JP4744175B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4744175B2
JP4744175B2 JP2005100584A JP2005100584A JP4744175B2 JP 4744175 B2 JP4744175 B2 JP 4744175B2 JP 2005100584 A JP2005100584 A JP 2005100584A JP 2005100584 A JP2005100584 A JP 2005100584A JP 4744175 B2 JP4744175 B2 JP 4744175B2
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Japan
Prior art keywords
exhaust
unit
transfer chamber
air supply
filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005100584A
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English (en)
Japanese (ja)
Other versions
JP2006286682A (ja
Inventor
義明 佐々木
雄介 村木
栄一 西村
優子 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005100584A priority Critical patent/JP4744175B2/ja
Priority to US11/391,390 priority patent/US8353986B2/en
Priority to KR1020060028187A priority patent/KR100795766B1/ko
Priority to CNB2006100671143A priority patent/CN100433248C/zh
Publication of JP2006286682A publication Critical patent/JP2006286682A/ja
Application granted granted Critical
Publication of JP4744175B2 publication Critical patent/JP4744175B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Treating Waste Gases (AREA)
  • Separation Of Gases By Adsorption (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
  • Drying Of Semiconductors (AREA)
  • Ventilation (AREA)
JP2005100584A 2005-03-31 2005-03-31 基板処理装置 Active JP4744175B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005100584A JP4744175B2 (ja) 2005-03-31 2005-03-31 基板処理装置
US11/391,390 US8353986B2 (en) 2005-03-31 2006-03-29 Substrate processing apparatus
KR1020060028187A KR100795766B1 (ko) 2005-03-31 2006-03-29 기판 처리 장치
CNB2006100671143A CN100433248C (zh) 2005-03-31 2006-03-31 基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005100584A JP4744175B2 (ja) 2005-03-31 2005-03-31 基板処理装置

Publications (2)

Publication Number Publication Date
JP2006286682A JP2006286682A (ja) 2006-10-19
JP4744175B2 true JP4744175B2 (ja) 2011-08-10

Family

ID=37030600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005100584A Active JP4744175B2 (ja) 2005-03-31 2005-03-31 基板処理装置

Country Status (3)

Country Link
JP (1) JP4744175B2 (zh)
KR (1) KR100795766B1 (zh)
CN (1) CN100433248C (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5030410B2 (ja) * 2005-09-28 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
JP4584821B2 (ja) * 2005-12-14 2010-11-24 東京エレクトロン株式会社 真空処理装置及び帯状気流形成装置
JP2008296069A (ja) * 2007-05-29 2008-12-11 Kondo Kogyo Kk 薄板状物製造装置における、微粒子、または微粒子並びに有害ガスの除去を目的とする空気清浄装置
KR100888044B1 (ko) * 2007-07-04 2009-03-10 스템코 주식회사 반도체 부품 제조 장치
JP4359640B2 (ja) * 2007-09-25 2009-11-04 東京エレクトロン株式会社 基板搬送装置及びダウンフロー制御方法
JP5387412B2 (ja) * 2007-11-21 2014-01-15 株式会社安川電機 搬送ロボット、筐体、半導体製造装置およびソータ装置
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
US8827695B2 (en) * 2008-06-23 2014-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer's ambiance control
JP5268659B2 (ja) * 2009-01-07 2013-08-21 東京エレクトロン株式会社 基板収納方法及び記憶媒体
JP2010182834A (ja) * 2009-02-04 2010-08-19 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP5465979B2 (ja) * 2009-10-26 2014-04-09 東京エレクトロン株式会社 半導体製造装置
JP5689294B2 (ja) * 2010-11-25 2015-03-25 東京エレクトロン株式会社 処理装置
TW201413780A (zh) * 2012-09-24 2014-04-01 Eugene Technology Co Ltd 煙氣移除設備及基板處理設備
JP6599599B2 (ja) * 2014-01-31 2019-10-30 シンフォニアテクノロジー株式会社 Ｅｆｅｍシステム
JP6349750B2 (ja) * 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP6291878B2 (ja) 2014-01-31 2018-03-14 シンフォニアテクノロジー株式会社 ロードポート及びｅｆｅｍ
JP6348754B2 (ja) * 2014-04-03 2018-06-27 日本エアーテック株式会社 分割可能型排気装置および分割可能型排気装置の使用方法
KR102444876B1 (ko) * 2015-11-12 2022-09-19 세메스 주식회사 기판 처리 장치
CN106517823A (zh) * 2016-12-27 2017-03-22 江苏宜达新材料科技股份有限公司 一种节能玻璃制品清洗水回收处理箱
JP6710178B2 (ja) * 2017-04-27 2020-06-17 三菱電機株式会社 半導体製造装置
JP7140960B2 (ja) 2018-03-15 2022-09-22 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP7206678B2 (ja) 2018-07-30 2023-01-18 Tdk株式会社 ロードポート装置、半導体製造装置及びポッド内雰囲気の制御方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929248B2 (ja) * 1991-04-29 1999-08-03 東京エレクトロン株式会社 清浄化装置
JPH0689837A (ja) * 1992-09-08 1994-03-29 Fujitsu Ltd 基板処理装置
JP3334929B2 (ja) 1993-02-04 2002-10-15 東京エレクトロン株式会社 熱処理装置
JP2984969B2 (ja) * 1993-11-12 1999-11-29 東京エレクトロン株式会社 処理システム
JPH08306599A (ja) * 1995-04-27 1996-11-22 Nikon Corp 空気浄化装置及び露光装置
JP3225344B2 (ja) * 1996-01-26 2001-11-05 東京エレクトロン株式会社 処理装置
JPH1140770A (ja) * 1997-07-18 1999-02-12 Nec Corp 半導体装置の製造方法および半導体製造装置
JP3425592B2 (ja) * 1997-08-12 2003-07-14 東京エレクトロン株式会社 処理装置
JPH1187204A (ja) * 1997-09-05 1999-03-30 Texas Instr Japan Ltd 半導体ウエハ処理装置用クリーンルームシステム
JPH11294817A (ja) 1998-04-16 1999-10-29 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JPH11314703A (ja) * 1998-04-30 1999-11-16 Ebara Corp 基板保管装置
JP2000188320A (ja) * 1998-12-24 2000-07-04 Hitachi Ltd 局所クリーンシステム
JP2000294530A (ja) 1999-04-06 2000-10-20 Nec Corp 半導体基板の洗浄方法及びその洗浄装置
JP2000346417A (ja) * 1999-06-07 2000-12-15 Hiroshima Nippon Denki Kk 緊急空気清浄化システムとそのフィルター
JP2001358197A (ja) * 2000-06-16 2001-12-26 Tokyo Electron Ltd 基板処理装置
JP4038352B2 (ja) * 2001-08-24 2008-01-23 株式会社日立産機システム クリーンルーム
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
JP4326784B2 (ja) * 2002-11-11 2009-09-09 株式会社半導体エネルギー研究所 生産システム
JP4320158B2 (ja) * 2002-11-12 2009-08-26 株式会社日立ハイテクノロジーズ 局所クリーン化搬送室および局所クリーン化処理装置
JP3830478B2 (ja) * 2003-09-22 2006-10-04 東京エレクトロン株式会社 基板の搬送システム及び基板の搬送方法

Also Published As

Publication number Publication date
KR100795766B1 (ko) 2008-01-21
CN100433248C (zh) 2008-11-12
CN1841655A (zh) 2006-10-04
KR20060106730A (ko) 2006-10-12
JP2006286682A (ja) 2006-10-19

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