JP5078039B2 - Ga2O3系半導体素子及びGa2O3系半導体素子の製造方法 - Google Patents
Ga2O3系半導体素子及びGa2O3系半導体素子の製造方法 Download PDFInfo
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- JP5078039B2 JP5078039B2 JP2009008686A JP2009008686A JP5078039B2 JP 5078039 B2 JP5078039 B2 JP 5078039B2 JP 2009008686 A JP2009008686 A JP 2009008686A JP 2009008686 A JP2009008686 A JP 2009008686A JP 5078039 B2 JP5078039 B2 JP 5078039B2
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- QZQVBEXLDFYHSR-UHFFFAOYSA-N gallium(III) oxide Inorganic materials O=[Ga]O[Ga]=O QZQVBEXLDFYHSR-UHFFFAOYSA-N 0.000 title 2
- 150000001875 compounds Chemical class 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 claims description 54
- 239000000758 substrate Substances 0.000 abstract description 37
- 230000000052 comparative effect Effects 0.000 description 30
- 238000010586 diagram Methods 0.000 description 27
- 238000004549 pulsed laser deposition Methods 0.000 description 9
- 239000002019 doping agent Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 230000001678 irradiating effect Effects 0.000 description 7
- 238000005253 cladding Methods 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- -1 gallium nitride (GaN) compound Chemical class 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
Description
図1は、本発明の第1の実施の形態に係る発光素子を示す。この発光素子1は、β−Ga2O3化合物半導体からなるn型β−Ga2O3基板2に、β−AlGaO3化合物半導体からなるn型導電性を示すn型β−AlGaO3クラッド層4、β−Ga2O3からなる活性層5、p型導電性を示すp型β−AlGaO3クラッド層6、およびβ−Ga2O3化合物半導体からなるp型導電性を示すp型β−Ga2O3コンタクト層7を順次積層したものである。
図2は、本発明の第2の実施の形態に係る発光素子を示す図である。この発光素子1は、第1の実施の形態に係る発光素子1とは、n側電極20のみが相違する。この発光素子1のn側電極20は、n型β−Ga2O3基板4の下面に、Ti層21を形成し、その下方にAu層22を形成したものである。Au層22の代わりにPt層であってもよい。
図3は、本発明の第3の実施の形態に係る発光素子の要部を示す。この発光素子1は、第1の実施の形態に係る発光素子1とは、n側電極20のみが相違する。この発光素子1のn側電極20は、n型β−Ga2O3基板2の下面にTi層21、Al層23およびAu層22を順次積層したものである。
図4は、本発明の第4の実施の形態に係る発光素子の要部を示す。この発光素子1は、第1の実施の形態に係る発光素子1とは、n側電極20のみが相違する。この発光素子1のn側電極20は、n型β−Ga2O3基板2の下面にTi層21、Al層23、Ni層24およびAu層22を順次積層したものである。
(比較例1)
トキー特性を示し、オーミック特性を示していない。
(比較例2)
(比較例3)
2 基板
4 n型β−AlGaO3クラッド層
5 活性層
6 p型β−AlGaO3クラッド層
7 p型β−Ga2O3コンタクト層
8 透明電極
9 パッド電極
10,12 接合部
11,13 ワイヤ
20 n側電極
21 Ti層
22 Au層
23 Al層
24 Ni層
30 プリント基板
31 接着剤
40 出射光
41 発光光
Claims (7)
- n型導電性を有するβ−Ga2O3化合物半導体からなるn型層と、
前記n型層上に形成されたTi層を有する電極と
を備え、
前記電極は、前記n型層にオーミック接続しているGa2O3系半導体素子。 - 前記電極は、前記Ti層上に形成されるAu層を更に有する請求項1に記載のGa2O3系半導体素子。
- 前記電極は、前記Ti層上に形成されるAl層を更に有する請求項1に記載のGa2O3系半導体素子。
- 前記電極は、前記Al層上に形成されるAu層を更に有する請求項3に記載のGa2O3系半導体素子。
- 前記電極は、前記Al層上に形成されるNi層と、前記Ni層上に形成されるAu層とを更に有する請求項3に記載のGa2O3系半導体素子。
- n型導電性を有するβ−Ga2O3化合物半導体からなるn型層を準備する工程と、
前記n型層上にTi層を形成する工程と、
前記Ti層上に、Au層又はAl層を形成する工程と
を備えるGa2O3系半導体素子の製造方法。 - 前記Ti層と、前記Au層又は前記Al層とが形成された前記n型層に熱処理を施す工程を更に備える請求項6に記載のGa2O3系半導体素子の製造方法。
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JP2009008686A JP5078039B2 (ja) | 2009-01-19 | 2009-01-19 | Ga2O3系半導体素子及びGa2O3系半導体素子の製造方法 |
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JP2009008686A JP5078039B2 (ja) | 2009-01-19 | 2009-01-19 | Ga2O3系半導体素子及びGa2O3系半導体素子の製造方法 |
Related Parent Applications (1)
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JP2004071816A Division JP4670034B2 (ja) | 2004-03-12 | 2004-03-12 | 電極を備えたGa2O3系半導体層 |
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JP2012183835A Division JP5799354B2 (ja) | 2012-08-23 | 2012-08-23 | Ga2O3系半導体素子 |
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JP2009081468A JP2009081468A (ja) | 2009-04-16 |
JP5078039B2 true JP5078039B2 (ja) | 2012-11-21 |
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Cited By (1)
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KR20160043968A (ko) | 2013-08-19 | 2016-04-22 | 이데미쓰 고산 가부시키가이샤 | 산화물 반도체 기판 및 쇼트키 배리어 다이오드 |
Families Citing this family (8)
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WO2013069729A1 (ja) * | 2011-11-09 | 2013-05-16 | 株式会社タムラ製作所 | 半導体素子及びその製造方法 |
JP2016015375A (ja) * | 2014-07-01 | 2016-01-28 | 株式会社タムラ製作所 | 発光素子 |
TWI660505B (zh) | 2015-12-18 | 2019-05-21 | 日商Flosfia股份有限公司 | Semiconductor device |
US20180097073A1 (en) | 2016-10-03 | 2018-04-05 | Flosfia Inc. | Semiconductor device and semiconductor system including semiconductor device |
WO2021141130A1 (ja) | 2020-01-10 | 2021-07-15 | 株式会社Flosfia | 導電性金属酸化膜、半導体素子および半導体装置 |
JPWO2021157720A1 (ja) | 2020-02-07 | 2021-08-12 | ||
KR20220134639A (ko) | 2020-02-07 | 2022-10-05 | 가부시키가이샤 플로스피아 | 반도체 소자 및 반도체 장치 |
JP2022069302A (ja) | 2020-10-23 | 2022-05-11 | 株式会社Flosfia | 半導体装置 |
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JPH111399A (ja) * | 1996-12-05 | 1999-01-06 | Lg Electron Inc | 窒化ガリウム半導体単結晶基板の製造方法並びにその基板を用いた窒化ガリウムダイオード |
JPH10303407A (ja) * | 1997-04-22 | 1998-11-13 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP3462429B2 (ja) * | 1999-06-07 | 2003-11-05 | 日本電信電話株式会社 | ワイドギャップ半導体用電極金属膜の作製方法 |
JP2003100657A (ja) * | 2001-09-20 | 2003-04-04 | Nissan Motor Co Ltd | 半導体装置の製造方法 |
JP4053926B2 (ja) * | 2002-05-27 | 2008-02-27 | 日亜化学工業株式会社 | 窒化物半導体発光素子とそれを用いた発光装置 |
JP3679097B2 (ja) * | 2002-05-31 | 2005-08-03 | 株式会社光波 | 発光素子 |
JP2004022796A (ja) * | 2002-06-17 | 2004-01-22 | Matsushita Electric Ind Co Ltd | 炭化珪素半導体素子およびその形成方法 |
JP2004071657A (ja) * | 2002-08-01 | 2004-03-04 | Nec Corp | Iii族窒化物半導体素子、iii族窒化物半導体基板およびiii族窒化物半導体素子の製造方法 |
JP4507532B2 (ja) * | 2002-08-27 | 2010-07-21 | 日亜化学工業株式会社 | 窒化物半導体素子 |
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KR20160043968A (ko) | 2013-08-19 | 2016-04-22 | 이데미쓰 고산 가부시키가이샤 | 산화물 반도체 기판 및 쇼트키 배리어 다이오드 |
US9570631B2 (en) | 2013-08-19 | 2017-02-14 | Idemitsu Kosan Co., Ltd. | Oxide semiconductor substrate and schottky barrier diode |
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