KR101779803B1 - 본딩 장치 - Google Patents

본딩 장치 Download PDF

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Publication number
KR101779803B1
KR101779803B1 KR1020100118665A KR20100118665A KR101779803B1 KR 101779803 B1 KR101779803 B1 KR 101779803B1 KR 1020100118665 A KR1020100118665 A KR 1020100118665A KR 20100118665 A KR20100118665 A KR 20100118665A KR 101779803 B1 KR101779803 B1 KR 101779803B1
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KR
South Korea
Prior art keywords
block
bonding
supported
arm
block body
Prior art date
Application number
KR1020100118665A
Other languages
English (en)
Korean (ko)
Other versions
KR20110061483A (ko
Inventor
쇼지 키타무라
테츠야 스에다
히로시 하야시
Original Assignee
캐논 머시너리 가부시키가이샤
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Application filed by 캐논 머시너리 가부시키가이샤 filed Critical 캐논 머시너리 가부시키가이샤
Publication of KR20110061483A publication Critical patent/KR20110061483A/ko
Application granted granted Critical
Publication of KR101779803B1 publication Critical patent/KR101779803B1/ko

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100118665A 2009-12-01 2010-11-26 본딩 장치 KR101779803B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-273126 2009-12-01
JP2009273126A JP4897033B2 (ja) 2009-12-01 2009-12-01 半導体製造装置

Publications (2)

Publication Number Publication Date
KR20110061483A KR20110061483A (ko) 2011-06-09
KR101779803B1 true KR101779803B1 (ko) 2017-09-19

Family

ID=44130366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100118665A KR101779803B1 (ko) 2009-12-01 2010-11-26 본딩 장치

Country Status (4)

Country Link
JP (1) JP4897033B2 (zh)
KR (1) KR101779803B1 (zh)
CN (1) CN102097350B (zh)
TW (1) TWI424509B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117976595A (zh) * 2024-04-02 2024-05-03 珠海市硅酷科技有限公司 固晶装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105637B2 (ja) * 1990-05-31 1995-11-13 三洋電機株式会社 部品装着装置
JP2924760B2 (ja) * 1996-02-20 1999-07-26 日本電気株式会社 ダイボンディング装置
JP4397349B2 (ja) * 2005-05-20 2010-01-13 株式会社新川 チップボンディング装置
CN101281873B (zh) * 2007-04-06 2011-08-03 均豪精密工业股份有限公司 用于安装半导体芯片的装置
JP2009004557A (ja) * 2007-06-21 2009-01-08 Renesas Technology Corp ボンディング装置

Also Published As

Publication number Publication date
CN102097350B (zh) 2014-09-24
TW201133660A (en) 2011-10-01
JP4897033B2 (ja) 2012-03-14
JP2011119319A (ja) 2011-06-16
KR20110061483A (ko) 2011-06-09
CN102097350A (zh) 2011-06-15
TWI424509B (zh) 2014-01-21

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