JP5089860B2 - 圧電アクチュエータ及び液体吐出ヘッド - Google Patents

圧電アクチュエータ及び液体吐出ヘッド Download PDF

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Publication number
JP5089860B2
JP5089860B2 JP2004351209A JP2004351209A JP5089860B2 JP 5089860 B2 JP5089860 B2 JP 5089860B2 JP 2004351209 A JP2004351209 A JP 2004351209A JP 2004351209 A JP2004351209 A JP 2004351209A JP 5089860 B2 JP5089860 B2 JP 5089860B2
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JP
Japan
Prior art keywords
control layer
thermal stress
stress control
thickness
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004351209A
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English (en)
Japanese (ja)
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JP2006165102A (ja
JP2006165102A5 (enExample
Inventor
靖和 二瓶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2004351209A priority Critical patent/JP5089860B2/ja
Priority to US11/290,643 priority patent/US20060119226A1/en
Publication of JP2006165102A publication Critical patent/JP2006165102A/ja
Publication of JP2006165102A5 publication Critical patent/JP2006165102A5/ja
Priority to US12/114,577 priority patent/US7652412B2/en
Priority to US12/501,935 priority patent/US20090271964A1/en
Priority to US12/637,368 priority patent/US8004159B2/en
Application granted granted Critical
Publication of JP5089860B2 publication Critical patent/JP5089860B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2004351209A 2004-12-03 2004-12-03 圧電アクチュエータ及び液体吐出ヘッド Expired - Fee Related JP5089860B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004351209A JP5089860B2 (ja) 2004-12-03 2004-12-03 圧電アクチュエータ及び液体吐出ヘッド
US11/290,643 US20060119226A1 (en) 2004-12-03 2005-12-01 Piezoelectric actuator, method of manufacturing same, and liquid ejection head
US12/114,577 US7652412B2 (en) 2004-12-03 2008-05-02 Piezoelectric actuator, method of manufacturing same, and liquid ejection head
US12/501,935 US20090271964A1 (en) 2004-12-03 2009-07-13 Piezoelectric actuator, method of manufacturing same, and liquid ejection head
US12/637,368 US8004159B2 (en) 2004-12-03 2009-12-14 Piezoelctric actuator, method of manufacturing same, and liquid ejection head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004351209A JP5089860B2 (ja) 2004-12-03 2004-12-03 圧電アクチュエータ及び液体吐出ヘッド

Publications (3)

Publication Number Publication Date
JP2006165102A JP2006165102A (ja) 2006-06-22
JP2006165102A5 JP2006165102A5 (enExample) 2007-08-23
JP5089860B2 true JP5089860B2 (ja) 2012-12-05

Family

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Family Applications (1)

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JP2004351209A Expired - Fee Related JP5089860B2 (ja) 2004-12-03 2004-12-03 圧電アクチュエータ及び液体吐出ヘッド

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Country Link
US (4) US20060119226A1 (enExample)
JP (1) JP5089860B2 (enExample)

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US7808180B2 (en) * 2003-05-26 2010-10-05 Koninklijke Philips Electronics N.V. Thorium-free electrode with improved color stability
US7888842B2 (en) * 2004-02-13 2011-02-15 University Of Maine System Board Of Trustees Ultra-thin film electrodes and protective layer for high temperature device applications
JP2005288853A (ja) * 2004-03-31 2005-10-20 Brother Ind Ltd インクジェットヘッドの製造方法及びインクジェットヘッド
JP2007181185A (ja) * 2005-12-01 2007-07-12 Sony Corp 音響共振器およびその製造方法
JP5391395B2 (ja) * 2007-10-15 2014-01-15 日立金属株式会社 圧電薄膜付き基板及び圧電素子
JP4784611B2 (ja) 2008-01-31 2011-10-05 ブラザー工業株式会社 圧電アクチュエータの製造方法及び液体移送装置の製造方法
JP5523692B2 (ja) * 2008-10-21 2014-06-18 Ｔｄｋ株式会社 圧電アクチュエータの製造方法
DE102008055123B3 (de) * 2008-12-23 2010-07-22 Robert Bosch Gmbh Ultraschallwandler zum Einsatz in einem fluiden Medium
JP2010149371A (ja) * 2008-12-25 2010-07-08 Brother Ind Ltd 液体移送装置の製造方法
JP5526704B2 (ja) * 2009-10-26 2014-06-18 Ｔｄｋ株式会社 圧電アクチュエータ
JP5350418B2 (ja) * 2011-02-28 2013-11-27 富士フイルム株式会社 共振振動子、共振振動子の製造方法およびこの共振振動子を有する超音波処置具
DE102011081276A1 (de) * 2011-08-19 2013-02-21 Siemens Aktiengesellschaft Verfahren zur Herstellung eines piezokeramischen Biegewandlers
US9136820B2 (en) * 2012-07-31 2015-09-15 Tdk Corporation Piezoelectric device
US9070394B1 (en) 2013-03-18 2015-06-30 Magnecomp Corporation Suspension microactuator with wrap-around electrode on inactive constraining layer
US9330694B1 (en) 2013-03-18 2016-05-03 Magnecomp Corporation HDD microactuator having reverse poling and active restraining layer
US11205449B2 (en) 2013-03-18 2021-12-21 Magnecomp Corporation Multi-layer PZT microacuator with active PZT constraining layers for a DSA suspension
US10607642B2 (en) 2013-03-18 2020-03-31 Magnecomp Corporation Multi-layer PZT microactuator with active PZT constraining layers for a DSA suspension
US9117468B1 (en) 2013-03-18 2015-08-25 Magnecomp Corporation Hard drive suspension microactuator with restraining layer for control of bending
US9741376B1 (en) 2013-03-18 2017-08-22 Magnecomp Corporation Multi-layer PZT microactuator having a poled but inactive PZT constraining layer
US9330698B1 (en) 2013-03-18 2016-05-03 Magnecomp Corporation DSA suspension having multi-layer PZT microactuator with active PZT constraining layers
US20150162523A1 (en) * 2013-12-06 2015-06-11 Murata Manufacturing Co., Ltd. Piezoelectric device
JP5757354B2 (ja) * 2014-04-09 2015-07-29 ブラザー工業株式会社 圧電アクチュエータの製造方法及び液体移送装置の製造方法
US10128431B1 (en) 2015-06-20 2018-11-13 Magnecomp Corporation Method of manufacturing a multi-layer PZT microactuator using wafer-level processing
KR102506301B1 (ko) * 2018-09-04 2023-03-07 카티르가마순다람 수리아쿠마르 음향 변환기와 관련 제작 및 패키징 기술
TW202243295A (zh) * 2021-04-22 2022-11-01 達運精密工業股份有限公司 震動模組及其製造方法
US20230099440A1 (en) * 2021-09-28 2023-03-30 Skyworks Global Pte. Ltd. Piezoelectric mems device with thermal compensation from different material properties

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Also Published As

Publication number Publication date
US7652412B2 (en) 2010-01-26
US20060119226A1 (en) 2006-06-08
US8004159B2 (en) 2011-08-23
US20080238263A1 (en) 2008-10-02
JP2006165102A (ja) 2006-06-22
US20100091073A1 (en) 2010-04-15
US20090271964A1 (en) 2009-11-05

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