JP4896236B2 - 基板搬送装置及び基板搬送方法 - Google Patents

基板搬送装置及び基板搬送方法 Download PDF

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Publication number
JP4896236B2
JP4896236B2 JP2010011078A JP2010011078A JP4896236B2 JP 4896236 B2 JP4896236 B2 JP 4896236B2 JP 2010011078 A JP2010011078 A JP 2010011078A JP 2010011078 A JP2010011078 A JP 2010011078A JP 4896236 B2 JP4896236 B2 JP 4896236B2
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JP
Japan
Prior art keywords
substrate
alignment
stage
support
support pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010011078A
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English (en)
Japanese (ja)
Other versions
JP2011148593A (ja
Inventor
慶崇 大塚
文宏 宮▲さき▼
孝志 中満
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2010011078A priority Critical patent/JP4896236B2/ja
Priority to KR1020110001813A priority patent/KR101577481B1/ko
Priority to TW100101444A priority patent/TWI479592B/zh
Priority to CN201110025022.XA priority patent/CN102157424B/zh
Publication of JP2011148593A publication Critical patent/JP2011148593A/ja
Application granted granted Critical
Publication of JP4896236B2 publication Critical patent/JP4896236B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010011078A 2010-01-21 2010-01-21 基板搬送装置及び基板搬送方法 Expired - Fee Related JP4896236B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010011078A JP4896236B2 (ja) 2010-01-21 2010-01-21 基板搬送装置及び基板搬送方法
KR1020110001813A KR101577481B1 (ko) 2010-01-21 2011-01-07 기판 반송장치 및 기판 반송방법
TW100101444A TWI479592B (zh) 2010-01-21 2011-01-14 基板運送裝置及基板運送方法
CN201110025022.XA CN102157424B (zh) 2010-01-21 2011-01-21 基板输送装置及基板输送方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010011078A JP4896236B2 (ja) 2010-01-21 2010-01-21 基板搬送装置及び基板搬送方法

Publications (2)

Publication Number Publication Date
JP2011148593A JP2011148593A (ja) 2011-08-04
JP4896236B2 true JP4896236B2 (ja) 2012-03-14

Family

ID=44438820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010011078A Expired - Fee Related JP4896236B2 (ja) 2010-01-21 2010-01-21 基板搬送装置及び基板搬送方法

Country Status (4)

Country Link
JP (1) JP4896236B2 (ko)
KR (1) KR101577481B1 (ko)
CN (1) CN102157424B (ko)
TW (1) TWI479592B (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5861365B2 (ja) * 2011-10-05 2016-02-16 大日本印刷株式会社 基板のアラインメント方法及び装置
JP5851271B2 (ja) * 2012-02-15 2016-02-03 株式会社エヌ・ピー・シー アライメント装置及び方法、並びに太陽電池モジュールの製造装置及び製造方法
JP5978937B2 (ja) * 2012-11-13 2016-08-24 旭硝子株式会社 基板搬送用ハンド及び基板搬送方法
CN102942062B (zh) * 2012-11-21 2016-01-06 深圳市华星光电技术有限公司 用于玻璃基板的传输装置和传输方法
JP6045376B2 (ja) * 2013-02-06 2016-12-14 Juki株式会社 基板搬送装置、基板の搬送方法
KR102218382B1 (ko) * 2014-08-21 2021-02-23 세메스 주식회사 반송 유닛, 이를 포함하는 기판 처리 장치 및 방법
TWI699582B (zh) * 2015-07-01 2020-07-21 日商信越工程股份有限公司 貼合器件的製造裝置及製造方法
CN106409738A (zh) * 2015-07-28 2017-02-15 细美事有限公司 基板移送装置及基板移送方法
JP6651392B2 (ja) * 2016-03-22 2020-02-19 東レエンジニアリング株式会社 基板浮上搬送装置
KR102063322B1 (ko) 2016-05-27 2020-01-08 세메스 주식회사 기판 처리 장치 및 방법
CN106081483A (zh) * 2016-06-01 2016-11-09 中国建材国际工程集团有限公司 用于玻璃定位的装置
CN106044225B (zh) * 2016-06-28 2019-05-31 江苏东旭亿泰智能装备有限公司 气浮平台、气浮装置及玻璃基板传送装置
CN106516740B (zh) * 2016-10-27 2018-10-19 信义玻璃(天津)有限公司 一种自调节双边自动磨边系统
JP6786162B2 (ja) * 2016-12-20 2020-11-18 東京応化工業株式会社 塗布装置、及び塗布方法
CN108345136B (zh) * 2018-04-16 2023-09-29 苏州富强科技有限公司 一种lcd吸附上料装置
JP7154687B2 (ja) * 2018-06-19 2022-10-18 株式会社ディスコ テープ拡張装置
CN108861595A (zh) * 2018-07-02 2018-11-23 君泰创新（北京）科技有限公司 定位装置
CN110718492B (zh) * 2019-09-23 2022-11-29 苏州均华精密机械有限公司 盘体收集模块及其方法
US11903302B2 (en) * 2020-12-16 2024-02-13 Universal Display Corporation Organic vapor jet printing system
CN115818207B (zh) * 2023-02-10 2023-06-02 季华实验室 一种基板传送装置、控制方法及相关设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4305918B2 (ja) * 2004-01-30 2009-07-29 東京エレクトロン株式会社 浮上式基板搬送処理装置
JP4378301B2 (ja) * 2005-02-28 2009-12-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法及び基板処理プログラム
JP4895518B2 (ja) * 2005-03-22 2012-03-14 オリンパス株式会社 基板保持装置及び基板の保持方法
JP2007107945A (ja) * 2005-10-12 2007-04-26 Olympus Corp 基板検査装置
JP4884871B2 (ja) * 2006-07-27 2012-02-29 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4842746B2 (ja) * 2006-09-20 2011-12-21 オリンパス株式会社 基板搬送装置
JP5315013B2 (ja) * 2008-02-05 2013-10-16 オリンパス株式会社 基板搬送装置、及び、基板搬送方法

Also Published As

Publication number Publication date
KR101577481B1 (ko) 2015-12-14
CN102157424A (zh) 2011-08-17
TWI479592B (zh) 2015-04-01
KR20110085883A (ko) 2011-07-27
JP2011148593A (ja) 2011-08-04
TW201145432A (en) 2011-12-16
CN102157424B (zh) 2014-09-24

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