JP5052007B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5052007B2
JP5052007B2 JP2005379661A JP2005379661A JP5052007B2 JP 5052007 B2 JP5052007 B2 JP 5052007B2 JP 2005379661 A JP2005379661 A JP 2005379661A JP 2005379661 A JP2005379661 A JP 2005379661A JP 5052007 B2 JP5052007 B2 JP 5052007B2
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JP
Japan
Prior art keywords
capacitor
electrode pad
semiconductor device
substrate
region
Prior art date
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Expired - Fee Related
Application number
JP2005379661A
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English (en)
Japanese (ja)
Other versions
JP2007180425A5 (enExample
JP2007180425A (ja
Inventor
竜二 山日
浩 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Device Innovations Inc
Original Assignee
Sumitomo Electric Device Innovations Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Device Innovations Inc filed Critical Sumitomo Electric Device Innovations Inc
Priority to JP2005379661A priority Critical patent/JP5052007B2/ja
Priority to US11/642,896 priority patent/US7332758B2/en
Priority to CN200610171482A priority patent/CN100587948C/zh
Publication of JP2007180425A publication Critical patent/JP2007180425A/ja
Priority to US12/003,111 priority patent/US7692227B2/en
Publication of JP2007180425A5 publication Critical patent/JP2007180425A5/ja
Application granted granted Critical
Publication of JP5052007B2 publication Critical patent/JP5052007B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
JP2005379661A 2005-12-28 2005-12-28 半導体装置 Expired - Fee Related JP5052007B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005379661A JP5052007B2 (ja) 2005-12-28 2005-12-28 半導体装置
US11/642,896 US7332758B2 (en) 2005-12-28 2006-12-21 Semiconductor device
CN200610171482A CN100587948C (zh) 2005-12-28 2006-12-28 半导体器件
US12/003,111 US7692227B2 (en) 2005-12-28 2007-12-20 Semiconductor device having an electrode pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005379661A JP5052007B2 (ja) 2005-12-28 2005-12-28 半導体装置

Publications (3)

Publication Number Publication Date
JP2007180425A JP2007180425A (ja) 2007-07-12
JP2007180425A5 JP2007180425A5 (enExample) 2009-02-19
JP5052007B2 true JP5052007B2 (ja) 2012-10-17

Family

ID=38192635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005379661A Expired - Fee Related JP5052007B2 (ja) 2005-12-28 2005-12-28 半導体装置

Country Status (3)

Country Link
US (2) US7332758B2 (enExample)
JP (1) JP5052007B2 (enExample)
CN (1) CN100587948C (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5197930B2 (ja) * 2006-06-30 2013-05-15 住友電工デバイス・イノベーション株式会社 半導体受光素子の製造方法
US7919860B2 (en) * 2007-08-27 2011-04-05 Texas Instruments Incorporated Semiconductor device having wafer level chip scale packaging substrate decoupling
JP5401817B2 (ja) * 2008-03-25 2014-01-29 富士通セミコンダクター株式会社 半導体装置の製造方法及び半導体装置
JP5474662B2 (ja) * 2010-05-27 2014-04-16 住友電工デバイス・イノベーション株式会社 半導体受光素子
WO2012026089A1 (ja) 2010-08-27 2012-03-01 国立大学法人奈良先端科学技術大学院大学 ＳｉＣ半導体素子
JP5734784B2 (ja) * 2011-08-05 2015-06-17 株式会社東芝 光結合装置
JP2013115371A (ja) 2011-11-30 2013-06-10 Sumitomo Electric Device Innovations Inc 容量素子
JP5920128B2 (ja) 2012-09-07 2016-05-18 住友電気工業株式会社 光導波路型受光素子の製造方法および光導波路型受光素子
KR102037866B1 (ko) * 2013-02-05 2019-10-29 삼성전자주식회사 전자장치
JP6094268B2 (ja) 2013-03-04 2017-03-15 住友電気工業株式会社 半導体集積受光デバイス
JP6330549B2 (ja) 2014-07-25 2018-05-30 住友電気工業株式会社 光半導体素子およびその製造方法
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
CN106981542A (zh) * 2017-03-29 2017-07-25 武汉京邦科技有限公司 一种半导体光电倍增器件的制造方法
KR102668436B1 (ko) * 2021-11-08 2024-05-24 (주)위드멤스 트렌치 커패시터 및 이의 제조 방법
CN114362119B (zh) * 2022-01-04 2024-05-14 武汉电信器件有限公司 一种apd保护电路结构

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698859A (en) * 1980-01-07 1981-08-08 Mitsubishi Electric Corp Solid-state electronic device
EP0093818A1 (de) * 1982-05-07 1983-11-16 Deutsche ITT Industries GmbH Monolithisch integrierte Schaltung mit integrierten Kondensatoren
JPS63186448A (ja) * 1987-01-28 1988-08-02 Mitsubishi Electric Corp 半導体装置
JPH0758294A (ja) * 1993-08-19 1995-03-03 Kawasaki Steel Corp 半導体集積回路チップ
JP4136009B2 (ja) * 1995-02-02 2008-08-20 住友電気工業株式会社 ｐｉｎ型受光素子、およびｐｉｎ型受光素子の製造方法
JPH0936305A (ja) * 1995-07-20 1997-02-07 Rohm Co Ltd ダイオードとコンデンサとを備えたチップ型複合素子の構造
US6902981B2 (en) * 2002-10-10 2005-06-07 Chartered Semiconductor Manufacturing Ltd Structure and process for a capacitor and other devices
JP2005129689A (ja) 2003-10-23 2005-05-19 Sumitomo Electric Ind Ltd 半導体受光素子及び光受信モジュール
EP1732134B1 (en) * 2004-02-27 2012-10-24 National University Corporation Tohoku Unversity Solid-state imagine device, line sensor, optical sensor, and method for operating solid-state imaging device
KR100672993B1 (ko) * 2005-01-19 2007-01-24 삼성전자주식회사 자가 승압 기능을 갖는 이미지 센서, 자가 승압 방법 및상기 이미지 센서 형성 방법
JP4911445B2 (ja) * 2005-06-29 2012-04-04 富士フイルム株式会社 有機と無機のハイブリッド光電変換素子

Also Published As

Publication number Publication date
US20080135961A1 (en) 2008-06-12
US7692227B2 (en) 2010-04-06
CN100587948C (zh) 2010-02-03
CN1992251A (zh) 2007-07-04
US20070145527A1 (en) 2007-06-28
JP2007180425A (ja) 2007-07-12
US7332758B2 (en) 2008-02-19

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