JP4904432B1 - ウエハ加工用テープ - Google Patents
ウエハ加工用テープ Download PDFInfo
- Publication number
- JP4904432B1 JP4904432B1 JP2011043504A JP2011043504A JP4904432B1 JP 4904432 B1 JP4904432 B1 JP 4904432B1 JP 2011043504 A JP2011043504 A JP 2011043504A JP 2011043504 A JP2011043504 A JP 2011043504A JP 4904432 B1 JP4904432 B1 JP 4904432B1
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- tape
- wafer processing
- peeling force
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011043504A JP4904432B1 (ja) | 2011-03-01 | 2011-03-01 | ウエハ加工用テープ |
TW100116773A TWI389267B (zh) | 2011-03-01 | 2011-05-13 | 晶圓加工用帶 |
KR1020110048381A KR101397300B1 (ko) | 2011-03-01 | 2011-05-23 | 웨이퍼 가공용 테이프 |
CN201110142882.1A CN102653661B (zh) | 2011-03-01 | 2011-05-30 | 晶片加工用胶带 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011043504A JP4904432B1 (ja) | 2011-03-01 | 2011-03-01 | ウエハ加工用テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4904432B1 true JP4904432B1 (ja) | 2012-03-28 |
JP2012182268A JP2012182268A (ja) | 2012-09-20 |
Family
ID=46060741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011043504A Active JP4904432B1 (ja) | 2011-03-01 | 2011-03-01 | ウエハ加工用テープ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4904432B1 (zh) |
KR (1) | KR101397300B1 (zh) |
CN (1) | CN102653661B (zh) |
TW (1) | TWI389267B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2980835A4 (en) * | 2013-03-27 | 2016-11-16 | Lintec Corp | COMPOSITE SHEET FOR FORMING PROTECTIVE FILM |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5598866B2 (ja) * | 2011-12-16 | 2014-10-01 | 古河電気工業株式会社 | ウエハ加工用テープ、ウエハ加工用テープの製造方法および打抜き刃 |
JP5598865B2 (ja) * | 2011-12-16 | 2014-10-01 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP6278178B2 (ja) * | 2013-11-11 | 2018-02-14 | 日立化成株式会社 | ウエハ加工用テープ |
KR102203908B1 (ko) * | 2014-06-17 | 2021-01-14 | 엘지디스플레이 주식회사 | 접착 필름, 이를 이용한 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
JP6790025B2 (ja) * | 2018-05-31 | 2020-11-25 | 古河電気工業株式会社 | 電子デバイス加工用テープおよび電子デバイス加工用テープの製造方法 |
JP7409029B2 (ja) | 2019-11-15 | 2024-01-09 | 株式会社レゾナック | 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法 |
JP7409030B2 (ja) | 2019-11-15 | 2024-01-09 | 株式会社レゾナック | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004356412A (ja) * | 2003-05-29 | 2004-12-16 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2005085827A (ja) * | 2003-09-04 | 2005-03-31 | Furukawa Electric Co Ltd:The | 粘接着テープ |
WO2008044349A1 (en) * | 2006-10-05 | 2008-04-17 | Okayama Prefectural Government | Intermediate member for laser bonding and method of bonding using the same |
JP2010098088A (ja) * | 2008-10-16 | 2010-04-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープの長尺体 |
JP2011023692A (ja) * | 2009-06-15 | 2011-02-03 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法 |
JP2011162699A (ja) * | 2010-02-12 | 2011-08-25 | Nippon Steel Chem Co Ltd | 多層接着シート及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4107417B2 (ja) | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP2009147201A (ja) | 2007-12-17 | 2009-07-02 | Denki Kagaku Kogyo Kk | ダイシングシート、その製造方法、および電子部品の製造方法 |
-
2011
- 2011-03-01 JP JP2011043504A patent/JP4904432B1/ja active Active
- 2011-05-13 TW TW100116773A patent/TWI389267B/zh active
- 2011-05-23 KR KR1020110048381A patent/KR101397300B1/ko active IP Right Grant
- 2011-05-30 CN CN201110142882.1A patent/CN102653661B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004356412A (ja) * | 2003-05-29 | 2004-12-16 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2005085827A (ja) * | 2003-09-04 | 2005-03-31 | Furukawa Electric Co Ltd:The | 粘接着テープ |
WO2008044349A1 (en) * | 2006-10-05 | 2008-04-17 | Okayama Prefectural Government | Intermediate member for laser bonding and method of bonding using the same |
JP2010098088A (ja) * | 2008-10-16 | 2010-04-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープの長尺体 |
JP2011023692A (ja) * | 2009-06-15 | 2011-02-03 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法 |
JP2011162699A (ja) * | 2010-02-12 | 2011-08-25 | Nippon Steel Chem Co Ltd | 多層接着シート及びその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2980835A4 (en) * | 2013-03-27 | 2016-11-16 | Lintec Corp | COMPOSITE SHEET FOR FORMING PROTECTIVE FILM |
US10030174B2 (en) | 2013-03-27 | 2018-07-24 | Lintec Corporation | Composite sheet for forming protective film |
Also Published As
Publication number | Publication date |
---|---|
TW201203473A (en) | 2012-01-16 |
KR20130129487A (ko) | 2013-11-29 |
TWI389267B (zh) | 2013-03-11 |
JP2012182268A (ja) | 2012-09-20 |
CN102653661A (zh) | 2012-09-05 |
KR101397300B1 (ko) | 2014-05-22 |
CN102653661B (zh) | 2014-03-12 |
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