JP5069449B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP5069449B2
JP5069449B2 JP2006308322A JP2006308322A JP5069449B2 JP 5069449 B2 JP5069449 B2 JP 5069449B2 JP 2006308322 A JP2006308322 A JP 2006308322A JP 2006308322 A JP2006308322 A JP 2006308322A JP 5069449 B2 JP5069449 B2 JP 5069449B2
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Japan
Prior art keywords
layer
wiring
substrate
pad
resist
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JP2006308322A
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Japanese (ja)
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JP2008124339A (ja
JP2008124339A5 (enExample
Inventor
泰彦 草間
茂次 村松
正宏 経塚
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2006308322A priority Critical patent/JP5069449B2/ja
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Publication of JP2008124339A5 publication Critical patent/JP2008124339A5/ja
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    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

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  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2006308322A 2006-11-14 2006-11-14 配線基板及びその製造方法 Active JP5069449B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006308322A JP5069449B2 (ja) 2006-11-14 2006-11-14 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006308322A JP5069449B2 (ja) 2006-11-14 2006-11-14 配線基板及びその製造方法

Publications (3)

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JP2008124339A JP2008124339A (ja) 2008-05-29
JP2008124339A5 JP2008124339A5 (enExample) 2009-11-05
JP5069449B2 true JP5069449B2 (ja) 2012-11-07

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JP2006308322A Active JP5069449B2 (ja) 2006-11-14 2006-11-14 配線基板及びその製造方法

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JP (1) JP5069449B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110038521A (ko) * 2009-10-08 2011-04-14 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
US10388608B2 (en) * 2015-08-28 2019-08-20 Hitachi Chemical Company, Ltd. Semiconductor device and method for manufacturing same
JP7048593B2 (ja) * 2017-05-19 2022-04-05 ベジ 佐々木 電子部品搭載用基板及びその製造方法
TWI705747B (zh) * 2019-08-30 2020-09-21 嘉聯益科技股份有限公司 多層軟性電路板及其製造方法
JP2022014750A (ja) * 2020-07-07 2022-01-20 キオクシア株式会社 半導体装置およびその製造方法
TWI831123B (zh) * 2022-01-28 2024-02-01 巨擘科技股份有限公司 多層基板表面處理層結構
CN115190701B (zh) * 2022-05-13 2023-06-02 广州广芯封装基板有限公司 一种埋入式线路封装基板及其加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03253091A (ja) * 1990-03-02 1991-11-12 Tokuyama Soda Co Ltd プリント配線板の製造方法
JPH11126974A (ja) * 1997-10-24 1999-05-11 Asahi Chem Res Lab Ltd 多層配線板の製造方法
JP2002299779A (ja) * 2001-03-30 2002-10-11 Hitachi Metals Ltd 配線形成用帯材及びそれを用いたバンプ付き配線を有する配線板並びに配線形成用帯材を用いた転写配線板の製造方法
JP2003008228A (ja) * 2001-06-22 2003-01-10 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2004095972A (ja) * 2002-09-03 2004-03-25 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
JP2005166910A (ja) * 2003-12-02 2005-06-23 Fujikura Ltd プリント配線板およびその製造方法

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JP2008124339A (ja) 2008-05-29

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