JP4831552B1 - Co−Si系銅合金板 - Google Patents
Co−Si系銅合金板 Download PDFInfo
- Publication number
- JP4831552B1 JP4831552B1 JP2011070183A JP2011070183A JP4831552B1 JP 4831552 B1 JP4831552 B1 JP 4831552B1 JP 2011070183 A JP2011070183 A JP 2011070183A JP 2011070183 A JP2011070183 A JP 2011070183A JP 4831552 B1 JP4831552 B1 JP 4831552B1
- Authority
- JP
- Japan
- Prior art keywords
- rolling
- copper alloy
- pickling
- mass
- roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 29
- 229910020711 Co—Si Inorganic materials 0.000 title claims abstract description 22
- 238000005096 rolling process Methods 0.000 claims abstract description 51
- 239000010949 copper Substances 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 230000003746 surface roughness Effects 0.000 claims description 15
- 238000009826 distribution Methods 0.000 claims description 14
- 238000010586 diagram Methods 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910001122 Mischmetal Inorganic materials 0.000 claims description 4
- 229910052790 beryllium Inorganic materials 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 24
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000005554 pickling Methods 0.000 description 44
- 238000005259 measurement Methods 0.000 description 25
- 239000006061 abrasive grain Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 238000005498 polishing Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 239000000956 alloy Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000007654 immersion Methods 0.000 description 6
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011070183A JP4831552B1 (ja) | 2011-03-28 | 2011-03-28 | Co−Si系銅合金板 |
CN201280015350.4A CN103429388B (zh) | 2011-03-28 | 2012-03-07 | Co-Si系铜合金板 |
EP12763618.1A EP2679341B1 (de) | 2011-03-28 | 2012-03-07 | KUPFERLEGIERUNGSPLATTE, DIE Co UND Si ENTHÄLT |
US14/006,880 US20140065441A1 (en) | 2011-03-28 | 2012-03-07 | Co-si based copper alloy plate |
KR1020137022995A KR101569262B1 (ko) | 2011-03-28 | 2012-03-07 | Co-Si 계 구리 합금판 |
PCT/JP2012/055830 WO2012132805A1 (ja) | 2011-03-28 | 2012-03-07 | Co-Si系銅合金板 |
TW101108257A TWI450985B (zh) | 2011-03-28 | 2012-03-12 | Co-Si copper alloy plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011070183A JP4831552B1 (ja) | 2011-03-28 | 2011-03-28 | Co−Si系銅合金板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4831552B1 true JP4831552B1 (ja) | 2011-12-07 |
JP2012201963A JP2012201963A (ja) | 2012-10-22 |
Family
ID=45418147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011070183A Active JP4831552B1 (ja) | 2011-03-28 | 2011-03-28 | Co−Si系銅合金板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140065441A1 (de) |
EP (1) | EP2679341B1 (de) |
JP (1) | JP4831552B1 (de) |
KR (1) | KR101569262B1 (de) |
CN (1) | CN103429388B (de) |
TW (1) | TWI450985B (de) |
WO (1) | WO2012132805A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6126791B2 (ja) | 2012-04-24 | 2017-05-10 | Jx金属株式会社 | Cu−Ni−Si系銅合金 |
TWI612691B (zh) * | 2013-09-02 | 2018-01-21 | Furukawa Electric Co Ltd | 用於光半導體裝置之引線框架用之基體及其製造方法、用有此之用於光半導體裝置之引線框架及其製造方法、及光半導體裝置 |
KR20160117210A (ko) | 2015-03-30 | 2016-10-10 | 제이엑스금속주식회사 | Cu-Ni-Si 계 압연 구리 합금 및 그 제조 방법 |
JP6177299B2 (ja) * | 2015-11-04 | 2017-08-09 | Jx金属株式会社 | メタルマスク材料及びメタルマスク |
US20170208680A1 (en) * | 2016-01-15 | 2017-07-20 | Jx Nippon Mining & Metals Corporation | Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna |
JP2019065361A (ja) * | 2017-10-03 | 2019-04-25 | Jx金属株式会社 | Cu−Ni−Sn系銅合金箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール |
JP7169149B2 (ja) * | 2017-10-20 | 2022-11-10 | 住友化学株式会社 | 非水電解液二次電池用セパレータ |
JP7296757B2 (ja) * | 2019-03-28 | 2023-06-23 | Jx金属株式会社 | 銅合金、伸銅品及び電子機器部品 |
CN112695219A (zh) * | 2020-12-11 | 2021-04-23 | 中南大学 | 一种提高熔炼铸造Cu-Cr-Nb合金强度和导电率的方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01306162A (ja) * | 1988-05-31 | 1989-12-11 | Nippon Steel Corp | 金属箔の連続研摩方法および装置 |
JPH05138525A (ja) * | 1991-11-20 | 1993-06-01 | Tipton Mfg Corp | 乾式バレル研磨法及び乾式メデイア |
JP2006231451A (ja) * | 2005-02-24 | 2006-09-07 | Nitto Shinko Kk | ガラス繊維含有樹脂連続板の製造方法および製造装置 |
JP2009291890A (ja) * | 2008-06-05 | 2009-12-17 | Nicca Chemical Co Ltd | バレル研磨用洗浄剤 |
JP4677505B1 (ja) * | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1112714A (ja) * | 1997-06-25 | 1999-01-19 | Dowa Mining Co Ltd | ダイレクトボンディング性及びはんだ付け性に優れた銅および銅基合金とその製造方法 |
CN1237131C (zh) * | 2001-11-29 | 2006-01-18 | 东洋纺绩株式会社 | 聚酯系被覆膜 |
JP4378502B2 (ja) * | 2004-02-25 | 2009-12-09 | Dowaメタルテック株式会社 | 半導体装置用の放熱板およびその製造法 |
TWI272135B (en) * | 2005-01-31 | 2007-02-01 | Kobe Steel Ltd | Precoated metal sheet and process for producing the same |
JP2008091040A (ja) * | 2006-09-29 | 2008-04-17 | Nikko Kinzoku Kk | 粗化処理用銅合金箔および銅合金箔素材 |
JP4413992B2 (ja) | 2007-10-03 | 2010-02-10 | 古河電気工業株式会社 | 電気・電子部品用銅合金板材 |
CN102112639A (zh) | 2008-07-31 | 2011-06-29 | 古河电气工业株式会社 | 用于电气电子部件的铜合金材料及其制造方法 |
EP2333127A4 (de) * | 2008-08-05 | 2012-07-04 | Furukawa Electric Co Ltd | Kupferlegierungsmaterial für elektrische und elektronische bauteile |
JP4615628B2 (ja) * | 2008-10-22 | 2011-01-19 | 古河電気工業株式会社 | 銅合金材料、電気電子部品および銅合金材料の製造方法 |
JP4972115B2 (ja) * | 2009-03-27 | 2012-07-11 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
JP4629154B1 (ja) * | 2010-03-23 | 2011-02-09 | Jx日鉱日石金属株式会社 | 電子材料用銅合金及びその製造方法 |
-
2011
- 2011-03-28 JP JP2011070183A patent/JP4831552B1/ja active Active
-
2012
- 2012-03-07 CN CN201280015350.4A patent/CN103429388B/zh active Active
- 2012-03-07 KR KR1020137022995A patent/KR101569262B1/ko active IP Right Grant
- 2012-03-07 EP EP12763618.1A patent/EP2679341B1/de active Active
- 2012-03-07 US US14/006,880 patent/US20140065441A1/en not_active Abandoned
- 2012-03-07 WO PCT/JP2012/055830 patent/WO2012132805A1/ja active Application Filing
- 2012-03-12 TW TW101108257A patent/TWI450985B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01306162A (ja) * | 1988-05-31 | 1989-12-11 | Nippon Steel Corp | 金属箔の連続研摩方法および装置 |
JPH05138525A (ja) * | 1991-11-20 | 1993-06-01 | Tipton Mfg Corp | 乾式バレル研磨法及び乾式メデイア |
JP2006231451A (ja) * | 2005-02-24 | 2006-09-07 | Nitto Shinko Kk | ガラス繊維含有樹脂連続板の製造方法および製造装置 |
JP2009291890A (ja) * | 2008-06-05 | 2009-12-17 | Nicca Chemical Co Ltd | バレル研磨用洗浄剤 |
JP4677505B1 (ja) * | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20140065441A1 (en) | 2014-03-06 |
KR20130122667A (ko) | 2013-11-07 |
CN103429388A (zh) | 2013-12-04 |
EP2679341B1 (de) | 2016-07-27 |
KR101569262B1 (ko) | 2015-11-13 |
EP2679341A4 (de) | 2014-12-24 |
TW201245471A (en) | 2012-11-16 |
WO2012132805A1 (ja) | 2012-10-04 |
EP2679341A1 (de) | 2014-01-01 |
JP2012201963A (ja) | 2012-10-22 |
TWI450985B (zh) | 2014-09-01 |
CN103429388B (zh) | 2016-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4831552B1 (ja) | Co−Si系銅合金板 | |
JP5961371B2 (ja) | Ni−Co−Si系銅合金板 | |
JP5916964B2 (ja) | 銅合金板材、コネクタ、および銅合金板材の製造方法 | |
WO2011068135A1 (ja) | 銅合金板材およびその製造方法 | |
JP4948678B2 (ja) | 銅合金板材、これを用いたコネクタ、並びにこれを製造する銅合金板材の製造方法 | |
JP2009256782A (ja) | アルミニウム合金厚板およびその製造方法 | |
KR20120114341A (ko) | 전자 재료용 구리 합금 및 그 제조 방법 | |
JP6863531B2 (ja) | チタン板および銅箔製造ドラム | |
JP2017014584A (ja) | 磁気ディスク用アルミニウム合金ブランク及び磁気ディスク用アルミニウム合金サブストレート | |
JP5937865B2 (ja) | プレス成形性と強度のバランス、及び耐食性に優れた純チタン板の製造方法 | |
WO2017163943A1 (ja) | 磁気ディスク用アルミニウム合金ブランクおよび磁気ディスク用アルミニウム合金サブストレート | |
CN108884520B (zh) | 磁盘用铝合金坯体和磁盘用铝合金基片 | |
JP5609784B2 (ja) | 電解Cu箔製造ドラム用チタン合金厚板とその製造方法 | |
WO2015099098A1 (ja) | 銅合金板材、コネクタ、及び銅合金板材の製造方法 | |
JP5531931B2 (ja) | 板面集合組織の発達した電解Cu箔製造ドラム用チタン合金板とその製造方法 | |
TWI454585B (zh) | 端子和連接器用銅合金板、及端子和連接器用銅合金板的製造方法 | |
WO2020213713A1 (ja) | チタン板、チタン圧延コイル及び銅箔製造ドラム | |
JP5508326B2 (ja) | Co−Si系銅合金板 | |
TWI774682B (zh) | 銅合金輥軋材料及其製造方法以及電氣電子零件 | |
JP2013119640A (ja) | Co−Si系銅合金板 | |
JP5631847B2 (ja) | 圧延銅箔 | |
TWI486462B (zh) | 端子和連接器材料用銅合金板、以及端子和連接器材料用銅合金板的製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20110824 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110912 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110912 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4831552 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140930 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |