JP4847547B2 - ラウンド型半田バンプを有するプリント基板 - Google Patents
ラウンド型半田バンプを有するプリント基板 Download PDFInfo
- Publication number
- JP4847547B2 JP4847547B2 JP2009015184A JP2009015184A JP4847547B2 JP 4847547 B2 JP4847547 B2 JP 4847547B2 JP 2009015184 A JP2009015184 A JP 2009015184A JP 2009015184 A JP2009015184 A JP 2009015184A JP 4847547 B2 JP4847547 B2 JP 4847547B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- printed circuit
- solder
- round
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
190 金属箔
200 プリントマスク
310 半田ペースト
300 半田バンプ
400 接続金属層
510 下部接続パッド形成用金属層
515 下部接続パッド
530 回路層
550 最上部回路層
551 回路パターン
555 上部接続パッド
600 絶縁層
700 半田レジスト
800 無電解メッキ層
Claims (4)
- 上下に配列された複数の回路層と、
前記回路層の間に介在された絶縁層と、
前記複数の回路層のうち最下部回路層に形成された下部接続パッドと、
前記下部接続パッドに電気的に接続し、パッド接続面がラウンド形状で、他面が平坦な形状である半田バンプとを含み、
前記下部接続パッドは、前記絶縁層の内部に凹んでいるラウンド形状であり、
前記半田バンプ形成面に半田レジスト層が形成されないラウンド型半田バンプを有するプリント基板。 - 前記下部接続パッドと前記半田バンプとの間に形成された接続金属層をさらに含むことを特徴とする、請求項1に記載のラウンド型半田バンプを有するプリント基板。
- 前記複数の回路層のうち最上部回路層に形成された上部接続パッドと、
前記最上部回路層の上部に形成され、前記上部接続パッドを露出させる開口部を有する半田レジスト層とをさらに含むことを特徴とする、請求項1に記載のラウンド型半田バンプを有するプリント基板。 - 前記接続金属層はニッケルメッキ層であることを特徴とする、請求項2に記載のラウンド型半田バンプを有するプリント基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080102682A KR101006619B1 (ko) | 2008-10-20 | 2008-10-20 | 라운드형 솔더범프를 갖는 인쇄회로기판 및 그 제조방법 |
KR10-2008-0102682 | 2008-10-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011069177A Division JP4954336B2 (ja) | 2008-10-20 | 2011-03-28 | ラウンド型半田バンプを有するプリント基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010098278A JP2010098278A (ja) | 2010-04-30 |
JP4847547B2 true JP4847547B2 (ja) | 2011-12-28 |
Family
ID=42107731
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009015184A Expired - Fee Related JP4847547B2 (ja) | 2008-10-20 | 2009-01-27 | ラウンド型半田バンプを有するプリント基板 |
JP2011069177A Expired - Fee Related JP4954336B2 (ja) | 2008-10-20 | 2011-03-28 | ラウンド型半田バンプを有するプリント基板およびその製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011069177A Expired - Fee Related JP4954336B2 (ja) | 2008-10-20 | 2011-03-28 | ラウンド型半田バンプを有するプリント基板およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100096171A1 (ja) |
JP (2) | JP4847547B2 (ja) |
KR (1) | KR101006619B1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101095211B1 (ko) | 2008-12-17 | 2011-12-16 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판 제조방법 |
KR101055462B1 (ko) | 2010-01-07 | 2011-08-08 | 삼성전기주식회사 | 인쇄회로기판 제조용 캐리어와 그 제조방법 및 이를 이용한 인쇄회로기판의 제조방법 |
JP5638269B2 (ja) * | 2010-03-26 | 2014-12-10 | 日本特殊陶業株式会社 | 多層配線基板 |
KR101222828B1 (ko) * | 2011-06-24 | 2013-01-15 | 삼성전기주식회사 | 코어리스 기판의 제조방법 |
KR101420499B1 (ko) * | 2012-07-26 | 2014-07-16 | 삼성전기주식회사 | 적층형 코어리스 인쇄회로기판 및 그 제조 방법 |
KR20140047967A (ko) * | 2012-10-15 | 2014-04-23 | 삼성전기주식회사 | 다층형 코어리스 인쇄회로기판 및 그 제조 방법 |
KR101585554B1 (ko) * | 2014-01-22 | 2016-01-14 | 앰코 테크놀로지 코리아 주식회사 | 임베디드 트레이스 기판과 그의 범프 형성 방법 |
KR20160010960A (ko) * | 2014-07-21 | 2016-01-29 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US9603247B2 (en) * | 2014-08-11 | 2017-03-21 | Intel Corporation | Electronic package with narrow-factor via including finish layer |
JP2017061612A (ja) * | 2015-09-25 | 2017-03-30 | Jsr株式会社 | 化学機械研磨用組成物および化学機械研磨方法 |
TWI595812B (zh) * | 2016-11-30 | 2017-08-11 | 欣興電子股份有限公司 | 線路板結構及其製作方法 |
CN109326569A (zh) * | 2017-07-31 | 2019-02-12 | 群创光电股份有限公司 | 封装元件及其制作方法 |
US10784203B2 (en) * | 2017-11-15 | 2020-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package and method |
KR102187538B1 (ko) * | 2018-09-17 | 2020-12-07 | 주식회사 지로이아이 | 쓰루홀 타입 단면형 인쇄회로기판 |
CN110839315B (zh) * | 2019-10-22 | 2020-12-15 | 江门崇达电路技术有限公司 | 一种沉金工艺测试板的设计方法 |
KR20220033204A (ko) * | 2020-09-09 | 2022-03-16 | 삼성전자주식회사 | 반도체 패키지 |
CN114478044B (zh) * | 2021-12-26 | 2023-01-06 | 南通威斯派尔半导体技术有限公司 | 一种改善覆铜陶瓷基板母板翘曲的方法 |
Family Cites Families (15)
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CA2034700A1 (en) * | 1990-01-23 | 1991-07-24 | Masanori Nishiguchi | Substrate for packaging a semiconductor device |
JPH0917937A (ja) * | 1995-06-27 | 1997-01-17 | Matsushita Electric Works Ltd | Bga型集積回路の実装構造 |
JP3055496B2 (ja) | 1997-06-26 | 2000-06-26 | 日本電気株式会社 | 半導体装置の実装構造 |
US6005198A (en) * | 1997-10-07 | 1999-12-21 | Dimensional Circuits Corporation | Wiring board constructions and methods of making same |
JP2001189550A (ja) * | 1999-12-28 | 2001-07-10 | Kyocera Corp | 回路基板 |
JP2002141646A (ja) | 2000-10-30 | 2002-05-17 | Kyocera Corp | 回路基板 |
JP3990962B2 (ja) * | 2002-09-17 | 2007-10-17 | 新光電気工業株式会社 | 配線基板の製造方法 |
JP3879724B2 (ja) * | 2003-09-29 | 2007-02-14 | 株式会社トッパンNecサーキットソリューションズ | 印刷配線板、半導体装置、及びそれらの製造方法 |
TW200609109A (en) * | 2004-08-02 | 2006-03-16 | Nippon Denkai Ltd | Composite copper foil and method for production thereof |
US7626829B2 (en) * | 2004-10-27 | 2009-12-01 | Ibiden Co., Ltd. | Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board |
JP5105168B2 (ja) * | 2005-11-02 | 2012-12-19 | イビデン株式会社 | 多層プリント配線板 |
JP4783692B2 (ja) * | 2006-08-10 | 2011-09-28 | 新光電気工業株式会社 | キャパシタ内蔵基板及びその製造方法と電子部品装置 |
KR100771467B1 (ko) * | 2006-10-30 | 2007-10-30 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
US8555494B2 (en) * | 2007-10-01 | 2013-10-15 | Intel Corporation | Method of manufacturing coreless substrate |
KR20090052716A (ko) * | 2007-11-21 | 2009-05-26 | 삼성전자주식회사 | 반도체 패키지 및 이를 구비한 전자 기기 |
-
2008
- 2008-10-20 KR KR1020080102682A patent/KR101006619B1/ko not_active IP Right Cessation
-
2009
- 2009-01-23 US US12/320,366 patent/US20100096171A1/en not_active Abandoned
- 2009-01-27 JP JP2009015184A patent/JP4847547B2/ja not_active Expired - Fee Related
-
2011
- 2011-03-28 JP JP2011069177A patent/JP4954336B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011139096A (ja) | 2011-07-14 |
KR101006619B1 (ko) | 2011-01-07 |
JP2010098278A (ja) | 2010-04-30 |
JP4954336B2 (ja) | 2012-06-13 |
US20100096171A1 (en) | 2010-04-22 |
KR20100043591A (ko) | 2010-04-29 |
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