melt when surface tension caused by autoregistration Effect is so as to correct dislocation, without placing under repair.In addition, in contrast, it is judged as what need not be repaired even in operator In the case of, do not flowed back appropriately sometimes and be changed into bad in checking upon reflowing yet.That is, following result can be become:Every In one inspection operation, though fixed configurations operator and the mistake after must being checked judges to judge, not only with installing matter The guarantee of amount does not contact directly, and causes to cause the increase of labour cost due to fixed configurations operator, reduces life Yield.
In addition, according to type of substrate, installation elements are covered sometimes and shielding element is installed, in this case, it is impossible to Carry out judging to judge according to the mistake of the visual observation after installation elements, if it is desired to carry out mistake and judge to judge, then must adopt Equipment expenses and the inspection method of time are needed with X-ray examination etc..In this case, if paying attention to ensuring for installation quality and entering Row, which all checks, then to be needed many reviews time and reduces productivity ratio, if in addition, use selective examination to shorten the time, can It can produce and check omission.So, following problem be present, in existing element mounting production line, it is difficult to take into account installation quality Ensure the raising with productivity ratio.
The content of the invention
Therefore, ensuring and the raising of productivity ratio for installation quality can be taken into account it is an object of the present invention to provide a kind of Element fixing apparatus and component mounting method.
The present invention provides a kind of element fixing apparatus, with the solder printing device of Printing Paste on substrate and to installation member The substrate after part is heated the reflux link so that scolding tin melting and solidification, is formed on substrate and is passed through welded and installed Element to manufacture the element mounting production line of installation base plate, wherein, there are installation elements on the substrate after print solder Element mounting portion and using the substrate after installation elements as object carry out as defined in check installation check portion, according to institute The result judgement of inspection is stated as that in the case of bad, will show that the mark element that the substrate is bad substrate passes through the element Installation portion is installed on the substrate and taken out of to the reflux.
The present invention provides a kind of component mounting method, is the component mounting method in element fixing apparatus, the element peace Assembling device on substrate to the substrate after installation elements with the solder printing device of Printing Paste and being heated so as to be welded The reflux of tin melting and solidification together, is formed on substrate and installed by welded and installed element with manufacturing the element of installation base plate Production line, wherein, the element fixing apparatus has the element mounting portion of installation elements on the substrate after print solder The defined installation check portion checked is carried out with by object of the substrate after installation elements, is included in the institute after print solder State the component mounting process that electronic component is installed on substrate and carry out defined examine by object of the substrate after installation elements The installation check process looked into, will be aobvious in the case where the result judgement of the inspection in the installation check process is bad Show that the mark element that the substrate is bad substrate is installed on the substrate and taken out of to described time by the element mounting portion Flow device.
It will link with solder printing device and reflux and the element fixing apparatus of composed component mounting production line is set to Element mounting portion with installation elements on the substrate after print solder and professional etiquette is entered as object using the substrate after installation elements The structure in the installation check portion of fixed inspection, in the case where being bad according to the result judgement of inspection, by the way that the base will be shown Plate is installed on the substrate and taken out of to reflux by element mounting portion for the mark element of bad substrate, so as to return Do not have to carry out whole inspections in inspection after stream, as long as and being only by object execution quality judgement of the substrate with identification element Can, the raising ensured with productivity ratio of installation quality can be taken into account.
Brief description of the drawings
Fig. 1 is the top view of the element mounting production line of an embodiment of the present invention;
Fig. 2 is the form explanation of the substrate of the manipulating object as element mounting production line of an embodiment of the present invention Figure;
Fig. 3 is the function declaration figure of the element fixing apparatus for element mounting production line of an embodiment of the present invention;
Fig. 4 is the function declaration figure of the element fixing apparatus for element mounting production line of an embodiment of the present invention;
Fig. 5 is the flow chart of the element installation process in the element mounting production line for represent an embodiment of the present invention;
Fig. 6 is the action specification figure of the element installation process in the component mounting method of an embodiment of the present invention;
Fig. 7 is the action specification figure of the element installation process in the component mounting method of an embodiment of the present invention;
Fig. 8 is the explanation figure of the component condition of the welding process in the component mounting method of an embodiment of the present invention.
Label declaration
1 element mounting production line
4 substrates
4a substrate supporting plates
M2 printing inspection apparatus
M3 element fixing apparatus
M3A element mounting portions
M3B installation checks portion
M4 refluxes
21 mounting heads
24 check head
25 unit transfer head
40 single substrates
40a component installation locations
41 electrodes
42 electronic components
43 shielding elements
44 mark elements
Embodiment
First, reference picture 1, the structure of element mounting production line 1 is illustrated.Element mounting production line 1, which has, to be passed through Electronic component is arranged on substrate to manufacture the function of installation base plate by welding, connects multiple electronic component apparatus for mounting and structure Into.Here, the structure for tandem printing device M1, printing inspection apparatus M2, element fixing apparatus M3 and reflux M4.
Hereinafter, the structure of each device is illustrated.Printing equipment M1 has the printed electronic on the substrate of mounting object The function of the soldering paste of element engagement, it is configured with the substrate 4 of mounting object in base station 2A upper surface along board carrying direction The substrate conveying mechanism 3 of carrying and the board positioning part 5 for carrying the substrate 4 come position holding.In board positioning part 5 Top be configured with the half tone mask 15 for being deployed in mask frame 14, in addition, being configured with the top of half tone mask 15 to be held in The Squeegee-printing unit 13 of moving beam 12 is by Y-axis workbench 11 and the screen painting portion of the structure of horizontal drive.
Make to supply from upstream side(Arrow a)And pass through the lower surface of the substrate 4 that board positioning part 5 positions and half tone mask 15 Abut, driving Y-axis workbench 11 so that Squeegee-printing unit 13 the half tone mask 15 of supply soldering paste upper surface slide, so as in shape Into the element connection in substrate 4 electrode via the pattern hole Printing Paste located at half tone mask 15.Printing inspection apparatus M2 The substrate 4 after presswork is performed by printing equipment M1 with receiving, examined to being printed in the printing state of soldering paste of substrate 4 The function of looking into.
The substrate conveying mechanism 3 linked with printing equipment M1 is configured with printing inspection apparatus M2 base station 2B upper surface And board positioning part 6.In addition, it is configured with the top of board positioning part 6 by being made up of Y-axis workbench 11, moving beam 16 Video camera travel mechanism and the video camera 17 of inspection that moves horizontally.Pass through actuated camera travel mechanism, video camera 17 Moved in the horizontal direction in the top of substrate 4, the optional position of substrate 4 is shot.Moreover, by Image recognizing section to this Processing is identified in shooting result, by identifying processing result by checking that processing unit carries out determination processing, so as to perform printing inspection Look into.
The element fixing apparatus M3 in the downstream for being configured at printing inspection apparatus M2 structure is illustrated.Base station 2C's Center, along board carrying direction(X-direction)It is configured with substrate conveying mechanism 18.Substrate conveying mechanism 18 is carried to be filled from print inspection M2 is put to transmit the substrate 4 come and be positioned at the erecting bed for carrying out component mounting work by component mounting mechanism.In substrate The side of carrying mechanism 18(It is downside in Fig. 1)It is configured with the element that electronic component is installed on the substrate after print solder 4 Installation portion M3A, in opposite side(It is upside in Fig. 1)With element mounting portion M3A is oppositely disposed installation check portion M3B, the peace It is defined inspection of the object progress on installment state that inspection portion M3B, which is filled, with the substrate 4 after installation elements.
Component feeding portion 22 is provided with element mounting portion M3A, multiple belt feed have been arranged side by side in component feeding portion 22 Device 23.Tape feeder 23 carries out pitch feeding by being installed on the carrier band of electronic component on substrate 4 to holding, so as to by electricity Subcomponent is supplied to component pick up location.Be configured with Y-axis moving table 19 in the end of base station 2C X-direction side, with Y-axis Mounting head 21 is separately installed with two X-axis moving tables 20A, 20B that mobile work platform 19 combines, checks first 24.Pass through Fig. 3, Fig. 4 illustrate to element mounting portion M3A, installation check portion M3B detailed functions.
Placement substrate carrying mechanism 28 and reflow ovens 29 on base station 2D are configured with element fixing apparatus M3 downstream Structure reflux M4.Entered by element mounting portion M3A after units install and execute the inspection based on installation check portion M3B Substrate 4 carried by substrate conveying mechanism 28 in the reflow ovens 29, so as to, substrate 4 heats according to the heating protocol of regulation, by This makes scolding tin melting and solidification so that electronic component is welded on substrate 4.Substrate 4 after welding is taken out of to downstream(Arrow b), into For the object checked after backflow.
Then, reference picture 2 illustrates to the form of the substrate 4 of the manipulating object as element mounting production line 1.Such as figure 2(a)Shown, substrate 4 is to make the structure that the single substrates such as polylith resin substrate 40 are maintained on substrate supporting plate 4a.Such as Fig. 2(b)Institute Show, be set with single substrate 40 multiple for installing electronic component 42(Reference picture 3, Fig. 4)Component installation location 40a, On each component installation location 40a, the form of corresponding each component type, formed with the electrode for welding electronic component 41.In the presswork carried out by printing inspection apparatus M2, the Printing Paste S on electrode 41.In addition, the knot as substrate 4 Structure, or by polylith single substrate(Submounts)The structure of embedded mother substrate.
Below, reference picture 3, detailed construction to element mounting portion M3A and the job content performed by element mounting portion M3A Illustrate.Such as Fig. 3(a)Shown, mounting head 21 possesses multiple unit transfer head 25, by being installed on constituent parts transfer head 25 Suction nozzle 25a is kept electronic component via vacuum suction.By driving Y-axis moving table 19 and X-axis moving table 20A, mounting head 21 is in X direction, Y-direction moves horizontally.Thus, mounting head 21 is respectively from the tape feeder in component feeding portion 22 23 are adsorbed and take out electronic component, and electronic element transferring is carried to the printing weldering for the erecting bed for being positioned at substrate conveying mechanism 18 On substrate 4 after tin.
Y-axis moving table 19, X-axis moving table 20A, mounting head 21 are formed by mounting head 21 from component feeding portion 22 Absorption is kept and picks up electronic component, and transfer is carried to the component mounting mechanism being printed with the substrate 4 of scolding tin.Moved in X-axis Workbench 20A lower surface is provided with the substrate integrally moved with mounting head 21 and identifies video camera 26, together with mounting head 21 The substrate identification video camera 26 of the top movement of substrate 4 is shot to substrate 4, by the way that place is identified to the shooting result Reason, to identify the component installation location on substrate 4.
In mounting head 21 from component feeding portion 22 to being provided with element identification video camera 27 on the mobile route of substrate 4.Pass through Keep electronic component mounting head 21 element identification video camera 27 top movement, element identification video camera 27 from below to by The electronic component that mounting head 21 is kept is shot, by the way that processing is identified to the shooting result, to being held in mounting head 21 The dislocation of electronic component of state detected.
Fig. 3(b)、(c)、(d)Represent the operation performed by the component mounting mechanism of said structure.First, Fig. 3(b)Represent Component mounting operation with the single substrate 40 after print solder for object.That is, mounting head 21 is made to be moved to component feeding portion 22 And electronic component 42 is taken out from tape feeder 23 by the suction nozzle 25a of m units transfer head 25, electronic component 42 is transferred into carrying To each component installation location 40a for the single substrate 40 for forming substrate 4.Moreover, the substrate 4 after installation elements turns into and will schemed The object checked after the installation illustrated in 4.
In addition, such as Fig. 3(c)It is shown, to the single substrate 40 after installation elements cover the shielding member of shielding element 43 Part installation action.I.e., similarly, mounting head 21 is moved to component feeding portion 22, by the suction nozzle 25a of unit transfer head 25 from The loader for accommodating shielding element 43 takes out shielding element 43, is covered on the single substrate 40 after installation elements and is provided with electronics The mounting surface of element 42 is to install shielding element 43.
In addition, such as Fig. 3(d)Shown, component mounting mechanism carries out being judged to pacifying on bad substrate in checking after mounting Dress represents operation of the substrate for the mark element 44 of bad substrate.Here, show in multiple electronic components 42, to one Individual electronic component 42* detects bad example.I.e., similarly, mounting head 21 is moved to component feeding portion 22, pass through list The suction nozzle 25a of displacement carrier head 25 takes out mark element 44 from mark is accommodated with the loader of element 44, is covering shielding member On single substrate 40 after part 43, mark element 44 is arranged on the bonding agent in the outside for defaulting in shielding element 43.Mark Note element 44 is supplied by component feeding portion 22 and taken out by mounting head 21.As long as bonding agent is that can be bonded mark element 44 Material on single substrate 40, but the preferably adhesives such as adhesive tape or scolding tin.It is that adhesive tape etc. is bonded material in bonding agent In the case of material, after reflow process described later, easily mark element 44 can also be unloaded from single substrate 40, made Industry is good.In addition, in the case where bonding agent is scolding tin, in above-mentioned print solder, the electrode of element connection is not only, And the position of bonding agent also can print solder together, therefore, save the trouble that bonding agent is set, good work.In addition, this When, the upper surface that shielding element 43 is arranged on to single substrate 40 can also be substituted, mark is arranged on substrate 4 with element 44 The position adjacent with the single substrate 40 on substrate supporting plate 4a.
Below, reference picture 4, the detailed construction to installation check portion M3B and the job content by installation check portion M3B execution Illustrate.Such as Fig. 4(a)It is shown, moved in X direction on the X-axis moving table 20B combined with Y-axis moving table 19 The inspection first 24 of built-in camera is installed freely.By driving Y-axis moving table 19 and X-axis moving table 20B, inspection Look into first 24 in X direction, Y-direction moves horizontally.
Thus, check first 24 after substrate 4 from installation elements to the erecting bed for being positioned at substrate conveying mechanism 18 top It is mobile, such as Fig. 4(b)It is shown, the single substrate 40 for being provided with electronic component 42 is shot.Moreover, obtained camera data Processing is identified by identifying processing portion 30, the inspection data prestored to its recognition result according to inspection processing unit 31 are entered Row inspection is handled, and thus, checks the quality of the installment state on the single substrate 40.Check first 24 and Y-axis moving table 19, X-axis moving table 20B forms inspection body.
Moreover, inspection result is transferred to control unit 32, control unit 32 is based on the inspection result, according to default action policy It is that the operation action that Object Selection should perform is performed with the single substrate 40.That is, installation check portion M3B turns into following knot Structure:With being arranged oppositely by checking first 24 couples and element mounting portion M3A component mounting mechanism and be provided with electronic component 42 The inspection body that is checked of single substrate 40.
Below, with Fig. 5 flow, with reference to each figure to the member with substrate 4 for object that is performed by element mounting production line 1 Part installation process illustrates.First, after element installation process starts(ST1), the substrate 4 for keeping multiple single substrates 40 is removed Enter printing equipment M1, be object with these multiple single substrates 40, carry out the printing of tin cream in the lump(ST2).Thus, such as Fig. 6(a) It is shown, screen painting soldering paste S on component installation location 40a each electrode 41 is formed on single substrate 40.Then, will print Substrate 4 afterwards moves into printing inspection apparatus M2, here, being checked after being printed(ST3), it is pair with inspection result OK substrate 4 As carrying out the installation of electronic component(ST4).
That is, such as Fig. 6(b)It is shown, following installation procedure is performed repeatedly:Make unit transfer head on element mounting portion M3A 25 move back and forth between component feeding portion 22 and substrate 4(Arrow d), while electronic component 42 is transferred into carrying to printing successively There is soldering paste S component installation location 40a.Then, it is object with the substrate 4 after installation, is checked after performing installation(ST5). That is, such as Fig. 6(c)It is shown, on installation check portion M3B, inspection first 24 is moved to the top of each single substrate 40(Arrow d), The single substrate 40 for being provided with electronic component 42 is shot.Moreover, after by the way that obtained camera data is identified Recognition result carries out inspection processing, judges the quality of installment state.
Here, if inspection result is OK, in order to which electronic component 42 is welded on single substrate 40, backflow work is performed Sequence(ST7).Here, in the present embodiment, turn into the electronic component of the mounting object based on element mounting portion M3A comprising electricity The shielding element 43 of magnetic screen, the installation of shielding element 43 perform before reflow.That is, such as Fig. 7(a)It is shown, pass through unit The absorption of transfer head 25 keeps shielding element 43, and monolithic base is arranged under the form for all electronic components 42 that covering is installed On plate 40(Arrow e).
In addition,(ST5)In the case that middle inspection result is NG, such as Fig. 3 is carried out(d)The peace of shown mark element 44 Dress(ST6).Fig. 8(a)The example that inspection result is NG is represented, represents following state:It is printed with soldering paste S's in electrode 41 In the state of component installation location 40a carries electronic component 42, the center C1 with respect to soldering paste S, the center of electronic component 42 Position C2 is misplaced with the magnitude of misalignment D more than license amount.In this case, such as Fig. 7(b)It is shown, mark element 44 is pacified On the single substrate 40(Arrow f).
Moreover, by completing with all single substrates 40 to be checked after the element installation and installation of object, such as Fig. 7(c) It is shown, it is changed into maintaining the state that inspection result is respectively OK, NG single substrate 40 on substrate 4.Moreover,(ST7)Return Flow in process, move into the substrate 4 of this state(Arrow g).Thus, mounting surface can not be carried out even in covering shielding element 43 Visual observation in the case of, also can reliably be distinguished after reflow process in the single substrate 40 comprising being determined as installment state The situation of bad electronic component.
I.e., in the present embodiment, after reflow process, if taking out of substrate 4 from reflux M4, sentence by visual observation It is disconnected whether to have mark element 44(ST8).Here, if NO(It is unmarked to use element 44), then mean in all electronics Backflow is performed in the state of the installment state of element 42 is good, is judged as having carried out welding and terminating element installation place well Reason(ST10).
In addition, if(ST8)For YES(There is mark element 44), then mean to exist in the bad shape of installment state The element to be flowed back under state.In this case, checked after performing the backflow according to X-ray examination(ST9).Thus, even in Covering shielding element 43 and in the case of the visual observation of mounting surface can not be carried out, weldering can also determine that to individual other electronic component 42 Connect the quality of state.
Fig. 8(b)Represent the welded condition detected by X-ray examination.Here,(A)Represent following example:By based on return The autoregistration effect of the surface tension of the melting scolding tin in process is flowed, electronic component 42 is pulled to soldering paste S center C1, and By such as Fig. 8(a)Installment state is bad caused by shown carrying dislocation is improved(Arrow h).Here, the magnitude of misalignment before backflow D is reduced to the magnitude of misalignment D* within License Value by the autoregistration effect, in this case, OK is checked after being determined as backflow.
On the other hand, Fig. 8(b)(B)Middle expression following example:Some are acted in scolding tin melting process exceed and be based on from right The external force of the attraction of the center position of quasi- effect, a side of electronic component 42(It is lower end side herein)To away from soldering paste S's Move in direction(Arrow i), in this case, NG is checked after being determined as backflow.Moreover, in being checked after the backflow, if OK Then element installation process terminates(ST10), in addition in the case of NG, the single substrate 40 is determined as bad substrate and turns into useless Abandon the object of processing(ST11).
As described in the foregoing description, the element mounting production line shown in present embodiment and component mounting method are possessing element In erecting device M3 element mounting production line 1, in the case where being bad according to the result judgement of inspection, the substrate will be shown It is arranged on the single substrate 40 and takes out of to reflux by element mounting portion M3A for the mark element 44 of bad substrate M4, the element fixing apparatus M3 have the element mounting portion that electronic component is installed on the single substrate 40 after print solder The M3A and installation check portion M3B for carrying out defined inspection for object with the single substrate 40 after installation elements.
Thus, it is possible to effectively solves the test mode used in the element mounting production line of prior art, i.e. every One inspection operation fixed configurations operator and the inspection judged by operator being determined as bad substrate progress mistake judgement The problem of being produced in mode.That is, whether appropriate the judgement that mistake judges to judge is largely by proficiency of operator or so, often It is not necessarily often appropriate judgement.Therefore following result can be become:In each inspection operation, even if fixed configurations operator couple The mistake after checking all is performed to judge to judge, the not only guarantee with installation quality do not contact directly, and cause due to Fixed configurations operator and caused by labour cost increase, reduce productivity ratio.
On the other hand, in the present embodiment, even in be determined as according to inspection result it is bad in the case of, without entering Row mistake judges to judge, and adjustment notch element 44 and is taken out of on the single substrate 40 to reflux M4, will only carry The object that mark is checked by the use of the single substrate 40 of element 44 as after flowing back.Thus, do not have to carry out all in checking upon reflowing Check, correct fine or not result of determination can be obtained, the raising ensured with productivity ratio of installation quality can be taken into account.
In addition, in the present embodiment, for by element fixing apparatus M3 element mounting portion M3A and in single substrate 40 The structure of upper adjustment notch element 44, the element fixing apparatus M3, which has, installs electronics member on the substrate after print solder The element mounting portion M3A of the part and installation check portion M3B that defined inspection is carried out using the substrate after installation elements as object, but tie Structure is not limited by this.The element fixing apparatus configuration of electronic component can also will be installed with peace on the substrate after print solder The downstream that the substrate after element carries out the defined installation check device checked for object is filled, by the element fixing apparatus in list Adjustment notch element 44 on plate base 40.
Industrial utilizability
The present invention element fixing apparatus and component mounting method have can take into account installation quality ensure and productivity ratio Raising effect, it is useful to manufacture the field of installation base plate to installing the element such as electronic component on substrate.

Claims (6)

  1. A kind of 1. element fixing apparatus, with the solder printing device of Printing Paste on substrate and to the base after installation elements Plate is heated the reflux link so that scolding tin melting and solidification, is formed on substrate by welded and installed element to manufacture peace Fill the element mounting production line of substrate, it is characterised in that
    Element mounting portion with installation elements on the substrate after print solder and with the substrate after installation elements The defined installation check portion checked is carried out for object,
    In the case where being bad according to the result judgement of the inspection, the mark element that the substrate is bad substrate will be shown Install on the substrate and take out of to the reflux by the element mounting portion.
  2. 2. element fixing apparatus as claimed in claim 1, it is characterised in that
    The element mounting portion possess by mounting head from component feeding portion stick electronic components and transfer carry to substrate element Installing mechanism,
    The installation check portion, which possesses, to be arranged oppositely by checking head pair and the component mounting mechanism and is provided with electronic component The inspection body that is checked of the substrate,
    The mark is supplied by the component feeding portion with element and taken out by the mounting head.
  3. 3. the element fixing apparatus as any one of claim 1 or 2, it is characterised in that
    All electricity that covering is installed are included in the electronic component as the mounting object based on the element mounting portion The shielding element installed under the form of subcomponent,
    The mark is installed on the outside of the shielding element with element on the mounting surface of the substrate.
  4. A kind of 4. component mounting method, for the component mounting method in element fixing apparatus, the element fixing apparatus and in base The solder printing device of Printing Paste and the substrate after installation elements heated so that scolding tin melting and solidification on plate Reflux together, is formed on substrate by welded and installed element to manufacture the element mounting production line of installation base plate, and it is special Sign is,
    The element fixing apparatus has on the substrate after print solder the element mounting portion of installation elements and with installation The substrate after element carries out the defined installation check portion checked for object,
    It is included on the substrate after print solder and the component mounting process of electronic component is installed and with the institute after installation elements State substrate and carry out the defined installation check process checked for object,
    In the case where the result judgement of the inspection in the installation check process is bad, it is bad for showing the substrate The mark element of substrate is installed on the substrate and taken out of to the reflux by the element mounting portion.
  5. 5. component mounting method as claimed in claim 4, it is characterised in that
    In the component mounting process, adsorbed by mounting head from component feeding portion and keep electronic component and transfer carrying to base Plate,
    In the installation check process, it is arranged oppositely by checking head pair and the component mounting mechanism and electronics member is installed The substrate of part checked,
    It is described be determined as it is bad in the case of, the mark element is supplied by the component feeding portion and by the mounting head Take out.
  6. 6. the component mounting method as any one of claim 4 or 5, it is characterised in that
    In the electronic component as the mounting object based on the element mounting portion, included in all electricity for being installed of covering The shielding element installed under the form of subcomponent, the mark element is arranged on the screen on the mounting surface of the substrate Cover the outside of element.
CN201310367561.0A 2012-08-21 2013-08-21 Element fixing apparatus and component mounting method Active CN103635074B (en)

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JP2012-182068 2012-08-21
JP2012182068A JP5927431B2 (en) 2012-08-21 2012-08-21 Component mounting apparatus and component mounting method

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CN103635074B true CN103635074B (en) 2017-12-12

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JP5927430B2 (en) * 2012-08-21 2016-06-01 パナソニックIpマネジメント株式会社 Component mounting line
JPWO2020070809A1 (en) * 2018-10-02 2021-03-25 株式会社Fuji Work machine
WO2021002005A1 (en) * 2019-07-04 2021-01-07 株式会社Fuji Component mounting machine

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