TW201039928A - Substrate coating apparatus and substrate coating method - Google Patents

Abstract

The present invention provides a suspension transporting type substrate coating treatment apparatus, which can start coating treatment from the substrate end part and prevent the front end of the nozzle from drying. The solution means is to divide the coating platform 4 for the coating treatment of substrate W into front coating platform 40 and rear coating platform 41. Each coating platform has small holes, which are used for the ejection and discharge of air for the formation of air flow to suspend the substrate W. The front end of the substrate W is located and stopped at the boundary line of the front coating platform 40 and rear coating platform 41 so that the slit nozzle 55 at the top of the rear coating platform 41 is allowed to descend and move towards the coating start position of the substrate end part. At this point, the air ejection and suction from the rear coating platform 41 is temporarily suspended.

Description

[Technical Field] The present invention relates to, for example, a prismatic glass substrate for a liquid crystal, a semiconductor substrate, a flexible substrate for a thin film liquid crystal, a substrate for a photomask, a substrate for a color filter, and the like. A substrate coating device for coating a surface of a substrate for a precision electronic device or a surface of various substrates similar thereto. [Prior Art] In the manufacturing steps of various substrates, a substrate coating device having a coating liquid applied to the surface of the substrate was used. As the substrate application device, there is known a slit coater that relatively moves the slit nozzle relative to the substrate while ejecting the processing liquid from the slit nozzle to coat the entire substrate. liquid. In particular, when a treatment liquid is applied to a large substrate, it is difficult to apply a spin coating method in which a treatment liquid is applied while rotating the substrate. Therefore, such a slit coater is mainly used. In the substrate coating apparatus of such a straight type (linear coating method), it is more preferable that the coating process is performed by adsorbing and holding the substrate from the viewpoint of shortening the takt time. The substrate is suspended and transported to carry out a coating process. Further, when the resist coating treatment is performed by the linear coating method, damage of the nozzle or poor coating due to contact between the slit nozzle and foreign matter on the surface of the substrate becomes a problem, and therefore some protective mechanism is required for the nozzle. Patent Document 1 discloses a substrate coating apparatus which is provided with a protective mechanism in front of a traveling direction of a nozzle when a substrate is adsorbed and held on an adsorption stage, and is scanned from an end portion of the substrate. Substrate 146775.doc 201039928 When the surface is 'can detect foreign matter in front of the substrate, protect the front end of the nozzle. [Prior Art] [Patent Document 1] [Patent Document 1] JP-A-2007-105623 SUMMARY OF INVENTION [Problems to be Solved by the Invention] However, the substrate is subjected to a liquid-repellent solution or the like by a suspension transfer method. In the case of the treatment liquid coating treatment, when the nozzle protection mechanism is to be used to scan the surface of the substrate from the end portion of the substrate, the suspension platform must be lowered in the state where the substrate is not present under the nozzle. Therefore, the treatment liquid at the tip end of the nozzle is dried by the flow of the air ejected from the suspension platform and discharged, so that there is a coating failure when the substrate is coated. Further, in the state where the end portion of the substrate is present immediately below the nozzle, the above problem does not occur when the nozzle is lowered. However, the flying height of the end portion of the substrate to be coated cannot be measured. Further, as shown in Fig. 28, it is not possible from the end of the substrate. P acts to detect foreign matter on the surface of the substrate between the protection mechanisms. The present invention has been made in view of the above-mentioned problems, and the first object of the present invention is to prevent coating failure due to drying of the treatment liquid at the tip end of the nozzle when the W-floating method performs a coating treatment on the substrate. A second object of the present invention is to prevent foreign matter inspection at the tip end portion of the substrate and to prevent coating failure due to drying of the treatment liquid at the tip end of the nozzle. [Technical means for solving the problem] The invention relates to the invention of the first aspect of the invention, and the substrate coating device 146775.doc 201039928 is characterized in that it is used to apply a treatment liquid to a substrate; a suspension platform, which forms a pressure gas layer on the platform surface by a gas flow through a gas hole provided on the platform surface, and suspends the substrate by the pressure gas layer; the treatment liquid supply mechanism is self-relative with respect to a nozzle for relatively moving the substrate, ejecting a specific processing liquid onto the substrate, thereby applying the processing liquid to the substrate; and a gas flow control mechanism between the forming state and the stopping state of the gas stream Performing the switching 'and the period of the discharge of the processing liquid in parallel with the relative movement described above, 'n' during the idling period', in the state where the discharge of the processing liquid from the nozzle is stopped, the nozzle is caused to be from the floating platform Moving relative to the substrate presence region relative to the substrate presence region; the gas flow control mechanism being at least a portion of the idling period The room, temporarily stops the flow of gas is formed for the area immediately below the nozzle of. The invention of claim 2 is the substrate coating apparatus of the first aspect, further comprising: a lifting mechanism for raising and lowering the nozzle above the floating platform; wherein the idling period includes: a period during which the nozzle is lowered from a specific waiting height And moving the nozzle to a horizontal direction relatively close to the substrate in a horizontal direction after the nozzle is in a lowered state; applying the processing liquid on the substrate to the lowering state; and performing the idling The formation of the gas flow is stopped during at least the horizontal movement period of the period. The invention of claim 3 is the substrate coating apparatus of the first aspect or the second aspect, wherein the gas flow forming regions in which the plurality of gas holes are respectively formed are adjacently disposed as another plate or sheet on the floating platform. U6775.doc 201039928, another part; an opening and closing mechanism for a gas flow path is provided corresponding to each of the plurality of gas flow forming regions; and the gas flow control mechanism is configured only for the plurality of gas flow forming regions A region where the substrate is not present directly under the nozzle and a temporary stop of formation of the gas flow using the opening and closing mechanism is performed. The invention of claim 4 is the technical solution j or the technical solution & substrate coating device, wherein after the gas flow is temporarily stopped, the gas flow is restarted using all the gas holes on the suspension platform, and the nozzle is from the above The processing start liquid is discharged from the application start position of the substrate. The invention of claim 5 is a suspension height measuring mechanism for measuring the levitation height of the substrate by using a substrate coating method; and the processing liquid supply mechanism further includes a protective member. When the relative movement is performed in the nozzle, it corresponds to the front side: 'protects the front end of the nozzle; and after the levitation height measuring means detects the levitation height of the application start position of the end portion of the substrate, and lowers the nozzle, The nozzle is smuggled, loaded, and the nozzle is moved relative to the substrate, whereby the protective member is advanced to the end of the substrate than the nozzle. The invention of claim 6 is the substrate coating apparatus of the technical method, the first embodiment or the second aspect, which is determined in advance by the formation of the above-mentioned rolling body flow due to temporary $μ, +. a ^ at 1T. The allowable value of the variation of the degree of the substrate is the duration of the temporary stop state in which the gas flow is formed, which is equal to or less than the allowable value. Further, the invention of the seventh aspect of the invention is the substrate coating device of the technical solution 2, wherein the floating platform is also formed with a plurality of sprays of the gas 146775.doc 201039928. And a plurality of suction holes for sucking the gas; the gas flow is generated during a process in which the pressure gas ejected from the plurality of ejection holes is sucked by the plurality of suction holes; and the gas flow control mechanism is The gas supply path for the plurality of discharge holes and the gas suction path for opening and closing the plurality of suction-suction holes are switched between the formation state and the stop state of the gas flow. The invention of claim 8 is a substrate coating method, which is characterized in that: a coating liquid for applying a treatment liquid sprayed from a specific nozzle to a substrate; the method comprising the following steps: the first step, by passing through the platform a gas flow of a gas hole provided on the surface forms a pressure gas layer on the surface of the platform, and suspends the substrate by the pressure gas layer; and is specific to the surface of the platform surface that is offset from the substrate and is directly below the nozzle a region temporarily stopping the gas flow; lowering the nozzle from the specific waiting height toward the specific region; moving the nozzle relative to the substrate to cause the nozzle to reach the application start position of the substrate, and starting to eject the nozzle from the nozzle The IF solution is re-started; and the formation of the gas stream is resumed for the specific region until the discharge of the treatment liquid is started. [Effects of the Invention] According to the inventions of the first aspect to the eighth aspect, in the state in which the processing liquid is ejected from the nozzle, the nozzle is relatively moved from the position on the floating platform from the substrate existence region to the substrate existence region. During at least a part of the idling period, the formation of a gas flow in a region including at least the region immediately below the nozzle in the region deviating from the substrate existence region is temporarily stopped. Therefore, it is possible to suppress the possibility of coating unevenness on the substrate when the coating process is performed due to the influence of the gas flow for forming the gas pressure layer, and the coating liquid at the tip end of the nozzle is 146775.doc 201039928. . And 'in particular, according to the technical party, the day of the 2nd, ^^^-Μ., the case of Mao Ming, due to the formation of gas flow in the most vulnerable to the gas / melon ringing level, Therefore, the anti-dry operation effect of the treatment liquid is particularly high. Further, in particular, according to the invention of the technical side, the road aa _ soft, the individual control can be performed, and in the gas flow forming region of the plural, the gas/claw is temporarily stopped in the area immediately below the oscillating nozzle. Therefore, when the nozzle is brought close to the substrate, the condition of the gas hole trowel can be changed according to the gas flow forming region, so that an inexpensive board or plate division can be partially utilized.

In addition, the pressure gas layer is opened on all the suspension flats a Q after the substrate reaches the coating start position, so that even if it is coated, it is moved. There is no doubt that the substrate will be deflected. Further, in particular, according to the invention of claim 5, the surface of the substrate can be scanned from the end portion of the substrate by using the protective member at the tip end of the nozzle, so that foreign matter on the entire surface of the substrate can be detected. Further, in particular, according to the invention of claim 6, the influence of the temperature variation of the substrate caused by the formation of the pressure gas layer on the suspension platform can be more quantitatively suppressed, so that the temperature at the substrate side can be suppressed by performing coating. Uneven coating caused by changes. Further, in particular, according to the invention of claim 7, the pressure gas layer is formed by the gas flow and the suction by the gas flow on the suspension platform, so that the pressure balance of the pressure gas layer can be obtained, thereby enabling a more stable The suspension of the substrate 146775.doc 201039928 is performed. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. - In the following description, when indicating the direction and orientation, the three-dimensional XYZ orthogonal coordinates shown in the figure are appropriately used. Here, the χ axis and the γ axis direction indicate the horizontal direction, and the Ζ axis direction indicates the sag direction (the ζ side is the upper side and the _ 侧 side is the lower side). Moreover, for the sake of convenience, the x-axis direction is referred to as the left-right direction 〇 (for the substrate transfer, the +χ side is the downstream side, the -X side is the upstream side), and the 丫-axis direction is the depth direction (+ Υ side, -γ side) ). <1. Outline of substrate processing apparatus> Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention when the nozzle unit 5 and the nozzle cleaning standby unit 9 have been removed. The substrate processing apparatus 1 is configured such that a nozzle that ejects the processing liquid and is formed as a slit of the slit moves relative to the substrate to apply a treatment liquid to the surface of the substrate (slit coater). This device i is used for a process of applying a resist liquid as a processing liquid to a substrate, and the like, as a process of selectively etching an electrode layer formed on the surface of the substrate. A substrate to be coated by a slit coater is typically used to produce a square glass substrate of a screen panel in a liquid crystal display device, but may be a semiconductor substrate, a flexible substrate for a thin film liquid crystal, or a light substrate. Other substrates such as a cover substrate and a color filter substrate. The mechanical configuration of the substrate processing apparatus 1 is roughly divided into a substrate transfer device 2 that receives a rectangular substrate w that is transported in a horizontal posture and is transported in the (+X) direction from the upstream sheet 146775.doc 201039928 70. The coating apparatus 3 for the cloth treatment liquid; and the float level σ 1 1 ^ The substrate 1 after the treatment liquid is applied by the substrate processing apparatus is transferred from the outlet suspension stage 11 to the decompression by the transfer robot 36 In the case of drying single illusion 7, 38, the applied treatment liquid is dried under reduced pressure. Thereafter, the substrate w is transferred to the parenting position 39 which is laminated in the up-and-down direction with the reduced-pressure drying unit 38, and is then transferred to another apparatus for the next step. The substrate transfer device 2 is roughly classified into a roller carrier 3G that transports the substrate W transferred from the upstream unit, an inlet suspension platform 1G that suspends the substrate W by compressed air, and a substrate W from the roller. The conveyor 3G is transferred to the transfer unit 6 of the inlet suspension level 10; and the both ends of the substrate w are held and transported to the downstream substrate transfer chuck 8. Further, the substrate application device 3 is substantially a nozzle unit 5 including a slit nozzle S5 for discharging the processing liquid, a nozzle cleaning waiting unit 9 for cleaning the slit nozzle 55, and a coating process for coating treatment. Cloth platform 4. When viewed through the entire substrate processing apparatus, the substrate transfer section TR is roughly divided into three sections depending on the substrate support method. (1) Contact support section TA: The contact support section TA on the upstream side is a "roller transfer method", which supports the substrate W on the one hand by the roller arrangement in contact with the lower surface of the substrate, on the one hand, by each roll The substrate is rotated to transport the substrate. The substrate support under the "roller transfer method" is one of the "contact support forms" for supporting the substrate W in contact with the surface under the substrate evaluation. The transfer by the upstream unit located on the front side of the substrate processing apparatus 146775.doc •10· 201039928 also becomes the roller transport mode. (2) Suspension support sections TC1 and TC2: Ο 悬浮 The suspension support sections TC1 and TC2 which are provided on the downstream side of the contact support section TA with the support form conversion section TB described later are suspended by the compressed air to support the substrate w. . Generally, the form in which the substrate is suspended and the supporting substrate is in a "suspended support form" is a suspension conveying mode in the present embodiment, which is realized by a pressurized gas (specifically, compressed air) in a suspension support form. On the one hand, the both ends of the substrate are adsorbed and held to move the substrate. The section TC1 of the sections TC1 and TC2* is a coating transport section directly related to the application of the treatment liquid, and the section TC2 is for delivering the substrate to the exit section of the transfer robot 36. ,

(3) Supporting the form conversion interval: TB is set between the above two types of intervals TA, (TC i, TC2). The support form conversion interval TB is used to convert the substrate between the contact support interval TA and the suspension support interval. The range of support methods. From the viewpoint of the substrate transfer method and the support form of the substrate, the 'support form conversion interval 邛 is in the "roller transfer method" of the "contact transfer method" in the contact support section TA, and the suspension support sections TC1, TC2. The section of the transfer method of the substrate is switched between the "suspension transfer method". The wide system shows the relationship between the control unit 7 and the month & control unit mainly controlled by the control unit 7. The control unit 7 is configured to use the electric chest in the brain. The control unit 7 controls the device according to the program of the women's clothing in the electric system, the characteristic data of each part of the device, and the order of the recipe (recipe). (4) The functions of each part of the control object will be described in the relevant parts of 146775.doc 201039928. <2_Composition of each part><•Roller Conveyor 30> The roller conveyor 30 is a contact type conveying device that abuts the uppermost surface of the outer peripheral surface of the plurality of rotating rollers 301 against the lower surface of the substrate buttocks to impart a propulsive force to the substrate W. Moving in the downstream direction, the motor 35 as the drive source, the one rotating shaft 302, and the adjacent rotating shafts 3〇2 are arranged with the timing belt 32 (see FIG. 6), so that they can be identical. The timings give the same rotational speed to each of the rotating shafts 302. Unlike the rollers 601 of the transfer unit 6 to be described later, the plurality of rollers 3〇1 are fixed at two degrees to form a roll in contact with the lower surface of the substrate. Subgroup. In the case of 30, a deceleration sensor (not shown) is provided at one of both end portions parallel to the X-axis direction, and a stop is provided on the downstream side of the transport direction of the substrate W from the installation position of the deceleration sensor. The sensor (not shown). The front end WE (refer to FIG. 12) of the substrate W that is transported is detected by the deceleration sense, whereby the rotation speed of the roller 301 is decelerated, and the sensor is detected by the stop sensor. The front end WE stops the rotation of the roller 3〇1. Thus, the impact applied to the substrate w can be minimized by reducing the speed of the substrate transported beforehand, and then the substrate w can be stopped. * Transfer unit 6> A transfer order is provided on the downstream side of the roller conveyor 30. The transfer unit 6 is disposed in the space between the roller conveyor 3 () and the inlet suspension platform (7), and includes The suspension pad 64 and the transfer lifting roller conveyor 6〇. The suspension 塾 64 is configured to eject compressed air from the upper surface of the substrate w to the lower surface of the substrate w. 146775.doc 12 201039928 For example, air is ejected to make the substrate float, in a non-contact state. To support the suspension mechanism of the substrate w. The suspension pad 64 is composed of A rectangular shape is provided which is disposed on the upper surface by a plurality of discharge holes 64a (see FIG. 12) for ejecting air, and the upper surface thereof is a gas nozzle surface. The air is ejected from the ejection holes. The 64 series is provided with a plurality of predetermined intervals along the γ-axis direction so that the longitudinal direction thereof is parallel to the substrate transfer direction. The plurality of suspension 塾 64 collective systems function as a substrate floating platform, and each suspension pad 64 is a unit suspension unit of the constituent elements. In the gap between the suspension mats 64 arranged at a predetermined interval, the roller group of the roller 6 including the plurality of rollers 6 of the lifting roller conveyor 60 is transferred. The rotation direction of the uppermost peripheral surface of each roller 601 is parallel to the longitudinal direction of the suspension pad 64, and the rotation shaft 602 penetrates the rotation center of the roller 6〇1. As shown in FIG. 4 and FIG. 5, which will be described later, the suspension pad 64 is present above the rotating shaft 602. The rotating shaft 602 is arranged substantially horizontally and passes through a plurality of rolls in a manner orthogonal to the Q length direction of the floating pad 64. The center of rotation of the child 601. The driving of the roller 601 and the rotating shaft 6〇2 is similar to that of the roller conveyor 3A. The motor 65 as a driving source and the one rotating shaft 6〇2 are further horizontally adjacent to each other. Since the timing belt 62 (see FIG. 6) is placed between the two, the same rotational speed can be given to each of the rotating shafts 6〇2 constituting the transfer lifting roller conveyor 60 at the same timing. Below the rotating shaft 602 of each roller 601, for example, a cylinder-like elevating mechanism 66 (see Fig. 4) is provided, and the elevating mechanism 66 and the rotating shaft 602 of each roller 601 are coupled via a member. Therefore, the transfer lifting roller conveyor 60 is held in a substantially water direction while being engaged with the 146775.doc -13-201039928 of the lifting mechanism 66. The ZZ cross-section of the transfer unit 6 when the Z-axis diagram 4 series transfer lifting roller conveyor 60 ascends ascends 6^z 2 γ surface ^ 2 5 series transfer lifting roller conveyor 6G descending . As shown in Fig. 4, the position of the roller 6〇1 when rising is the position at which the uppermost surface of the outer peripheral surface is in contact with the height of the substrate w by the self-ejection hole (4) and the empty milk. Higher position. X, as shown in Fig. 5, when descending, the uppermost portion of the outer peripheral surface of the roller 601 is lowered to a position lower than the upper surface of the hand pad 64. At the time of ascending, similarly to the roller conveyor 3, the outermost surface of the outer peripheral surface of the rotating roller is attached to the lower surface of the substrate W to impart a propulsive force to the substrate w, and the substrate % is moved in the downstream direction. The transfer lift roller conveyor 6G is rotated in an ascending state, whereby the substrate W is transported from the roller conveyor 3 to the human levitation platform. When the substrate W passes the roller conveyor 3G, the transfer lift roller conveyor 6q is lowered to the upper surface of the rudder pad 64. The support of the substrate w by the & 'transfer unit 6 only becomes the levitation force of the suspension pad 64, and cooperates with the suspension force on the inlet suspension platform 10 to suspend the substrate W, thereby converting to a lower mechanism such as a roller. Contact status. The length of the transfer direction (+χ direction) of the transfer unit 6, that is, the length of the support form change interval TB in the transfer unit 6 is shorter than the length of the substrate w in the transfer direction. In other words, the transfer direction (+χ direction) In the apparatus 1 for processing the substrate w of a specific length, the transport direction (+Χ direction) of the transfer unit 6 is 146775.doc -14· 201039928, so that the total length of the substrate processing line can be shortened to be shorter than the The specific length is long. Ο 〇 - Fig. 6 is a side view of the roller conveyor 3 〇 and the transfer unit 6. As shown in Fig. 6, the roller conveyor 30 is adjacent to the transfer unit 6 but is not connected. In the meantime, the material transporting support frame wood 69 looks like a joint when viewed from the side, but in fact, it is not connected to the top view of the ride. Therefore, the vibration generated by the roller driving of the roller conveyor 30 is not transmitted to the downstream side by the transfer unit 6. As a result, in the processing liquid coating process described later, it is possible to prevent useless vibration. Uneven coating produced. <*Inlet suspension platform 1 〇> An inlet suspension platform 1G is disposed on the downstream side of the transfer unit 6. The inlet w is floated on the σ 10 and distributed over the entire surface of the plate-like deck surface to form a plurality of air ejection orifices. The gas generated by the ejection of the air repeatedly suspends the substrate W, and the substrate w can be brought into a non-contact state with respect to the upper surface of the inlet σ 10 , that is, with respect to the gas ejection surface. At this time, the suspension height of the substrate W is 10 to 500 μm. The above-mentioned substrate suspension principle of the inlet suspension platform 10 is the same as the parallel arrangement of the suspension cassettes 64 of the transfer unit 6. As shown in Fig. 12, on the substrate transfer path of the substrate processing apparatus, relatively Guide rollers 102p to 102s are provided on the outer side of the substrate w in which the transfer direction of the substrate W is parallel (hereinafter referred to as "side position"). (+γ) of the transfer unit 6 The side is provided with a guide ι〇2ρ, and a guide stick 102r is placed on the (-Υ) side, and a 146775.doc -15-201039928 is placed on the (+γ) side of the inlet suspension platform 1 with a guide roller 102q '( -Y) side is provided with light guide i〇2s. When the stage 1 is transported by the substrate w, the guide rollers 丨02p to 丨02s are located at the retracted position (the position separated from the line corresponding to the movement trajectory of the side of the substrate W), but when the substrate is transported, A guide roller cylinder (not shown) mounted on the guide roller 1〇2p to 1〇2s, so that both sides of the substrate W parallel to the transport direction are squeezed from both sides toward the center line of the substrate W parallel to the X-axis The pressure rollers are in contact with each other. The guide rollers 102P to 102s are disposed such that their rotation axes are parallel to the z-axis, whereby when the transfer unit 6 is transferred to the inlet suspension platform 10, the roller conveyor 30 and the transfer lifting roller can be used. The propulsion force given by the rotation of the roller 6〇1 of the sub-conveyor 6 is transmitted only in the conveyance direction, so that the lateral shift of the substrate W can be prevented. A deceleration sensor (not shown) and a stop sensor (not shown) are provided in the same manner as the roller conveyor 30 in the one end portion of the inlet suspension platform 1 which is parallel to the X-axis direction. The conveyance speed of the substrate W is decelerated, and the conveyance of the substrate W can be stopped at a specific stop position on the inlet overhanging platform 10. As shown in FIG. 15, alignment processing pins (7) 氕 丨〇 f 5f for aligning the substrate w stopped by the stop sensor of the inlet floating platform 1 are provided in the transfer unit 6 and the inlet. The suspension platform is surrounded by 1 inch. Specifically, the alignment processing pins 105g to 105j that are in contact with both sides of the substrate w parallel to the X-axis direction are disposed on the (+γ) side at the lateral position of the transfer unit 6 and the inlet suspension stage 1〇. There are 105g, i〇5h, and 1〇5i, l〇5j are arranged on the (_γ) side, and they are connected to both sides of the substrate which are parallel to the axis direction. The alignment processing pin 105e '105f which is in contact with one side of the substrate W at the rear end with respect to the conveying direction is on the boundary of the roller conveyor 3〇 and the transfer unit 6 along the γ axis I46775.doc -16· 201039928 The alignment process (4) 5e and (4) which are arranged to be in contact with one side of the substrate w of the front end with respect to the conveyance direction are provided in a large concave portion which is aligned with the alignment processing pins 10a, 5c, and 10d, and is along the ¥ Provided in the axial direction, the concave portion is formed on the population floating platform 10 on the downstream side of the front side of the substrate at the stop position on the floating platform 1(). The alignment processing pins 105c to 105f that are in contact with the two sides of the front end WE and the rear end of the substrate w in the γ-axis direction are retracted to the roller conveyor so as not to hinder the substrate conveyance when the substrate is normally transferred. 30 is at the boundary with the transfer unit 6 and is formed below the recess on the person D suspension platform 1 (). When this is equal to the advance alignment process, the alignment process pin cylinder (not shown) is extended above the substrate transfer path to a position where it can abut against the substrate w, and the uppermost end of the substrate W is abutted. In part, the position is changed in the direction of the substrate, so that it is in contact with both sides of the substrate W parallel to the x-axis direction. In this manner, the substrate W is positioned at the correct stop position by the operation of the alignment processing pins i〇5c to i〇5f provided at a total of eight places. <•Coating Platform 4> The coating platform 4 is present downstream of the σ suspension platform 1G. On the coating, the resist liquid is applied to the substrate w from the slit nozzle 55 as a processing liquid. The coating platform 4 and the population suspension platform have a plurality of small holes formed in the surface of the platform. However, in the case where the person σ m floats (four), the small hole is only made: the gas is ejected, and on the coating platform 4, a small hole for not only the air for the mouth but also for sucking the air is formed. That is, as shown in FIG. 8, a plurality of small holes (gas holes) existing on the coating platform 4 are classified into compressed air discharge holes 40a, 41a and suction holes 40b, 411, and thus air spray 146775 .doc •17- 201039928 The suction and the suction, so that the air flow of the compressed air ejected from the ejection holes 4〇a, 41a onto the deck surface is diffused in the horizontal direction, adjacent to the ejection holes 40a, 41a The suction holes 4〇b, 41b are sucked, and the pressure balance in the air layer (pressure gas layer) between the suspended substrate w and the upper surface of the coating stage 4 becomes more stable. The coating stage 4 is divided into two parts, and Fig. 8 is a plan view of the coating stage 4 divided into two parts. The substrate w stopped on the inlet floating platform 1 is sucked and held by the substrate transfer chuck 8, and is conveyed in the (+χ) direction and temporarily stopped on the coating stage 4. The position immediately below the front end we of the stopped substrate w is defined as the board boundary st, and the board constituting the coating stage 4 is divided into two parts on the board boundary. The plate in the direction of the plate boundary is used as the pre-coating platform 40, and the plate in the (+χ) direction is used as the post-coating platform 41. Fig. 9 shows the supply flow path and the suction flow path of the air before the application of the platform 4〇 and the coated platform 41. The air supply flow path is set to a specific temperature by the temperature control unit 2〇2 and the air compressed by the compression mechanism 201 such as a compressor reaches a specific temperature, and then branched into a flow path of each of the pre-application stage 40 and the post-application stage 41. . The air is set to a specific temperature by the temperature adjustment unit 220, in order to maintain the air at a constant temperature state irrespective of the outside air temperature. The branched air is purified by the filters 12, 22 in the respective flow paths, and after the pressure is adjusted via the needle valves 13 and 23, the valves 16 are rolled by the flow meters 14, 24 and the pressure gauge 15 25 After 26, the discharge holes 4〇a and 4la in the front stage 4涂布 and the coated stage 41 are ejected. The start of the air supply and the 146775.doc •18· 201039928 #stop is performed by opening and closing the pneumatic valves 16 and 26 by the command signal from the control unit 7 (Fig. 3). The control unit 7 also performs pressure control of the compressed air. Ο

In the suction of air, the blowers 18 and 28 are used as the suction mechanism, and the drive motor (not shown) is subjected to the reverse phase control. In the suction flow path from the suction holes 4〇b and 41b provided on the pre-coating stage and the post-coating stage 41, pressure gauges 17, 27 are provided to measure the pressure in the suction flow path. Further, relief valves 19 and 29 are provided in the suction flow path. Therefore, when the pressure in the suction flow path is higher than the suction pressure obtained by the rotation of the blowers 18, 28, the air in the suction flow path can be discharged to the outside from the relief valves 19, 29, whereby A fine adjustment is performed to maintain the pressure in the suction flow path constant. The compression mechanism 201 as the air supply mechanism is is, and the flow path can be assigned to each platform by branching. On the other hand, the blowers 18 and 28 as the suction mechanisms are provided for each of the suction passages of the respective platforms. Thus, the coating platform 4 is divided into two, and the internal flow path is divided after the coating stage (4) is applied, so that the ejection and suction of the empty rolling can be adjusted for each stage. That is to say, 'the two pressures of the two platforms, the pressure gas layer (air flow), can be controlled separately, not only can the two sides of the compressed air pumping disc simultaneously be carried out, but only the middle side can be temporarily stopped.喷喷喷: For example, when the air ejection and suction of the platform 41 after coating is to be stopped separately, the pneumatic cymbal 26 is completely closed for the ejection, and for the insertion, the driving motor of the second: tributary wind 8 (not shown) connected inverter (not stopped: do = achieve the above separate control. Pneumatic valve 26 or the above-mentioned inverter as a gas flow controller 146775.doc that controls the flow of air to form a pressurized gas layer. 19· 201039928 Functions and functions. &lt;*Nozzle unit 5&gt; Nozzle unit 5, ϋ 洗 等待 等待 ί ί ί 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 Y Y Y Y Y Y Y Y Y Y The core 4 of the Gubeifeng saponin 5 is disposed on the coating and has the bridging structure shown in Fig. 10. The bridging name of the bridge is, for example, a carbon fiber reinforced resin as a nozzle support for the aggregate: the U end is raised and lowered A lifting mechanism is formed. A slit spray is arranged on the nozzle support portion. 55. The slit nozzle (4) is formed from the lower end of the shape: the slit-shaped nozzle outlet 55a ejects the anti-(4) supplied from the treatment liquid supply mechanism (not shown) toward the upper surface of the substrate w. The discharge port is opposed to the coating The cloth table 4 is substantially horizontal and extends in the Y-axis direction. The nozzle lifting mechanism is provided at both ends of the nozzle support portion mainly by a feeding motor 59 and a ball screw 58 as driving sources. In the motor 59, the nozzle support portion is driven to be lifted and lowered along the ball screw 58 of the ship's vertical side of the coating platform 4, and the interval between the discharge port 55a of the slit nozzle 55 and the substrate w is adjusted. In the 垓 lifting mechanism, at both ends (-Y side, +Y side) of the substrate conveying path / at a position where the soil plates are not in contact with each other, the nozzle unit traveling guide 51 is provided along the y-axis direction. Each of the fixed sheets of the nozzle unit 70 linear motor (-Y side, +Y side) is disposed on the side surface of the main body device in the Y-axis direction along the x-axis direction, and each of the moving sheets is disposed on the outer side of the elevating mechanism by the IU. The magnetic interaction between the fixed piece and the moving piece The nozzle unit 5 travels along the nozzle unit 146775.doc •20· 201039928 to guide the is 51 to move. About the two nozzles, the single linear scale 52 is also disposed at both ends of the body device (-Y side, +Y#) J). The nozzle unit linear scale is used to detect the movement position of the nozzle unit 5. Therefore, the control unit 7 can control (4) the position of the nozzle unit linear motor 53 according to the detection result, and control the movement of the nozzle unit axis direction. That is, the scanning of the surface of the substrate by the slit nozzle 55 is controlled. When the coating process is performed, the substrate transfer chuck 8 holds the substrate w in the state of the liquid from the slit nozzle 55 = (+X) The axis direction moves horizontally at a specific speed. The substrate transfer chuck 8 is a device for holding the substrate W with the lower surface in a non-contact state and transporting the substrate in the downstream direction. In the origin state, the substrate transfer chuck 8 is located immediately below the both ends of the substrate W which is stopped across the suspension pad 64 and the inlet floating stage ι. That is, the transfer unit 6 and the inlet suspension stage 1 are located inside the position where the substrate w is sandwiched. As shown in FIG. 1 and the like, the substrate transfer chuck 8 is along the substrate transfer path, and extends not only to the inlet floating platform 丨〇, the coating platform 4 and the both sides P of the outlet floating platform 11 but also to both sides of the transfer unit 6. . Moreover, the transport speed of the substrate w is transferred by the substrate transfer chuck 8, the substrate transport speed of the substrate is transferred by the rollers 301 of the roller conveyor 3, and the transfer speed is increased by the rising state. The substrate transfer speed of the substrate to be transferred by the rotation of each of the rollers 601 of the unit 6 is the same speed, and is unified to a specific reference speed. Here, the "transport speed" referred to herein is defined as the speed of the steady-state speed section other than the acceleration/deceleration period at the start and end of the transport. Therefore, in order to prevent the substrates from colliding with each other during the simultaneous movement of the substrates of 146775.doc - 21 - 201039928 in the apparatus 1, there is no unnecessary space between the substrates. As shown in FIG. 10, the substrate transfer chuck 8 is bilaterally symmetrical (symmetric on the +γ side and the _γ side). The structure includes a chuck portion 88 for adsorbing and holding the substrate, and is used for moving in the X-axis direction. The chuck guide guide 81 is transported; a transport linear motor 8 3 for generating the driving force for the above movement; and a transport chuck linear scale 82 for detecting the position of the substrate W are generated. As shown in Figs. 4 and 5, the chuck portion 88 can be raised and lowered by the action of the chuck lift cylinder 85. Since the chuck portion 88 is raised, the lower surfaces of both end portions of the substrate w on the +γ side and the _¥ side are supported and held by adsorption. Below the chuck portion 88, at the both ends (_γ side, +Υ side) of the substrate transfer path, the transfer chuck is disposed in the X-axis direction at a position further inside than the nozzle unit travel guide 51. The travel guide 81. The fixing pieces of the two transfer chuck linear motors (_γ side, +Υ side) are provided on the innermost side in the z-axis direction of the substrate processing apparatus 1 in the X-axis direction. The respective moving sheets are fixed to the substrate transfer chuck 8. The substrate transfer chuck 8 moves along the transport chuck travel guide 81 under the magnetic interaction generated between the fixed piece and the moving piece. The two transfer chuck linear scales 82 are also provided at both ends (-Υ side, + γ side) of the substrate processing apparatus 1, respectively. Since the transport chuck linear scale 82 detects the moving position of the substrate transfer chuck 8, the control unit 7 can control the substrate position based on the detection result. The nozzle cleaning waiting unit 9 washes the surface of the nozzle contaminated with the resist liquid after the slit nozzle 55 applies the surface treatment of the substrate W, and applies the coating treatment of 146775.doc -22-201039928 2 Further, a device for adjusting the state of the discharge port 55a of the slit nozzle 55 is provided. Therefore, it includes a substantially cylindrical roller 95 that serves as a discharge target of the resist liquid from the slit nozzle 55. As shown in Fig. 10, the nozzle cleaning standby unit 9 is disposed outside the substrate transport path and further inside the nozzle unit 5 in the X-axis direction. In the nozzle cleaning waiting unit 9, the nozzle cleaning standby unit travel guide 91, the nozzle cleaning wait unit linear motor 93, and the nozzle cleaning are also included in the right and left (_γ side, +γ side). Wait for the unit linear scale 92. When viewed in the direction of the Υ axis, the nozzle cleaning unit is the guide for the spray unit. 151 is provided at both ends (_γ side, + Υ side) of the substrate transport path with the transfer chuck travel guide 81 and the /σ X-axis direction. The two nozzles of the nozzle cleaning waiting unit are provided at both ends (-丫 side, the side). The respective fixed pieces of the raw motor 93 are attached to the substrate processing apparatus! The side surface on the inner side in the x-axis direction is provided along the X-axis direction. Further, the respective moving sheets are placed on the nozzle cleaning waiting unit 9. The nozzle cleaning waiting unit 9 moves along the nozzle cleaning waiting unit travel guide 91 under the magnetic interaction generated between the (four) sheets and the moving sheets. The two nozzle cleaning standby unit linear scale % are also provided at both ends (_γ side, + γ side) of the substrate processing apparatus 1, respectively. The nozzle cleaning waits early and the linear scale 92 detects the moving position of the nozzle cleaning waiting unit 9, so that the control unit 7 can control the position of the nozzle unit 9 based on the detection result. The temple is to be washed in the nozzle waiting unit 9, which mainly includes a roller 146775.doc -23-201039928 1 and a roller slot. The cleaning unit 99 wipes the spray outlets of the slits after the coating treatment. When the slit nozzle 55 is brought close to the roll + circumferential surface, a predetermined resist liquid is ejected from the discharge port 55a, and a liquid solution of the anti-money liquid is formed at the exit port 55a. Thus, after the liquid outlet is formed in the mouth outlet, the subsequent coating treatment can be performed with high precision. The discharge port 55a of the slit nozzle 55 is initialized (hereinafter referred to as "pre-mouth") ϋ in the subsequent coating process. The rotation of the roller % is performed by the driving of the roller rotation motor 98. When the roller 95 rotates, the lower end is immersed in the cleaning liquid stored in the roller groove 96, thereby removing the anti-rice liquid adhering to the roller %. . As shown in FIG. 18, a protective member 57 for protecting the tip end of the nozzle is attached to the slit nozzle of the nozzle unit 5, which is used in the case where there is a foreign matter on the substrate surface of the nozzle. Suppressing the tip end of the nozzle from contacting the foreign object may cause the slit nozzle 55 to be damaged. When the slit nozzle 55 scans the substrate, the slit nozzle 55 enters the position of the substrate w at the position closer to the substrate w. The member 57 is such that the plate surface is positively opposed to the substrate surface, and the lower surface of the plate is located below the front end of the slit nozzle 55. When foreign matter is present, the foreign matter may come into contact with the protective member 57 to generate vibration, and The vibration can be transmitted to the slit nozzle 55. On the slit nozzle 55, a vibration sensor 55S for detecting vibration is provided, and the detected electrical signal is input to the control portion 7, thereby understanding the existence of the foreign matter, Therefore, the scanning of the slit nozzles 5 is forcibly stopped. Further, when the substrate w and the slit nozzle 55 are relatively moved in the horizontal direction on the slit nozzle 55, the protective member 57 is further inserted onto the substrate w. 146775 .doc -24- 201039928 At the position of the square area, a levitation height detecting sensor 58 for detecting the levitation height of the substrate w in a non-contact manner is provided. The suspended height detecting sensor 58 can be used to measure the suspended substrate. The distance between W and the upper surface of the coating platform 4 is the distance, and the position at which the slit nozzle 55 is lowered can be adjusted via the control unit 7 with the detected value. As the detecting sensor 5 8, optical sensing can be used. Or ultrasonic sensor, etc. As illustrated in Fig. 8 and Fig. 9, the coating platform 4 is divided into two parts, and the supply flow path and the suction flow path of the air can be individually adjusted on the platforms of the respective turns. Therefore, at the stage in which the front end WE of the substrate W is moved directly above the pre-coating stage 4〇, the ejection of air on the pre-coating stage 4〇 can be maintained, and the substrate W has not yet arrived at this stage. The coated platform 41 in the upper region can stop the ejection and suction of the air on the coated platform 41. Therefore, even if the substrate w is not present directly under the nozzle, even the slit squirt 55 is lowered. To the coating start height, it can also be prevented due to the area (painting The treatment liquid of the discharge port of the slit 〇 nozzle 55 caused by the ejection and suction of air in the area where the cloth is placed in the rear of the cloth is dried. Therefore, the treatment due to the partial drying of the treatment liquid at the tip end of the nozzle can be prevented. The liquid ejection failure is good, so that the coating failure of the substrate W can be prevented. Further, since the substrate w can be scanned in the horizontal direction after the slit nozzle 55 is lowered, the nozzle height detecting sensor 58 that first enters the front end (four) of the substrate can be used. The actual correct levitation height of the front end side of the substrate on which the slit nozzle 55 starts to be applied is detected. Therefore, the nozzle unit 5 can finely adjust the lowering height of the slit nozzle and can make the ejection opening of the slit nozzle 55 The height of 55& corresponds to the front end WE of the substrate at the specific interval between the tip end of the nozzle and the substrate table 146775.doc -25-201039928 when the coating process is actually performed, so that the tip end of the nozzle reaches the coating start position SP? The coating start position sp is slightly closer to the center side of the substrate w than the front end WE of the substrate, but may be substantially the same position as the front end WE of the substrate. Further, since the slit nozzle can be scanned from the end portion of the substrate, the foreign matter can be detected by the protective member 57 and the vibration sensor 55S for the foreign matter on the entire surface of the substrate. A * port suspension platform 11 is disposed downstream of the inlet suspension platform 11. The ejection hole 11a for ejecting gas is formed in the same manner as the inlet suspension platform 1'', and is further disposed to face the entire substrate w. The lifting pin U5 is disposed at a predetermined interval between the square teeth and the gaps of the ejection holes 11a. The lifting pin U5 is vertically oriented by a lifting pin lifting mechanism (not shown) provided below the outlet floating platform u. (Z-axis direction) is driven up and down. When descending, the front end of the lifting pin H5 descends below the upper surface of the outlet floating platform u, and when rising, the front end of the lifting pin 115 rises to the parent to the transfer robot 36 Since the lifting pin 115 is raised, the lower surface of the substrate w is supported and lifted, so that the substrate w is peeled off from the upper surface of the outlet suspension plate. The transfer robot disposed downstream of the outlet floating platform Η 36, a transfer fork is inserted between the lift pins 115, and the substrate W is transferred from the lift pins 115. <3. Operation of the substrate processing apparatus> Next, the flow of the basic operation of the substrate processing apparatus will be described. 11 is a timing chart showing the operation of the main functional units corresponding to the processing state of the substrate w. This timing chart shows the interlocking of the functional units of the respective devices in the case where the substrate w is continuously processed. 146775.doc -26- 201039928 Timing The steps in the figure are divided into five steps (A) to (E). • First stage = (A) to (B): Steps before starting the coating process by stopping the substrate W0 at the application start position sp The step of starting the transfer of the predetermined substrate w from the stop position of the roller conveyor 30 to the transfer unit 6. The second stage = (B) to (〇: 〇 • to the substrate W0) The step of performing the coating treatment; the step of transferring the substrate W to the inlet suspension platform 1〇. • The third stage = (〇 to (D): the coating treatment of the substrate wo ends and stops at the exit suspension platform 】Steps until i; Aligning the substrate W • Stage 4 = (D) to (E): • The step of transporting the substrate W0 to the downstream device; • The step of performing the coating process after the substrate w is aligned and maintained in this state. Fifth stage = (E) to (A): • A step corresponding to moving the substrate to the coating start position ;; The roller conveyor 30 moves the substrate subjected to the next processing to the stop position. The operation of the substrate processing apparatus will be described, and in order to explain the case where the substrate W is carried in and out with respect to the substrate processing apparatus, the 146775.doc -27- 201039928 is repeated for two people to perform the step (A) in FIG. To (8) for easy understanding. In the first pass, the substrate machine with the upper right oblique hatching in Fig. 11 is equivalent to the gaze board W' in the second cycle, and the substrate with the right lower oblique hatching is called the viewing substrate W. &lt;3-1·First time: Stages (A) to (B)&gt; Fig. 12 is a plan view showing a state in which the substrate W is transported by the roller conveyor 3G. In addition to Fig. 12, Fig. 13, Fig. 15, Fig. 17, Fig. 23, and Fig. are diagrams for convenience of illustration, and a substrate which is more advanced than the substrate W to be observed is not depicted. The substrates W processed in the upstream unit in Fig. 11 and Fig. 12 are transferred to the fixed roller conveyor 3 to be transported to the downstream step. By the rotation of the roller conveyor 30, the lower surface of the substrate w and the outer peripheral surface of the roller are in contact with the uppermost portion. Therefore, the substrate W is biased in the (+χ) direction and transported in the downstream direction. At both ends of the roller conveyor 3 which are parallel to the direction of the x-axis. Ρ#, set with deceleration sensor and stop sensor. When the deceleration sensor detects the front end WE of the substrate w to be conveyed, the rotation speed of the roller conveyance (4) is decelerated, and the conveyance speed of the substrate stomach is slowed. Further, when the right = stop sensor detects the front end WE of the substrate w, the rotation of the roller conveyor 将 is stopped, and the conveyance of the substrate W is stopped. Prior to step (B), the roller conveyor 30 resumes rotation. At this time, the transfer lift roller conveyor 60 is raised, and in the step (B), the roller conveyor 3G and the transfer lift roller conveyor 6 () are simultaneously rotationally driven to convey the substrate w. In Fig. ,, the action associated with the nozzle of this stage in the second cycle is related to the application of the treatment liquid to the leading substrate Wa, and thus is independent of the processing of the gaze substrate w by 146775.doc 201039928. &lt;3-2·First time: Second stage (B) to (c)&gt; Fig. 13 is a plan view showing a state in which the substrate W is transported to the population by the consumption unit 6. Fig. 14 is a cross-sectional view showing the XZ of the case where the substrate w is moved to the population floating platform 1G by the transfer unit . As shown in the figure, the air is in the state of the self-transfer unit 6 (four) continuously ejected. During the steps (B) to (c), the transfer lift roller conveyor ❹6G is present in the raised position. The roller conveyor 3 is used to transfer the lift roller conveyor. The raft is rotated at the same rotational speed, and the substrate W is transported to the inlet suspension platform 1 that is disposed downstream of the transfer sheet. In Fig. u, the air of the inlet suspension platform 1 is not shown to be continuously ejected. Therefore, the portion of the substrate that enters the inlet suspension platform 10 travels in a state of being suspended on the inlet suspension platform 10. At this time, the guide roller 1 disposed on the side of the transfer unit 6 and the inlet suspension platform ι〇 〇2ρ~ enters and exits and abuts on both sides of the substrate 1 parallel to the x-axis direction. Both sides of the substrate W parallel to the axial direction are pressed by the guide rollers i〇2p~i〇2k, so the substrate W is traversed Since the position in the direction of the substrate transport path is restricted, it is not shifted in this direction but is transported to the downstream direction. Thus, since the guide rolls 1〇2p to 1〇2s are present, they are transferred to the substrate to be advanced. The force is prevented from being shifted in the downstream direction by the roller conveyor 30 and the transfer lifting roller carrier, so that the substrate w can be prevented from shifting. At this time, the roller conveyor 30 and the transfer unit 6 serve as respective The other device is completely cut open (ie, non-contact at the work station), so the vibration of the roller conveyor is not transmitted to the transfer unit 6. Therefore, it can prevent the use of the vibration due to useless vibration 146775.doc •29 · 201039928 The coating treatment of the first substrate causes adverse effects In the inlet overhanging platform 10, a deceleration sensor and a stop sensor are provided in the same manner as the roller conveyor 3. The transfer unit is lowered by detecting the front end WE of the substrate W being conveyed by the deceleration sensor. The rotation speed of the transfer roller conveyor 60 of 6 is stopped. The drive of the roller conveyor 3 is stopped by the roller conveyor 3 at the rear end of the conveyed substrate W. Further, the driving of the roller conveyor 3 is stopped. The substrate is transported to the inlet floating platform 10 only by the driving of the transfer lifting roller conveyor 6〇 until the stop sensor of the inlet floating platform 10 detects the front end WE of the substrate W being transported. When the stop sensor of the floating platform is detected, the rotation of the transfer lift roller conveyor 6 is stopped. Further, in steps (B) to (D) of the first cycle, the substrate transfer chuck 8 The operation is for transporting the leading substrate, so the omission of this stage will be described. &lt;3-3. The first time: the third stage to (D)&gt; Fig. 15 shows the transfer of the substrate w to the transfer unit 6 A top view of the case where the middle stop is stopped. Fig. 16 shows that the transfer unit 6 is lowered so that the substrate w XZ cross-sectional view of the case of being in a non-contact state. If the rear end of the substrate W to be transported is completely transferred to the transfer unit 6, the substrate W is stopped in a state of traversing the transfer unit 6 and the inlet floating platform. Then, the raised transfer roller conveyor 6〇 is lowered until the uppermost portion of the outer surface of the roller 6〇 is lower than the upper surface of the suspension pad 64. Thus, the entire surface of the substrate W is The suspension pad 64 and the inlet suspension platform 10 are suspended due to the air ejection from the suspension pad 64, so that the suspension pad 64 or the inlet suspension platform 10 is in a non-contact state. 146775.doc • 30· 201039928 The transfer unit 6 is shorter than the length of the substrate w, so The temperature of the substrate w caused by the difference in the degree of temperature drop of the airflow in the substrate W on the transfer unit 6 above the transfer lift roller conveyor 6 () and the floating pad The low level of the property 1 can suppress the unevenness of the coating due to the temperature distribution of the substrate W (temperature unevenness). In the conveyance direction of the substrate w which is stopped in the non-contact state, "forward and backward, left and right, alignment processing for positioning at a specific stop position is provided." Pins 1〇5C to 1〇5j. At the lateral position of the substrate W, the alignment processing pins 105g, 105h disposed on the (+Y) side and the alignment processing pins i〇5i, 105j disposed on the (_γ) side are aligned by the processing pin cylinder ( Not shown), it moves toward the substrate W in the horizontal direction, and is in contact with both sides of the substrate W which are parallel to the X-axis direction. The alignment processing pin 1 05cm 05f for positioning after the month il waits below the transport path of the substrate w, so the alignment processing pin l〇5c~l〇5f is driven by the alignment processing of the lift pin cylinder. The upper surface of the upper surface of the substrate is brought into contact with the substrate, and the uppermost portion of the substrate is brought into contact with both the front end WE and the rear end of the substrate W by changing the position in the direction of the substrate. As a result, the substrate w is positioned at the correct stop position by the action of the alignment processing pins i〇5c to 1〇5j. &lt;3-4. First: 4th stage (D) to (E)&gt; The substrate W is subjected to alignment processing by aligning the processing pins i〇5c to 1〇5j. In the meantime, 'the substrate transporting the disk 8' of the substrate W (the substrate Wa of FIG. 11) which has been subjected to the coating process before the transfer is stopped, and the adsorption of the disk portion 88 is stopped, and the disk portion 88 is lowered to the edge of the substrate. In the lower height state, the substrate W is moved toward the initial position in the (_χ) direction in order to transport the substrate W. Figure! 146775.doc •31- 201039928 During the operation of the substrate transfer chuck 8, the period marked with the (_) mark corresponds to this. In the step (C) of the operation of the substrate transfer chuck 8, the period in which the (+) mark is attached is the period in which the substrate transfer chuck 8 moves in the (-X) direction. The slit nozzle 55 which has been subjected to the coating treatment of the substrate W0 is horizontally moved in the (+χ) direction in order to perform nozzle cleaning and pre-discharging, and is moved upward toward the post-coating stage 41. &lt;3-5·First time: 5th stage (E) to (A)&gt; Fig. 1 shows that the substrate W is stopped at the application start position SP, and the substrate W1 of the next process is present in the roll. A top view of the position of the sub-conveyor 3's stop position. The substrate transfer chuck 8 that moves in the (-X) direction is positioned below the both sides of the substrate W that is correctly positioned by the alignment process pins 105c to 105f and that is stopped in parallel with the transfer direction. Stop at the location. Further, the substrate transfer chuck 8 is lifted by the chuck lift cylinder 85 and adsorbed to both ends of the lower surface of the substrate W by the action of the chuck lift cylinder 85. As shown in Fig. 1, the suction system for adsorption starts before contact with the substrate W. Therefore, the substrate 1 is held by the chuck portion 88, the substrate transfer chuck 8 is moved in the (+χ) direction, and the substrate W is transferred to the coating stage 4 while being suspended. The coating platform 4 is divided into a pre-coating stage 40 and a coated stage 41 by dividing the board constituting the platform into two sheets. By the substrate transfer chuck 8, the substrate trade is transported until the front end WE is positioned above the boundary line st of the two sheets. Fig. 18 is a cross-sectional view showing the state in which the slit nozzle 55 is pre-discharged. Fig. 19 is a cross-sectional view showing the XZ of the case where the nozzle washing standby unit 9 is moved to the retracted position. 146775.doc -32- 201039928 The nozzle unit 5 is stopped at a position where the slit nozzle 55 exists above the coated platform 41. The nozzle cleaning standby unit 9 moves in accordance with the position of the slit nozzle 55, and performs cleaning and pre-discharging of the discharge port 55a of the slit nozzle 55. After the front end of the slit nozzle 55 is initialized by the pre-discharging, the nozzle cleaning standby unit 9 moves in the (-X) direction and retreats. Further, in synchronization with the movement of the substrate transfer chuck 8 for moving the substrate W to the application start position sp, the roller conveyor 3 is also driven, and the pre-processing is performed in the upstream unit shown in Fig. The substrate W1 to be processed in the next process is transported to the stop position on the roller conveyor 30. &lt;3-6. Second: First stage (a) to (B)&gt; Fig. 20 is a cross-sectional view taken along line xz showing a state in which the slit nozzle 55 is lowered to the coating start height. Fig. 21 is an XZ sectional view showing a state in which the slit nozzle 55 is horizontally moved toward the application start position. Further, Fig. 26 shows an enlarged view of the portion of the blade of Fig. 21. Fig. 27 corresponds to the discharge and suction of the compressed air of the stage 4 after the application of the slit nozzle μ to the application start position SP. A partial enlargement of the situation. The substrate Wa, which is regarded as the 'leading' in Fig. 11 of the second cycle, corresponds to the substrate studied here. Since the nozzle cleaning waiting unit 9 retreats, a space can be made between the slit nozzle 55 and the coated flat σ 41 . The slit nozzle 55 is lowered in the space to the set down position, that is, to the coating start height. The slit nozzle 55 which has descended to the coating start height moves in the (_χ) direction to the coating start position sp near the front end WE of the substrate hip. When the slit nozzle 55 is moved to the coating start position SP, the nozzle height detecting sensor 58 first enters the substrate w front end WEm coating start position 146775.doc - 33 - 201039928 sp. Since the actual suspension enthalpy of the coating start position SP can be detected by the nozzle height detecting sensor 58, the slit nozzle 55 is performed on one side to set the height of the slit nozzle 55 to the actual coating height. Finely adjust and move in the (-X) direction. Then, the plate-shaped protective member 57 enters from the front end WE of the substrate to scan the surface of the substrate. Since the scanning is performed from the front end WE of the substrate, foreign matter on the entire surface of the substrate can be detected. At this time, the height of the slit nozzle 55 is equal to the height at which the coating is actually applied. When the slit nozzle 55 reaches the coating start position ", the movement of the slit nozzle 55 in the (-X) direction is stopped. The period from the start of the slit nozzle 55 until the coating start position is reached" is temporarily stopped. Previously, in order to keep the ambient temperature constant, the compressed air was ejected from the ejection hole 41a of the post-coating stage 41, and the air was sucked by the suction hole 41b. Thereby, the formation of the air stream (gas stream) (and even the formation of the pressure gas layer) is also temporarily stopped. In other words, the slit nozzle 55 is lowered from the waiting position until the end of the falling period, and the slit nozzle 55 is horizontally moved while the processing of the unprocessed liquid remains after the end of the lowering of the slit nozzle 55 until the slit nozzle 55 reaches the substrate w. Any one of the horizontal movement periods until the cloth start position SP belongs to the "idle period" in which the slit nozzle 55 does not discharge the processing liquid, and stops at the corresponding slit in at least a part of the idle period. The formation of the air flow (formation of the pressure air layer) of the platform 41 after the coating is performed in the area directly under the nozzle 55 (set to the OFF state). Preferably, during the descending period, the discharge and suction of the air are turned to the 0FF state until the slit nozzle 55 is lowered, and the nozzle 55 is horizontally moved until the substrate is reached at the slit spray 146775.doc -34·201039928. It is preferable that the air flow is in an OFF state until the application start position of w. The both the lowering period and the horizontal movement period are set as a temporary stop period of the air flow. And a region including at least the nozzle directly under the region where the substrate exists.

Thereby, when the slit nozzle 55 is lowered to approach the coated platform 41, it is possible to prevent the processing liquid of the discharge port 55a of the slit nozzle from being dried due to the influence of the ejection and suction of air. Therefore, the actual substrate is When the surface is subjected to the coating treatment, unevenness in the stripe shape or ejection failure can be suppressed. As shown in Fig. 28, it is assumed that the slit nozzle 55 is lowered from the upper waiting position to the front side of the front end WE of the substrate. Next, even if the formation of the air flow by the coated platform 41 is not temporarily stopped, the processing liquid at the front end of the slit nozzle 55 is not dried. However, in this case, since the protective member W does not act on the substrate W The scanning is performed directly above the front end training. Therefore, even if there is foreign matter in the vicinity of the front end WE, it cannot be excluded or detected by the protective member 57. Since the front end of the slit nozzle 55 may be contaminated by foreign matter Therefore, it is preferable to make the slit nozzle η descend from the front end WE of the substrate W to the position deviated from the horizontal direction and then enter the second front end WE, but in this point, temporarily stop as described above. The formation of the air flow by the platform 41 after application is particularly effective. On the other hand, before the above-mentioned falling period, the first _ _ is the 〇N (on) state. When the air is stopped (4), the temperature will change. The temperature of the base will change. It may be 146775.doc -35- 201039928 which may cause uneven deformation or coating unevenness of the substrate stomach. (4), better In the meantime, the duration of the temporary stop state in which the air flow is formed is experimentally determined as the time when the temperature fluctuation of the substrate reaches a predetermined allowable value or less, thereby preventing coating failure due to temperature fluctuation on the substrate side. When the slit nozzle 55 is closer to the post-application stage 41, the more easily it is affected by the air flow ejected from the post-coating stage 41, so that the air flow is temporarily stopped only for the portion of the idling period described above. It is preferable that the horizontal movement period in the above-described falling period and horizontal movement period is included in the temporary stop period of the air flow. After the slit nozzle 55 reaches the coating start position ,, the previous stop is made, that is, it becomes After the application of the OFF state, the platform 4 restarts the air discharge and suction to be in the ON state. Therefore, the formation of the pressurized air layer is performed again using all the air holes on the coating platform 4, and in this state, the narrow The slit nozzle 55 starts to apply the coating liquid from the coating start position sp. Further, the substrate transfer chuck 8 starts moving toward the coated platform 41 side (+χ direction), thereby starting the substrate arm to be narrow. The relative movement of the slit nozzles 55. Therefore, during the application operation of the actual treatment liquid, a pressure air layer is formed over the entire range of the coating platform 4, thereby stably supporting the suspension of the substrate. When the chuck 8 starts moving, the substrate W1 for the next processing is transferred, and therefore the roller conveyor 3 is driven to start with the transfer lift roller conveyor 60 at the raised position. &lt;3-7. 2nd: 2nd stage (Β) - Fig. 22 is a cross-sectional view showing a state in which a coating process is performed. Fig. 23 is a plan view showing the case where the coating treatment is performed, 146775.doc • 36 - 201039928. As shown in Fig. 22, in a state in which both ends of the substrate w are held by the swash plate portion 88, the substrate transfer chuck 8 is moved in the downstream direction at a specific speed. Slot • The nozzle 55 is ejected in a state where it is fixed after reaching the coating start position SP. The a55a continuously supplies the anti-liquid, and the substrate W moves in the downstream direction in a suspended state, thereby coating the surface of the substrate W. Cloth processing. That is, until the slit nozzle 55 descends and reaches the coating start position sp, the substrate (four) floats and stops, and the slit nozzle 55 moves in the (9) direction, but after the slit nozzle 55 reaches the coating start position SP, the substrate evaluation Moving in the (four) direction, coating scanning is started by the relative movement of the slit nozzle 55 and the substrate W. At this time, the substrate for the next processing is transferred from the roller conveyor 3 to the inlet floating platform 1 through the transfer unit 6. Moreover, it stops across the inlet suspension platform 10 and the transfer unit 6. &lt;3-8. 2nd: 3rd stage (〇~(1))> For the lower-process predetermined substrate W1, the lift roller conveyor (10) ο τ drops ', and the entire surface is suspended. Further, alignment processing is performed by aligning the processing pins 105c to 105j. The base fW passes directly under the slit nozzle 55, and after the coating process is completed, the substrate w is conveyed by the substrate transfer chuck 8 through the coated platform and conveyed toward the exit suspension stage 11. &lt;3_9. 2nd: 4th stage (D) to (E)&gt; After the light application coating process, the slit nozzle 55 is horizontally moved in the (+X) direction until the position first lowered, and then From this position to the original nozzle interval. Further, the retracted nozzle cleaning waiting unit 9 performs cleaning and pre-discharging of the slit nozzle $5 toward (+χ) side 146775.doc -37-201039928 to the moving J ten-down-coating process. Fig. 24 is a plan view showing a state in which the substrate w is transported to the exit floating stage n. After the substrate w is transported to the exit floating stage ,, the chuck portion 88 is lowered to the lowered position by the operation of the chuck lift cylinder 85 of the substrate transfer chuck 8, and the suction holding at both ends of the substrate W is released. Then, in a state in which the disc loss portion 88 is at the lowered position, the substrate transfer chuck 8 is moved to the initial position for the conveyance of the substrate W1 to be processed in the next process. Since the substrate W is densely spaced from the substrate for the next processing, the substrate w 1 to be processed next is waiting for the substrate transfer chuck 8 while the entire surface has been suspended. Therefore, in a state where the chuck portion 88 has been raised, the chuck portion 88 is lowered to return to the initial position in order to contact the substrate W1 which is scheduled to be under a predetermined state in the suspended state. The group of lifting pins 5 disposed at a predetermined interval by the air ejection holes 11a provided on the outlet floating platform 11 rises relative to the substrate W in a non-contact state, and supports the lower surface of the substrate w and Upgrade. The transfer fork provided to the downstream transfer robot 36 enters the gap of the lift pin 115 to receive the substrate W' and is transferred to the reduced-pressure drying unit 37. The transfer robot 36 transfers the substrate W to the reduced-pressure drying unit 37, and transfers it to the laminated structure of the reduced-pressure drying unit 38 and the reduced-pressure drying unit 38, the transfer position 39 toward the downstream direction, and the like. Thereafter, the substrate W1 is subjected to a coating process in the same manner as the substrate W, and is transported in the downstream direction. The above is the flow of the processing performed by the substrate processing apparatus 1. 146775.doc -38- 201039928 &lt;4. Modifications&gt; In the above embodiment, the substrate W is carried into the next processing predetermined substrate W1 after passing through the transfer unit 6, but the invention is not limited to this embodiment. - In the state where the substrate to be coated and transported by the substrate transfer chuck 8 is not transferred to the transfer unit 6, the next substrate W1 can be transported. In this case, since the rear end of the substrate W which is being subjected to the coating process remains, the transfer lift roller conveyor 60 which should be raised as it is necessary must receive the next predetermined substrate in the lowered state. In the transfer unit 6. Therefore, at the stage where the coating processing substrate 7 has passed the transfer unit 6, the roller 6〇1 of the transfer lifting roller conveyor 6 is rotated at the same speed as the rotation of the roller conveyor 30. Rotate and rise. The substrate W1 that has been processed by the transfer unit 6 is transferred to the transfer unit 6 by the propulsion force generated by the rotation of the roller conveyor 30, and the lower surface thereof is rolled up by the transfer lift roller conveyor 60 which rises from the middle. Supported by the child 〇1, and the propulsive force is imparted by the rotation of the roller 〇601. Then, the substrate is transported until the position of the entrance suspension platform 10 is stopped by the sensor. In this way, the rotation of the roller 3〇1 of the roller conveyor 3, the rotation of the roller 6〇1 of the transfer lift roller conveyor 60, and the conveyance speed of the substrate transfer chuck 8 can be set equally. Therefore, during the coating operation of the substrate W, the substrates to be processed by the lower processing can be carried into the transfer unit 6. Thereby, the transfer interval between the substrate W and the substrate can be made denser, so that the time required for the processing can be further shortened. Further, in the above embodiment, the plate of the coating platform 4 is divided into two parts 146775.doc • 39· 201039928 'but is not limited thereto. Figure 25 is a coating platform 130 from a panel divided into three sections. At this time, each plate was used as a pre-coating stage ιι, a main coating stage 118, and a coated stage 12〇. On the main coating stage 118, the gas holes provided on the land surface are formed such that the air ejection holes 118a and the suction holes 118] 3 become dense. On the other hand, on the pre-application stage 11〇 and the post-application stage 12〇 at both ends, the configuration is as follows: the ejection hole 11〇&amp; and the suction hole nob, the spray are compared with the main coating stage 118. The outlet hole i20a and the suction hole 12 have a lower density, and the distance between the holes is longer. In this case, the substrate w is stopped so that the leading end WE of the substrate W in the transport direction is located at the position of the region boundary Sc of the main coating stage 118. The area boundary Sc is not the boundary of a different board, but a conceptual area boundary defined by the approximate center of the sheet. The slit nozzle 55 is located above the coated rear platform uo on the downstream side of the area boundary Sc of the main coating stage 118. At this time, the plate is divided into three parts, but the internal air flow path is separated into two systems from the upstream side and the further downstream side of the area boundary Sc. Similarly to the above-described embodiment, the slit nozzle 55 is lowered from the stop position to the application start height, and then horizontally moved from the position toward the (_χ) direction. From the start of the lowering, until the slit nozzle 55 reaches the coating start position on the substrate, the air is ejected from the ejection holes 118a and 120a and the suction holes 115b and 120b located on the downstream side of the region boundary Sc. And the suction is temporarily stopped. As described above, in the same manner as in the above embodiment, it is possible to prevent the discharge port 55a of the slit nozzle 55 from drying during the lowering period. With regard to the plate 'increasing the density of the ejection hole and the suction hole, the substrate can be stably suspended, but it is costly in processing. In this case, in particular, the region in which the substrate w is stably suspended is a region where the substrate material to be conveyed is subjected to coating treatment. Therefore, the necessary effect can be sufficiently obtained only by using a precision plate having a higher density of the discharge holes Ii8a and the suction holes U8b for the main coating plate 118 located below the area. Thus, the board is divided into three parts and separated by S, whereby at the both ends of the pre-coating platform i 1〇 and the coated platform 120, the mouth of the air can be used compared to the board of the main coating platform 118. Outlet

The inexpensive boards of ll〇a, 120a and the suction holes 11〇b and (4) have a lower density. The coating platform m is constructed such that the plate is divided into three parts, but the plate is divided into several P-knifes... and the heart can be divided into a plurality of sheets. When the slit nozzle 55 is lowered from the rising position and reaches the application start position on the substrate W, the air can be temporarily ejected and sucked in the region on the downstream side of the position of the tip end of the substrate w in the transport direction. The internal air flow path can also be divided into flow paths. Further, if the internal air flow path is separated and the ΟΝ/OFF control can be independently performed, the plate may not be physically divided. In the general performance, a gas flow forming region in which a plurality of gas holes are formed is provided as a separate portion of a gas flow forming region of a plurality of plates or other plates. An opening and closing mechanism for the gas flow path is provided. Further, in the plurality of gas flow forming regions, the gas flow is formed by using the opening and closing mechanism to stop the formation of the gas flow only in the region where the substrate is present immediately below the nozzle and there is no substrate thereon. Further, in the above embodiment, the slit nozzle 55 is lowered and moved in the (_χ) direction to reach the application start position sp of the substrate W, but also the result is the same as the above-described embodiment. 146775.doc -41 - 201039928 The mechanism may be such that the slit nozzle 55 is lowered, and the substrate W is moved in the (+Χ) direction to cause the discharge port 55a of the slit nozzle 55 to reach the coating start position SP. In this case, the slit nozzle 55 is lowered. During this period, the ejection and suction of the air from the coating platform 4 in the region where the substrate w is not present is stopped. Further, the substrate is moved in the (+X) direction toward the slit nozzle 55. When the discharge port 55a of the nozzle 55 has reached the coating start position sp, the air is ejected and sucked again. Thus, the discharge port 5 of the slit nozzle 55 can be prevented from being dried. The compressed gas in which the substrate w is suspended is typically 'in the case of the substrate transport in the anaerobic process, nitrogen gas or the like may be compressed and used as an inert gas. Further, in the substrate processing apparatus of the above embodiment, the roller is transported by the roller. The transfer unit is used when the substrate received by the mechanism is delivered to the suspension transport mechanism. However, the present invention is also applicable to a device in which the substrate received by the material transport mechanism is delivered to the roll by the transfer unit (support form conversion mechanism). Further, in the present embodiment, the nozzle cleaning standby unit 9 is a mechanism that moves along the X-axis side, but may not move. That is, when the nozzle unit is multi-moved, the nozzle is movable. The washing waiting unit 9 can also be fixed. In this case, it becomes no. The nozzle washing waiting unit of the nozzle washing waiting unit 9 is also placed. The linear scale 92 and the nozzle are cleaned. A structural unit linear motor to be "in. The nozzle washing standby unit 9 can be manually moved to set only the nozzle cleaning. 146775.doc • 42· 201039928 The unit traveling guide 91 is fixed by a lock mechanism so as not to move during the conveyance. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a substrate processing apparatus of the present invention. Fig. 2 is a plan view of the substrate processing apparatus of Fig. 1 when the nozzle unit and the nozzle cleaning standby unit have been removed. Fig. 3 is a block diagram showing a control mechanism of the substrate processing apparatus. ❹ Figure 4 is a YZ scraping view of the transfer unit at the time of ascent. Figure 5 is a cross-sectional view of the gamma ζ of the transfer unit when it is lowered. Figure 6 is a side view of the XZ of the roller conveyor and the transfer unit. Figure 7 is a top plan view of the elevating conveyor support frame. Fig. 8 is a plan view of the coating platform of the embodiment. Fig. 9 is a cross-sectional view showing the flow path of the supply and suction air to the coating platform shown in Fig. 8. Figure 10 is a cross-sectional view showing the YZ of the substrate processing apparatus of the present invention. Fig. 11 is a timing chart showing the operation of the substrate processing apparatus of the present invention. Fig. 12 is a plan view partially showing the processing flow of the substrate processing apparatus of the present invention. Fig. 13 is a plan view partially showing the processing flow of the substrate processing apparatus of the present invention. Fig. 14 is a cross-sectional view partially showing the processing flow of the substrate processing apparatus of the present invention. Fig. 15 is a plan view partially showing the processing flow of the substrate processing apparatus of the present invention. 146775.doc -43- 201039928 Fig. 1 is a partial cross-sectional view showing the XZ cross section of the processing flow of the substrate processing apparatus of the present invention. Fig. 17 is a plan view partially showing the processing flow of the substrate processing apparatus of the present invention. Fig. 18 is a partially sectional view showing the XZ cross section of the processing flow of the substrate processing apparatus of the present invention. Fig. 19 is a partially sectional view showing the XZ cross section of the processing flow of the substrate processing apparatus of the present invention. Figure 20 is a cross-sectional view, partially in section, of the process flow of the substrate processing apparatus of the present invention. Fig. 2 is a partial cross-sectional view showing the XZ of the processing flow of the substrate processing apparatus of the present invention. Figure 22 is a cross-sectional view, partially in section, of the process flow of the substrate processing apparatus of the present invention. Fig. 23 is a plan view partially showing the processing flow of the substrate processing apparatus of the present invention. Fig. 24 is a plan view partially showing the processing flow of the substrate processing apparatus of the present invention. Figure 25 is a plan view of a coating platform of a modification. Fig. 26 is a partially enlarged view showing the ΟΝ/OFF switching of the air flow in accordance with the positional relationship between the nozzle and the substrate. Fig. 27 is a partially enlarged view showing the ΟΝ/OFF switching of the air flow in accordance with the positional relationship between the nozzle and the substrate. Fig. 28 is a partially enlarged view showing a state in which the nozzle is lowered on the substrate. 146775.doc -44- 201039928 〇〇【Main component symbol description】 1 Substrate processing device 2 Substrate transfer device 3 Substrate coating device 4 Coating platform 5 Nozzle unit 6 Transfer unit 7 Control unit 8 Substrate transfer chuck 9 Nozzle wash Net Waiting Unit 10 Inlet Suspension Platform 10a, 11a, 40a, 41a Discharge Hole 11 Outlet Suspension Platform 16 ' 26 Pneumatic Valves 18, 28 Blower 40 Pre-Coating Platform 40a '41a Discharge Holes 40b, 41b Suction Holes 41 Coating Rear platform 55 slit nozzle 55a discharge port 55S vibration sensor 57 protection member 58 ball screw 146775.doc -45- 201039928 60 64 95 96 99 SP St

W, WO, W1, Wa, Wb WE

X, Y, Z Transfer lifting roller conveyor Suspension pad Roller Inching cleaning unit Coating start position Plate boundary Substrate Front end of the substrate Direction 146775.doc 46 -

Claims (1)

201039928 VII. Patent application scope: 1. A substrate coating device, characterized in that: it is used for coating a processing liquid on a substrate; and the method comprises: a floating platform, which passes through a gas hole provided on the platform surface a gas flow is formed on the platform surface to form a pressure gas layer, and the substrate is suspended by the pressure gas layer; and the treatment liquid supply mechanism ejects a specific treatment liquid from the nozzle that relatively moves relative to the substrate to the above a substrate on which the processing liquid is applied; and a gas flow control device that switches between a state in which the gas stream is formed and a stopped state; and the processing liquid is ejected in parallel with the relative movement Before the idling period is set, the nozzle is relatively moved from the position on the floating platform offset from the substrate existence region to the substrate existence region while stopping the discharge of the processing liquid from the above (4); the gas flow control mechanism is Temporarily stopping at the above nozzle during at least one of the idling periods The area immediately below is formed by the above gas flow. 2. The substrate coating apparatus according to claim 1, further comprising: a lifting mechanism for raising and lowering the nozzle above the floating platform; wherein the idling period includes: a period during which the nozzle is lowered from a specific waiting height, and After the nozzle is in a lowered state, the horizontal movement period of the nozzle relative to the substrate in the horizontal direction is 146775.doc 201039928. The coating of the processing liquid on the substrate is performed in the descending state; The formation of the gas flow is stopped during at least the horizontal movement period of the period. 3. The substrate coating apparatus according to claim 1 or 2, wherein, on the floating platform, a plurality of gas flow forming regions respectively formed with gas holes are adjacently disposed as another portion of the other sheet or the sheet; An opening and closing mechanism for the gas flow path is provided in each of the plurality of gas flow forming regions; and the gas flow control mechanism is located only in the plurality of gas flow forming regions, directly below the nozzle, and not thereon The region where the substrate is present is temporarily stopped by the formation of the gas flow using the opening and closing mechanism. 4) The substrate coating apparatus according to claim 1 or 2, wherein after the gas flow is temporarily stopped, Cao performs the above-described "μ," "formation of the pore flow" until the start of the ordering of the nozzle from the substrate. The processing liquid 5 is sprayed out at the start position of the apparatus. The substrate coating 襄 ^ ^ / T of the request item U2 further includes a levitation height measuring means for measuring the hanging degree of the substrate; and the processing liquid supply means further includes protection a member that is mounted in the mouth of the mouth to perform the above-mentioned side corresponding to the front side, and the front end of the nozzle that is moved to the front of the nozzle; 146775.doc 201039928 The above-mentioned substrate end is detected by the above-mentioned overhanging height measuring mechanism After the nozzle is lowered in the coating start position and the nozzle is lowered, the nozzle is moved relative to the substrate, whereby the protective member enters the substrate end earlier than the nozzle. Or a substrate coating apparatus of 2, which determines an allowable value of temperature change of the substrate caused by temporarily stopping the formation of the gas flow; The duration of the temporary stop state in which the gas flow is formed is determined as the time when the temperature fluctuation is equal to or less than the allowable value. The substrate coating apparatus of claim 1 or 2, wherein the suspension and the spear platform are Mixing and forming a plurality of discharge holes for discharging the gas and a plurality of suction holes for sucking the gas; wherein the gas flow is generated during a process in which a pressure gas ejected from the plurality of discharge holes is sucked by the plurality of suction holes The gas flow control means switches between a gas supply path of the plurality of discharge holes and a gas suction path for opening and closing the plurality of suction holes by opening and closing the gas suction path of the plurality of suction holes. 8 - a substrate coating method, characterized in that it is used to apply a treatment liquid sprayed from a specific nozzle to a tomb; the method includes the following steps: by passing a gas hole provided on the platform surface a first step of forming a pressure gas layer on the platform surface and suspending the substrate by the pressure gas layer; 146775.doc 201039928 temporarily stopping the gas flow in a specific region of the platform surface deviating from the substrate existence region and directly below the nozzle; lowering the nozzle from the specific waiting height toward the specific region; moving the nozzle relative to the substrate to cause the nozzle Arranging the processing liquid from the nozzles above the application start position of the substrate, and restarting the formation of the gas flow in the specific region until the discharge of the processing liquid is started. 146775.doc