JP4831949B2 - 物理量センサ装置 - Google Patents
物理量センサ装置 Download PDFInfo
- Publication number
- JP4831949B2 JP4831949B2 JP2004260730A JP2004260730A JP4831949B2 JP 4831949 B2 JP4831949 B2 JP 4831949B2 JP 2004260730 A JP2004260730 A JP 2004260730A JP 2004260730 A JP2004260730 A JP 2004260730A JP 4831949 B2 JP4831949 B2 JP 4831949B2
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- circuit chip
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- sensor device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Gyroscopes (AREA)
Description
図1は、本発明の第1実施形態に係る物理量センサ装置としての角速度センサ装置S1の構成を示す図である。図1において、(a)は当該センサ装置S1の概略平面図であり、(b)は同センサ装置S1の概略断面図である。なお、図1(a)は、蓋140を取り外した状態のものを図1(b)の上方から見た図である。
図5は、本発明の第2実施形態に係る物理量センサ装置としての角速度センサ装置S2の概略平面構成を示す図である。なお、図5は、上記蓋140を取り外した状態のものを見た図である。上記実施形態と相違するところを述べる。
なお、回路チップ300とセンサチップ200とはバンプ500を用いたフリップチップ接続でなくてもよく、たとえば、積層された両チップ200、300の間でワイヤボンディングを行い、ボンディングワイヤによる接続を行ってもよい。
Claims (2)
- パッケージ(100)と、
前記パッケージ(100)に収納されて保持された回路チップ(300)と、
前記回路チップ(300)に積層されて固定された物理量検出を行うセンサチップ(200)とを備える物理量センサ装置において、
前記回路チップ(300)と前記パッケージ(100)とは、テープ(410)とリード(420,430)よりなるフレキシブルなテープ状配線部材(400)を介して電気的および機械的に接続されており、
前記テープ状配線部材(400)は、前記回路チップ(300)の外周を取り囲むように設けられており、
前記テープ状配線部材(400)の前記テープ(410)の内周の一部が、前記回路チップ(300)側へ突出しており、この突出部(412)において前記回路チップ(300)に接合されていることを特徴とする物理量センサ装置。 - 前記テープ状配線部材(400)における前記テープ(410)の前記突出部(412)には、当該突出部(412)の面積を小さくするためのスリット(413)が設けられていることを特徴とする請求項1に記載の物理量センサ装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004260730A JP4831949B2 (ja) | 2004-09-08 | 2004-09-08 | 物理量センサ装置 |
US11/208,603 US7468552B2 (en) | 2004-09-08 | 2005-08-23 | Physical quantity sensor |
DE102005041577A DE102005041577A1 (de) | 2004-09-08 | 2005-09-01 | Sensor für eine physikalische Grösse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004260730A JP4831949B2 (ja) | 2004-09-08 | 2004-09-08 | 物理量センサ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006078248A JP2006078248A (ja) | 2006-03-23 |
JP4831949B2 true JP4831949B2 (ja) | 2011-12-07 |
Family
ID=35852759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004260730A Expired - Fee Related JP4831949B2 (ja) | 2004-09-08 | 2004-09-08 | 物理量センサ装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7468552B2 (ja) |
JP (1) | JP4831949B2 (ja) |
DE (1) | DE102005041577A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4786328B2 (ja) * | 2005-12-20 | 2011-10-05 | Okiセミコンダクタ株式会社 | 半導体パッケージ |
US7600429B2 (en) * | 2006-04-20 | 2009-10-13 | Intel Corporation | Vibration spectrum sensor array having differing sensors |
DE102006022807A1 (de) * | 2006-05-16 | 2007-11-22 | Robert Bosch Gmbh | Chipgehäuse mit reduzierter Schwingungseinkopplung |
WO2007147137A2 (en) | 2006-06-15 | 2007-12-21 | Sitime Corporation | Stacked die package for mems resonator system |
JP2008070230A (ja) * | 2006-09-14 | 2008-03-27 | Hitachi Ltd | 物理量検出装置 |
US10266392B2 (en) * | 2007-06-07 | 2019-04-23 | E-Pack, Inc. | Environment-resistant module, micropackage and methods of manufacturing same |
WO2009031285A1 (ja) | 2007-09-03 | 2009-03-12 | Panasonic Corporation | 慣性力センサ |
JP5417737B2 (ja) * | 2008-04-23 | 2014-02-19 | パナソニック株式会社 | 慣性力センサ |
DE102008028299B3 (de) | 2008-06-13 | 2009-07-30 | Epcos Ag | Systemträger für elektronische Komponente und Verfahren für dessen Herstellung |
DE102010030960B4 (de) | 2010-07-06 | 2020-12-10 | Robert Bosch Gmbh | Verfahren zur Herstellung eines schwingungsgedämpften Bauteils |
JP5764898B2 (ja) * | 2010-09-30 | 2015-08-19 | セイコーエプソン株式会社 | センサーデバイスの製造方法 |
DE102011003195B4 (de) | 2011-01-26 | 2019-01-10 | Robert Bosch Gmbh | Bauteil und Verfahren zum Herstellen eines Bauteils |
JP2013044524A (ja) * | 2011-08-21 | 2013-03-04 | Denso Corp | 角速度センサ装置 |
JP5927434B2 (ja) * | 2011-09-30 | 2016-06-01 | パナソニックIpマネジメント株式会社 | 慣性力センサ |
JPWO2014002416A1 (ja) * | 2012-06-25 | 2016-05-30 | パナソニックIpマネジメント株式会社 | 歪センサ |
US9250262B1 (en) * | 2013-02-01 | 2016-02-02 | Maxim Integrated Products, Inc. | Method and apparatus for an integrated isolation mechanical filter with substrate based package |
EP2871455B1 (en) | 2013-11-06 | 2020-03-04 | Invensense, Inc. | Pressure sensor |
EP3367082A1 (en) | 2013-11-06 | 2018-08-29 | Invensense, Inc. | Pressure sensor |
US9863828B2 (en) * | 2014-06-18 | 2018-01-09 | Seiko Epson Corporation | Physical quantity sensor, electronic device, altimeter, electronic apparatus, and mobile object |
EP3076146B1 (en) | 2015-04-02 | 2020-05-06 | Invensense, Inc. | Pressure sensor |
JP6641878B2 (ja) * | 2015-10-21 | 2020-02-05 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
JP2017125753A (ja) * | 2016-01-13 | 2017-07-20 | セイコーエプソン株式会社 | 電子デバイス、電子機器および移動体 |
US11225409B2 (en) | 2018-09-17 | 2022-01-18 | Invensense, Inc. | Sensor with integrated heater |
WO2020236661A1 (en) | 2019-05-17 | 2020-11-26 | Invensense, Inc. | A pressure sensor with improve hermeticity |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6005778A (en) * | 1995-06-15 | 1999-12-21 | Honeywell Inc. | Chip stacking and capacitor mounting arrangement including spacers |
JP3514349B2 (ja) | 1996-02-13 | 2004-03-31 | 株式会社日立国際電気 | マイクロパッケージ構造 |
US6249046B1 (en) * | 1997-02-13 | 2001-06-19 | Seiko Epson Corporation | Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device |
JP3876088B2 (ja) * | 1999-01-29 | 2007-01-31 | ローム株式会社 | 半導体チップおよびマルチチップ型半導体装置 |
JP2002005951A (ja) * | 2000-06-26 | 2002-01-09 | Denso Corp | 半導体力学量センサ及びその製造方法 |
US7081373B2 (en) * | 2001-12-14 | 2006-07-25 | Staktek Group, L.P. | CSP chip stack with flex circuit |
SG120073A1 (en) * | 2002-07-18 | 2006-03-28 | United Test & Assembly Ct Ltd | Multiple chip semiconductor packages |
JP2004087936A (ja) * | 2002-08-28 | 2004-03-18 | Seiko Epson Corp | 半導体装置及び半導体装置の製造方法並びに電子機器 |
US7243545B2 (en) * | 2003-03-20 | 2007-07-17 | Denso Corporation | Physical quantity sensor having spring |
US20050104186A1 (en) * | 2003-11-14 | 2005-05-19 | International Semiconductor Technology Ltd. | Chip-on-film package for image sensor and method for manufacturing the same |
-
2004
- 2004-09-08 JP JP2004260730A patent/JP4831949B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-23 US US11/208,603 patent/US7468552B2/en not_active Expired - Fee Related
- 2005-09-01 DE DE102005041577A patent/DE102005041577A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
JP2006078248A (ja) | 2006-03-23 |
US7468552B2 (en) | 2008-12-23 |
DE102005041577A1 (de) | 2006-03-09 |
US20060049497A1 (en) | 2006-03-09 |
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