JP4817575B2 - 渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法 - Google Patents

渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法 Download PDF

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Publication number
JP4817575B2
JP4817575B2 JP2001547540A JP2001547540A JP4817575B2 JP 4817575 B2 JP4817575 B2 JP 4817575B2 JP 2001547540 A JP2001547540 A JP 2001547540A JP 2001547540 A JP2001547540 A JP 2001547540A JP 4817575 B2 JP4817575 B2 JP 4817575B2
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Prior art keywords
sample
eddy current
signal
probe
film
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Expired - Fee Related
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Japanese (ja)
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JP2003522937A (ja
Inventor
レーマン・カート・アール．
リー・シング・エム．
ジョンソン・ウォルト
フィールデン・ジョン
チャオ・グオヘング
ニコーナハド・メアダッド
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KLA Corp
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KLA Corp
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Priority claimed from US09/633,800 external-priority patent/US6707540B1/en
Priority claimed from US09/633,198 external-priority patent/US6433541B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Pathology (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2001547540A 1999-12-23 2000-12-22 渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法 Expired - Fee Related JP4817575B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US17208099P 1999-12-23 1999-12-23
US60/172,080 1999-12-23
US09/633,198 2000-08-07
US09/633,800 US6707540B1 (en) 1999-12-23 2000-08-07 In-situ metalization monitoring using eddy current and optical measurements
US09/633,800 2000-08-07
US09/633,198 US6433541B1 (en) 1999-12-23 2000-08-07 In-situ metalization monitoring using eddy current measurements during the process for removing the film
PCT/US2000/035358 WO2001046684A1 (fr) 1999-12-23 2000-12-22 Surveillance de metallisation sur site a l'aide de mesures par courant de foucault et de mesures optiques

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011048928A Division JP5113920B2 (ja) 1999-12-23 2011-03-07 Ｃｍｐシステム、及び、渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法

Publications (2)

Publication Number Publication Date
JP2003522937A JP2003522937A (ja) 2003-07-29
JP4817575B2 true JP4817575B2 (ja) 2011-11-16

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JP2001547540A Expired - Fee Related JP4817575B2 (ja) 1999-12-23 2000-12-22 渦電流測定を利用して、メタライゼーション処理を実状態で監視する方法
JP2011048928A Expired - Lifetime JP5113920B2 (ja) 1999-12-23 2011-03-07 Ｃｍｐシステム、及び、渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011048928A Expired - Lifetime JP5113920B2 (ja) 1999-12-23 2011-03-07 Ｃｍｐシステム、及び、渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法

Country Status (3)

Country Link
EP (1) EP1244907A1 (fr)
JP (2) JP4817575B2 (fr)
WO (1) WO2001046684A1 (fr)

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US6924641B1 (en) 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US6878038B2 (en) 2000-07-10 2005-04-12 Applied Materials Inc. Combined eddy current sensing and optical monitoring for chemical mechanical polishing
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US6608495B2 (en) 2001-03-19 2003-08-19 Applied Materials, Inc. Eddy-optic sensor for object inspection
US6966816B2 (en) 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
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ITFI20020077A1 (it) * 2002-05-10 2003-11-10 Galileo Vacuum Systems S R L Dispositivo per la determinazione dello spessore di uno strato conduttivo
US7205166B2 (en) * 2002-06-28 2007-04-17 Lam Research Corporation Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
US6788050B2 (en) * 2002-12-23 2004-09-07 Lam Research Corp. System, method and apparatus for thin-film substrate signal separation using eddy current
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US7101257B2 (en) * 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus
US7112960B2 (en) 2003-07-31 2006-09-26 Applied Materials, Inc. Eddy current system for in-situ profile measurement
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
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JP4699797B2 (ja) * 2005-04-20 2011-06-15 株式会社リベックス 測定方法および装置
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JP6445771B2 (ja) * 2014-03-12 2018-12-26 株式会社荏原製作所 膜厚測定値の補正方法、及び、膜厚補正器
KR102326730B1 (ko) * 2014-03-12 2021-11-17 가부시키가이샤 에바라 세이사꾸쇼 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서
KR102083607B1 (ko) * 2014-12-12 2020-04-16 주식회사 케이씨텍 화학 기계적 연마 장치
WO2018080764A1 (fr) 2016-10-28 2018-05-03 Applied Materials, Inc. Configuration de noyau à montants alternés pour système de surveillance d'induction électromagnétique in situ
US11079459B2 (en) 2017-01-13 2021-08-03 Applied Materials, Inc. Resistivity-based calibration of in-situ electromagnetic inductive monitoring
TWI789385B (zh) * 2017-04-21 2023-01-11 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
US10898986B2 (en) 2017-09-15 2021-01-26 Applied Materials, Inc. Chattering correction for accurate sensor position determination on wafer
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
JP7083279B2 (ja) * 2018-06-22 2022-06-10 株式会社荏原製作所 渦電流センサの軌道を特定する方法、基板の研磨の進行度を算出する方法、基板研磨装置の動作を停止する方法および基板研磨の進行度を均一化する方法、これらの方法を実行するためのプログラムならびに当該プログラムが記録された非一過性の記録媒体
JP7153490B2 (ja) * 2018-07-13 2022-10-14 株式会社荏原製作所 研磨装置およびキャリブレーション方法
WO2021231427A1 (fr) 2020-05-14 2021-11-18 Applied Materials, Inc. Technique d'apprentissage de réseau neuronal destiné à être utilisé dans une surveillance in situ pendant un polissage et système de polissage
CN115038549B (zh) 2020-06-24 2024-03-12 应用材料公司 使用研磨垫磨损补偿的基板层厚度确定
EP4204757A1 (fr) 2020-08-25 2023-07-05 Corning Incorporated Surveillance d'épaisseur de dépôt in situ
JP7493414B2 (ja) 2020-08-25 2024-05-31 株式会社荏原製作所 渦電流センサの出力信号処理装置
CN112611800B (zh) * 2020-11-16 2024-07-30 江苏安泰安全技术有限公司 一种检测压力设备表面微裂纹的快速扫描方法和系统
JP7396382B2 (ja) * 2022-03-10 2023-12-12 沖電気工業株式会社 光ファイバセンサ及びブリルアン周波数シフト測定方法
JP7351365B1 (ja) 2022-03-17 2023-09-27 沖電気工業株式会社 光ファイバセンサ及びブリルアン周波数シフト測定方法

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Publication number Publication date
JP5113920B2 (ja) 2013-01-09
JP2003522937A (ja) 2003-07-29
EP1244907A1 (fr) 2002-10-02
WO2001046684A9 (fr) 2002-05-23
WO2001046684A1 (fr) 2001-06-28
JP2011164110A (ja) 2011-08-25

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