JP4817575B2 - 渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法 - Google Patents

渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法 Download PDF

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Publication number
JP4817575B2
JP4817575B2 JP2001547540A JP2001547540A JP4817575B2 JP 4817575 B2 JP4817575 B2 JP 4817575B2 JP 2001547540 A JP2001547540 A JP 2001547540A JP 2001547540 A JP2001547540 A JP 2001547540A JP 4817575 B2 JP4817575 B2 JP 4817575B2
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Prior art keywords
sample
eddy current
signal
probe
film
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Expired - Fee Related
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Japanese (ja)
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JP2003522937A (ja
Inventor
レーマン・カート・アール．
リー・シング・エム．
ジョンソン・ウォルト
フィールデン・ジョン
チャオ・グオヘング
ニコーナハド・メアダッド
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KLA Corp
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KLA Corp
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Priority claimed from US09/633,800 external-priority patent/US6707540B1/en
Priority claimed from US09/633,198 external-priority patent/US6433541B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Pathology (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2001547540A 1999-12-23 2000-12-22 渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法 Expired - Fee Related JP4817575B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US17208099P 1999-12-23 1999-12-23
US60/172,080 1999-12-23
US09/633,198 2000-08-07
US09/633,800 2000-08-07
US09/633,800 US6707540B1 (en) 1999-12-23 2000-08-07 In-situ metalization monitoring using eddy current and optical measurements
US09/633,198 US6433541B1 (en) 1999-12-23 2000-08-07 In-situ metalization monitoring using eddy current measurements during the process for removing the film
PCT/US2000/035358 WO2001046684A1 (fr) 1999-12-23 2000-12-22 Surveillance de metallisation sur site a l'aide de mesures par courant de foucault et de mesures optiques

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011048928A Division JP5113920B2 (ja) 1999-12-23 2011-03-07 Ｃｍｐシステム、及び、渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法

Publications (2)

Publication Number Publication Date
JP2003522937A JP2003522937A (ja) 2003-07-29
JP4817575B2 true JP4817575B2 (ja) 2011-11-16

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JP2001547540A Expired - Fee Related JP4817575B2 (ja) 1999-12-23 2000-12-22 渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法
JP2011048928A Expired - Lifetime JP5113920B2 (ja) 1999-12-23 2011-03-07 Ｃｍｐシステム、及び、渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011048928A Expired - Lifetime JP5113920B2 (ja) 1999-12-23 2011-03-07 Ｃｍｐシステム、及び、渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法

Country Status (3)

Country Link
EP (1) EP1244907A1 (fr)
JP (2) JP4817575B2 (fr)
WO (1) WO2001046684A1 (fr)

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US6924641B1 (en) 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US6878038B2 (en) 2000-07-10 2005-04-12 Applied Materials Inc. Combined eddy current sensing and optical monitoring for chemical mechanical polishing
US6602724B2 (en) * 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring
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US6608495B2 (en) 2001-03-19 2003-08-19 Applied Materials, Inc. Eddy-optic sensor for object inspection
US6966816B2 (en) 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
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US7205166B2 (en) * 2002-06-28 2007-04-17 Lam Research Corporation Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
US6788050B2 (en) * 2002-12-23 2004-09-07 Lam Research Corp. System, method and apparatus for thin-film substrate signal separation using eddy current
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US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus
US7112960B2 (en) 2003-07-31 2006-09-26 Applied Materials, Inc. Eddy current system for in-situ profile measurement
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
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JP4699797B2 (ja) * 2005-04-20 2011-06-15 株式会社リベックス 測定方法および装置
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KR102326730B1 (ko) * 2014-03-12 2021-11-17 가부시키가이샤 에바라 세이사꾸쇼 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서
JP6445771B2 (ja) * 2014-03-12 2018-12-26 株式会社荏原製作所 膜厚測定値の補正方法、及び、膜厚補正器
KR102083607B1 (ko) * 2014-12-12 2020-04-16 주식회사 케이씨텍 화학 기계적 연마 장치
US11004708B2 (en) 2016-10-28 2021-05-11 Applied Materials, Inc. Core configuration with alternating posts for in-situ electromagnetic induction monitoring system
KR102489419B1 (ko) 2017-01-13 2023-01-18 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 모니터링으로부터의 측정들의 비저항 기반 조정
TWI789385B (zh) * 2017-04-21 2023-01-11 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
US10898986B2 (en) 2017-09-15 2021-01-26 Applied Materials, Inc. Chattering correction for accurate sensor position determination on wafer
TWI825075B (zh) * 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
JP7153490B2 (ja) * 2018-07-13 2022-10-14 株式会社荏原製作所 研磨装置およびキャリブレーション方法
JP2023517449A (ja) 2020-05-14 2023-04-26 アプライド マテリアルズ インコーポレイテッド 研磨中のインシトゥモニタリングで使用するためのニューラルネットワークをトレーニングするための技術及び研磨システム
CN115038549B (zh) 2020-06-24 2024-03-12 应用材料公司 使用研磨垫磨损补偿的基板层厚度确定
CN115605725A (zh) * 2020-08-25 2023-01-13 康宁股份有限公司（Us） 原位沉积厚度监测
JP7396382B2 (ja) 2022-03-10 2023-12-12 沖電気工業株式会社 光ファイバセンサ及びブリルアン周波数シフト測定方法
JP7351365B1 (ja) 2022-03-17 2023-09-27 沖電気工業株式会社 光ファイバセンサ及びブリルアン周波数シフト測定方法

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Publication number Publication date
EP1244907A1 (fr) 2002-10-02
WO2001046684A1 (fr) 2001-06-28
JP2003522937A (ja) 2003-07-29
JP2011164110A (ja) 2011-08-25
WO2001046684A9 (fr) 2002-05-23
JP5113920B2 (ja) 2013-01-09

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