JPH0286128U - - Google Patents
Info
- Publication number
- JPH0286128U JPH0286128U JP16625188U JP16625188U JPH0286128U JP H0286128 U JPH0286128 U JP H0286128U JP 16625188 U JP16625188 U JP 16625188U JP 16625188 U JP16625188 U JP 16625188U JP H0286128 U JPH0286128 U JP H0286128U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- polishing
- polishing cloth
- surface plate
- fixed surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16625188U JPH0286128U (fr) | 1988-12-21 | 1988-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16625188U JPH0286128U (fr) | 1988-12-21 | 1988-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286128U true JPH0286128U (fr) | 1990-07-09 |
Family
ID=31453471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16625188U Pending JPH0286128U (fr) | 1988-12-21 | 1988-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286128U (fr) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04255218A (ja) * | 1990-08-06 | 1992-09-10 | Micron Technol Inc | 平坦なウエーハを研磨する方法及びその装置 |
| WO2001056068A1 (fr) * | 2000-01-25 | 2001-08-02 | Nikon Corporation | Systeme de controle et procede associe, dispositif de polissage et procede de fabrication d'une tranche de silicium |
| US7037403B1 (en) | 1992-12-28 | 2006-05-02 | Applied Materials Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
| KR100576890B1 (ko) * | 1998-03-10 | 2006-05-03 | 램 리서치 코퍼레이션 | 이동 가능한 윈도우를 갖춘 웨이퍼 정밀 연마 장치 |
| KR100555169B1 (ko) * | 1996-06-28 | 2006-05-26 | 어플라이드 머티어리얼즈 인코포레이티드 | 박막검사방법 |
| JP2011164110A (ja) * | 1999-12-23 | 2011-08-25 | Kla-Tencor Corp | 渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法 |
| JP2012256913A (ja) * | 2005-08-22 | 2012-12-27 | Applied Materials Inc | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
-
1988
- 1988-12-21 JP JP16625188U patent/JPH0286128U/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04255218A (ja) * | 1990-08-06 | 1992-09-10 | Micron Technol Inc | 平坦なウエーハを研磨する方法及びその装置 |
| US7037403B1 (en) | 1992-12-28 | 2006-05-02 | Applied Materials Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
| US7569119B2 (en) | 1992-12-28 | 2009-08-04 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
| US7582183B2 (en) | 1992-12-28 | 2009-09-01 | Applied Materials, Inc. | Apparatus for detection of thin films during chemical/mechanical polishing planarization |
| KR100555169B1 (ko) * | 1996-06-28 | 2006-05-26 | 어플라이드 머티어리얼즈 인코포레이티드 | 박막검사방법 |
| KR100576890B1 (ko) * | 1998-03-10 | 2006-05-03 | 램 리서치 코퍼레이션 | 이동 가능한 윈도우를 갖춘 웨이퍼 정밀 연마 장치 |
| JP2011164110A (ja) * | 1999-12-23 | 2011-08-25 | Kla-Tencor Corp | 渦電流測定あるいは光学測定を利用して、メタライゼーション処理を実状態で監視する方法 |
| WO2001056068A1 (fr) * | 2000-01-25 | 2001-08-02 | Nikon Corporation | Systeme de controle et procede associe, dispositif de polissage et procede de fabrication d'une tranche de silicium |
| US6916225B2 (en) | 2000-01-25 | 2005-07-12 | Nikon Corporation | Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
| JP2012256913A (ja) * | 2005-08-22 | 2012-12-27 | Applied Materials Inc | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |