KR101397300B1 - 웨이퍼 가공용 테이프 - Google Patents

웨이퍼 가공용 테이프 Download PDF

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Publication number
KR101397300B1
KR101397300B1 KR1020110048381A KR20110048381A KR101397300B1 KR 101397300 B1 KR101397300 B1 KR 101397300B1 KR 1020110048381 A KR1020110048381 A KR 1020110048381A KR 20110048381 A KR20110048381 A KR 20110048381A KR 101397300 B1 KR101397300 B1 KR 101397300B1
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KR
South Korea
Prior art keywords
adhesive layer
peeling
tape
film
pressure
Prior art date
Application number
KR1020110048381A
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English (en)
Korean (ko)
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KR20130129487A (ko
Inventor
치까꼬 가와따
구니히꼬 이시구로
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20130129487A publication Critical patent/KR20130129487A/ko
Application granted granted Critical
Publication of KR101397300B1 publication Critical patent/KR101397300B1/ko

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  • Engineering & Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020110048381A 2011-03-01 2011-05-23 웨이퍼 가공용 테이프 KR101397300B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011043504A JP4904432B1 (ja) 2011-03-01 2011-03-01 ウエハ加工用テープ
JPJP-P-2011-043504 2011-03-01

Publications (2)

Publication Number Publication Date
KR20130129487A KR20130129487A (ko) 2013-11-29
KR101397300B1 true KR101397300B1 (ko) 2014-05-22

Family

ID=46060741

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110048381A KR101397300B1 (ko) 2011-03-01 2011-05-23 웨이퍼 가공용 테이프

Country Status (4)

Country Link
JP (1) JP4904432B1 (zh)
KR (1) KR101397300B1 (zh)
CN (1) CN102653661B (zh)
TW (1) TWI389267B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5598865B2 (ja) * 2011-12-16 2014-10-01 古河電気工業株式会社 ウエハ加工用テープ
JP5598866B2 (ja) * 2011-12-16 2014-10-01 古河電気工業株式会社 ウエハ加工用テープ、ウエハ加工用テープの製造方法および打抜き刃
US10030174B2 (en) 2013-03-27 2018-07-24 Lintec Corporation Composite sheet for forming protective film
JP6278178B2 (ja) * 2013-11-11 2018-02-14 日立化成株式会社 ウエハ加工用テープ
KR102203908B1 (ko) * 2014-06-17 2021-01-14 엘지디스플레이 주식회사 접착 필름, 이를 이용한 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
JP6790025B2 (ja) * 2018-05-31 2020-11-25 古河電気工業株式会社 電子デバイス加工用テープおよび電子デバイス加工用テープの製造方法
JP7409030B2 (ja) 2019-11-15 2024-01-09 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法
JP7409029B2 (ja) 2019-11-15 2024-01-09 株式会社レゾナック 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134689A (ja) 2002-10-15 2004-04-30 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005268434A (ja) * 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2009147201A (ja) 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法
KR100921855B1 (ko) 2003-05-29 2009-10-13 닛토덴코 가부시키가이샤 다이싱 다이본딩 필름, 칩상 워크의 고정 방법, 및 반도체장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4267986B2 (ja) * 2003-09-04 2009-05-27 古河電気工業株式会社 粘接着テープ
EP2070685A4 (en) * 2006-10-05 2011-06-15 Okayama Prefectural Government INTERMEDIATE MEMBER FOR LASER WELDING AND WELDING METHOD USING THE SAME
JP5019633B2 (ja) * 2008-10-16 2012-09-05 古河電気工業株式会社 ウエハ加工用テープの長尺体
JP2011023692A (ja) * 2009-06-15 2011-02-03 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法
JP5388892B2 (ja) * 2010-02-12 2014-01-15 新日鉄住金化学株式会社 多層接着シート及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134689A (ja) 2002-10-15 2004-04-30 Nitto Denko Corp ダイシング・ダイボンドフィルム
KR100921855B1 (ko) 2003-05-29 2009-10-13 닛토덴코 가부시키가이샤 다이싱 다이본딩 필름, 칩상 워크의 고정 방법, 및 반도체장치
JP2005268434A (ja) * 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2009147201A (ja) 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法

Also Published As

Publication number Publication date
TW201203473A (en) 2012-01-16
CN102653661B (zh) 2014-03-12
JP4904432B1 (ja) 2012-03-28
JP2012182268A (ja) 2012-09-20
KR20130129487A (ko) 2013-11-29
CN102653661A (zh) 2012-09-05
TWI389267B (zh) 2013-03-11

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