JP4719790B2 - 補強板貼り付け装置 - Google Patents

補強板貼り付け装置 Download PDF

Info

Publication number
JP4719790B2
JP4719790B2 JP2008502642A JP2008502642A JP4719790B2 JP 4719790 B2 JP4719790 B2 JP 4719790B2 JP 2008502642 A JP2008502642 A JP 2008502642A JP 2008502642 A JP2008502642 A JP 2008502642A JP 4719790 B2 JP4719790 B2 JP 4719790B2
Authority
JP
Japan
Prior art keywords
reinforcing plate
base film
pasting
tape
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2008502642A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2007099654A1 (ja
Inventor
和彦 河東
Original Assignee
株式会社 ベアック
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 ベアック filed Critical 株式会社 ベアック
Priority to JP2008502642A priority Critical patent/JP4719790B2/ja
Publication of JPWO2007099654A1 publication Critical patent/JPWO2007099654A1/ja
Application granted granted Critical
Publication of JP4719790B2 publication Critical patent/JP4719790B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP2008502642A 2006-03-03 2006-05-29 補強板貼り付け装置 Expired - Lifetime JP4719790B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008502642A JP4719790B2 (ja) 2006-03-03 2006-05-29 補強板貼り付け装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPPCT/JP2006/304176 2006-03-03
PCT/JP2006/304176 WO2007099645A1 (ja) 2006-03-03 2006-03-03 補強板貼り付け装置、補強板型抜き用金型及びフレキシブル基板
PCT/JP2006/310623 WO2007099654A1 (ja) 2006-03-03 2006-05-29 補強板貼り付け装置、補強板型抜き用金型、補強板生成用裁断装置、フレキシブル基板及び電子機器
JP2008502642A JP4719790B2 (ja) 2006-03-03 2006-05-29 補強板貼り付け装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011017794A Division JP5113273B2 (ja) 2006-03-03 2011-01-31 補強板貼り付け装置、補強板型抜き用金型、補強板生成用裁断装置、フレキシブル基板及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2007099654A1 JPWO2007099654A1 (ja) 2009-07-16
JP4719790B2 true JP4719790B2 (ja) 2011-07-06

Family

ID=38458770

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008502642A Expired - Lifetime JP4719790B2 (ja) 2006-03-03 2006-05-29 補強板貼り付け装置
JP2011017794A Expired - Lifetime JP5113273B2 (ja) 2006-03-03 2011-01-31 補強板貼り付け装置、補強板型抜き用金型、補強板生成用裁断装置、フレキシブル基板及び電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011017794A Expired - Lifetime JP5113273B2 (ja) 2006-03-03 2011-01-31 補強板貼り付け装置、補強板型抜き用金型、補強板生成用裁断装置、フレキシブル基板及び電子機器

Country Status (2)

Country Link
JP (2) JP4719790B2 (enExample)
WO (2) WO2007099645A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200135120A (ko) * 2019-05-22 2020-12-02 베아크 가부시끼가이샤 첩부 장치 및 첩부 방법

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4371276B2 (ja) * 2006-11-27 2009-11-25 Ｊｐテック株式会社 貼付装置
KR101113004B1 (ko) 2010-02-22 2012-02-24 세호로보트 주식회사 보강부재의 부착장치
CN104159407B (zh) * 2014-08-26 2017-04-19 安捷利电子科技（苏州）有限公司 一种高精度小尺寸补强贴合方法
US9504163B2 (en) * 2014-08-28 2016-11-22 Wojciech B. Kosmowski Y axis beam positioning system for a PCB drilling machine
CN109496074B (zh) * 2018-12-18 2024-08-02 深圳市欣中大自动化技术有限公司 一种全自动fpc补强贴合装置
CN110602885B (zh) * 2019-08-29 2024-03-19 深圳市今日之星电子科技有限公司 一种冲孔补强板贴合装置
CN112040630B (zh) * 2020-07-28 2024-11-26 深圳市鑫达辉软性电路科技有限公司 一种柔性电路的超厚异形补强片的加工方法
CN112895470B (zh) * 2021-03-20 2024-10-11 东莞市弘胜机械科技有限公司 一种片料冷热多层复合装置
CN113825311B (zh) * 2021-08-27 2023-03-21 深圳市鑫达辉软性电路科技有限公司 补强胶纸吸附贴合治具
JP7070956B1 (ja) * 2021-10-26 2022-05-18 株式会社 ベアック 貼付装置
CN114506094B (zh) * 2022-01-18 2024-01-30 上海伽材新材料科技有限公司 一种预浸料铺贴定位方法
CN116533537B (zh) * 2023-07-06 2023-08-29 微网优联科技(成都)有限公司 一种用于摄像头模组的镜头的高精密连续贴膜装置及方法
CN120358676B (zh) * 2025-06-25 2025-08-26 赣州光通电子有限公司 一种fpc线板补强板贴合机

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608045A (ja) * 1983-06-27 1985-01-16 Nitto Electric Ind Co Ltd 粘着フイルム貼付方法
JPH0226095A (ja) * 1988-07-14 1990-01-29 Fujikura Ltd フレキシブル配線基板用補強板貼り合わせ装置
JPH03228A (ja) * 1989-05-29 1991-01-07 Hitachi Cable Ltd フィルム貼り付け装置
JPH03101934A (ja) * 1989-03-29 1991-04-26 Somar Corp フィルム張付装置
JPH03293793A (ja) * 1990-04-11 1991-12-25 Fujikura Ltd フレキシブルプリント基板における補強板の取付装置
JPH07195527A (ja) * 1993-12-29 1995-08-01 Nitto Denko Corp 基板への粘着フィルム貼着装置
JP2003062912A (ja) * 2001-08-27 2003-03-05 Hitachi Industries Co Ltd フィルム貼合せ装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03195079A (ja) * 1989-12-25 1991-08-26 Sony Corp フレキシブル回路基板元材及びフレキシブル回路基板の製造方法
JPH10177182A (ja) * 1996-12-16 1998-06-30 Hitachi Electron Eng Co Ltd 液晶パネルのｐｃｂ圧着装置
JP2004314436A (ja) * 2003-04-16 2004-11-11 Fujikura Ltd 積層体の製造方法及びその装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608045A (ja) * 1983-06-27 1985-01-16 Nitto Electric Ind Co Ltd 粘着フイルム貼付方法
JPH0226095A (ja) * 1988-07-14 1990-01-29 Fujikura Ltd フレキシブル配線基板用補強板貼り合わせ装置
JPH03101934A (ja) * 1989-03-29 1991-04-26 Somar Corp フィルム張付装置
JPH03228A (ja) * 1989-05-29 1991-01-07 Hitachi Cable Ltd フィルム貼り付け装置
JPH03293793A (ja) * 1990-04-11 1991-12-25 Fujikura Ltd フレキシブルプリント基板における補強板の取付装置
JPH07195527A (ja) * 1993-12-29 1995-08-01 Nitto Denko Corp 基板への粘着フィルム貼着装置
JP2003062912A (ja) * 2001-08-27 2003-03-05 Hitachi Industries Co Ltd フィルム貼合せ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200135120A (ko) * 2019-05-22 2020-12-02 베아크 가부시끼가이샤 첩부 장치 및 첩부 방법
KR102298472B1 (ko) * 2019-05-22 2021-09-03 베아크 가부시끼가이샤 첩부 장치 및 첩부 방법

Also Published As

Publication number Publication date
JPWO2007099654A1 (ja) 2009-07-16
JP5113273B2 (ja) 2013-01-09
WO2007099645A1 (ja) 2007-09-07
WO2007099654A1 (ja) 2007-09-07
JP2011156869A (ja) 2011-08-18

Similar Documents

Publication Publication Date Title
JP5113273B2 (ja) 補強板貼り付け装置、補強板型抜き用金型、補強板生成用裁断装置、フレキシブル基板及び電子機器
JP4097679B2 (ja) カバーレイフィルム貼り合わせ装置
CN101953238B (zh) 薄膜贴合装置、小片部件的转移设置装置及其头部装置
JP2012084688A (ja) 両面粘着テープ貼付け方法および両面粘着テープ貼付け装置
KR101079950B1 (ko) 인쇄회로기판의 가접장치
JP2010168214A (ja) フィルム貼着装置
KR101182847B1 (ko) 보강판 부착장치
JP2019140286A (ja) フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造装置
JP2007036198A (ja) プリント配線板及びその製造方法
JP4892551B2 (ja) カバーレイフィルム貼り合わせ装置
JP3722053B2 (ja) 板材の連結方法及び板材連結装置
JP2007302398A (ja) 接合シート貼付装置及び方法
JP4776701B2 (ja) フィルム貼り合わせ装置
JP4877848B2 (ja) 小片部材の移載定置装置
JP4202376B2 (ja) 半導体装置の製造装置及び半導体装置の製造方法
JP4818008B2 (ja) 異方導電性テープの貼着装置および電気機器の製造方法
JP3780875B2 (ja) 連結した回路板の切断方法
JP5408183B2 (ja) Ａｃｆ貼着装置、部品実装システム、ａｃｆ貼着方法及び部品実装方法
JP4776700B2 (ja) ヘッド装置
JP4778796B2 (ja) プリント配線板の単板接続装置
JP2006142629A (ja) フィルム貼合方法及びフィルム貼合装置
JP4950647B2 (ja) プリント配線板の単板接続装置及びその方法
JP7205896B2 (ja) 貼り付け装置および貼り付け方法
JP2006165072A (ja) 基板端面自動清掃装置及び配線基板の製造方法
JP2005203533A (ja) 樹脂フィルム貼付装置および樹脂フィルム貼付方法

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110131

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110308

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110404

R150 Certificate of patent or registration of utility model

Ref document number: 4719790

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140408

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term