JP4964936B2 - 洗浄装置 - Google Patents
洗浄装置 Download PDFInfo
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- JP4964936B2 JP4964936B2 JP2009256815A JP2009256815A JP4964936B2 JP 4964936 B2 JP4964936 B2 JP 4964936B2 JP 2009256815 A JP2009256815 A JP 2009256815A JP 2009256815 A JP2009256815 A JP 2009256815A JP 4964936 B2 JP4964936 B2 JP 4964936B2
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- 238000004140 cleaning Methods 0.000 title claims description 184
- 239000000758 substrate Substances 0.000 claims description 138
- 230000032258 transport Effects 0.000 claims description 58
- 238000001035 drying Methods 0.000 claims description 36
- 239000007788 liquid Substances 0.000 claims description 32
- 239000000126 substance Substances 0.000 claims description 15
- 239000007921 spray Substances 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 9
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Liquid Crystal (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
をさらに含み、第1及び第2フローティングユニットは、上側に空気を噴射すると共に噴射された空気を吸入することによって基板をフローティング状態に維持させることを特徴とする。
一方、異物洗浄部101は、第1及び第2フローティングユニット101a,101bをさらに備えることができる。第1フローティングユニット101aは、第2搬送ローラ202と第1下部異物洗浄部101Baとの間に位置し、第2フローティングユニット101bは、第3搬送ローラ203と第3下部異物洗浄部101Bcとの間に位置する。
100 プラズマ照射部
101 異物洗浄部
102 仕上げ洗浄部
103 乾燥部
112 基板アンローディング部
100abc フローティングユニット
101Babc:下部異物洗浄部
101Uabc 上部異物洗浄部
1031 下部乾燥部
1032 上部乾燥部
201 第1搬送ローラ
202 第2搬送ローラ
203 第3搬送ローラ
204 第4搬送ローラ
Claims (9)
- 基板ローディング部から基板が供給され、該基板にプラズマを照射して基板上の異物を除去するプラズマ照射部と、
前記プラズマ照射部から前記基板が供給され、該基板上に残っている異物を除去する異物洗浄部と、
前記異物洗浄部から基板が供給され、該基板を洗浄する仕上げ洗浄部と、
前記仕上げ洗浄部から基板が供給され、該基板を乾燥させる乾燥部と、
前記乾燥部から基板が供給され、該基板をアンローディングする基板アンローディング部と、
前記基板ローディング部に設置されて外部からの基板をプラズマ照射部に搬送する第1搬送ローラと、
前記プラズマ照射部と異物洗浄部との間に位置して前記プラズマ照射部からの基板を前記異物洗浄部に搬送する第2搬送ローラと、
前記異物洗浄部と前記乾燥部との間に位置して前記異物洗浄部からの基板を前記乾燥部に搬送する第3搬送ローラと、
前記基板アンローディング部に設置されて前記乾燥部からの基板を外部に搬送する第4搬送ローラと、
を含み、
前記プラズマ照射部は、前記基板にプラズマを照射するプラズマ照射ユニット及び前記基板をフローティング状態に維持させるフローティングユニットを含み、
前記仕上げ洗浄部は、前記第3搬送ローラの上側に位置して前記第3搬送ローラ上に置かれた基板に向けて洗浄液を噴射する洗浄ユニットを含み、
前記プラズマ照射ユニットと前記フローティングユニットは、互いに離間しつつ相対向するように配置され、前記プラズマ照射ユニットと前記フローティングユニットとの間に形成された移動空間を基板が通過し、
前記フローティングユニットは、前記移動空間に向けて空気を噴射すると共に噴射された空気を吸入することによって基板をフローティング状態に維持させることを特徴とする洗浄装置。 - 前記フローティングユニットは、前記移動空間に向けて空気を噴射すると共に前記噴射された空気を吸入することによって前記基板をフローティング状態に維持させることを特徴とする請求項1に記載の洗浄装置。
- 前記フローティングユニットは、第1〜第3フローティングユニットに区分され、
前記第2フローティングユニットは、前記プラズマ照射ユニットと対向しつつ前記第1フローティングユニットと第3フローティングユニットとの間に位置し、
前記基板の進行方向に位置している第1及び第3フローティングユニットの各一側面が傾斜していることを特徴とする請求項2に記載の洗浄装置。 - 前記第1フローティングユニットは、前記第1搬送ローラに隣接して位置し、前記第1フローティングユニットの一側面が前記第1搬送ローラに向って漸次低くなる形態の傾斜面を有し、
前記第3フローティングユニットは、前記第2搬送ローラに隣接して位置し、前記第3フローティングユニットの一側面が前記第2搬送ローラに向って漸次低くなる形態の傾斜面を有することを特徴とする請求項3に記載の洗浄装置。 - 前記第1フローティングユニットの一側面において最も低い部分から地面までの距離が、前記第1搬送ローラの中心軸から地面までの距離と同一であり、
前記第3フローティングユニットの一側面において最も低い部分から地面までの距離が、前記第2搬送ローラの中心軸から地面までの距離と同一であることを特徴とする請求項4に記載の洗浄装置。 - 前記異物洗浄部は、
前記基板が通過できる移動空間を形成するように互いに離間して対向配置される上部異物洗浄部及び下部異物洗浄部を含み、
前記上部異物洗浄部は、前記移動空間に向けて空気を噴射すると共に前記噴射された空気を吸入し、前記下部異物洗浄部は、前記移動空間に向けて空気を噴射すると共に前記噴射された空気を吸入することによって、前記基板をフローティング状態に維持させ、
前記上部異物洗浄部は、前記移動空間に向けて洗浄液を噴射し、この洗浄液と前記噴射された空気とを用いてバブルを生成することによって、前記移動空間を通過する基板の上面についた異物を除去し、
前記下部異物洗浄部は、前記移動空間に向けて洗浄液を噴射し、この洗浄液と前記噴射された空気とを用いてバブルを生成することによって、前記移動空間を通過する基板の下面についた異物を除去し、
前記上部異物洗浄部及び下部異物洗浄部は、前記吸入される空気を用いて前記洗浄液を外部に排出させることを特徴とする請求項1に記載の洗浄装置。 - 外部から供給された空気が前記上部異物洗浄部及び下部異物洗浄部自体を通過して前記移動空間に噴射されるように、前記上部異物洗浄部及び下部異物洗浄部は多孔性素材からなることを特徴とする請求項6に記載の洗浄装置。
- 前記異物洗浄部は、
前記第2搬送ローラの一側に位置している第1フローティングユニットと、
前記第3搬送ローラの一側に位置している第2フローティングユニットと、
をさらに含み、
前記第1及び第2フローティングユニットは、上側に空気を噴射すると共に前記噴射された空気を吸入することによって前記基板をフローティング状態に維持させることを特徴とする請求項6に記載の洗浄装置。 - 前記乾燥部は、
前記第3搬送ローラの一側に位置している第1フローティングユニットと、
前記第4搬送ローラの一側に位置している第2フローティングユニットと、
をさらに含み、
前記第1及び第2フローティングユニットは、上側に空気を噴射すると共に前記噴射された空気を吸入することによって前記基板をフローティング状態に維持させることを特徴とする請求項1に記載の洗浄装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2008-0113050 | 2008-11-14 | ||
KR1020080113050A KR101296659B1 (ko) | 2008-11-14 | 2008-11-14 | 세정 장치 |
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JP2010115648A JP2010115648A (ja) | 2010-05-27 |
JP4964936B2 true JP4964936B2 (ja) | 2012-07-04 |
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US (2) | US9362146B2 (ja) |
JP (1) | JP4964936B2 (ja) |
KR (1) | KR101296659B1 (ja) |
CN (1) | CN101733258B (ja) |
TW (1) | TWI400133B (ja) |
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CN104907289A (zh) * | 2014-03-13 | 2015-09-16 | 东莞高伟光学电子有限公司 | 清洁电子元件的清洁设备及工艺 |
EP3151981B1 (en) * | 2014-06-05 | 2021-11-17 | Illinois Tool Works, Inc. | System and method for cleaning an object |
JP6254108B2 (ja) * | 2015-01-07 | 2017-12-27 | 住友化学株式会社 | 有機elパネルの製造方法 |
JP5799181B1 (ja) * | 2015-01-07 | 2015-10-21 | 住友化学株式会社 | 有機電子素子の製造方法 |
TWI575641B (zh) * | 2016-06-02 | 2017-03-21 | 盟立自動化股份有限公司 | 溼式製程設備 |
KR101682566B1 (ko) * | 2016-06-15 | 2016-12-26 | 신흥플라즈마코팅 주식회사 | 옵셋 인쇄장치 실린더 자켓용 금속판의 표면처리방법 |
KR102115184B1 (ko) * | 2018-10-16 | 2020-05-27 | 주식회사 탑 엔지니어링 | 패널 제조 장치 및 이를 이용한 패널 제조 방법 |
CN109317431B (zh) * | 2018-11-05 | 2021-07-23 | 江苏立讯机器人有限公司 | 一种清洗装置 |
CN110190011B (zh) * | 2019-05-16 | 2021-10-01 | Tcl华星光电技术有限公司 | 一种蚀刻装置 |
JP2023003251A (ja) | 2021-06-23 | 2023-01-11 | 株式会社Screenホールディングス | 基板洗浄装置および基板洗浄方法 |
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2008
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- 2009-09-11 CN CN2009101731520A patent/CN101733258B/zh not_active Expired - Fee Related
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US9362146B2 (en) | 2016-06-07 |
CN101733258B (zh) | 2012-09-19 |
TW201018532A (en) | 2010-05-16 |
KR20100054235A (ko) | 2010-05-25 |
JP2010115648A (ja) | 2010-05-27 |
TWI400133B (zh) | 2013-07-01 |
KR101296659B1 (ko) | 2013-08-14 |
US20100122716A1 (en) | 2010-05-20 |
US10217651B2 (en) | 2019-02-26 |
US20150200115A1 (en) | 2015-07-16 |
CN101733258A (zh) | 2010-06-16 |
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