EP2679341A4 - Kupferlegierungsplatte auf co-si-basis - Google Patents
Kupferlegierungsplatte auf co-si-basisInfo
- Publication number
- EP2679341A4 EP2679341A4 EP12763618.1A EP12763618A EP2679341A4 EP 2679341 A4 EP2679341 A4 EP 2679341A4 EP 12763618 A EP12763618 A EP 12763618A EP 2679341 A4 EP2679341 A4 EP 2679341A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper alloy
- alloy sheet
- based copper
- sheet
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011070183A JP4831552B1 (ja) | 2011-03-28 | 2011-03-28 | Co−Si系銅合金板 |
PCT/JP2012/055830 WO2012132805A1 (ja) | 2011-03-28 | 2012-03-07 | Co-Si系銅合金板 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2679341A1 EP2679341A1 (de) | 2014-01-01 |
EP2679341A4 true EP2679341A4 (de) | 2014-12-24 |
EP2679341B1 EP2679341B1 (de) | 2016-07-27 |
Family
ID=45418147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12763618.1A Active EP2679341B1 (de) | 2011-03-28 | 2012-03-07 | KUPFERLEGIERUNGSPLATTE, DIE Co UND Si ENTHÄLT |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140065441A1 (de) |
EP (1) | EP2679341B1 (de) |
JP (1) | JP4831552B1 (de) |
KR (1) | KR101569262B1 (de) |
CN (1) | CN103429388B (de) |
TW (1) | TWI450985B (de) |
WO (1) | WO2012132805A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6126791B2 (ja) | 2012-04-24 | 2017-05-10 | Jx金属株式会社 | Cu−Ni−Si系銅合金 |
TWI612691B (zh) * | 2013-09-02 | 2018-01-21 | Furukawa Electric Co Ltd | 用於光半導體裝置之引線框架用之基體及其製造方法、用有此之用於光半導體裝置之引線框架及其製造方法、及光半導體裝置 |
KR20160117210A (ko) | 2015-03-30 | 2016-10-10 | 제이엑스금속주식회사 | Cu-Ni-Si 계 압연 구리 합금 및 그 제조 방법 |
JP6177299B2 (ja) * | 2015-11-04 | 2017-08-09 | Jx金属株式会社 | メタルマスク材料及びメタルマスク |
US20170208680A1 (en) * | 2016-01-15 | 2017-07-20 | Jx Nippon Mining & Metals Corporation | Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna |
JP2019065361A (ja) * | 2017-10-03 | 2019-04-25 | Jx金属株式会社 | Cu−Ni−Sn系銅合金箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール |
JP7169149B2 (ja) * | 2017-10-20 | 2022-11-10 | 住友化学株式会社 | 非水電解液二次電池用セパレータ |
JP7296757B2 (ja) * | 2019-03-28 | 2023-06-23 | Jx金属株式会社 | 銅合金、伸銅品及び電子機器部品 |
CN112695219A (zh) * | 2020-12-11 | 2021-04-23 | 中南大学 | 一种提高熔炼铸造Cu-Cr-Nb合金强度和导电率的方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1112714A (ja) * | 1997-06-25 | 1999-01-19 | Dowa Mining Co Ltd | ダイレクトボンディング性及びはんだ付け性に優れた銅および銅基合金とその製造方法 |
JP2005243821A (ja) * | 2004-02-25 | 2005-09-08 | Dowa Mining Co Ltd | 半導体装置用の放熱板およびその製造法 |
WO2010047373A1 (ja) * | 2008-10-22 | 2010-04-29 | 古河電気工業株式会社 | 銅合金材料、電気電子部品および銅合金材料の製造方法 |
US20100221576A1 (en) * | 2007-10-03 | 2010-09-02 | Kuniteru Mihara | Copper alloy strip material for electrical/electronic components |
JP4629154B1 (ja) * | 2010-03-23 | 2011-02-09 | Jx日鉱日石金属株式会社 | 電子材料用銅合金及びその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01306162A (ja) * | 1988-05-31 | 1989-12-11 | Nippon Steel Corp | 金属箔の連続研摩方法および装置 |
JP3263818B2 (ja) * | 1991-11-20 | 2002-03-11 | 株式会社チップトン | 乾式バレル研磨法及び粗仕上げ乃至中仕上げ用乾式メディア |
CN1237131C (zh) * | 2001-11-29 | 2006-01-18 | 东洋纺绩株式会社 | 聚酯系被覆膜 |
TWI272135B (en) * | 2005-01-31 | 2007-02-01 | Kobe Steel Ltd | Precoated metal sheet and process for producing the same |
JP2006231451A (ja) * | 2005-02-24 | 2006-09-07 | Nitto Shinko Kk | ガラス繊維含有樹脂連続板の製造方法および製造装置 |
JP2008091040A (ja) * | 2006-09-29 | 2008-04-17 | Nikko Kinzoku Kk | 粗化処理用銅合金箔および銅合金箔素材 |
JP2009291890A (ja) * | 2008-06-05 | 2009-12-17 | Nicca Chemical Co Ltd | バレル研磨用洗浄剤 |
CN102112639A (zh) | 2008-07-31 | 2011-06-29 | 古河电气工业株式会社 | 用于电气电子部件的铜合金材料及其制造方法 |
EP2333127A4 (de) * | 2008-08-05 | 2012-07-04 | Furukawa Electric Co Ltd | Kupferlegierungsmaterial für elektrische und elektronische bauteile |
JP4972115B2 (ja) * | 2009-03-27 | 2012-07-11 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
JP4677505B1 (ja) * | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
-
2011
- 2011-03-28 JP JP2011070183A patent/JP4831552B1/ja active Active
-
2012
- 2012-03-07 CN CN201280015350.4A patent/CN103429388B/zh active Active
- 2012-03-07 KR KR1020137022995A patent/KR101569262B1/ko active IP Right Grant
- 2012-03-07 EP EP12763618.1A patent/EP2679341B1/de active Active
- 2012-03-07 US US14/006,880 patent/US20140065441A1/en not_active Abandoned
- 2012-03-07 WO PCT/JP2012/055830 patent/WO2012132805A1/ja active Application Filing
- 2012-03-12 TW TW101108257A patent/TWI450985B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1112714A (ja) * | 1997-06-25 | 1999-01-19 | Dowa Mining Co Ltd | ダイレクトボンディング性及びはんだ付け性に優れた銅および銅基合金とその製造方法 |
JP2005243821A (ja) * | 2004-02-25 | 2005-09-08 | Dowa Mining Co Ltd | 半導体装置用の放熱板およびその製造法 |
US20100221576A1 (en) * | 2007-10-03 | 2010-09-02 | Kuniteru Mihara | Copper alloy strip material for electrical/electronic components |
WO2010047373A1 (ja) * | 2008-10-22 | 2010-04-29 | 古河電気工業株式会社 | 銅合金材料、電気電子部品および銅合金材料の製造方法 |
JP4629154B1 (ja) * | 2010-03-23 | 2011-02-09 | Jx日鉱日石金属株式会社 | 電子材料用銅合金及びその製造方法 |
EP2551384A1 (de) * | 2010-03-23 | 2013-01-30 | JX Nippon Mining & Metals Corporation | Kupferlegierung für ein elektronisches material und herstellungsverfahren dafür |
Also Published As
Publication number | Publication date |
---|---|
US20140065441A1 (en) | 2014-03-06 |
KR20130122667A (ko) | 2013-11-07 |
CN103429388A (zh) | 2013-12-04 |
EP2679341B1 (de) | 2016-07-27 |
KR101569262B1 (ko) | 2015-11-13 |
TW201245471A (en) | 2012-11-16 |
JP4831552B1 (ja) | 2011-12-07 |
WO2012132805A1 (ja) | 2012-10-04 |
EP2679341A1 (de) | 2014-01-01 |
JP2012201963A (ja) | 2012-10-22 |
TWI450985B (zh) | 2014-09-01 |
CN103429388B (zh) | 2016-10-05 |
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