JP4897033B2 - 半導体製造装置 - Google Patents
半導体製造装置 Download PDFInfo
- Publication number
- JP4897033B2 JP4897033B2 JP2009273126A JP2009273126A JP4897033B2 JP 4897033 B2 JP4897033 B2 JP 4897033B2 JP 2009273126 A JP2009273126 A JP 2009273126A JP 2009273126 A JP2009273126 A JP 2009273126A JP 4897033 B2 JP4897033 B2 JP 4897033B2
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- bonding
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- arm
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims description 60
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 claims description 64
- 230000007246 mechanism Effects 0.000 claims description 28
- 230000007723 transport mechanism Effects 0.000 claims description 25
- 239000007767 bonding agent Substances 0.000 claims description 12
- 230000005484 gravity Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009273126A JP4897033B2 (ja) | 2009-12-01 | 2009-12-01 | 半導体製造装置 |
| KR1020100118665A KR101779803B1 (ko) | 2009-12-01 | 2010-11-26 | 본딩 장치 |
| CN201010568207.0A CN102097350B (zh) | 2009-12-01 | 2010-11-29 | 结合装置 |
| TW099141257A TWI424509B (zh) | 2009-12-01 | 2010-11-29 | 半導體製造裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009273126A JP4897033B2 (ja) | 2009-12-01 | 2009-12-01 | 半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011119319A JP2011119319A (ja) | 2011-06-16 |
| JP4897033B2 true JP4897033B2 (ja) | 2012-03-14 |
Family
ID=44130366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009273126A Active JP4897033B2 (ja) | 2009-12-01 | 2009-12-01 | 半導体製造装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4897033B2 (zh) |
| KR (1) | KR101779803B1 (zh) |
| CN (1) | CN102097350B (zh) |
| TW (1) | TWI424509B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117976595A (zh) * | 2024-04-02 | 2024-05-03 | 珠海市硅酷科技有限公司 | 固晶装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105637B2 (ja) * | 1990-05-31 | 1995-11-13 | 三洋電機株式会社 | 部品装着装置 |
| JP2924760B2 (ja) * | 1996-02-20 | 1999-07-26 | 日本電気株式会社 | ダイボンディング装置 |
| JP4397349B2 (ja) * | 2005-05-20 | 2010-01-13 | 株式会社新川 | チップボンディング装置 |
| CN101281873B (zh) * | 2007-04-06 | 2011-08-03 | 均豪精密工业股份有限公司 | 用于安装半导体芯片的装置 |
| JP2009004557A (ja) * | 2007-06-21 | 2009-01-08 | Renesas Technology Corp | ボンディング装置 |
-
2009
- 2009-12-01 JP JP2009273126A patent/JP4897033B2/ja active Active
-
2010
- 2010-11-26 KR KR1020100118665A patent/KR101779803B1/ko active IP Right Grant
- 2010-11-29 TW TW099141257A patent/TWI424509B/zh active
- 2010-11-29 CN CN201010568207.0A patent/CN102097350B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI424509B (zh) | 2014-01-21 |
| CN102097350A (zh) | 2011-06-15 |
| KR20110061483A (ko) | 2011-06-09 |
| TW201133660A (en) | 2011-10-01 |
| CN102097350B (zh) | 2014-09-24 |
| JP2011119319A (ja) | 2011-06-16 |
| KR101779803B1 (ko) | 2017-09-19 |
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