JP4904432B1 - ウエハ加工用テープ - Google Patents

ウエハ加工用テープ Download PDF

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Publication number
JP4904432B1
JP4904432B1 JP2011043504A JP2011043504A JP4904432B1 JP 4904432 B1 JP4904432 B1 JP 4904432B1 JP 2011043504 A JP2011043504 A JP 2011043504A JP 2011043504 A JP2011043504 A JP 2011043504A JP 4904432 B1 JP4904432 B1 JP 4904432B1
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JP
Japan
Prior art keywords
adhesive layer
tape
wafer processing
peeling force
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011043504A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012182268A (ja
Inventor
千佳子 井之前
邦彦 石黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2011043504A priority Critical patent/JP4904432B1/ja
Priority to TW100116773A priority patent/TWI389267B/zh
Priority to KR1020110048381A priority patent/KR101397300B1/ko
Priority to CN201110142882.1A priority patent/CN102653661B/zh
Application granted granted Critical
Publication of JP4904432B1 publication Critical patent/JP4904432B1/ja
Publication of JP2012182268A publication Critical patent/JP2012182268A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011043504A 2011-03-01 2011-03-01 ウエハ加工用テープ Active JP4904432B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011043504A JP4904432B1 (ja) 2011-03-01 2011-03-01 ウエハ加工用テープ
TW100116773A TWI389267B (zh) 2011-03-01 2011-05-13 晶圓加工用帶
KR1020110048381A KR101397300B1 (ko) 2011-03-01 2011-05-23 웨이퍼 가공용 테이프
CN201110142882.1A CN102653661B (zh) 2011-03-01 2011-05-30 晶片加工用胶带

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011043504A JP4904432B1 (ja) 2011-03-01 2011-03-01 ウエハ加工用テープ

Publications (2)

Publication Number Publication Date
JP4904432B1 true JP4904432B1 (ja) 2012-03-28
JP2012182268A JP2012182268A (ja) 2012-09-20

Family

ID=46060741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011043504A Active JP4904432B1 (ja) 2011-03-01 2011-03-01 ウエハ加工用テープ

Country Status (4)

Country Link
JP (1) JP4904432B1 (zh)
KR (1) KR101397300B1 (zh)
CN (1) CN102653661B (zh)
TW (1) TWI389267B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2980835A4 (en) * 2013-03-27 2016-11-16 Lintec Corp COMPOSITE SHEET FOR FORMING PROTECTIVE FILM

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5598866B2 (ja) * 2011-12-16 2014-10-01 古河電気工業株式会社 ウエハ加工用テープ、ウエハ加工用テープの製造方法および打抜き刃
JP5598865B2 (ja) * 2011-12-16 2014-10-01 古河電気工業株式会社 ウエハ加工用テープ
JP6278178B2 (ja) * 2013-11-11 2018-02-14 日立化成株式会社 ウエハ加工用テープ
KR102203908B1 (ko) * 2014-06-17 2021-01-14 엘지디스플레이 주식회사 접착 필름, 이를 이용한 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
JP6790025B2 (ja) * 2018-05-31 2020-11-25 古河電気工業株式会社 電子デバイス加工用テープおよび電子デバイス加工用テープの製造方法
JP7409029B2 (ja) 2019-11-15 2024-01-09 株式会社レゾナック 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法
JP7409030B2 (ja) 2019-11-15 2024-01-09 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356412A (ja) * 2003-05-29 2004-12-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005085827A (ja) * 2003-09-04 2005-03-31 Furukawa Electric Co Ltd:The 粘接着テープ
WO2008044349A1 (en) * 2006-10-05 2008-04-17 Okayama Prefectural Government Intermediate member for laser bonding and method of bonding using the same
JP2010098088A (ja) * 2008-10-16 2010-04-30 Furukawa Electric Co Ltd:The ウエハ加工用テープの長尺体
JP2011023692A (ja) * 2009-06-15 2011-02-03 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法
JP2011162699A (ja) * 2010-02-12 2011-08-25 Nippon Steel Chem Co Ltd 多層接着シート及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107417B2 (ja) 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2009147201A (ja) 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356412A (ja) * 2003-05-29 2004-12-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005085827A (ja) * 2003-09-04 2005-03-31 Furukawa Electric Co Ltd:The 粘接着テープ
WO2008044349A1 (en) * 2006-10-05 2008-04-17 Okayama Prefectural Government Intermediate member for laser bonding and method of bonding using the same
JP2010098088A (ja) * 2008-10-16 2010-04-30 Furukawa Electric Co Ltd:The ウエハ加工用テープの長尺体
JP2011023692A (ja) * 2009-06-15 2011-02-03 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法
JP2011162699A (ja) * 2010-02-12 2011-08-25 Nippon Steel Chem Co Ltd 多層接着シート及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2980835A4 (en) * 2013-03-27 2016-11-16 Lintec Corp COMPOSITE SHEET FOR FORMING PROTECTIVE FILM
US10030174B2 (en) 2013-03-27 2018-07-24 Lintec Corporation Composite sheet for forming protective film

Also Published As

Publication number Publication date
TW201203473A (en) 2012-01-16
KR20130129487A (ko) 2013-11-29
TWI389267B (zh) 2013-03-11
JP2012182268A (ja) 2012-09-20
CN102653661A (zh) 2012-09-05
KR101397300B1 (ko) 2014-05-22
CN102653661B (zh) 2014-03-12

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