CN106409738A - Substrate transferring device and substrate transferring method - Google Patents

Substrate transferring device and substrate transferring method Download PDF

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Publication number
CN106409738A
CN106409738A CN201610587450.4A CN201610587450A CN106409738A CN 106409738 A CN106409738 A CN 106409738A CN 201610587450 A CN201610587450 A CN 201610587450A CN 106409738 A CN106409738 A CN 106409738A
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CN
China
Prior art keywords
substrate
described substrate
sidepiece
grasping part
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610587450.4A
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Chinese (zh)
Inventor
具世薰
李正洙
吴昌石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
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Semes Co Ltd
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Publication of CN106409738A publication Critical patent/CN106409738A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a substrate transferring device and a substrate transferring method. The substrate transferring device comprises a substrate floating work bench, guide rails and substrate holding parts. The substrate floating work bench allows a substrate to float by spraying gas. The guide rails are configured to be on two side parts of the substrate floating work bench. The substrate holding components hold the firsts side part and the second side part of the substrate and move along the guide rails. Each substrate holding component comprises multiple substrate holding parts for dividing the first side part and the second side part into more than two parts for holding. The substrate holding parts can hold the parts of the first side part and the second side part of the substrate at a preset time interval. According to the invention, the substrate is prevented from being bent during floating and transferring.

Description

Base plate transfer device and base plate transfer method
Technical field
The present invention relates to substrate floating is moved by base plate transfer device and base plate transfer method, more particularly, to one kind The base plate transfer device sending and the base plate transfer method using this base plate transfer device.
Background technology
Generally, FPD (Flat Panel Display:FPD) device is by the relatively large substrate of area Make.During manufacturing the operation of this panel display apparatus, described substrate is between the manufacturing equipments such as cavity Frequently transfer.Especially, manufacture described panel display apparatus operation in described substrate on be coated with During the painting process of photoresist agent solution, described substrate is transferred with the state floating described substrate.
The device transferring described substrate with the state floating described substrate generally includes and floats the floating of described substrate Play workbench, the configuration guide rail in the both sides of described workbench, the both sides of the described substrate of holding And the substrate grasping portion along described guide rail movement etc..
According to existing base plate transfer device, substrate grasping portion integrally holds when transferring described substrate simultaneously The both sides of described substrate.For example, have during described base plate transfer can be whole in described substrate grasping portion Body covers the length of the both sides of described substrate, holds the both sides of described substrate respectively simultaneously.
But in the case that described substrate grasping portion integrally holds the both sides of described substrate simultaneously, described substrate Handle part causes described substrate integrally bending.Especially, to painting photoresist solution on described substrate Painting process during, in the case that described substrate grasping portion causes described substrate integrally bending, described The top of substrate is possible to be collided with the nozzle spraying described photoresist agent solution and leads to described substrate Impaired.And, because described photoresist agent solution cannot be uniformly applied on described substrate, therefore Described display device may be caused bad.
Content of the invention
Technical problem
It is an object of the present invention to provide a kind of include being prevented from described substrate in substrate floating transfer The base plate transfer device of the substrate grasping part that period bends.
Another object of the present invention is to providing one kind to be prevented from described substrate using described base plate transfer Device transfers the base plate transfer method bending during described substrate.
Technical scheme
For reaching above-mentioned purpose, base plate transfer device according to embodiments of the present invention may include:Substrate floating Workbench, it floats described substrate to gas injection on the bottom surface of substrate;Guide rail, its configuration is in described base The both sides of plate workbench;Substrate grasping part, it holds first sidepiece and second of described substrate Sidepiece and moving along described guide rail, and described substrate grasping part has the first sidepiece of described substrate And second sidepiece be divided into two or more part hold multiple substrate grasping parts;Vacuum provides part, its There is provided vacuum to described substrate grasping part;And, control unit, it makes the base of described substrate grasping part Plate grip portion holds the first sidepiece of described substrate and the part of the second sidepiece at predetermined intervals.
According to embodiment, described substrate grasping part can be in the way of the bottom surface of substrate described in vacuum suction Hold described substrate.
According to embodiment, the substrate grasping of described substrate grasping part partly can be relative to each other, identical The substrate grasping of number partly can be arranged respectively at the first sidepiece of adjacent described substrate and the position of the second sidepiece Put.
According to embodiment, the substrate grasping part of described substrate grasping part is along the transfer direction of described substrate Hold the part of the first sidepiece of described substrate, the substrate grasping part edge of described substrate grasping part successively The transfer direction of described substrate holds the part of the second sidepiece of described substrate successively.
For reaching another object of the present invention, according to using including floating the substrate of substrate by gas injection Workbench, the guide rail of both sides being configured at described substrate floating workbench and the described substrate of holding First sidepiece and the second sidepiece and along described guide rail movement substrate grasping part base plate transfer device shifting Delivery method, described substrate grasping part has can be by the first sidepiece of described substrate and the second sidepiece difference It is divided into multiple substrate grasping parts that two or more part holds, the plurality of substrate grasping partly can be with Predetermined time interval holds the first sidepiece of described substrate and the part of the second sidepiece.
According to embodiment, according to the first sidepiece and the second sidepiece that hold described substrate with predetermined time interval Part process, hold the part of the first sidepiece of described substrate successively to the transfer direction of described substrate Afterwards, the step holding the part of the second sidepiece of described substrate to the transfer direction of described substrate successively.
Technique effect
According to embodiments of the invention, substrate grasping part can have can be by the first sidepiece of substrate and Two sidepieces are divided into multiple substrate grasping parts that two or more part holds, and described substrate grasping part can First sidepiece of described substrate and the part of the second sidepiece are held with predetermined time interval.Therefore, it is possible to prevent Described substrate bends during described substrate floating is transferred.Using the device and method shown in embodiment In the case of manufacturing display device, it is possible to increase manufacture the stability of the operation of described display device, and The reliability of described display device can be improved.
Brief description
Fig. 1 is the plan of brief display base plate transfer device according to embodiments of the present invention.
Specific embodiment
Base plate transfer device according to embodiments of the present invention and base plate transfer method are below described.The present invention can Carry out various deformation, can have variform, below embodiment is specifically described.But its purpose is simultaneously Non- limit the invention to specifically disclose form, it should be understood that be including the thought belonging to the present invention and Being had altered of technical scope, equivalent and substitute.In terms of each accompanying drawing is described, to being similarly comprised Key element adds similar reference.First, second grade term can be used for multiple inscapes are described, but Above-mentioned inscape is not limited by described term.It is that distinguishing a composition wants using the purpose of described term Element and other inscapes.Term used herein is only intended to specific embodiment is described, purpose is simultaneously Non- limit the invention.If no separately defining in contents, the form of expression of odd number it should be understood that For also including the form of expression of plural number.The term such as the term " inclusion " in the application or " having " is used for Illustrate to exist feature described in specification, numeral, step, work, inscape, component or its group Close, and simultaneously non-predetermined excludes other features one or more, numeral, step, action, composition The presence of key element, component or a combination thereof or additional possibility.
If no separately defining, all including technical term or scientific terminology used in this specification Term all represents the general understanding identical implication with general technical staff of the technical field of the invention. The term that the dictionary definition being usually used is crossed should be interpreted that contain consistent with the context of correlation technique Justice, undefined in the application on the premise of shall not be construed as ideal or the implication of excessive formality.
Fig. 1 is the pie graph of brief display base plate transfer device according to embodiments of the present invention.
With reference to Fig. 1, transfer be can be used for for FPD dress according to the base plate transfer device 100 of embodiment The relatively large substrate 11 of the area put.Described base plate transfer device 100 can manufacture described flat board to execution In the cavity (not shown) of the predetermined operation in the operation of display device and float described base from described cavity Plate 11 is transferred.For example, executing the coating to painting photoresist solution on described substrate 11 In the case of operation, described base plate transfer device 100 can float the described substrate 11 of transfer.
According to embodiment, described base plate transfer device 100 may include substrate floating workbench 13, guide rail 1 5th, substrate grasping part 17, vacuum provide part 19, control unit 21 etc..
Described substrate floating workbench 13 can float described substrate 11 by gas injection.Described substrate floats Play workbench 13 and may connect to gas supply part (not shown).Described substrate floating workbench 13 can wrap Include multiple spray-holes 14 that described gas is sprayed on described substrate 11.According to embodiment, described substrate 1 1 can be loaded on described substrate floating workbench 13, and described substrate floating workbench 13 can pass through described Spray-hole 14 sprays described gas on the bottom surface of described substrate 11.Therefore, described substrate 11 can be from Described substrate floating workbench 13 floats.For example, described gas may include the inert gases such as nitrogen, argon gas .
According to embodiment, described base plate transfer device 100 is used for executing the apparatus for coating of described painting process In the case of, described substrate floating workbench 13 may include three regions.For example, described substrate floating work Station 13 may include and loads the loading area of described substrate 11, is coated with photoresist on described substrate 11 The dispensing area of agent solution, the unloading area of the described substrate 11 of unloading.In this case, described substrate floats Play the described loading area of workbench 13 and described unloading area can have for the bottom to described substrate 11 The described spray-hole 14 of described gas is sprayed on face.And, the shifting for substrate 11 described in precise control Send, the described dispensing area of described substrate floating workbench 13 can have and can suck from described spray-hole 1 The structure of the described gas on 4 bottom surfaces being ejected into described substrate 11.For example, described substrate floating work The described dispensing area of platform 13 can have can suck from described spray-hole 14 injection described gas many Individual inlet hole.Therefore, by the spray-hole 14 of described loading area and described unloading area to described substrate The described inlet hole described gas of suction passing through described dispensing area while described gas is sprayed on 11 bottom surface Body, being capable of the transfer on described substrate floating workbench 13 top for the substrate 11 described in precise control.
Described guide rail 15 can be arranged respectively at the both sides of described substrate floating workbench 13.Described guide rail 15 can essentially be relative to each other.According to embodiment, described substrate 11 is worked by described substrate floating After platform 13 floats, (for example, described substrate 11 can be directed to the predetermined operation of execution along described guide rail 11 Described painting process) described cavity in.
Described substrate grasping part 17 can be mobile along described guide rail 15.For example, described substrate grasping portion Part 17 can hold the both sides of described substrate 11.In described base plate transfer device 100, described substrate floats Rise after workbench 13 floats described substrate 11, described substrate grasping part 17 is holding described substrate 11 In the state of along described guide rail 15 mobile such that it is able to described substrate 11 is transplanted on target location, example As being transplanted on described cavity.
According to embodiment, described substrate grasping part 17 can have can be respectively by described substrate 11 The structure that two side portions hold for two or more part.For example, described substrate grasping part 17 can be by institute The first sidepiece stating substrate 11 is divided into two or more part to hold, and can be by the of described substrate 11 Two sidepieces are divided into two or more part to hold.Herein, the first sidepiece of described substrate 11 can essentially be with Second sidepiece of described substrate 11 is relatively.
According to embodiment, described substrate grasping part 17 may include the first sidepiece of described substrate 11 and Second sidepiece is divided into multiple substrate grasping parts that some holds.For example, adjacent described substrate 11 Second sidepiece of the number of described substrate grasping part of the first sidepiece and adjacent described substrate 11 described The number of substrate grasping part can essentially be identical.But can according to the shape of described substrate 11, size, Constitute material etc. increase or decrease the first sidepiece with described substrate 11 and/or the second sidepiece adjacent described in The number of the substrate grasping part of substrate grasping part 17.And, the first side of adjacent described substrate 11 The described substrate handle of the number of described substrate grasping part in portion and the second sidepiece of adjacent described substrate 11 The number holding part can be with inequality.
According to embodiment, the described substrate grasping part 17 of described base plate transfer device 100 as shown in figure 1, May include four substrate grasping parts 17a, 17b of the first sidepiece of adjacent described substrate 11,17c, 17 Four substrate grasping parts 17e, 17f, 17g, 17h of second sidepiece of d and adjacent described substrate 11. Therefore, it can substrate grasping part 17a, 17b by described substrate grasping part 17,17c, 17d First sidepiece of described substrate 11 is divided into four parts to hold, described substrate grasping part 1 can be passed through Second sidepiece of described substrate 11 is divided into four by 7 substrate grasping part 17e, 17f, 17g, 17h Part holds.In this case, the described substrate grasping part 1 of the first sidepiece of adjacent described substrate 11 7 substrate grasping part 17a, 17b, 17c, 17d can respectively with adjacent described substrate 11 the second side Substrate grasping part 17e, 17f of described substrate grasping part 17 in portion, 17g, 17h are relatively.Described Substrate grasping part 17a, 17b of substrate grasping part 17,17c, 17d, 17e, 17f, 17g, Interval between 17h can essentially be identical.But can also according to the shape of described substrate 11, size, Constitute material etc. change described substrate grasping part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 1 Interval between 7h.And, described substrate grasping part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h can need with various shapes according to the operation of display device.
Referring again to Fig. 1, it is described that described vacuum provides part 19 to hold in described substrate grasping part 17 During substrate 11 can respectively to substrate grasping part 17a, 17b of described substrate grasping part 17,17c, 1 7d, 17e, 17f, 17g, 17h provide vacuum, so that described substrate grasping part 17 can be by true Suction is attached to hold described substrate 11.For example, substrate grasping part 17a of described substrate grasping part 17, 17b, 17c, 17d, 17e, 17f, 17g, 17h provide part 19 to obtain vacuum from described vacuum respectively Afterwards, each described substrate grasping part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h with described Between the bottom surface of substrate 11 formed vacuum, described substrate grasping part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h can stably hold described substrate 11.
According to the base plate transfer device 100 of embodiment, part 19 can be provided to described base from described vacuum Plate holds provides described vacuum between part 17 and the bottom surface of described substrate 11, and described substrate 11 passes through true Suction is attached to be adsorbed by described substrate grasping part 17, the plurality of substrate grasping part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h can hold the first sidepiece and second sidepiece of described substrate 11 respectively Some.
According to embodiment, in order to respectively to described substrate grasping part 17 substrate grasping part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h provide vacuum, and multiple vacuum provide part 19 can divide Be not connected to substrate grasping part 17a, 17b of described substrate grasping part 17,17c, 17d, 17e, 17f、17g、17h.As shown in figure 1, the position of the first sidepiece of adjacent described substrate 11 configures four Described substrate grasping part 17a, 17b, 17c, 17d, the position of the second sidepiece of adjacent described substrate 11 Put four described substrate grasping parts 17e, 17f of configuration, in the case of 17g, 17h, adjacent described substrate Four described substrate grasping parts 17a, 17b of 11 the first sidepiece, 17c, 17d can connect four respectively Individual vacuum provides part 19.And, four described substrate handles of the second sidepiece of adjacent described substrate 11 Hold part 17e, 17f, 17g, 17h can connect four vacuum offer parts 19 respectively.
Described control unit 21 can control described vacuum to provide part 19 to make described substrate grasping part 17 Substrate grasping part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h can be respectively with predetermined Time interval hold the first sidepiece of described substrate 11 and the second sidepiece.For example, described control unit 21 Can control described vacuum provide part 19 make the plurality of substrate grasping part 17a, 17b, 17c, During the part of the first sidepiece of 17d, 17e, 17f, 17g, 17h described substrate 11 of holding and the second sidepiece, Can hold successively at predetermined intervals.
According to embodiment, described control unit 21 can control described substrate grasping part 17 to described substrate 11 holding enables described substrate grasping part 17a, 17b, 17e, 17d along described substrate 11 Transfer direction holds the part of the first sidepiece of described substrate 11 successively so that described substrate grasping part 1 7e, 17f, 17g, 17h can hold the second of described substrate 11 successively along the transfer direction of described substrate The part of sidepiece.For example as shown in figure 1, described control unit 21 can control so that according to reference 1 Shown in substrate grasping part shown in 7a, reference 17b shown in substrate grasping part, reference 17c Substrate handle shown in substrate grasping part, reference 17e shown in substrate grasping part, reference 17d Hold part, substrate grasping part shown in substrate grasping part, reference 17g shown in reference 17f And the order of substrate grasping part shown in reference 17h hold successively described substrate 11 the first sidepiece and The part of the second sidepiece.
Although Fig. 1 is according to substrate shown in substrate grasping part shown in reference 17a, reference 17b Substrate grasping portion shown in substrate grasping part, reference 17d shown in grip portion, reference 17c Point, substrate grasping part shown in substrate grasping part, reference 17f shown in reference 17e, attached Icon remembers that the order of substrate grasping part and substrate grasping part shown in reference 17h shown in 17g holds First sidepiece of described substrate 11 and the part of the second sidepiece, but the substrate of described substrate grasping part 17 Grip portion 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h hold the of described substrate 11 The order of the part of one sidepiece and the second sidepiece is not limited.Substrate grasping part 17a, 17b, 17c, The part of the first sidepiece of 17d, 17e, 17f, 17g, 17h described substrate 11 of holding and the second sidepiece Order can change as needed.
As described above, according to the base plate transfer device 100 of embodiment, can having and can make described substrate Holding part 17 is divided into two or more part to hold the first sidepiece of described substrate 11 and the second sidepiece Multiple substrate grasping parts 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h, described substrate handle Hold part 17a, 17b, 17c, 17d, 17e, 17f, 17g, 17h can at predetermined intervals Hold the first sidepiece of described substrate 11 and the part of the second sidepiece.Therefore, it is possible to prevent described substrate grasping Part 17 in order to float transfer described substrate 11 and hold described substrate 11 during described substrate 11 occur curved Bent.
Method according to transferring described substrate 11 using aforesaid substrate transfer device 100, described substrate floating Workbench 13 can float described substrate 11, and described substrate grasping part 17 has can be by described substrate 11 the first sidepiece and the second sidepiece are divided into the structure that two or more part holds successively, therefore, it is possible to anti- Only float described substrate 11 while described substrate 11 bending and be transplanted on predetermined position.For example, it is possible to Described substrate grasping part 17a, 17b, 17c, 17d along described substrate 11 transfer direction successively Hold described substrate 11 the first sidepiece partly after, described substrate grasping part 17e, 17f, 17g, 17 H along described substrate 11 transfer direction hold successively described substrate 11 the second sidepiece part.Therefore, Can effectively prevent from described plate holding part 17 from holding described substrate 11 during described substrate 11 to bend.
According to embodiments of the invention, described substrate can be floated while preventing substrate from bending and move Deliver to target location.For example, aforesaid substrate transfer device and base plate transfer method are adapted to described base In the case of the painting process of painting photoresist solution on plate, described substrate grasping part holds described Prevent described substrate from bending during substrate such that it is able to prevent top and the described light of supply of described substrate The nozzle causing Resist Solution collides, it is possible to increase be applied to the described photoresist on described substrate The thickness uniformity of agent solution.Therefore, the base plate transfer device according to embodiment and base plate transfer method energy Enough improve manufacturing process's stability of the display device such as panel display apparatus, that improves described display device can By property.
Above embodiments of the invention are illustrated, but those of ordinary skill in the art it is generally understood that In the range of without departing from the scope of the present invention and thought, multiple modifications and changes are carried out to the present invention.

Claims (6)

1. a kind of base plate transfer device is it is characterised in that include:
Substrate floating workbench, it floats described substrate to gas injection on the bottom surface of substrate;
Guide rail, its configuration is in the both sides of described substrate floating workbench;
Substrate grasping part, it holds the first sidepiece of described substrate and the second sidepiece and moves along described guide rail Dynamic, and described substrate grasping part has and for the first sidepiece of described substrate and the second sidepiece to be divided into two Multiple substrate grasping parts that above section holds;
Vacuum provides part, and it provides vacuum to described substrate grasping part;And
Control unit, it makes the substrate grasping part of described substrate grasping part hold at predetermined intervals First sidepiece of described substrate and the part of the second sidepiece.
2. base plate transfer device according to claim 1 it is characterised in that:
Described substrate grasping part holds described substrate in the way of the bottom surface of substrate described in vacuum suction.
3. base plate transfer device according to claim 1 it is characterised in that:
The substrate grasping of described substrate grasping part is partly relative to each other, the substrate grasping part of same number It is arranged respectively at the first sidepiece of adjacent described substrate and the position of the second sidepiece.
4. base plate transfer device according to claim 1 it is characterised in that:
The substrate grasping part of described substrate grasping part along described substrate transfer direction hold successively described The part of the first sidepiece of substrate, the substrate grasping part of described substrate grasping part is along the shifting of described substrate Direction is sent to hold the part of the second sidepiece of described substrate successively.
5. a kind of base plate transfer method, it is using including floating the substrate floating work of substrate by gas injection Station, the guide rail of both sides being configured at described substrate floating workbench and the first side holding described substrate Portion and the base plate transfer device of the second sidepiece and the substrate grasping part along described guide rail movement, its feature exists In, including:
Described substrate grasping part has and can be respectively divided into the first sidepiece of described substrate and the second sidepiece Multiple substrate grasping parts that two or more part holds, between described substrate grasping part is with the predetermined time Every the step holding the first sidepiece of described substrate and the part of the second sidepiece.
6. base plate transfer method according to claim 5 is it is characterised in that with predetermined time interval Hold the first sidepiece of described substrate and the step of the part of the second sidepiece includes:
Hold successively to the transfer direction of described substrate described substrate the first sidepiece partly after, to described The step that the transfer direction of substrate holds the part of the second sidepiece of described substrate successively.
CN201610587450.4A 2015-07-28 2016-07-22 Substrate transferring device and substrate transferring method Pending CN106409738A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0106256 2015-07-28
KR20150106256 2015-07-28

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101107186A (en) * 2005-01-24 2008-01-16 东京毅力科创株式会社 Stage apparatus and application processing apparatus
CN102157424A (en) * 2010-01-21 2011-08-17 东京毅力科创株式会社 Substrate conveying apparatus and substrate conveying method
JP2014123679A (en) * 2012-12-21 2014-07-03 Kawasaki Heavy Ind Ltd Substrate angle alignment device, substrate angle alignment method, and substrate transfer method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101107186A (en) * 2005-01-24 2008-01-16 东京毅力科创株式会社 Stage apparatus and application processing apparatus
CN102157424A (en) * 2010-01-21 2011-08-17 东京毅力科创株式会社 Substrate conveying apparatus and substrate conveying method
JP2014123679A (en) * 2012-12-21 2014-07-03 Kawasaki Heavy Ind Ltd Substrate angle alignment device, substrate angle alignment method, and substrate transfer method

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Application publication date: 20170215