First, reference picture 1, the structure of element mounting production line 1 is illustrated.Element mounting production line 1, which has, to be passed through
Electronic component is arranged on substrate to manufacture the function of installation base plate by welding, connects multiple electronic component apparatus for mounting and structure
Into.Here, the structure for tandem printing device M1, printing inspection apparatus M2, element fixing apparatus M3 and reflux M4.
Hereinafter, the structure of each device is illustrated.Printing equipment M1 has the printed electronic on the substrate of mounting object
The function of the soldering paste of element engagement, it is configured with the substrate 4 of mounting object in base station 2A upper surface along board carrying direction
The substrate conveying mechanism 3 of carrying and the board positioning part 5 for carrying the substrate 4 come position holding.In board positioning part 5
Top be configured with the half tone mask 15 for being deployed in mask frame 14, in addition, being configured with the top of half tone mask 15 to be held in
The Squeegee-printing unit 13 of moving beam 12 is by Y-axis workbench 11 and the screen painting portion of the structure of horizontal drive.
Make to supply from upstream side（Arrow a）And pass through the lower surface of the substrate 4 that board positioning part 5 positions and half tone mask 15
Abut, driving Y-axis workbench 11 so that Squeegee-printing unit 13 the half tone mask 15 of supply soldering paste upper surface slide, so as in shape
Into the element connection in substrate 4 electrode via the pattern hole Printing Paste located at half tone mask 15.Printing inspection apparatus M2
The substrate 4 after presswork is performed by printing equipment M1 with receiving, examined to being printed in the printing state of soldering paste of substrate 4
The function of looking into.
The substrate conveying mechanism 3 linked with printing equipment M1 is configured with printing inspection apparatus M2 base station 2B upper surface
And board positioning part 6.In addition, it is configured with the top of board positioning part 6 by being made up of Y-axis workbench 11, moving beam 16
Video camera travel mechanism and the video camera 17 of inspection that moves horizontally.Pass through actuated camera travel mechanism, video camera 17
Moved in the horizontal direction in the top of substrate 4, the optional position of substrate 4 is shot.Moreover, by Image recognizing section to this
Processing is identified in shooting result, by identifying processing result by checking that processing unit carries out determination processing, so as to perform printing inspection
The element fixing apparatus M3 in the downstream for being configured at printing inspection apparatus M2 structure is illustrated.Base station 2C's
Center, along board carrying direction（X-direction）It is configured with substrate conveying mechanism 18.Substrate conveying mechanism 18 is carried to be filled from print inspection
M2 is put to transmit the substrate 4 come and be positioned at the erecting bed for carrying out component mounting work by component mounting mechanism.In substrate
The side of carrying mechanism 18（It is downside in Fig. 1）It is configured with the element that electronic component is installed on the substrate after print solder 4
Installation portion M3A, in opposite side（It is upside in Fig. 1）With element mounting portion M3A is oppositely disposed installation check portion M3B, the peace
It is defined inspection of the object progress on installment state that inspection portion M3B, which is filled, with the substrate 4 after installation elements.
Component feeding portion 22 is provided with element mounting portion M3A, multiple belt feed have been arranged side by side in component feeding portion 22
Device 23.Tape feeder 23 carries out pitch feeding by being installed on the carrier band of electronic component on substrate 4 to holding, so as to by electricity
Subcomponent is supplied to component pick up location.Be configured with Y-axis moving table 19 in the end of base station 2C X-direction side, with Y-axis
Mounting head 21 is separately installed with two X-axis moving tables 20A, 20B that mobile work platform 19 combines, checks first 24.Pass through
Fig. 3, Fig. 4 illustrate to element mounting portion M3A, installation check portion M3B detailed functions.
Placement substrate carrying mechanism 28 and reflow ovens 29 on base station 2D are configured with element fixing apparatus M3 downstream
Structure reflux M4.Entered by element mounting portion M3A after units install and execute the inspection based on installation check portion M3B
Substrate 4 carried by substrate conveying mechanism 28 in the reflow ovens 29, so as to, substrate 4 heats according to the heating protocol of regulation, by
This makes scolding tin melting and solidification so that electronic component is welded on substrate 4.Substrate 4 after welding is taken out of to downstream（Arrow b）, into
For the object checked after backflow.
Then, reference picture 2 illustrates to the form of the substrate 4 of the manipulating object as element mounting production line 1.Such as figure
2（a）Shown, substrate 4 is to make the structure that the single substrates such as polylith resin substrate 40 are maintained on substrate supporting plate 4a.Such as Fig. 2（b）Institute
Show, be set with single substrate 40 multiple for installing electronic component 42（Reference picture 3, Fig. 4）Component installation location 40a,
On each component installation location 40a, the form of corresponding each component type, formed with the electrode for welding electronic component
41.In the presswork carried out by printing inspection apparatus M2, the Printing Paste S on electrode 41.In addition, the knot as substrate 4
Structure, or by polylith single substrate（Submounts）The structure of embedded mother substrate.
Below, reference picture 3, detailed construction to element mounting portion M3A and the job content performed by element mounting portion M3A
Illustrate.Such as Fig. 3（a）Shown, mounting head 21 possesses multiple unit transfer head 25, by being installed on constituent parts transfer head 25
Suction nozzle 25a is kept electronic component via vacuum suction.By driving Y-axis moving table 19 and X-axis moving table
20A, mounting head 21 is in X direction, Y-direction moves horizontally.Thus, mounting head 21 is respectively from the tape feeder in component feeding portion 22
23 are adsorbed and take out electronic component, and electronic element transferring is carried to the printing weldering for the erecting bed for being positioned at substrate conveying mechanism 18
On substrate 4 after tin.
Y-axis moving table 19, X-axis moving table 20A, mounting head 21 are formed by mounting head 21 from component feeding portion 22
Absorption is kept and picks up electronic component, and transfer is carried to the component mounting mechanism being printed with the substrate 4 of scolding tin.Moved in X-axis
Workbench 20A lower surface is provided with the substrate integrally moved with mounting head 21 and identifies video camera 26, together with mounting head 21
The substrate identification video camera 26 of the top movement of substrate 4 is shot to substrate 4, by the way that place is identified to the shooting result
Reason, to identify the component installation location on substrate 4.
In mounting head 21 from component feeding portion 22 to being provided with element identification video camera 27 on the mobile route of substrate 4.Pass through
Keep electronic component mounting head 21 element identification video camera 27 top movement, element identification video camera 27 from below to by
The electronic component that mounting head 21 is kept is shot, by the way that processing is identified to the shooting result, to being held in mounting head 21
The dislocation of electronic component of state detected.
Fig. 3（b）、（c）、（d）Represent the operation performed by the component mounting mechanism of said structure.First, Fig. 3（b）Represent
Component mounting operation with the single substrate 40 after print solder for object.That is, mounting head 21 is made to be moved to component feeding portion 22
And electronic component 42 is taken out from tape feeder 23 by the suction nozzle 25a of m units transfer head 25, electronic component 42 is transferred into carrying
To each component installation location 40a for the single substrate 40 for forming substrate 4.Moreover, the substrate 4 after installation elements turns into and will schemed
The object checked after the installation illustrated in 4.
In addition, such as Fig. 3（c）It is shown, to the single substrate 40 after installation elements cover the shielding member of shielding element 43
Part installation action.I.e., similarly, mounting head 21 is moved to component feeding portion 22, by the suction nozzle 25a of unit transfer head 25 from
The loader for accommodating shielding element 43 takes out shielding element 43, is covered on the single substrate 40 after installation elements and is provided with electronics
The mounting surface of element 42 is to install shielding element 43.
In addition, such as Fig. 3（d）Shown, component mounting mechanism carries out being judged to pacifying on bad substrate in checking after mounting
Dress represents operation of the substrate for the mark element 44 of bad substrate.Here, show in multiple electronic components 42, to one
Individual electronic component 42* detects bad example.I.e., similarly, mounting head 21 is moved to component feeding portion 22, pass through list
The suction nozzle 25a of displacement carrier head 25 takes out mark element 44 from mark is accommodated with the loader of element 44, is covering shielding member
On single substrate 40 after part 43, mark element 44 is arranged on the bonding agent in the outside for defaulting in shielding element 43.Mark
Note element 44 is supplied by component feeding portion 22 and taken out by mounting head 21.As long as bonding agent is that can be bonded mark element 44
Material on single substrate 40, but the preferably adhesives such as adhesive tape or scolding tin.It is that adhesive tape etc. is bonded material in bonding agent
In the case of material, after reflow process described later, easily mark element 44 can also be unloaded from single substrate 40, made
Industry is good.In addition, in the case where bonding agent is scolding tin, in above-mentioned print solder, the electrode of element connection is not only,
And the position of bonding agent also can print solder together, therefore, save the trouble that bonding agent is set, good work.In addition, this
When, the upper surface that shielding element 43 is arranged on to single substrate 40 can also be substituted, mark is arranged on substrate 4 with element 44
The position adjacent with the single substrate 40 on substrate supporting plate 4a.
Below, reference picture 4, the detailed construction to installation check portion M3B and the job content by installation check portion M3B execution
Illustrate.Such as Fig. 4（a）It is shown, moved in X direction on the X-axis moving table 20B combined with Y-axis moving table 19
The inspection first 24 of built-in camera is installed freely.By driving Y-axis moving table 19 and X-axis moving table 20B, inspection
Look into first 24 in X direction, Y-direction moves horizontally.
Thus, check first 24 after substrate 4 from installation elements to the erecting bed for being positioned at substrate conveying mechanism 18 top
It is mobile, such as Fig. 4（b）It is shown, the single substrate 40 for being provided with electronic component 42 is shot.Moreover, obtained camera data
Processing is identified by identifying processing portion 30, the inspection data prestored to its recognition result according to inspection processing unit 31 are entered
Row inspection is handled, and thus, checks the quality of the installment state on the single substrate 40.Check first 24 and Y-axis moving table 19,
X-axis moving table 20B forms inspection body.
Moreover, inspection result is transferred to control unit 32, control unit 32 is based on the inspection result, according to default action policy
It is that the operation action that Object Selection should perform is performed with the single substrate 40.That is, installation check portion M3B turns into following knot
Structure：With being arranged oppositely by checking first 24 couples and element mounting portion M3A component mounting mechanism and be provided with electronic component 42
The inspection body that is checked of single substrate 40.
Below, with Fig. 5 flow, with reference to each figure to the member with substrate 4 for object that is performed by element mounting production line 1
Part installation process illustrates.First, after element installation process starts（ST1）, the substrate 4 for keeping multiple single substrates 40 is removed
Enter printing equipment M1, be object with these multiple single substrates 40, carry out the printing of tin cream in the lump（ST2）.Thus, such as Fig. 6（a）
It is shown, screen painting soldering paste S on component installation location 40a each electrode 41 is formed on single substrate 40.Then, will print
Substrate 4 afterwards moves into printing inspection apparatus M2, here, being checked after being printed（ST3）, it is pair with inspection result OK substrate 4
As carrying out the installation of electronic component（ST4）.
That is, such as Fig. 6（b）It is shown, following installation procedure is performed repeatedly：Make unit transfer head on element mounting portion M3A
25 move back and forth between component feeding portion 22 and substrate 4（Arrow d）, while electronic component 42 is transferred into carrying to printing successively
There is soldering paste S component installation location 40a.Then, it is object with the substrate 4 after installation, is checked after performing installation（ST5）.
That is, such as Fig. 6（c）It is shown, on installation check portion M3B, inspection first 24 is moved to the top of each single substrate 40（Arrow d）,
The single substrate 40 for being provided with electronic component 42 is shot.Moreover, after by the way that obtained camera data is identified
Recognition result carries out inspection processing, judges the quality of installment state.
Here, if inspection result is OK, in order to which electronic component 42 is welded on single substrate 40, backflow work is performed
Sequence（ST7）.Here, in the present embodiment, turn into the electronic component of the mounting object based on element mounting portion M3A comprising electricity
The shielding element 43 of magnetic screen, the installation of shielding element 43 perform before reflow.That is, such as Fig. 7（a）It is shown, pass through unit
The absorption of transfer head 25 keeps shielding element 43, and monolithic base is arranged under the form for all electronic components 42 that covering is installed
On plate 40（Arrow e）.
In addition,（ST5）In the case that middle inspection result is NG, such as Fig. 3 is carried out（d）The peace of shown mark element 44
Dress（ST6）.Fig. 8（a）The example that inspection result is NG is represented, represents following state：It is printed with soldering paste S's in electrode 41
In the state of component installation location 40a carries electronic component 42, the center C1 with respect to soldering paste S, the center of electronic component 42
Position C2 is misplaced with the magnitude of misalignment D more than license amount.In this case, such as Fig. 7（b）It is shown, mark element 44 is pacified
On the single substrate 40（Arrow f）.
Moreover, by completing with all single substrates 40 to be checked after the element installation and installation of object, such as Fig. 7（c）
It is shown, it is changed into maintaining the state that inspection result is respectively OK, NG single substrate 40 on substrate 4.Moreover,（ST7）Return
Flow in process, move into the substrate 4 of this state（Arrow g）.Thus, mounting surface can not be carried out even in covering shielding element 43
Visual observation in the case of, also can reliably be distinguished after reflow process in the single substrate 40 comprising being determined as installment state
The situation of bad electronic component.
I.e., in the present embodiment, after reflow process, if taking out of substrate 4 from reflux M4, sentence by visual observation
It is disconnected whether to have mark element 44（ST8）.Here, if NO（It is unmarked to use element 44）, then mean in all electronics
Backflow is performed in the state of the installment state of element 42 is good, is judged as having carried out welding and terminating element installation place well
In addition, if（ST8）For YES（There is mark element 44）, then mean to exist in the bad shape of installment state
The element to be flowed back under state.In this case, checked after performing the backflow according to X-ray examination（ST9）.Thus, even in
Covering shielding element 43 and in the case of the visual observation of mounting surface can not be carried out, weldering can also determine that to individual other electronic component 42
Connect the quality of state.
Fig. 8（b）Represent the welded condition detected by X-ray examination.Here,（A）Represent following example：By based on return
The autoregistration effect of the surface tension of the melting scolding tin in process is flowed, electronic component 42 is pulled to soldering paste S center C1, and
By such as Fig. 8（a）Installment state is bad caused by shown carrying dislocation is improved（Arrow h）.Here, the magnitude of misalignment before backflow
D is reduced to the magnitude of misalignment D* within License Value by the autoregistration effect, in this case, OK is checked after being determined as backflow.
On the other hand, Fig. 8（b）（B）Middle expression following example：Some are acted in scolding tin melting process exceed and be based on from right
The external force of the attraction of the center position of quasi- effect, a side of electronic component 42（It is lower end side herein）To away from soldering paste S's
Move in direction（Arrow i）, in this case, NG is checked after being determined as backflow.Moreover, in being checked after the backflow, if OK
Then element installation process terminates（ST10）, in addition in the case of NG, the single substrate 40 is determined as bad substrate and turns into useless
Abandon the object of processing（ST11）.
As described in the foregoing description, the element mounting production line shown in present embodiment and component mounting method are possessing element
In erecting device M3 element mounting production line 1, in the case where being bad according to the result judgement of inspection, the substrate will be shown
It is arranged on the single substrate 40 and takes out of to reflux by element mounting portion M3A for the mark element 44 of bad substrate
M4, the element fixing apparatus M3 have the element mounting portion that electronic component is installed on the single substrate 40 after print solder
The M3A and installation check portion M3B for carrying out defined inspection for object with the single substrate 40 after installation elements.
Thus, it is possible to effectively solves the test mode used in the element mounting production line of prior art, i.e. every
One inspection operation fixed configurations operator and the inspection judged by operator being determined as bad substrate progress mistake judgement
The problem of being produced in mode.That is, whether appropriate the judgement that mistake judges to judge is largely by proficiency of operator or so, often
It is not necessarily often appropriate judgement.Therefore following result can be become：In each inspection operation, even if fixed configurations operator couple
The mistake after checking all is performed to judge to judge, the not only guarantee with installation quality do not contact directly, and cause due to
Fixed configurations operator and caused by labour cost increase, reduce productivity ratio.
On the other hand, in the present embodiment, even in be determined as according to inspection result it is bad in the case of, without entering
Row mistake judges to judge, and adjustment notch element 44 and is taken out of on the single substrate 40 to reflux M4, will only carry
The object that mark is checked by the use of the single substrate 40 of element 44 as after flowing back.Thus, do not have to carry out all in checking upon reflowing
Check, correct fine or not result of determination can be obtained, the raising ensured with productivity ratio of installation quality can be taken into account.
In addition, in the present embodiment, for by element fixing apparatus M3 element mounting portion M3A and in single substrate 40
The structure of upper adjustment notch element 44, the element fixing apparatus M3, which has, installs electronics member on the substrate after print solder
The element mounting portion M3A of the part and installation check portion M3B that defined inspection is carried out using the substrate after installation elements as object, but tie
Structure is not limited by this.The element fixing apparatus configuration of electronic component can also will be installed with peace on the substrate after print solder
The downstream that the substrate after element carries out the defined installation check device checked for object is filled, by the element fixing apparatus in list
Adjustment notch element 44 on plate base 40.
The present invention element fixing apparatus and component mounting method have can take into account installation quality ensure and productivity ratio
Raising effect, it is useful to manufacture the field of installation base plate to installing the element such as electronic component on substrate.