JP5018270B2 - 半導体積層体とそれを用いた半導体装置 - Google Patents
半導体積層体とそれを用いた半導体装置 Download PDFInfo
- Publication number
- JP5018270B2 JP5018270B2 JP2007164605A JP2007164605A JP5018270B2 JP 5018270 B2 JP5018270 B2 JP 5018270B2 JP 2007164605 A JP2007164605 A JP 2007164605A JP 2007164605 A JP2007164605 A JP 2007164605A JP 5018270 B2 JP5018270 B2 JP 5018270B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- semiconductor
- semiconductor chip
- conductive resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13005—Structure
- H01L2224/13009—Bump connector integrally formed with a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/9202—Forming additional connectors after the connecting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007164605A JP5018270B2 (ja) | 2007-06-22 | 2007-06-22 | 半導体積層体とそれを用いた半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007164605A JP5018270B2 (ja) | 2007-06-22 | 2007-06-22 | 半導体積層体とそれを用いた半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009004593A JP2009004593A (ja) | 2009-01-08 |
JP2009004593A5 JP2009004593A5 (zh) | 2010-04-22 |
JP5018270B2 true JP5018270B2 (ja) | 2012-09-05 |
Family
ID=40320650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007164605A Expired - Fee Related JP5018270B2 (ja) | 2007-06-22 | 2007-06-22 | 半導体積層体とそれを用いた半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5018270B2 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2010101163A1 (ja) * | 2009-03-04 | 2012-09-10 | 日本電気株式会社 | 機能素子内蔵基板及びそれを用いた電子デバイス |
JP5187284B2 (ja) * | 2009-06-26 | 2013-04-24 | ソニー株式会社 | 半導体装置の製造方法 |
WO2011036819A1 (ja) * | 2009-09-28 | 2011-03-31 | 株式会社 東芝 | 半導体装置の製造方法 |
JP5517800B2 (ja) | 2010-07-09 | 2014-06-11 | キヤノン株式会社 | 固体撮像装置用の部材および固体撮像装置の製造方法 |
WO2016114320A1 (ja) * | 2015-01-13 | 2016-07-21 | デクセリアルズ株式会社 | 多層基板 |
CN110783728A (zh) * | 2018-11-09 | 2020-02-11 | 广州方邦电子股份有限公司 | 一种柔性连接器及制作方法 |
KR20200094529A (ko) * | 2019-01-30 | 2020-08-07 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 및 그 제조방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4154919B2 (ja) * | 2002-02-28 | 2008-09-24 | 日立化成工業株式会社 | 回路接続材料及びそれを用いた回路端子の接続構造 |
JP3950406B2 (ja) * | 2002-11-21 | 2007-08-01 | 東レエンジニアリング株式会社 | 半導体基板セグメント及びその製造方法並びに該セグメントを積層して成る積層半導体基板及びその製造方法 |
JP5247968B2 (ja) * | 2003-12-02 | 2013-07-24 | 日立化成株式会社 | 回路接続材料、及びこれを用いた回路部材の接続構造 |
JP4467318B2 (ja) * | 2004-01-28 | 2010-05-26 | Necエレクトロニクス株式会社 | 半導体装置、マルチチップ半導体装置用チップのアライメント方法およびマルチチップ半導体装置用チップの製造方法 |
JP4074862B2 (ja) * | 2004-03-24 | 2008-04-16 | ローム株式会社 | 半導体装置の製造方法、半導体装置、および半導体チップ |
JP2006165073A (ja) * | 2004-12-03 | 2006-06-22 | Hitachi Ulsi Systems Co Ltd | 半導体装置およびその製造方法 |
KR20110048079A (ko) * | 2005-11-18 | 2011-05-09 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물 |
-
2007
- 2007-06-22 JP JP2007164605A patent/JP5018270B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009004593A (ja) | 2009-01-08 |
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