JP4834665B2 - 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン - Google Patents

銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン Download PDF

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Publication number
JP4834665B2
JP4834665B2 JP2007524685A JP2007524685A JP4834665B2 JP 4834665 B2 JP4834665 B2 JP 4834665B2 JP 2007524685 A JP2007524685 A JP 2007524685A JP 2007524685 A JP2007524685 A JP 2007524685A JP 4834665 B2 JP4834665 B2 JP 4834665B2
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Japan
Prior art keywords
group
paste composition
silver paste
pattern
formula
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JP2007524685A
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English (en)
Japanese (ja)
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JPWO2007007802A1 (ja
Inventor
正樹 佐々木
賢治 加藤
聖夫 有馬
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Priority to JP2007524685A priority Critical patent/JP4834665B2/ja
Publication of JPWO2007007802A1 publication Critical patent/JPWO2007007802A1/ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Gas-Filled Discharge Tubes (AREA)
JP2007524685A 2005-07-13 2006-07-12 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン Active JP4834665B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007524685A JP4834665B2 (ja) 2005-07-13 2006-07-12 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005204083 2005-07-13
JP2005204083 2005-07-13
JP2007524685A JP4834665B2 (ja) 2005-07-13 2006-07-12 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン
PCT/JP2006/313892 WO2007007802A1 (ja) 2005-07-13 2006-07-12 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン

Publications (2)

Publication Number Publication Date
JPWO2007007802A1 JPWO2007007802A1 (ja) 2009-01-29
JP4834665B2 true JP4834665B2 (ja) 2011-12-14

Family

ID=37637192

Family Applications (1)

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JP2007524685A Active JP4834665B2 (ja) 2005-07-13 2006-07-12 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン

Country Status (6)

Country Link
US (1) US7517632B2 (enExample)
JP (1) JP4834665B2 (enExample)
KR (1) KR100989744B1 (enExample)
CN (1) CN101223477B (enExample)
TW (1) TW200720846A (enExample)
WO (1) WO2007007802A1 (enExample)

Families Citing this family (22)

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Publication number Priority date Publication date Assignee Title
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
US20070178310A1 (en) * 2006-01-31 2007-08-02 Rudyard Istvan Non-woven fibrous materials and electrodes therefrom
JP5210657B2 (ja) * 2007-07-18 2013-06-12 太陽ホールディングス株式会社 感光性組成物、及びその焼成物からなるパターン
KR100861399B1 (ko) * 2007-12-17 2008-10-02 주식회사 잉크테크 은 나노입자 분산 수지의 제조 방법
CN101471215B (zh) 2007-12-29 2011-11-09 清华大学 热电子源的制备方法
US20100006146A1 (en) * 2008-07-08 2010-01-14 Palo Alto Research Center Incorporated Wafer-Specific Line Patterning For Solar Cells And The Like
JP5236557B2 (ja) * 2009-03-31 2013-07-17 太陽ホールディングス株式会社 レーザーを用いたパターン形成方法
JP5399193B2 (ja) * 2009-09-30 2014-01-29 太陽ホールディングス株式会社 感光性導電ペーストおよびその製造方法
CN102812399A (zh) * 2010-03-18 2012-12-05 东丽株式会社 感光性导电糊剂及导电图形的制备方法
KR101277020B1 (ko) 2010-09-30 2013-06-24 다이요 홀딩스 가부시키가이샤 감광성 도전 페이스트
CN105867067A (zh) * 2011-03-14 2016-08-17 东丽株式会社 感光性导电糊剂和导电图案的制造方法
TWI489492B (zh) * 2011-04-07 2015-06-21 Lg Chemical Ltd 用於形成電極之銀膠組成物及其製備方法
KR20130066929A (ko) 2011-12-13 2013-06-21 한국전자통신연구원 패턴 형성 조성물 및 이를 이용한 패턴 형성 방법
KR101350960B1 (ko) * 2012-01-13 2014-01-16 한화케미칼 주식회사 글래스 프릿, 이를 포함하는 도전성 페이스트 조성물 및 태양전지
JP5403187B1 (ja) * 2012-03-22 2014-01-29 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法
TWI550643B (zh) 2012-03-30 2016-09-21 Taiyo Holdings Co Ltd Conductive paste and conductive circuit
WO2014010549A1 (ja) * 2012-07-11 2014-01-16 日油株式会社 銀含有組成物及び銀要素形成基材
JP6061697B2 (ja) * 2013-01-24 2017-01-18 株式会社日本化学工業所 新規な光重合開始剤及びその使用方法
CN103969951A (zh) * 2013-01-30 2014-08-06 太阳油墨制造株式会社 导电性树脂组合物及导电电路
CN105960683A (zh) * 2014-02-12 2016-09-21 东丽株式会社 导电糊剂、图案的制造方法、导电图案的制造方法和传感器
JP6635415B2 (ja) * 2015-06-30 2020-01-22 パナソニックＩｐマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板
WO2017002319A1 (ja) * 2015-06-30 2017-01-05 パナソニックＩｐマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317112A (ja) * 1998-05-01 1999-11-16 Taiyo Ink Mfg Ltd アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP2000080068A (ja) * 1998-06-26 2000-03-21 Ciba Specialty Chem Holding Inc 新規ｏ―アシルオキシム光開始剤
JP2001233842A (ja) * 1999-12-15 2001-08-28 Ciba Specialty Chem Holding Inc オキシムエステルの光開始剤
JP2002105112A (ja) * 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd 感光性ペースト組成物及びそれを用いて焼成物パターンを形成したパネル
JP2003280193A (ja) * 2002-03-26 2003-10-02 Taiyo Ink Mfg Ltd アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP2005182004A (ja) * 2003-11-27 2005-07-07 Taiyo Ink Mfg Ltd 硬化性樹脂組成物、その硬化物、およびプリント配線板

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JP3758220B2 (ja) 1995-11-17 2006-03-22 東レ株式会社 感光性導電ペーストおよび電極の製造方法
JP3510761B2 (ja) 1997-03-26 2004-03-29 太陽インキ製造株式会社 アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP3520798B2 (ja) 1998-03-19 2004-04-19 東レ株式会社 プラズマディスプレイ用導電ペ―ストならびにプラズマディスプレイおよびその基板
MY121423A (en) * 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
JP2002072472A (ja) 2000-08-24 2002-03-12 Toray Ind Inc 感光性ペースト
JP2002351072A (ja) 2001-05-28 2002-12-04 Fuji Photo Film Co Ltd 感光性組成物
JP2002351071A (ja) 2001-05-28 2002-12-04 Fuji Photo Film Co Ltd 感光性組成物
US7189489B2 (en) * 2001-06-11 2007-03-13 Ciba Specialty Chemicals Corporation Oxime ester photoiniators having a combined structure
JP4043870B2 (ja) 2002-07-10 2008-02-06 関西ペイント株式会社 半導体レーザー用硬化型樹脂組成物及びその組成を使用したレジストパターン形成方法
JP2004198444A (ja) * 2002-10-25 2004-07-15 Sumitomo Bakelite Co Ltd 感光性銀フィルム及びそれを用いた画像表示装置
CN101223478B (zh) * 2005-07-13 2011-10-12 太阳控股株式会社 黑色糊剂组合物及使用其的黑色矩阵图案的形成方法、以及该黑色矩阵图案

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH11317112A (ja) * 1998-05-01 1999-11-16 Taiyo Ink Mfg Ltd アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP2000080068A (ja) * 1998-06-26 2000-03-21 Ciba Specialty Chem Holding Inc 新規ｏ―アシルオキシム光開始剤
JP2001233842A (ja) * 1999-12-15 2001-08-28 Ciba Specialty Chem Holding Inc オキシムエステルの光開始剤
JP2002105112A (ja) * 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd 感光性ペースト組成物及びそれを用いて焼成物パターンを形成したパネル
JP2003280193A (ja) * 2002-03-26 2003-10-02 Taiyo Ink Mfg Ltd アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP2005182004A (ja) * 2003-11-27 2005-07-07 Taiyo Ink Mfg Ltd 硬化性樹脂組成物、その硬化物、およびプリント配線板

Also Published As

Publication number Publication date
JPWO2007007802A1 (ja) 2009-01-29
CN101223477B (zh) 2011-08-31
CN101223477A (zh) 2008-07-16
KR20080026165A (ko) 2008-03-24
US20080118865A1 (en) 2008-05-22
TWI326005B (enExample) 2010-06-11
KR100989744B1 (ko) 2010-10-26
WO2007007802A1 (ja) 2007-01-18
TW200720846A (en) 2007-06-01
US7517632B2 (en) 2009-04-14

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