201145432 六、發明說明： 【發明所屬之技術領域】 板運^^系關於水平移動運送被處理基板之基板運送裝置及基 【先前技術】 圖案例如錢FPD(平面顯M)時’藉由觸光微影程序形成電路 该光微影程序具體如下進行。 理液基板等被處理基板使既定膜成膜後，塗布係處 使光_; 軸光_。又，_路圖案 本;κΊϊ年此光微影程序中，為提升處理量之目的，多 理二行井=之狀態運送被處理基板，並同時對此被處 布、乾燥、加熱、冷卻處理等各處理之構成。 至既定之構成’大致以水平姿態之狀態使基板浮升 運送方向運送基板之浮升運送受到注目。 圖8之基板運送裝置2〇〇包含： 璃基i ^)X轴方向浮升運送係被處理基板之玻 左右:導Ϊ 202 ’朝該玻璃基板G前進方向舖設於浮升平台201 在導4軌個 自下方吸__基板G _附近， 浐面，分別以—定間隔交互設有： 噴射 用以朝上方喷射既定氣體；及 夕數吸氧口 201b，用以吸氣。 201145432 又，藉由使自氣體喷射口 201a噴射之氣體噴射量與來自吸氣 口 201b之吸氣量之壓力負載一定，使玻璃基板G自浮^升平台2〇1 表面浮升至一定高度。 σ 且於浮升平台201基板送入位置Η平台2〇1之左右兩側，設 有分別對應經送入之玻璃基板G四角隅之4個對準裝置2〇4， 由各對準裝置204作動配置基板g於既定位置。 曰 又，此基板運送裝置200中，因適用於塗布處理裝置，包含 如圖示橫跨玻璃基板G左右方向(寬方向)配置，對在浮升平台^i 上浮升運送之玻璃基板G表面供給光阻液之光阻嘖嘴 〇 如此構成之基板運送裝置200中，針對自前段'程序裝置送入 之玻璃基板G，在基板運送開始前藉由該對準裝置2〇4進行對準 作業(稱對準)。根據圖8(a)(b)(c)及圖9之流程圖說明關於此對準程 序。 、首先，沿導轨2〇2運送1片玻璃基板〇完畢之基板載具2〇3 為接收下一運送之基板G，如圖8(a)所示回到浮升平台2〇1之芙板 送入位置tl待命(圖9之步驟SP1)。 土 接著，如圖8(b)所示，一旦重新送入玻璃基板^ ,對準梦 204之手掌部魏即上昇至在平台2〇1上浮升之玻璃基板/之高 度，並開始朝基板G側(亦即内侧)移動以接近基板〇四角觸9 之步驟SP2)。 藉此對準裝置2〇4之手掌部2〇4a接近玻璃基板G四角隅，推 壓玻璃基板G，移動玻璃基板至既定位置，進行對準。基板g之 ^對準-旦完畢’基板載具加之吸附墊廳即上昇，如 斤示吸附固持基板G四角隅(圖9之步驟SP3)。 ⑽且玻璃基板G 一旦固持於基板載具203，基板G之位置即不 m Q故對準裝置204之手掌部204&遠離基板G而回到待命位置 (圖9之步驟SP4)。 咐卩仅真 又，藉由基板載具203沿執道2〇2順著X方向移動，在浮升 太二201上運达基板G，在基板G通過光阻喷嘴2〇5下方塗 布光阻液(圖9之步驟SP5)。 、 201145432 哉呈ίΐΪΓϊ後’基板載具203回到基板送入位置η，基板 載/、置於待'»-ρ位置（圖9之步驟SPJ)。 土 [習知技術文獻] [專利文獻〗]日本特開2006-237482號公報 【發明内容】 [發明所欲解決的問題] 如，對準基板G時，在藉由對準裝置2〇4之 持基板G於既定位置之妝能下μ 士 | 羊。P 2〇4a固 因此，美招G ί你ίΐ 基板載具203進行刻寸固持。 妒二料盆4·置可不偏離而藉由基板載具203進行運送。201145432 VI. Description of the Invention: [Technical Field] The board transport device is a substrate transport device and a base for horizontally moving a substrate to be processed. [Prior Art] When a pattern such as a money FPD (flat display M) is used, The lithography program forming circuit The optical lithography program is specifically performed as follows. After the substrate to be processed, such as a liquid crystal substrate, is formed into a film, the film is coated with light _; In addition, _ road pattern book; κ Ίϊ 此 此 此 此 此 Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ Ίϊ The composition of each process. In the case of a predetermined configuration, the floating transport of the substrate in the direction in which the substrate is lifted and transported in a substantially horizontal state is attracting attention. The substrate transport device 2 of FIG. 8 includes: a glass base i ^) an X-axis direction floating transport system on the left and right sides of the substrate to be processed: a guide 202' is laid on the floating platform 201 toward the glass substrate G in the direction of advancement. The rails are respectively sucked from the lower side of the __substrate G _, and the kneading surfaces are respectively arranged at a predetermined interval: the jet is used to spray a predetermined gas upward; and the vacant oxygen port 201b is used for inhaling. In addition, the glass substrate G is lifted from the surface of the floating platform 2〇1 to a certain height by the constant pressure load of the gas injection amount injected from the gas injection port 201a and the intake air amount from the intake port 201b. σ is provided on the left and right sides of the substrate 送 platform 2〇1 of the floating platform 201, and four aligning devices 2〇4 corresponding to the four corners of the fed glass substrate G are provided, respectively, by the aligning devices 204. The arrangement substrate g is actuated at a predetermined position. Further, the substrate transfer device 200 is applied to the surface of the glass substrate G that is lifted and transported on the floating platform ^i by being disposed in the left-right direction (wide direction) across the glass substrate G as shown in the figure. In the substrate transfer device 200 configured as described above, the glass substrate G fed from the previous stage program device is aligned by the alignment device 2〇4 before the substrate transfer starts ( Said to be aligned). This alignment procedure will be explained based on the flowcharts of Figs. 8(a)(b)(c) and Fig. 9. First, one glass substrate is transported along the guide rail 2〇2, and the substrate carrier 2〇3 is received to receive the next transported substrate G, and returns to the floating platform 2〇1 as shown in FIG. 8(a). The board feed position tl stands by (step SP1 of Fig. 9). Then, as shown in Fig. 8(b), once the glass substrate is re-introduced, the palm of the palm of the dream 204 rises to the height of the glass substrate/uplifted on the platform 2〇1, and starts to face the substrate G. The side (i.e., the inner side) moves to approach step SP2) of the substrate 〇 four corners. Thereby, the palm portion 2〇4a of the alignment device 2〇4 approaches the four corners of the glass substrate G, pushes the glass substrate G, moves the glass substrate to a predetermined position, and performs alignment. The alignment of the substrate g is completed. The substrate carrier is increased by the adsorption pad chamber, and the substrate is held at the corner of the substrate G (step SP3 of Fig. 9). (10) Once the glass substrate G is held by the substrate carrier 203, the position of the substrate G is not so that the palm portion 204 & of the alignment device 204 is returned to the standby position away from the substrate G (step SP4 of Fig. 9).咐卩 Only true, by the substrate carrier 203 moving along the lane 2〇2 along the X direction, the substrate G is carried on the floating lift 201, and the photoresist is coated on the substrate G under the photoresist nozzle 2〇5. Liquid (step SP5 of Fig. 9). After the 201145432 is displayed, the substrate carrier 203 is returned to the substrate feeding position η, and the substrate is placed at the position to be '»-ρ (step SPJ in Fig. 9). [Technical Document] [Patent Document] Japanese Laid-Open Patent Publication No. 2006-237482 [Draft] [Problems to be Solved by the Invention] For example, when aligning the substrate G, by aligning the device 2〇4 Holding the substrate G at a given position, the makeup can be lowered. P 2〇4a is solid. Therefore, the US package G ί you ΐ the substrate carrier 203 for the inch. The second bowl 4 can be transported by the substrate carrier 203 without deviation.
復至基板送人健H 綱a相干擾之技術性課題。 Ά旱裝置204之手掌部 番orft’-自以往係如沿上述圖9之流程圖所說明，夢由㈣步 進讀準作f係在完祕板運 3 ^ 基板送入位置Η後進行。 《減戟具203恢復至 美相時在以浮升平台观運送1絲板G後，若不等待 ====基1人位置^時__之_ 灯开^下基板運达，處理量降低之技術十生課題。 男‘、，、 鑑於如上述習知技術之問題點，— 法;ί Γ片式逐—水;移動運 處置中，可縮短送入基板至運送開始之作業時間，g [解決問題之技術手段] -水辦収將基板逐 =升平台，藉由噴射氣體使該基板浮 導執，配置於該浮升平台側方；It is a technical issue to reproduce the interference of the substrate to the human body. The palm of the drowning device 204 is orft'--from the past, as shown in the flow chart of Fig. 9 above, the dream is carried out by the step (4) step-by-step operation. "When the cockroach 203 is restored to the US, after transporting the 1 slab G on the floating platform, if you do not wait ==== base 1 person position ^ __ _ light on the lower substrate, the throughput Reduce the technical tenth issue. Male ',,, in view of the above-mentioned problems of the prior art, - method; Γ 式 式 逐 ; ; ; ; 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动] - the water office receives the substrate from the liter platform, and the substrate is floated and guided by the injection gas, and is disposed on the side of the floating platform;
S 201145432 基板載具’分別以可移動之方式沿該導軌 附固持該基板邊緣部； 了自下方吸 對準機構，設置於該浮升平△ 送入之該基板自待命位置位；，可相對於經 該基板配置於既定位置魏4置任以退，接龍基板而將 .㈣i板支持機構’於該浮升平台之基板送入位置 準機巧置於既定健之縣板下方域該基板； 自藉由該對 動作 控制部’㈣該基域具、該解機構與該基板支持機構之 該浮制’俾在完成基板運送之該基板載具回到 配置於既ί位内，該對準機構進行將該基板 ί此?ϊί機構並恢復至不干擾錄板載具之置 舰：^暫時_對雜序後之被處縣板之基板支持 =對ί在基板載具回到浮升平台之基板送入位置 後進::準不板載具回到浮升平台之基板送入位置 理量。 了—自狄基板至運賴始之作鱗間，提升處 之‘ίϊΐί，’依本發明之基板運送方法藉由包含下列者 之基置以單片式將基板逐—水平移動運送：下歹J者 ^平。，猎由噴射氣體使該基板浮升； $ ’配置於該浮升平台側方；S 201145432 substrate carrier 'removably holding the edge portion of the substrate along the guide rail; respectively, the bottom suction aligning mechanism is disposed on the substrate of the floating level Δ feeding from the standby position; The substrate is placed at a predetermined position, and the substrate is placed in the predetermined position. The pair of operation control unit '(4) the base device, the solution mechanism, and the floating device of the substrate support mechanism are returned to the substrate carrier in the substrate carrier, and the alignment mechanism performs The substrate is 此 ϊ 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 机构 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Feeding position and backward:: The board carrier returns to the position of the substrate of the floating platform. The substrate transport method according to the present invention is carried out in a single piece by means of a substrate in a single piece by means of a substrate to the beginning of the process: 歹 水平 歹 : : : : : : : : : : 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板J is ^ Ping. Hunting is caused by the jet of gas to lift the substrate; $' is disposed on the side of the floating platform;
持該飾之柿爾執設1，可自下方吸附固 對準機構’設置於該浮升A 201145432 基板支持彳域：，於§亥浮升平台之基 準機==位置之該基板下方支=及 動作控制和控制該基板載具、該對準機構與該基板支持機構之 且該基板運送方法之特徵在於包含下列程序. 板而回到該浮升平台之基板送人位ί止期^内， 將浮升平台上的基板送二=機構 =ΐί軌完成基板運送之該基板載具為接收下-運送之基 對準機構 位置之對準； _ •一&〜江、〃/人叫置於既定 恢復至待命位置 ，如此之方法’藉由基板支持機構 =對;在基板載具回到浮升平台之基板送上= 亦即’不需如以往在基板载具回到浮升平台之 後進行對準，縣域具_絲送 ^板 ^運送，故可縮短自送人基板至 [發明之效果] 至/ΐί發Lli得—種基板運送裳置及基板運送方法，在以 早片，逐-水平祕運送被處理基板之基板運送裝置中，可 运入基板至運送開始之作業時間，提升處理量。 、'、 【實施方式】 之玻=Si;T，理單 浮升運送部2A，用來以單片式逐一浮升運送破璃基板G ;及 201145432 運送滾子運达部2B ’自該浮升運送部2A接收絲G，進行滾子 基，G可進行所謂水平移動運送。 之浮係基板運送方向之X方向延長 以一定間隔交互t 沿x方向與γ方向 來自氣射多數氣體喷出口3a與氣體吸氣口3b，藉由使 體噴出量，與來自氣體吸氣口 3b 中，雖夢由载—疋’使玻璃基板G浮升。又，此實施形態 由此等美部亚在導軌5上移動之4個基板載具6。藉 移動。又玻璃基板G沿運送方向 ϋ方 平纟3 ^财，更延體置线子運送部 各基板載具6如圖3所示，包含： 滑動構件6a，以可祕之方式沿導轨5設置； Γΐ==，藉由抽吸侧動作可吸附基板°下表面；及 缸同驅動邛6c，使吸附構件6b昇降移動。 接縮件奶連接抽吸泵(未經圖示），藉由抽吸與基板G 接觸區域之^氣使其接近真空狀態，吸祕板G。 m區籌成之控制部5〇，控制該滑動構件如、缸 同驅動部6c與該抽吸泵其驅動。 G JtH、圖2所示’於浮升平台3自前段程序裝置送入基板 置之對㈣上，進她[錢从基板G至既定位 ( )此，於浮升平台3基板送人位置Η左右 兩側，设有4個對準裝置7，俾分 右 201145432 各對準裝置7包含分別自側方接近基板G 以可接觸之方式設置之手掌構件7a(對角隅(角隅W， 件7a可接觸基板〇四角隅，如圖4所示包含：且為使該手掌構 缸筒驅動部7b，使手掌構件7a昇降.及 進退=_部7e’使手t構件7a相對於基板g水啊沿γ方向） 又’ ^由控制部50，控制該缸筒驅動部％、％ 準之; =膽在浮升平台3基板送入位 =:== Γ各支制機構8如圖2、®4所示包含： 浮升平台3表面朝上方恰可突出既収寸(例如 =筒=部8b(昇降驅動部），使支持銷8a ΐ在iiV控制缸筒驅動部劝其驅動。 光阻液之ί^嘴9 ，設有對玻璃基板G流出 形狀。且喷嘴9形成為較例如玻璃基 所不於喷嘴9下端部形成狹縫狀流中 向寬長。如圖2 圖示)對此喷嘴9供給光阻液。爪a，光阻液供給源(未經 喈壁η π θ本 不夕勒t’ 11固持。此噴嘴9可藉由喑 由相關1=圖&有昇喷嘴9可昇降至既定高度。藉 之济，i喷嘴可在對玻璃基板g流出光阻液 動。L ”在自此更上游側的旋轉輥I2及待命部14之間移 走轉秦b 12以可繞著軸旋轉之方式收納於清洗槽η内。 201145432 拔、^絲?"洗如圖2所示之噴嘴9流出σ 9a時，噴嘴9泣屮 接近旋轉輥12最上部。又 爲9*出〇 9a =旋，2流出光二==’中自： J狀“-。糟此’可使噴嘴9流出口知中光阻液之流出② 於該旋轉輕12更上游側，有嘴 14中設有例如清洗噴嘴9之功能或防止喷嘴9 ^之功倉f寺命部 子運運送部从後_滾^， 轉，之複數根滾子軸16。於各滾子軸16，胃=5旋 17 ’猎，此等運送滾子Π旋轉運送基板G。-數運运滚子 接著順著圖5之流程圖及圖6、7說明關 運送裝置1巾鱗魏G之程和 •此構成之基板 基板，上逐-運送 板运入位置Η(圖5之步驟si)。 罢’如圖_所示於浮升平台3基板送入位置Η，重新 =璃$ G。在此，於浮升平台3上，自氣體喷出置二： ^由平體;及氣° 3b吸氣，藉此形成非活性氣體之氣流。 ϊίίίίί 成之該非活性氣體之氣流自下方支持該經 &針對該重新送人之基板G，對準裝置7之付構件？ 7同ei動ί基^ G料高度，水平移祕藉由缸筒^動部 7c接近基板G四角隅角隅部。藉此玻璃基板G移動至浮 3 上的既定位置，進行對準(同圖5之步驟S1)。如此於本實施形,&， 如圖6(b)所不在基板载具6回到基板送入位置H前實施對準。 11 201145432 針對經送入之基板G之對準—曰*筮z / 中，即藉由叙筒驅動部8b使支持銷:上曰j各支持銷機構8 銷如自下方支持基板G(圖5i=sa2p移動，藉由4根支持 一旦藉由支持銷8a固持基板g至既宏办要， =;置二之手掌構件7a即藉由缸_^b 所示夢 由缸__部7e沿絲G左右方向鶴m動更猎 ：：ΐ!3)0 χ' 方藉二，但因自下 非活性氣體之氣流沖走而移動。亦台3上形成之 於既定位置。且藉由在該浮升平I 而固持 自下方支持基板G，故基板不撓曲。上域之非活性氣體之氣流 如該步驟S3對準裝置7之手掌構件7a _ 位置，基板載具6即不干擾對準穿f —確見口到其待命 完畢。 竹㈣砰置7而娜板送人位置Η移動 回到基板送入位置Η之基板载具6中，吸 驅動部6。上昇移動，如圖制所示藉由吸附構件奶二^ 持基板G邊緣部(圖5之步驟S4)。 及附固 且一旦藉由基板载具6固持基板G，控制部5 機構8中德筒驅_ 8b使支持銷8a 口支持^ 銷如支持之支持狀態。 ㈣解除猎由支持 又，藉由基板載具6基板G如圖剛所示沿導執5在 ί；ί；1Γ5^^ 4上，依本㈣之糊實施職，包相㈣咖持對準 後之基板G之支持鑛構8，故在基扳载具一到浮 板达入位置Η前，可實施下一運送之基板G之對準。D 土 =，不需如雄在基域具6 _浮升平台3基板送入位 置Η後貫細下一運送之基板G之對準’隨基板载具6回到基板送 12 201145432 ϊίί?、:'17Γ基板載具6固持基板°而開始進行運送，故 了縮短自运入基板至運送開始之作業時間，提升處理量。 前述^形發==送裝置之第2實施形態。又，與Holding the decoration of the Persimmon 1, the adsorption alignment mechanism can be set from the bottom to the floating A 201145432 substrate support area: the base of the base of the §Haisheng platform == position of the substrate = And the operation control and control of the substrate carrier, the alignment mechanism and the substrate supporting mechanism, and the substrate transporting method is characterized by comprising the following program: the board returns to the substrate of the floating platform to give a position , the substrate on the floating platform is sent to the second = mechanism = ΐ 轨 轨 完成 完成 完成 完成 完成 完成 完成 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收 接收Placed in the intended return to standby position, such a method 'by the substrate support mechanism = pair; the substrate carrier is returned to the substrate of the floating platform to send = that is, 'no need to return to the floating platform as in the previous substrate carrier After the alignment, the county has a _ wire to send the board ^ transport, so it can shorten the self-delivering substrate to [the effect of the invention] to / ΐ 发 L Lli - a kind of substrate transporting and substrate transport methods, in the early film, The substrate transport device for transporting the substrate to be processed in a horizontal-to-horizontal manner The substrate may be transported into the transport operation to the beginning of time, improve the processing amount. , ', [Embodiment] Glass = Si; T, single-lifting and transporting section 2A, for transporting the glass substrate G one by one in a single piece; and 201145432 Shipping roller transporting part 2B 'from the floating The lift transport unit 2A receives the wire G and performs a roller base, and G can perform so-called horizontal movement transport. The X-direction of the floating substrate transport direction is extended at a constant interval t from the gas-emitting majority gas discharge port 3a and the gas intake port 3b in the x direction and the γ direction, by the amount of discharge of the body, and the gas suction port 3b In the middle, although the dream is carried by the carrier, the glass substrate G is raised. Further, in this embodiment, the four substrate carriers 6 which are moved by the U.S. Borrow. Further, the glass substrate G is arranged in the direction of the conveyance direction, and the substrate carriers 6 of the extension-line-line transport unit are as shown in FIG. 3, and include: a sliding member 6a which is disposed along the guide rail 5 in a secret manner. Γΐ==, the bottom surface of the substrate can be adsorbed by the suction side action; and the cylinder is driven by the driving 邛6c to move the adsorption member 6b up and down. The constricting piece is connected to a suction pump (not shown), and sucks the secret plate G by sucking the gas in contact with the substrate G to bring it close to a vacuum state. The control unit 5a of the m zone controls the sliding member such as the cylinder driving unit 6c to drive the suction pump. G JtH, as shown in Figure 2, on the floating platform 3 from the front-end program device to the substrate placed on the pair (four), into her [money from the substrate G to the positioning (), on the floating platform 3 substrate delivery position Η On the left and right sides, there are four aligning devices 7, and the right aligning device 201145432 includes arranging members 7a (diagonal 隅W, pieces) which are respectively disposed from the side to the substrate G in a contactable manner. 7a can contact the substrate 〇 four corners, as shown in FIG. 4, and the palm member 7a is lifted and lowered by the palm cylinder driving portion 7b, and the forward/backward portion _ portion 7e' makes the hand t member 7a relative to the substrate g The water is in the γ direction) and '^ is controlled by the control unit 50 to control the cylinder drive unit % and %; = the gallbladder is placed on the substrate of the floating platform 3 =:== ΓThe various supporting mechanisms 8 are as shown in Fig. 2 The product shown in Fig. 4 includes: The surface of the floating platform 3 is upwardly protruded to be both closed (for example, the cylinder = portion 8b (elevating drive portion), so that the support pin 8a is driven by the iiV control cylinder drive portion. The liquid-repellent nozzle 9 is provided with a shape in which the glass substrate G flows out, and the nozzle 9 is formed to be wider than the lower end portion of the nozzle 9 such as a glass base. As shown in Fig. 2, the nozzle 9 is supplied with a photoresist liquid. The claw a, the photoresist liquid supply source (without the wall η π θ 不 勒 勒 t'11 holds. This nozzle 9 can be related by 喑1 = Fig. & The lift nozzle 9 can be raised and lowered to a predetermined height. By the way, the i nozzle can flow out of the photoresist on the glass substrate g. L "On the upstream side of the rotating roller I2 and the standby portion 14 The shifting Qin b 12 is stored in the cleaning tank η so as to be rotatable about the axis. 201145432 Pulling, Wire, and Washing When the nozzle 9 shown in Fig. 2 flows out of σ 9a, the nozzle 9 is nearly rotated. The uppermost part of the roller 12 is 9* out 9a = rotation, 2 out of the light 2 == 'in the self: J-shaped "-. bad this" can make the nozzle 9 out of the outlet know the outflow of the photoresist 2 in the rotation On the upstream side of the 12, the nozzle 14 is provided with, for example, a function of cleaning the nozzle 9 or a plurality of roller shafts 16 for preventing the nozzles from being transferred from the rear to the second. Each of the roller shafts 16, the stomach = 5 turns 17 'hunting, these transport rollers rotate the transport substrate G. The number of transport rollers then follows the flow chart of Figure 5 and Figures 6 and 7 to illustrate the transport device 1 Scale Wei G • The substrate substrate of this configuration is transported into the position by the transport plate (step si of Figure 5). As shown in Figure _, at the substrate of the floating platform 3, the position is Η, re-glazed $ G. On the floating platform 3, the gas is ejected two times: ^ is a flat body; and the gas is sucked by air to form an inert gas flow. ϊ ί ί ί ί ί ί ί 非 成 成 成 成 成 成 成 成 成 成 成 成 非 非 非 非 非 非 非 非 非For the substrate G to be re-delivered, the component of the alignment device 7 is the same as the height of the material, and the horizontal movement is close to the corner of the substrate G by the cylinder moving portion 7c. Thereby, the glass substrate G is moved to a predetermined position on the float 3, and alignment is performed (step S1 of Fig. 5). In this embodiment, the alignment is performed before the substrate carrier 6 is returned to the substrate feeding position H as shown in FIG. 6(b). 11 201145432 For the alignment of the fed substrate G - 曰 * 筮 z / medium, that is, by the cylinder driving portion 8b to make the support pin: the upper support j support pin mechanism 8 pin as the support substrate G from the bottom (Fig. 5i =sa2p moves, with 4 supports once the substrate g is held by the support pin 8a to the same macro, =; the palm member 7a of the second is represented by the cylinder _^b by the cylinder __ portion 7e along the wire G left and right direction crane m move more hunting:: ΐ! 3)0 χ' side borrowed two, but moved by the air flow from the lower inert gas. It is also formed in the established position on the platform 3. Further, since the support substrate G is held by the floating level I, the substrate is not bent. The flow of the inert gas of the upper domain. As in step S3, the position of the palm member 7a_ of the aligning device 7 is such that the substrate carrier 6 does not interfere with the alignment, so that the mouth is ready to stand by. The bamboo (four) is placed 7 and the plate is moved to the position Η. The substrate carrier 6 is returned to the substrate feeding position ,, and the driving unit 6 is sucked. Ascending movement, as shown in the figure, the edge portion of the substrate G is held by the adsorption member (step S4 of Fig. 5). And when the substrate G is held by the substrate carrier 6, the control unit 5 mechanism 8 supports the support pin 8a to support the support state. (4) De-hunting support, and by means of the substrate carrier 6 substrate G as shown in the figure 5 along the guide 5 on ί; ί; 1 Γ 5 ^ ^ 4, according to the (4) paste implementation, the phase (4) coffee alignment The rear substrate G supports the mineral structure 8, so that the alignment of the substrate G to be transported can be performed before the substrate carrier reaches the floating plate. D soil =, do not need to be in the base area with 6 _ floating platform 3 substrate feeding position Η after the fine delivery of the substrate G alignment ' with the substrate carrier 6 back to the substrate to send 12 201145432 ϊ ίί?, : '17 Γ The substrate carrier 6 holds the substrate ° and starts to transport. Therefore, the operation time from the transport of the substrate to the start of transportation is shortened, and the amount of processing is increased. The second embodiment of the above-mentioned ^ shape hair == delivery device. Again, with
^i^cf。2細紅軸繼61。靠中，沿X 、，於浮升運送部2A前段懷基板運送方向上游 二滚子運送部2c中’於浮升平台3前段，並列設有、由 ΐίΐ ίί旋_動之複數根滾子軸63。於各滾子軸63 ,曰安 裝有運运滾子64。 板運用1在if平台3上運送運送滾子64上_板g之基 板運达機構，例如分類器65。分類器65如圖10〜12所示， 吸附墊66，用以吸附固持基板G ; 吸附墊昇降機構67，用以使吸附墊66昇降；及 動機構68，用以使吸瞻66與_墊昇降機構67 >σ入万向移動。 心t如Λ13所示’吸附塾66藉由配管85連接抽吸泵％。且於 6= L 有用以朝2方向切财路之三通閥87，且在吸附塾 伐7之間設f可任意開合之二通閥88。此三通閥87連 : ^ 一端，配管89之另一端連接加壓氣體供給源90。因 麻^^啟二通闕88，更切換三通闕87，可使吸附墊66連接 % Qri、,/吸附固持基板G，或使吸附墊66連接加壓氣體供給 瞻66供給加觀如齡基板^魏。又，分 所構成之控制部5Q ’控制吸附墊昇降機構67、吸附塾 私動機，68」三通閥87、二通閥88其驅動。 …Λ且^本Μ施形悲，分別逐二配置有用以在浮升平台3上將經 ^ G對準於既定位置’侧準機構之對準銷69、70、7卜 72 ’俾分別對應基板G四角隅。 72八H10、14所不，對準機構包含用以使對準銷69、70、71、 刀1沿基板G各一邊正交方向移動之對準銷移動機構73。且於 13 201145432 夹隔著基板G與對準銷69對向之斟進 73與對準銷70之間設有可任音’在對準銷移動機構 機構73外對準銷70接觸基板;時，二 基板G之負載不過大。於夾隔荖^對初祕機構73施加於 r亦相同’在對準銷72與對準菁 準銷昇降機構77動作以使對準鎖 使對準銷移動機構73動作，令對準銷的、7〇、7 後， ㈣控制對準銷移動機構73與對準銷昇降機構77 且各基板載具6如圖1〇所示，包含： 滑動構件6a ’以可移動之方式沿導執5設置；及 广藉由抽吸·斷開動作可吸附基板〇下表面。 之吸附^ ^ 6^_構件&相對_構件知昇降 件昇降機構6d可固持吸附構⑽於3個高度。吸附 ^)。吸It%固持基板〇時之位置(此位置稱擷取 $實施謝，嫩;時 細轉件喊絲糾下表面時 又’如圖17所示’吸附構件你連接抽吸聚9 之空氣以接近真空狀'態，藉此可朗基板G，在吸^ = ί ίϊ之間’設有細減壓值之減愿感測器96。且在抽 泵95與減屋感測器96之間，設有使流路開合之二通闕97。^i^cf. 2 fine red axis followed by 61. Centering, along the X, in the front section of the floating transport portion 2A, in the upstream two-roller transport portion 2c in the substrate transport direction, in the front section of the floating platform 3, and arranged in parallel, the plurality of roller shafts are rotated by ΐίΐ ίί 63. For each roller shaft 63, the wheel is equipped with a transport roller 64. The board application 1 transports the substrate transport mechanism on the transport roller 64 on the if platform 3, such as the classifier 65. As shown in FIGS. 10 to 12, the classifier 65 is configured to adsorb and hold the substrate G; the adsorption pad lifting mechanism 67 for lifting and lowering the adsorption pad 66; and the moving mechanism 68 for making the suction surface 66 and the pad The lifting mechanism 67 > σ enters the universal movement. The heart t is as shown in Fig. 13 'The adsorption port 66 is connected to the suction pump % by the pipe 85. Further, at 6 = L, there is a three-way valve 87 for cutting the road in two directions, and a two-way valve 88 which can be arbitrarily opened and closed between the adsorption cuts 7 is provided. The three-way valve 87 is connected to: ^ one end, and the other end of the pipe 89 is connected to the pressurized gas supply source 90. Because the hemp ^^二二阙阙88, and the three-way switch 87, the adsorption pad 66 can be connected to the % Qri, / adsorption holding substrate G, or the adsorption pad 66 can be connected to the pressurized gas supply. Substrate ^ Wei. Further, the control unit 5Q' configured by the branch controls the adsorption pad elevating mechanism 67, the adsorption cassette, the 68" three-way valve 87, and the two-way valve 88 to drive. ...and ^ Μ 形 形 , , ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The substrate G is square. 728, H10, and 14, the alignment mechanism includes an alignment pin moving mechanism 73 for moving the alignment pins 69, 70, 71 and the blade 1 in the orthogonal direction of each side of the substrate G. And 13 201145432 is disposed between the substrate G and the alignment pin 69 and the alignment pin 70 is disposed between the alignment pin 70 and the alignment pin 70. The alignment pin 70 contacts the substrate at the alignment pin movement mechanism 73. The load of the two substrates G is not large. The same applies to the initial secret mechanism 73 applied to r. The action of the alignment pin 72 and the alignment trigger pin lifting mechanism 77 causes the alignment lock to actuate the alignment pin moving mechanism 73, so that the alignment pin is After 7〇, 7 (4), the alignment pin moving mechanism 73 and the alignment pin lifting mechanism 77 are controlled, and each substrate carrier 6 is as shown in FIG. 1B, and includes: the sliding member 6a' is movable along the guide 5 The bottom surface of the substrate can be adsorbed by suction and disconnection. The adsorption ^ ^ 6 ^ _ member & relative _ member knows that the lifting member lifting mechanism 6d can hold the adsorption structure (10) at three heights. Adsorption ^). The position where the It% holds the substrate ( (this position is called 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施Close to the vacuum state, thereby enabling the substrate G to be 'with a reduced pressure value reduction sensor 96 between the suctions and between the pump 95 and the reduced house sensor 96 There is a two-way 阙 97 for opening and closing the flow path.
S 14 201145432 送至控制部50。 其起動，減壓感測器％之測定值^ 荖γϋ:構件6b其上表面(吸附基板G之-面)可短著Υ έ 者疋轉調整’吸附構件6b可吸關持基板)G 4 X軸及繞 之間^軸示’在X轴方向之吸附構件你與吸附構件6b 複數載持支架75，吸附固持基板；及 載持支架滑動構件76，可沿導勒5銘+番4士丄 ;:r所示，分別具有二載 木'月動構件76昇降移動之載持支架昇降機構％。、载持支 G接Lt、圖19所不’載持支架75連接抽吸泵1()1，抽吸盥其故 架=與抽吸泵之間’設有伽臟值之減壓‘哭支 吸泵1=與減壓感測器搬之間，設有使流路 f抽 且載持支架75之上表面(吸附基板G之一面)僅。 H x軸及繞著Y轉調整，載持支架 轉調整，藉由如此構成，可以簡易之構造，藉由吸車= 持支架75確實吸附固持基板g。 、 舁載 傭ΐ力’載气支架昇降機構78可固持載持支架75们個高产。 支木75取咼之位置係吸附、固持基板g時之位置(此位i稱 ，位置)。载持支架75中間高度之位置係於基板G進(行J 理Μ本錢賴巾，於基板G塗布紐時)之錄(此位 ^ =置）。婦妓75最低之位置係翁核π _基板G下J 吟之位置(此位置稱釋放位置）。 且分別藉由電腦所構成之控制部50，控制載持支架滑動構件 76、、載持支架昇降機構78、二通閥103其驅動，減壓感測器1〇2 之測定值可傳至控制部50。 °° 15 201145432 其次，說明關於此第2實施形態中基板運送裝 之 =基板2至奸親部2⑽定位置後，即停止奸驅動部62， 猎此停止基板G之移動。又，於分_ 65之吸_ %下降之位 3二墊移動至絲G下魏定位置，其後，開始吸附墊 66之抽吸動作。又，錯由吸附墊昇降機構们使吸附 上 藉由吸附墊66吸附固持基板G下表面。 其次’自氣體噴出開始喷出非活性氣體，自氣體抽吸口 = 65 轴方向移動，運送基 送入3置H。其次’自吸附墊66喷出加壓氣體以解除 fo ^ =使對準銷昇降機構77動作，使對準銷69、 7〇、71、72上歼。其後’使對準銷移動機構 ” ' 71、72接近、接觸基板G，對準基板G =2=， 此時，藉由來自氣體噴出π 3a非活性氣體之喷出， ^口 3b非活性«之抽吸之平衡，基板G保持在自料平 =抽 至既定南度之狀態中。其次，停止來自吸二 ;3 : 下降’使吸附墊66脫離基板G下表面？ ς如65為準備運运下—基板G，移動至原來的位置。 /、二人，使對準銷移動機構73動作，令對準銷69旬 70^離f ^其ί #由對準銷昇降機構77使對準銷69與夕 下降又’此時，對準銷71與72不脫離基板G，維 Ϊ觸物肖71與72維持接近、接觸基板G之狀 基板之位置可不偏離，固持基板G於既定位置。且對 G ’ _輯準銷69、％摩擦基板〇而 吸附^ 力件昇降機構&與載持支架昇降機構78，使 及附構件6b與载持支架％位於釋放位置，其後，使 ίίΪ%動作以令吸附構件你與麟支架75 “ 土板G下方。其-人，開始吸附構件汕與載持支架乃 作，使吸附構件昇降機構⑺與載持支架昇降機構78動作，使吸 16 201145432 75之高度位置上昇至擷取位置，藉由吸附 -、載持支架75，吸附固持基板g。 夕鬥在吸附構件6b及載持支架75與抽吸泵(未經圖示） 作使:到達既定減壓值後，使對準鎖移動機構73動 乍使對準銷71與72沿水平方向脫離基板G。 並令件6^及載持支架75之高度下降至處理位置， 物娜支架滑動構 之作形態’可縮短自送人基板G至運送開始 ^，說明本發明第3實施形 悲相，略酬。_實辆態t，設想各觀^之:。 部81設於於既定位置時用以接近、接觸基板G之段差 69 H /72，°代之^57不使用第2實施形態中之對準銷 代之以本貫知形態之對準銷8〇。 準銷Z2。1:;②未之準=广71、72糊形，對 平方向脫離基板G之狀能下推耔μ曰/2右在未沿水 7卜72與基板G即會相谓進二’ ^^準_、70、 使同時進行鱗鎖8G之料之解銷80，即 8〇魅板G亦不相干擾向2^·下降動作，對準銷 又，該實施形態中 光阻塗布處理單元之愔开料月之基板運达褒置適用於 不限定於此單元，於:但依本發明之基板運送裝置 係熟知該技藝者，當然當使用。且若 種變更例或修正例，關於此等=巳己載之構想中各 圍。且上述實施形態雖係於;明 17 201145432 亦可適用於在基 亦可適用於基板係FPD基板以外之矩形基板時， 板上塗布光阻液以外液體時。 【圖式簡單說明】 i明實施形態整體概略構成之俯視圖。 [圖2]係顯不依本發明實施形態整體概略構 [圖3]係圖2基板運送裝置之A_A箭視剖面圖。° θ ° [圖4]係圖2基板運送裳置之Β_Β箭視剖面圖。 [圖5]係顯示依本發明實施形態動作之流程圖。 個以說明依本發明實施職動作之俯視圖。 Ξ 8 ^ 細依本發明實絲_叙俯視圖。 圖。[圖係用以說明習知基板運送裝置概略構成之俯視 [圖9]係顯示習知基板運送裝置動作流程之流程圖。 ，顯示依本發明第2實施形態整體構成之俯視圖 [圖11]係依本發明分類器之俯視圖。 [圖12]係依本發明分類器之側視圖。 依本發明連接吸_之配管構成說明圖。 [圖14]係依本發明對準機構之俯視圖。 [圖15]係依本發明鱗機構之側視圖。 圖16]係财發板魅之舰圖。 發明連接吸附構件之配管構成說明圖。 ，聊依本發明載持支架之側視圖。 [圖之配管 月弟3貫靶形恶對準銷之說明圖。 '、、發明第1與第2實施形態對準銷之說明圖 【主要元件符號說明】 縣板（破璃基板）（基板） 基板秋位置（基板置入位置）S 14 201145432 is sent to the control unit 50. The starting value, the measured value of the decompression sensor % 荖 ϋ ϋ: the upper surface of the member 6b (the surface of the adsorption substrate G) can be short Υ 疋 疋 调整 调整 ' 'Adsorption member 6b can suck the holding substrate) G 4 The X-axis and the winding between the ^ axis show 'the adsorption member in the X-axis direction. You and the adsorption member 6b carry the holder 75 in plurality, adsorbing and holding the substrate; and carrying the bracket sliding member 76, along the guide 5 Ming + Fan 4丄;: r, respectively, has two carrier wood 'monthly moving member 76 lifting movement of the support bracket lifting mechanism%. , carrying the support G to Lt, Figure 19 does not 'carrier bracket 75 connected to the suction pump 1 () 1, pumping the 架 故 = = with the suction pump 'with decompression of the gamma value' cry Between the suction pump 1 and the pressure-reduction sensor, the flow path f is drawn and the upper surface of the holder 75 (one surface of the adsorption substrate G) is held only. The H x axis is adjusted around the Y rotation, and the carrier is rotated and adjusted. With such a configuration, the structure can be easily constructed, and the holding substrate g can be surely adsorbed by the suction car holder 75.舁 ΐ ’ ‘ ‘ carrier’s bracket lift mechanism 78 can hold the carrier bracket 75 a high yield. The position of the branch 75 is the position at which the substrate g is adsorbed and held (this position is called the position). The position of the intermediate height of the carrier 75 is recorded on the substrate G (when the substrate is processed, and the substrate G is coated with the button) (this position is ^=). The lowest position of the 妓 75 is the position of the π _ _ substrate G under J ( (this position is called the release position). The control unit 50 composed of a computer controls the carrier holder sliding member 76, the carrier holder lifting mechanism 78, and the two-way valve 103 to drive the measurement value of the pressure reducing sensor 1〇2 to control. Department 50. °° 15 201145432 Next, in the second embodiment, after the substrate 2 to the traitor 2 (10) is positioned, the smear driving unit 62 is stopped, and the movement of the substrate G is stopped. Further, in the position of the suction_% drop of the _65, the two pads are moved to the position of the Weiding of the filament G, and thereafter, the suction operation of the adsorption pad 66 is started. Further, the suction pad lifting mechanism causes the adsorption to adsorb the lower surface of the substrate G by the adsorption pad 66. Next, the inert gas is ejected from the gas ejection, and is moved from the gas suction port = 65 axis direction, and the transport base is fed with 3 H. Next, the pressurized gas is ejected from the adsorption pad 66 to release fo ^ = the alignment pin elevating mechanism 77 is operated to align the alignment pins 69, 7〇, 71, and 72. Thereafter, the 'alignment pin moving mechanism' '71, 72 approaches, contacts the substrate G, aligns the substrate G = 2 =, at this time, by the ejection of the π 3a inert gas from the gas, the port 3b is inactive «The balance of suction, the substrate G is kept in the state of self-leveling = pumping to a predetermined south degree. Secondly, the stop is from the suction two; 3: the lowering is to make the adsorption pad 66 off the lower surface of the substrate G? For example, 65 is prepared Under the transport - the substrate G, moved to the original position. /, two people, the alignment pin moving mechanism 73 is operated, so that the alignment pin 69 is 70 ° away from the ^ ^ ί # by the alignment pin lifting mechanism 77 At this time, the alignment pins 71 and 72 are not separated from the substrate G, and the contacts 71 and 72 are maintained close to each other, and the position of the substrate contacting the substrate G is not deviated, and the substrate G is held at a predetermined position. And G _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ ίίΪ% action to make the adsorption member you with the collar bracket 75 "under the earth plate G. The human-initiated adsorption member 汕 and the carrier holder act to move the adsorption member lifting mechanism (7) and the carrier-supporting lifting mechanism 78 to raise the height position of the suction 16 201145432 75 to the suction position, by adsorption-and-loading The holder 75 is held to adsorb and hold the substrate g. In the case of the suction member 6b and the carrier holder 75 and the suction pump (not shown), after the predetermined pressure reduction value is reached, the alignment lock moving mechanism 73 is moved to cause the alignment pins 71 and 72 to be horizontal. Disengaged from the substrate G. And the height of the member 6^ and the carrier holder 75 is lowered to the processing position, and the shape of the sliding frame of the object holder can shorten the self-delivering substrate G to the start of transportation, and the third embodiment of the present invention is described as a sad phase. . _ Real vehicle state t, Imagine each view ^: The portion 81 is provided at a predetermined position for approaching and contacting the step G of the substrate G by 69 H / 72, and instead of using the alignment pin of the second embodiment, the alignment pin 8 of the presently known configuration is used instead. Hey. Quasi-sale Z2.1:;2 is not accurate = wide 71, 72 paste shape, the direction of the plane G can be pushed down 耔μ曰/2 right in the water 7 b 72 and the substrate G will be said Into the second '^^ quasi-, 70, so that the scale of the 8G material is released at the same time 80, that is, 8 〇 charm plate G does not interfere with the 2^· descent action, the alignment pin again, the light in this embodiment The substrate transporting device of the resist coating processing unit is not limited to this unit, but the substrate transporting device according to the present invention is well known to those skilled in the art and of course used. And if there are any examples of changes or amendments, please refer to the concept of such a description. Further, the above-described embodiment is also applicable to the case where the substrate can be applied to a rectangular substrate other than the substrate-based FPD substrate, and the liquid is applied to a liquid other than the photoresist. BRIEF DESCRIPTION OF THE DRAWINGS A plan view showing an overall schematic configuration of an embodiment will be described. Fig. 2 is a schematic cross-sectional view showing the substrate transport apparatus of Fig. 2 in an arrowhead view. ° θ ° [Fig. 4] Fig. 2 is a cross-sectional view of the substrate. Fig. 5 is a flow chart showing the operation of an embodiment of the present invention. A plan view illustrating the actions performed in accordance with the present invention. Ξ 8 ^ According to the invention, the silk _ is a top view. Figure. [Fig. 9] A plan view showing a schematic configuration of a conventional substrate transfer device. Fig. 9 is a flow chart showing an operation flow of a conventional substrate transfer device. A plan view showing the overall configuration of a second embodiment of the present invention is shown in Fig. 11 as a plan view of a classifier according to the present invention. [Fig. 12] A side view of a classifier according to the present invention. An explanatory diagram of a piping for connecting suction according to the present invention. Fig. 14 is a plan view of an alignment mechanism according to the present invention. Fig. 15 is a side view of a scale mechanism according to the present invention. Figure 16] is a map of the ship of the financial board. The piping configuration diagram of the connection adsorption member is invented. , talk about the side view of the carrier according to the invention. [Picture of the figure The illustration of the three-dimensional target-shaped evil alignment pin of the moon brother. ', and the explanatory drawings of the alignment pins of the first and second embodiments of the invention. [Description of main component symbols] The county plate (glass substrate) (substrate) The substrate autumn position (substrate placement position)
S 18 201145432 * S1 〜S5、SP1 〜SP5.·.步驟 1.. .基板運送裝置 2A...浮升運送部 2B、2C...滾子運送部 3.. .浮升平台 3a...氣體喷出口 3b...氣體吸氣口 5…導軌 6.. .基板載具 6a...滑動構件 6b...吸附構件 6c...缸筒驅動部 6d...吸附構件昇降機構 7…對準裝置 7a...手掌構件(對準機構） 7b、7c...缸筒驅動部 8.. .支持銷機構(基板支持機構) 8a...支持鎖 8b...缸筒驅動部(昇降驅動部） 9.. .喷嘴 9a...流出口 10.. .導軌 11.. .喷嘴臂 12.. .旋轉輥 13.. .清洗槽 14.. .待命部 16.. .滾子軸 17.. .運送滾子 25.. .滚子驅動部 50.. .控制部 19 201145432 61.. .基板運送裝置 62.. .滚子驅動部 63.. .滚子轴 64.. .運送滚子 65.. .分類器 66.. .吸附墊 67.. .吸附墊昇降機構 68.. .吸附墊移動機構 69、70、7卜72...對準銷 73.. .對準銷移動機構 74…彈簧 75…載持支架 76.. .載持支架滑動構件 77.. .對準銷昇降機構 78.. .載持支架昇降機構 80.. .對準銷 81.. .段差部 85.. .配管 86.. .抽吸泵 87.. .三通閥 88.. .二通閥 89.. .配管 90.. .加壓氣體供給源 95.. .抽吸泵 96.. .減壓感測器 97.. .二通閥 101.. .抽吸泉 102.. .減壓感測器 103.. .二通閥 200.. .基板運送裝置 201145432 201.··浮升平台（平台） 201a...氣體喷射口 201b...吸氣口 202··.導軌（執道） 203.. .基板載具 203a...吸附墊 204.. .對準裝置 204a...手掌部 205.. .光阻喷嘴S 18 201145432 * S1 to S5, SP1 to SP5. Step 1. 1. Substrate transport device 2A...Floating transport unit 2B, 2C...Roller transport unit 3.....Floating platform 3a.. Gas ejection port 3b...gas suction port 5...rail 6: substrate carrier 6a...sliding member 6b...adsorption member 6c...cylinder driving portion 6d...adsorption member lifting mechanism 7...alignment device 7a...palm member (alignment mechanism) 7b, 7c...cylinder drive unit 8.. support pin mechanism (substrate support mechanism) 8a... support lock 8b...cylinder Drive unit (elevation drive unit) 9.. Nozzle 9a... Outflow port 10... Guide rail 11... Nozzle arm 12.. Rotating roller 13.. Cleaning tank 14.. Standby part 16.. Roller shaft 17.. Transport roller 25. Roller drive unit 50.. Control unit 19 201145432 61.. Substrate transport unit 62.. Roller drive unit 63.. Roller shaft 64 .. . transport roller 65.. . sorter 66.. adsorption pad 67.. adsorption pad lifting mechanism 68.. adsorption pad moving mechanism 69, 70, 7 72 ... alignment pin 73.. Alignment pin moving mechanism 74...spring 75...carrier bracket 76..bearing bracket sliding member 77..aligning pin lifting mechanism 78..bearing bracket lifting Structure 80.. Alignment pin 81.. Step section 85... Piping 86.. . Suction pump 87.. . 3-way valve 88.. 2-way valve 89.. . piping 90.. Add Pressure gas supply source 95.. suction pump 96.. decompression sensor 97.. two-way valve 101.. suction spring 102.. decompression sensor 103.. two-way valve 200.. . Substrate transport device 201145432 201.··Floating platform (platform) 201a... gas injection port 201b... intake port 202··. guide rail (obsessed) 203.. substrate carrier 203a. ..Adsorption pad 204.. Alignment device 204a... Palm portion 205.. . Photoresist nozzle