CN102881603A - 双轴驱动机构和模片结合器 - Google Patents

双轴驱动机构和模片结合器 Download PDF

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CN102881603A
CN102881603A CN2011102712825A CN201110271282A CN102881603A CN 102881603 A CN102881603 A CN 102881603A CN 2011102712825 A CN2011102712825 A CN 2011102712825A CN 201110271282 A CN201110271282 A CN 201110271282A CN 102881603 A CN102881603 A CN 102881603A
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保坂浩二
深泽信吾
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Fasford Technology Co Ltd
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Abstract

本发明提供不增大水平驱动轴的转矩便可实现升降轴的高速化的包含Z轴的双轴驱动机构和使用该双轴驱动机构的模片结合器。本发明的双轴驱动机构，具有：处理部；第一直线电动机，具备使上述处理部沿第一直线导轨升降的第一可动部和第一固定部；第二直线电动机，具备使上述处理部在与上述升降方向垂直的水平方向上移动的第二可动部和第二固定部；连接部，借助于上述第一直线导轨连接上述第一可动部且直接或间接地连接上述第二可动部；第二直线导轨，使上述第一可动部、上述第二可动部和上述连接部成为一体并在上述水平方向上移动；和支撑体，将上述第一固定部和上述第二固定部在上述水平方向上以预定的长度互相平行地固定。

Description

双轴驱动机构和模片结合器
技术领域
本发明涉及包含升降轴的双轴驱动机构和模片结合器，尤其涉及实现含有升降轴的双轴驱动机构的结合头的高速化，生产率高的模片结合器。
背景技术
在一种半导体制造装置中具有将半导体芯片(模片)结合在引线框等的基板上的模片结合器。在模片结合器中，用结合头对模片进行真空吸附、以高速上升、水平移动、下降再安装在基板上。该情况下，进行上升、下降的是升降(Z)驱动轴。
现在，对模片结合器的高精度、高速化的要求提高，特别地，作为结合的心脏部的结合头的高速化的要求提高。
作为满足该要求的技术而存在专利文献1记载的内容。通常，如果使装置高速化，则高速移动物体所产生的振动增大，因该振动而使装置难以得到其目的的精度。在专利文献1中，用反动吸收装置减小该振动，维持精度并实现高速化。
专利文献1：特开2004-263825号公报
但是，在专利文献1那样的使用滚珠螺杆的伺服电动机驱动中，存在高速化的限度。于是，开始研究适于高速化的利用直线电动机得到的驱动。如果只使用直线电动机驱动，则如图7所示，Z轴驱动的Z轴直线电动机的定子和转子皆为水平例如成为后述的Y方向的Y驱动轴的负荷。如果增大Y驱动轴的转矩，则消耗电力增大，如果减小Z轴驱动的直线电动机的定子和转子的重量，则Z轴的转矩减小，不能实现预定的高速化。
发明内容
因此，本发明的目的是提供不增大水平驱动轴的转矩便能实现升降轴的高速化的包含Z轴的双轴驱动机构和使用该双轴驱动机构的模片结合器。
本发明为实现上述目的而至少具有以下特征。
本发明的第一特征在于，一种双轴驱动机构，具有：处理部；具备使上述处理部沿第一直线导轨升降的第一可动部和第一固定部的第一直线电动机；具备使上述处理部在与上述升降方向垂直的水平方向上移动的第二可动部和第二固定部的第二直线电动机；借助于上述第一直线导轨连接上述第一可动部且直接或间接地连接上述第二可动部的连接部；使上述第一可动部、上述第二可动部和上述连接部成为一体并在上述水平方向上移动的第二直线导轨；和将上述第一固定部和上述第二固定部在上述水平方向上以预定的长度互相平行地固定的支撑体。
此外，本发明的第二特征在于，上述第一可动部和上述第二可动部互相平行或垂直地设置。
再有，本发明的第三特征在于，将上述第二直线导轨设置在上述支撑体上，上述支撑体在上述第二固定部设置在下部。
另外，本发明的第四特征在于，将上述第二直线导轨设置在上述连接部的上部的上述支撑体上。
还有，本发明的第五特征在于，在上述第一可动部上在上述升降的方向上N极、S极交替地设置多组的电磁铁设置在上述水平方向的预定区域。
此外，本发明的第六特征在于，在上述第一固定部或第二固定部与上述连接部之间设置第三直线导轨。
再有，本发明的第七特征在于，通过第一至第六特征记载的双轴驱动机构的上述处理来对基板进行处理。
另外，本发明的第八特征在于，上述处理部是将模片从晶片拾取且向基板结合的结合头或向上述基板涂敷模片粘接剂的针。
还有，本发明的第九特征在于，第五特征记载的上述预定区域是上述拾取的区域和上述结合的区域。
此外，本发明的第十特征在于，在上述第一可动部设置以上述升降的方向为转轴使上述处理部旋转的旋转构件。
根据本发明，能提供不增大水平驱动轴的转矩便能实现升降轴的高速化的含有Z轴的双轴驱动机构和使用该双轴驱动机构的模片结合器。
附图说明
图1是从上方观察作为本发明一个实施方式的模片结合器的概念图。
图2是图1所示的ZY驱动轴的结合头所在的位置处的A-A剖视图。
图3是从B方向观察图2所示的ZY驱动轴的向视图。
图4是示意表示能在预定位置处使结合头升降的左右的固定磁铁部的构成例的图。
图5是表示作为第二实施方式的ZY驱动轴60B的基本构成的图。
图6是表示作为第三实施方式的ZY驱动轴60C的基本构成的图。
图7是表示Z轴成为负荷的双轴驱动机构的图。
附图标记说明：
1-晶片供给部；2-工件供给、输送部；3-模片结合部；10-模片结合器；32-结合头部；35-结合头；40-Y驱动轴；41-Y轴可动部；42-Y轴固定部；43-Y轴直线导轨；44-Y轴导轨；45-Y轴可动部固定部；46-直线导轨；47、47d、47u-固定电磁铁；50-Z驱动轴；51-Z轴可动部；52-Z轴固定部；53-Z轴直线导轨；57、57h、57m-固定电磁铁；60、60A、60B、60C：ZY驱动轴；61-连接部；62、62a、62b、62c-支撑体；70-X驱动轴；80：旋转驱动部。
具体实施方式
下面参照附图来说明本发明的实施方式。
图1是从上方观察作为本发明一个实施方式的模片结合器10的概念图。模片结合器大体具有晶片供给部1、工件供给、输送部2和模片结合器部3。
晶片供给部1具有晶片盒升降机11和拾取装置12。晶片盒升降机11具有填充晶片环的晶片盒(未图示)，将晶片环依次向拾取装置12供给。拾取装置12使晶片环移动以能从晶片环拾取期望的模片。
工件供给、输送部2具有堆料装载器21、框进料器22和卸载器23，将工件(引线框等的基板)向箭头方向输送。堆料装载器21将粘接有模片的工件向框进料器22供给。框进料器22将工件经由框进给器22上的两个处理位置向卸载器23输送。卸载器23保管输送的工件。
模片结合部3具有预制部(模片糊料涂覆装置)31和结合头部32。预制部31在由框进料器22输送的工件例如引线框上用针涂敷模片粘接剂。结合头部32从拾取装置12拾取模片并上升，将模片移动到框进料器22上的结合点。而且，结合头部32在结合点使模片下降，在涂敷了模片粘接剂的工件上结合模片
结合头部32具有使结合头35(参照图2)在Z(高度)方向上升降且在Y方向上移动的ZY驱动轴60、和使结合头在X方向上移动的X驱动轴70。ZY驱动轴60具有在Y方向上即、使结合头在晶片环支架12内的拾取位置和结合点之间往复的Y驱动轴40、和为了将模片从晶片拾取或向基板结合而使该模片升降的Z驱动轴50。X驱动轴70使ZY驱动轴60整体在作为输送工件的方向的X方向上移动。X驱动轴70可采用用伺服电动机驱动滚珠螺杆的构成，也可采用由在ZY驱动轴60的构成中说明的直线电动机驱动的构成。
下面，使用附图来说明作为本发明特征的ZY驱动轴60的实施方式。图2、图3是表示作为第一实施方式的ZY驱动轴60A的基本构成的图。图2是在ZY驱动轴60A的结合头35所位于的图1所示的位置处的A-A剖视图。图3是从B方向观察图2所示的ZY驱动轴60A的向视图。
作为第一实施方式的ZY驱动轴60A具有Y驱动轴40、Z驱动轴50、连接Y驱动轴40的Y轴可动部41和Z驱动轴50的Z轴可动部51的连接部61、作为处理部的结合头35、使结合头35以Z轴为中心进行旋转的旋转驱动部80、和支撑其整体的横L形的支撑体62。再有，为了便于理解以下的说明，固定在支撑体62上的部分用斜线表示，Y轴可动部41、X轴可动部51和连接部61成为一体地移动的部分用空白表示。此外，支撑体62具有上部支撑体62a、侧部支撑体62b和下部支撑体62c。
Y驱动轴40具有：具有N极和S极的电磁铁在Y方向上交替地排列多个的上下的固定电磁铁部47u、47d(下面在没有指定整体或位置时简称为47)的反コ形的Y轴固定部42；具有在上述排列方向上至少一组的N极和S极的电磁铁且插入到反コ形的凹部中并在凹部内移动的Y轴可动部41；支撑Y轴可动部41的连接部61；和固定在连接部61上且具备设于与下部的支撑体62c之间的Y轴直线导轨43的Y轴导引部44。Y轴固定部42在图1的虚线表示的Y驱动轴40的大体整个区域范围内设置以使Y轴可动部41能在预定的范围移动。此外，Y轴直线导轨43具有在Y方向上延伸的两个直线导轨43a和在直线导轨上移动的直线滑动体43b。
Z驱动轴50与Y驱动轴40同样，具有：具有N极和S极的电磁铁在Z方向上交替地排列多个的左右的固定电磁铁部57h、57m(参照图4，下面在没有指定整体或位置时简称为57)的倒U形的Z轴固定部52；在上部具有在Z轴固定部52的排列方向上至少一组的N极和S极的电磁铁且插入倒U形的凹部中并在凹部内移动的Z轴可动部51；在Z轴可动部51和连接部61之间具有与Y轴直线导轨43同样的结构的Z轴直线导轨53。Z轴直线导轨53具有固定在连接部61上且在Z方向上延伸的两个直线导轨53a和固定在Z轴可动部51上且在直线导轨上移动的直线滑动体53b。
Z轴可动部51借助于连接部61与Y轴可动部41连接，如果Y轴可动部41在Y方向上水平移动，则Z轴可动部51也一同在Y方向上水平移动。而且，需要在移动目的地的预定的位置能使Z轴可动部51(结合头35)升降。
图4中，示意表示能在预定位置处使结合头升降的左右的固定磁铁部57(57h、57m)的构成例的图。在本实施例中，至少在结合区域和拾取区域交替地设置在Y方向上细长的N极、S极。细长的N极、S极可分割得较短。当然，也可在Y方向的整个区域范围内交替地设置在Y方向上细长的N极、S极。
结合头35通过旋转驱动部80并借助于齿轮35b可旋转地设置在Z轴可动部51的前端，在自身前端具有模片吸附用的筒夹35a。此外，旋转驱动部80用固定在Z轴可动部51上的电动机8并借助于齿轮82、35b控制结合头35的旋转姿势。
如上所述，根据本实施方式的ZY驱动轴60A，在大体整个区域设置Z轴固定部52，但与图7所示的构成相比，作为重量体的Z轴固定部52自身不移动，因此对于Y方向的移动的负荷大幅减小，不增大水平驱动轴的转矩便可实现升降轴的高速化。
图5是表示作为第二实施方式的ZY驱动轴60B的基本构成的图。在图5中，基本上具有与第一实施方式相同的构成或功能的部件标注相同标记。
ZY驱动轴60B与第一实施方式的ZY驱动轴60A的不同之处在于，第一，支撑使Y轴可动部41可进行Y方向移动的Y轴直线导轨43的Y轴导引部44从下部支撑体62c移动到上部支撑体62a；第二，Z轴固定部52从U形成为I形，固定磁铁部57h、57m仅为单侧的固定磁铁部57。
图6是表示作为第三实施方式的ZY驱动轴60C的基本构成的图。对于附图的标记与图5相同。ZY驱动轴60C与第二实施方式的ZY驱动轴60B的不同之处在于，第一，使Y轴固定部42与第二实施方式的Z轴固定部52同样地成为I形，使Y轴的固定磁铁部仅为单侧的47；第二，设置Y轴可动部41和固定在连接部61上的Y轴可动部固定部45；第三，为了防止Y方向的移动时的左右摇动，在Y轴固定部42和连接部61之间设置直线导轨46。
再有，在第一实施方式、第二实施方式中，可将此类使移动稳定的直线导轨46设置在Y轴固定部42或Z轴固定部52与连接部61之间。
其他方面与第二实施方式60B基本相同。再有，在第三实施方式中，可使用第一实施方式的反コ形Y驱动轴40。
在以上说明的第二、第三实施方式中，与第一实施方式同样，与图7所示的构成相比，作为重量体的Z轴固定部52自身不移动，因此对于Y方向的移动的负荷大幅减小，不增大水平驱动轴的转矩便可实现升降轴的高速化。
在以上的说明中，以结合头的实例作为进行某种处理的处理部的实例来进行说明。基本上，可适用于需要具有升降轴的双轴驱动机构所需的处理部。例如，可适用于在模片结合器中在基板上涂敷模片粘接剂的针。
虽然如上述那样对本发明的实施方式进行说明，但本领域技术人员可根据上述说明来实施各种替换例、修正或变形，本发明在不脱离其主旨的范围内包括上述各种替换例、修正或变形。

Claims (11)

1.一种双轴驱动机构，其特征在于，
具有：处理部；
具备使上述处理部沿第一直线导轨升降的第一可动部和第一固定部的第一直线电动机；
具备使上述处理部在与上述升降方向垂直的水平方向上移动的第二可动部和第二固定部的第二直线电动机；
借助于上述第一直线导轨连接上述第一可动部并直接或间接地连接上述第二可动部的连接部；
使上述第一可动部、上述第二可动部和上述连接部成为一体并在上述水平方向上移动的第二直线导轨；和
将上述第一固定部和上述第二固定部在上述水平方向上以预定的长度互相平行地固定的支撑体。
2.根据权利要求1所述的双轴驱动机构，其特征在于，
上述第一可动部和上述第二可动部互相平行或垂直地设置。
3.根据权利要求1所述的双轴驱动机构，其特征在于，
将上述第二直线导轨设置在上述支撑体上，上述支撑体在上述第二固定部设置在下部。
4.根据权利要求1所述的双轴驱动机构，其特征在于，
将上述第二直线导轨设置在上述连接部的上部的上述支撑体上。
5.根据权利要求1所述的双轴驱动机构，其特征在于，
在上述第一可动部上在上述升降的方向上N极、S极交替地设置多组的电磁铁设置在上述水平方向的预定区域。
6.根据权利要求1所述的双轴驱动机构，其特征在于，
在上述第一固定部或第二固定部与上述连接部之间设置第三直线导轨。
7.一种模片结合器，其特征在于，
具备权利要求1至6中任一项所述的双轴驱动机构，通过上述处理部来对基板进行处理。
8.根据权利要求7所述的模片结合器，其特征在于，
上述处理部是将模片从晶片拾取且向上述基板结合的结合头。
9.一种模片结合器，其特征在于，
具备权利要求5所述的双轴驱动机构，上述处理部是将模片从晶片拾取且向上述基板结合的结合头，上述预定区域是上述拾取的区域和上述结合的区域。
10.根据权利要求7所述的模片结合器，其特征在于，
上述处理部是向上述基板涂敷模片粘接剂的针。
11.根据权利要求7所述的模片结合器，其特征在于，
在上述第一可动部设置以上述升降的方向为转轴使上述处理部旋转的旋转构件。
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