CN101223477B - 银糊剂组合物及使用其的导电性图案的形成方法、以及该导电性图案 - Google Patents

银糊剂组合物及使用其的导电性图案的形成方法、以及该导电性图案 Download PDF

Info

Publication number
CN101223477B
CN101223477B CN200680025372.3A CN200680025372A CN101223477B CN 101223477 B CN101223477 B CN 101223477B CN 200680025372 A CN200680025372 A CN 200680025372A CN 101223477 B CN101223477 B CN 101223477B
Authority
CN
China
Prior art keywords
silver paste
paste composition
conductive pattern
pattern
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680025372.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN101223477A (zh
Inventor
佐佐木正树
加藤贤治
有马圣夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd, Taiyo Holdings Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN101223477A publication Critical patent/CN101223477A/zh
Application granted granted Critical
Publication of CN101223477B publication Critical patent/CN101223477B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Gas-Filled Discharge Tubes (AREA)
CN200680025372.3A 2005-07-13 2006-07-12 银糊剂组合物及使用其的导电性图案的形成方法、以及该导电性图案 Expired - Fee Related CN101223477B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005204083 2005-07-13
JP204083/2005 2005-07-13
PCT/JP2006/313892 WO2007007802A1 (ja) 2005-07-13 2006-07-12 銀ペースト組成物、及びそれを用いた導電性パターンの形成方法、並びにその導電性パターン

Publications (2)

Publication Number Publication Date
CN101223477A CN101223477A (zh) 2008-07-16
CN101223477B true CN101223477B (zh) 2011-08-31

Family

ID=37637192

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680025372.3A Expired - Fee Related CN101223477B (zh) 2005-07-13 2006-07-12 银糊剂组合物及使用其的导电性图案的形成方法、以及该导电性图案

Country Status (6)

Country Link
US (1) US7517632B2 (enExample)
JP (1) JP4834665B2 (enExample)
KR (1) KR100989744B1 (enExample)
CN (1) CN101223477B (enExample)
TW (1) TW200720846A (enExample)
WO (1) WO2007007802A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
US20070178310A1 (en) * 2006-01-31 2007-08-02 Rudyard Istvan Non-woven fibrous materials and electrodes therefrom
JP5210657B2 (ja) * 2007-07-18 2013-06-12 太陽ホールディングス株式会社 感光性組成物、及びその焼成物からなるパターン
KR100861399B1 (ko) * 2007-12-17 2008-10-02 주식회사 잉크테크 은 나노입자 분산 수지의 제조 방법
CN101471215B (zh) 2007-12-29 2011-11-09 清华大学 热电子源的制备方法
US20100006146A1 (en) * 2008-07-08 2010-01-14 Palo Alto Research Center Incorporated Wafer-Specific Line Patterning For Solar Cells And The Like
JP5236557B2 (ja) * 2009-03-31 2013-07-17 太陽ホールディングス株式会社 レーザーを用いたパターン形成方法
JP5399193B2 (ja) * 2009-09-30 2014-01-29 太陽ホールディングス株式会社 感光性導電ペーストおよびその製造方法
CN102812399A (zh) * 2010-03-18 2012-12-05 东丽株式会社 感光性导电糊剂及导电图形的制备方法
KR101277020B1 (ko) 2010-09-30 2013-06-24 다이요 홀딩스 가부시키가이샤 감광성 도전 페이스트
CN105867067A (zh) * 2011-03-14 2016-08-17 东丽株式会社 感光性导电糊剂和导电图案的制造方法
TWI489492B (zh) * 2011-04-07 2015-06-21 Lg Chemical Ltd 用於形成電極之銀膠組成物及其製備方法
KR20130066929A (ko) 2011-12-13 2013-06-21 한국전자통신연구원 패턴 형성 조성물 및 이를 이용한 패턴 형성 방법
KR101350960B1 (ko) * 2012-01-13 2014-01-16 한화케미칼 주식회사 글래스 프릿, 이를 포함하는 도전성 페이스트 조성물 및 태양전지
JP5403187B1 (ja) * 2012-03-22 2014-01-29 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法
TWI550643B (zh) 2012-03-30 2016-09-21 Taiyo Holdings Co Ltd Conductive paste and conductive circuit
WO2014010549A1 (ja) * 2012-07-11 2014-01-16 日油株式会社 銀含有組成物及び銀要素形成基材
JP6061697B2 (ja) * 2013-01-24 2017-01-18 株式会社日本化学工業所 新規な光重合開始剤及びその使用方法
CN103969951A (zh) * 2013-01-30 2014-08-06 太阳油墨制造株式会社 导电性树脂组合物及导电电路
CN105960683A (zh) * 2014-02-12 2016-09-21 东丽株式会社 导电糊剂、图案的制造方法、导电图案的制造方法和传感器
JP6635415B2 (ja) * 2015-06-30 2020-01-22 パナソニックＩｐマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板
WO2017002319A1 (ja) * 2015-06-30 2017-01-05 パナソニックＩｐマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1241562A (zh) * 1998-06-26 2000-01-19 西巴特殊化学品控股有限公司 新的o－酰基肟光引发剂
CN1307693A (zh) * 1998-06-26 2001-08-08 西巴特殊化学品控股有限公司 可光聚合热固性树脂组合物
CN1514845A (zh) * 2001-06-11 2004-07-21 �������⻯ѧƷ�ع����޹�˾ 具有复合结构的肟酯光引发剂

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3218767B2 (ja) 1992-01-24 2001-10-15 東レ株式会社 感光性導電ペースト
JP3758220B2 (ja) 1995-11-17 2006-03-22 東レ株式会社 感光性導電ペーストおよび電極の製造方法
JP3510761B2 (ja) 1997-03-26 2004-03-29 太陽インキ製造株式会社 アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP3520798B2 (ja) 1998-03-19 2004-04-19 東レ株式会社 プラズマディスプレイ用導電ペ―ストならびにプラズマディスプレイおよびその基板
JP3541125B2 (ja) * 1998-05-01 2004-07-07 太陽インキ製造株式会社 アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
NL1016815C2 (nl) * 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester-fotoinitiatoren.
JP2002072472A (ja) 2000-08-24 2002-03-12 Toray Ind Inc 感光性ペースト
JP2002105112A (ja) * 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd 感光性ペースト組成物及びそれを用いて焼成物パターンを形成したパネル
JP2002351072A (ja) 2001-05-28 2002-12-04 Fuji Photo Film Co Ltd 感光性組成物
JP2002351071A (ja) 2001-05-28 2002-12-04 Fuji Photo Film Co Ltd 感光性組成物
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP4043870B2 (ja) 2002-07-10 2008-02-06 関西ペイント株式会社 半導体レーザー用硬化型樹脂組成物及びその組成を使用したレジストパターン形成方法
JP2004198444A (ja) * 2002-10-25 2004-07-15 Sumitomo Bakelite Co Ltd 感光性銀フィルム及びそれを用いた画像表示装置
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
CN101223478B (zh) * 2005-07-13 2011-10-12 太阳控股株式会社 黑色糊剂组合物及使用其的黑色矩阵图案的形成方法、以及该黑色矩阵图案

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1241562A (zh) * 1998-06-26 2000-01-19 西巴特殊化学品控股有限公司 新的o－酰基肟光引发剂
CN1307693A (zh) * 1998-06-26 2001-08-08 西巴特殊化学品控股有限公司 可光聚合热固性树脂组合物
CN1514845A (zh) * 2001-06-11 2004-07-21 �������⻯ѧƷ�ع����޹�˾ 具有复合结构的肟酯光引发剂

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2002-351071A 2002.12.04
JP特开2002-351072A 2002.12.04
JP特开2004-45596A 2004.02.12

Also Published As

Publication number Publication date
JPWO2007007802A1 (ja) 2009-01-29
CN101223477A (zh) 2008-07-16
KR20080026165A (ko) 2008-03-24
US20080118865A1 (en) 2008-05-22
TWI326005B (enExample) 2010-06-11
JP4834665B2 (ja) 2011-12-14
KR100989744B1 (ko) 2010-10-26
WO2007007802A1 (ja) 2007-01-18
TW200720846A (en) 2007-06-01
US7517632B2 (en) 2009-04-14

Similar Documents

Publication Publication Date Title
US7517632B2 (en) Silver paste composition, method of forming conductive pattern by using the same, and the conductive pattern formed
JP4071171B2 (ja) 感光性導電組成物およびプラズマディスプレイパネル
JP3510761B2 (ja) アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP5393402B2 (ja) 感光性導電ペースト及びその製造方法
US7648814B2 (en) Black paste composition, method of forming black matrix pattern by using the same, and the black matrix pattern formed
KR101451986B1 (ko) 감광성 조성물 및 그의 소성물을 포함하는 패턴
JP5183161B2 (ja) ペースト組成物、及びそれを用いたパターンの形成方法、並びにそのパターン
JP5825963B2 (ja) 感光性導電性樹脂組成物、感光性導電性ペーストおよび導電体パターン
JP5183160B2 (ja) 黒色ペースト組成物、及びそれを用いたブラックマトリックスパターンの形成方法、並びにそのブラックマトリックスパターン
KR100902729B1 (ko) 감광성 도전 페이스트 및 이를 사용하여 형성된 도전체패턴
JP5399193B2 (ja) 感光性導電ペーストおよびその製造方法
JP3943057B2 (ja) アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP2015184631A (ja) 感光性樹脂組成物、二層電極構造体、及びその製造方法並びにプラズマディスプレイパネル
JP3599733B2 (ja) 感光性導電ペースト及びそれを用いて形成した導電体パターン
JP2015184630A (ja) 感光性樹脂組成物、電極構造体、およびその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110831

CF01 Termination of patent right due to non-payment of annual fee