JP4716668B2 - 被着物の加熱剥離方法及び被着物加熱剥離装置 - Google Patents
被着物の加熱剥離方法及び被着物加熱剥離装置 Download PDFInfo
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- JP4716668B2 JP4716668B2 JP2004125331A JP2004125331A JP4716668B2 JP 4716668 B2 JP4716668 B2 JP 4716668B2 JP 2004125331 A JP2004125331 A JP 2004125331A JP 2004125331 A JP2004125331 A JP 2004125331A JP 4716668 B2 JP4716668 B2 JP 4716668B2
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- heat
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Images
Classifications
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- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
- B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING
- B63B35/00—Vessels or similar floating structures specially adapted for specific purposes and not otherwise provided for
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- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F3/00—Biological treatment of water, waste water, or sewage
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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Description
本発明の他の目的は、被着物加工時は加熱剥離型粘着シートから被着物を脱落させることなく保持させることができ、加工後には被着物に損傷や位置ずれを生じさせることなく、該加熱剥離型粘着シートから複数個の被着物のうち所望する一部の被着物を容易に且つより迅速に分離させることができる被着物の加熱剥離方法及び被着物加熱剥離装置を提供することにある。
本発明における加熱剥離型粘着シートは、発泡剤を含有する熱膨張性層を少なくとも備えている。このような加熱剥離型粘着シートとしては、図1で示されるように、熱膨張性層および粘着剤層として、熱膨張性粘着層が用いられた構成を有していてもよく、熱膨張性層と、粘着剤層とが別々の層として用いられた構成を有していてもよい。従って、発泡剤を含有する熱膨張性層は、粘着剤層としての機能を有していてもよい。このように、熱膨張性層が粘着剤層としての機能も有している熱膨張性粘着層である場合、加熱剥離型粘着シートは粘着剤層を有する必要がなく、熱膨張性粘着層の表面を、被着物を貼付する粘着面として利用することができる。一方、熱膨張性層が、粘着剤層としての機能を有していない場合、加熱剥離型粘着シートは粘着剤層を有していることが必要であり、該粘着剤層の表面を、被着物を貼付する粘着面として利用することができる。なお、前記粘着剤層は、熱膨張性層上に形成することができる。
熱膨張性層は熱膨張性を付与するための発泡剤を含有している。そのため、加熱剥離型粘着シートの粘着面上に複数個の被着物が貼着された状態で、任意な時に加熱剥離型粘着シートを部分的に加熱して、該部分的に加熱された熱膨張性層の部分に含有されている発泡剤を発泡及び/又は膨張させることにより、熱膨張性層が部分的に膨張し、この熱膨張性層の部分的な膨張により、該膨張した部分に対応した粘着面が凹凸状に変形して、該粘着面と被着物との接着面積が減少し、これにより、前記凹凸状に変形した粘着面と被着物との間の接着力が減少し、該粘着面に貼着している被着物を加熱剥離型粘着シートから剥離させることができる。
図1で示される加熱剥離型粘着シートでは、支持基材(単に「基材」と称する場合がある)が用いられている。このような基材は、熱膨張性層等の支持母体として用いることができる。基材としては、例えば、紙などの紙系基材;織布、不織布、フェルト、ネットなどの繊維系基材;金属箔、金属板などの金属系基材;プラスチックのフィルムやシートなどのプラスチック系基材;ゴムシートなどのゴム系基材;発泡シートなどの発泡体や、これらの積層体(特に、プラスチック系基材と他の基材との積層体や、プラスチックフィルム(又はシート)同士の積層体など)等の適宜な薄葉体を用いることができる。基材としては、熱膨張性層の加熱処理温度で溶融しない耐熱性に優れるものが、加熱後の取扱性などの点より好ましい。基材としては、プラスチックのフィルムやシートなどのプラスチック系基材を好適に用いることができる。このようなプラスチックのフィルムやシートにおける素材としては、例えば、ポリエチレン(PE)、ポリプロピレン(PP)、エチレン−プロピレン共重合体、エチレン−酢酸ビニル共重合体(EVA)等のα−オレフィンをモノマー成分とするオレフィン系樹脂;ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリブチレンテレフタレート(PBT)等のポリエステル;ポリ塩化ビニル(PVC);ポリフェニレンスルフィド(PPS);ポリアミド(ナイロン)、全芳香族ポリアミド(アラミド)等のアミド系樹脂;ポリエーテルエーテルケトン(PEEK)などが挙げられる。これらの素材は単独で又は2種以上組み合わせて使用することができる。
本発明の加熱剥離型粘着シートは、例えば、基材と熱膨張性層との間などに1層又は2層以上の中間層を有していてもよい。このような中間層としては、剥離性の付与を目的とした剥離剤のコーティング層や、密着力の向上を目的とした下塗り剤のコーティング層などが挙げられる。なお、剥離剤のコーティング層や下塗り剤のコーティング層以外の中間層としては、例えば、良好な変形性の付与を目的とした層、被着物(半導体ウエハなど)への接着面積の増大を目的とした層、接着力の向上を目的とした層、被着物(半導体ウエハなど)の表面形状に良好に追従させることを目的とした層、加熱による接着力低減の処理性の向上を目的とした層、加熱後の被着物(半導体ウエハなど)よりの剥離性の向上を目的とした層などが挙げられる。特に、加熱剥離型粘着シートの変形性の付与や加熱後の剥離性の向上などの点より、基材と熱膨張性層との間の中間層として、図1で示されるように、ゴム状有機弾性層を設けることができる。
図1では、熱膨張性層としての熱膨張性粘着層の保護材としてセパレータ(剥離ライナー)が用いられているが、セパレータは必ずしも設けられていなくてもよい。なお、熱膨張性粘着層以外の粘着層が設けられている場合、その粘着層の保護材としても、セパレータ(剥離ライナー)が用いられていてもよい。
本発明では、加熱剥離型粘着シートとしては、発泡剤を含有する熱膨張性層を備えていればよく、例えば、図1で示されるように、基材を有する加熱剥離型粘着シート(基材付き加熱剥離型粘着シート)であってもよく、基材を有していない加熱剥離型粘着シート(基材レス加熱剥離型粘着シート)であってもよい。加熱剥離型粘着シートが基材付き加熱剥離型粘着シートである場合、熱膨張性層は、基材の少なくとも一方の面に形成されていればよく、例えば、例えば、(1)基材の片面に熱膨張性層が形成された形態の加熱剥離型粘着シート、(2)基材の両面に熱膨張性層が形成された形態の加熱剥離型粘着シート、(3)基材の一方の面に熱膨張性層が形成され、且つ基材の他方の面に非熱膨張性粘着層(熱膨張性を有していない粘着層)が形成された形態の加熱剥離型粘着シートなどが挙げられる。
本発明の被着物の加熱剥離方法では、前記加熱剥離型粘着シート(すなわち、発泡剤を含有する熱膨張性層を備えた加熱剥離型粘着シート)に貼着した複数個の被着物のうち一部の被着物を、50℃以上且つ熱膨張性層が膨張しない温度の温度雰囲気下で、加熱剥離型粘着シートを部分的に加熱して、選択的に剥離している。すなわち、本発明の被着物の加熱剥離方法では、50℃以上且つ熱膨張性層が膨張しない温度の温度雰囲気下で、加熱剥離型粘着シートを部分的に加熱して、該加熱剥離型粘着シートに貼着した複数個の被着物のうち一部の被着物を、選択的に剥離する工程(部分的加熱剥離工程)を少なくとも具備していることが重要である。
本発明の被着物加熱剥離装置は、前記加熱剥離型粘着シート(すなわち、発泡剤を含有する熱膨張性層を備えた加熱剥離型粘着シート)から被着物を剥離する際に用いられる装置であって、50℃以上且つ熱膨張性層が膨張しない温度の温度雰囲気下で、加熱剥離型粘着シートを部分的に加熱して、複数個の被着物のうち一部の被着物を選択的に剥離させるための加熱部を有している。このような被着物加熱剥離装置としては、例えば、図2で示されるような被着物加熱剥離装置を用いることができる。図2は、本発明の被着物加熱剥離装置の一例を部分的に示す概略図である。図2において、6は被着物加熱剥離装置における加熱剥離処理部、7は加熱部、7aは加熱部7の表面部、8は吸着ノズル、9は固定リング、10はダイボンダー、11は熱源、12は加熱剥離型粘着シート、13は熱膨張性粘着層、13aは熱膨張性粘着層13が膨張していない未膨張部、13bは熱膨張性粘着層13が膨張した膨張部、14は基材、15は被着物、15aは剥離された被着物である。
被着物としては、種々の加工等を施すために、加熱剥離型粘着シートに貼着させるものであれば特に制限されない。被着物としては、例えば、半導体ウエハ(シリコンウエハなど)や半導体チップなどの電子系部品類や、電子系部品類が用いられた電子部品や回路基板(例えば、シリコンウエハを基板とする電子部品など)などが挙げられる。
ポリエステル基材(100μm厚)と、90℃で接着力が低下する熱膨張性粘着層とから構成される加熱剥離型粘着テープ(固定リングによりに固定)の熱膨張性粘着層面に、150mm×150mmのニッケル箔(「Ni箔」と称する場合がある;100μm厚)を貼り付け、該Ni箔を5mm角に切断して、Ni箔切断片が貼着された状態の加熱剥離型粘着テープを得た。
ポリエステル基材(100μm厚)と、前記ポリエステル基材の一方の面に形成された120℃で接着力が低下する熱膨張性粘着層と、前記ポリエステル基材の他方の面に形成された台座固定用粘着層とから構成される加熱剥離型粘着テープの熱膨張性粘着層面に、直径6インチのシリコンウエハー(150μm厚)を気泡なく貼り付けるとともに、台座固定用粘着層面(シリコンウエハー貼着側に対して反対側の接着面)を平滑なステンレス製の台座に貼り付け、前記シリコンウエハーを3mm角にダイシングして、シリコンウエハー切断片が貼着された状態の加熱剥離型粘着テープを得た。
Ni箔切断片が貼着された状態の加熱剥離型粘着テープ(固定リングによりに固定)を、23℃の雰囲気下で3分間静置させて、この雰囲気下において、切断操作により形成された複数個のNi箔切断片のうち、剥離する所望のNi箔切断片の貼着部分を、先端部が150℃に熱せられた加熱部によりシート背面側から押圧し、熱膨張性粘着層を熱膨張させたこと以外は、実施例1と同様にして、加熱剥離型粘着テープからNi箔切断片を剥離させて分離回収した。なお、熱膨張性粘着層上に貼着しているNi箔切断片を破壊することなく、加熱部により加熱させて剥離させるのに要する時間(剥離に要する時間)は、表1に示されているように、2.6秒であった。
シリコンウエハー切断片が貼着された状態の加熱剥離型粘着テープを、23℃の雰囲気下で3分間静置させて、この雰囲気下において、切断操作により形成された複数個のシリコンウエハー切断片のうち、剥離する所望のシリコンウエハー切断片の貼着部分を、先端部が160℃に熱せられた加熱部によりシリコンウエハー貼着面側から押圧し、熱膨張性粘着層を熱膨張させたこと以外は、実施例2と同様にして、加熱剥離型粘着テープからシリコンウエハー切断片を剥離させて分離回収した。なお、熱膨張性粘着層上に貼着しているシリコンウエハー切断片を破壊することなく、加熱部により加熱させて剥離させるのに要する時間(剥離に要する時間)は、表1に示されているように、2.8秒であった。
2 支持基材
3 ゴム状有機弾性層
4 熱膨張性粘着層
5 セパレータ(剥離ライナー)
6 被着物加熱剥離装置における加熱剥離処理部
7 加熱部
7a 加熱部7の表面部
8 吸着ノズル
9 固定リング
10 ダイボンダー、
11 熱源
12 加熱剥離型粘着シート
13 熱膨張性粘着層
13a 熱膨張性粘着層13が膨張していない未膨張部
13b 熱膨張性粘着層13が膨張した膨張部
14 基材
15 被着物
15a 剥離された被着物
Claims (9)
- 発泡剤として熱膨張性微小球を含有する熱膨張性層を備えた加熱剥離型粘着シートに貼着した複数個の被着物のうち一部の被着物を、選択的に剥離する方法であって、50℃以上であるとともに、(T 0 −45℃)以上且つ(T 0 −20℃)以下(T0は加熱剥離型粘着シートの剥離開始温度を示す)の温度雰囲気下のボックス内又は室内で、加熱剥離型粘着シートを部分的に加熱して、被着物を選択的に剥離することを特徴とする被着物の加熱剥離方法。
- 加熱剥離型粘着シートを部分的に加熱することができるとともに、剥離させる被着物の形状に対応して加熱することが可能な加熱手段により、加熱剥離型粘着シートのうち前記剥離させる被着物の貼着部位を加熱して、前記被着物を選択的に剥離する請求項1記載の被着物の加熱剥離方法。
- 加熱剥離型粘着シートの被着物貼着側及びその反対側のうち、少なくとも一方の側から加熱する請求項1又は2の何れかの項に記載の被着物の加熱剥離方法。
- 発泡剤として熱膨張性微小球を含有する熱膨張性層を備えた加熱剥離型粘着シートに貼着した複数個の被着物のうち一部の被着物を、選択的に剥離する方法であって、加熱剥離型粘着シートに貼着した被着物を複数の切断片に切断加工する工程と、50℃以上であるとともに、(T 0 −45℃)以上且つ(T 0 −20℃)以下(T0は加熱剥離型粘着シートの剥離開始温度を示す)の温度雰囲気下のボックス内又は室内で、前記複数の切断片のうち一部の切断片を、該加熱剥離型粘着シートを部分的に加熱して、選択的に剥離する工程とを具備することを特徴とする被着物の加熱剥離方法。
- 発泡剤として熱膨張性微小球を含有する熱膨張性層を備えた加熱剥離型粘着シートから被着物を剥離する装置であって、50℃以上であるとともに、(T 0 −45℃)以上且つ(T 0 −20℃)以下(T0は加熱剥離型粘着シートの剥離開始温度を示す)の温度雰囲気下のボックス内又は室内で、加熱剥離型粘着シートを部分的に加熱して、複数個の被着物のうち一部の被着物を選択的に剥離させるための加熱部を有していることを特徴とする被着物加熱剥離装置。
- 加熱部が、剥離させる被着物の形状に対応して加熱することが可能な形状を有している請求項5記載の被着物加熱剥離装置。
- 加熱部が、加熱剥離型粘着シートの被着物貼着側及びその反対側のうち、少なくとも一方の側に設けられている請求項5又は6記載の被着物加熱剥離装置。
- 加熱部が、水平方向及び/又は垂直方向に移動可能である請求項5〜7の何れかの項に記載の被着物加熱剥離装置。
- 発泡剤として熱膨張性微小球を含有する熱膨張性層を備えた加熱剥離型粘着シートに貼着した被着物を複数の切断片に切断加工する切断加工部と、50℃以上であるとともに、(T 0 −45℃)以上且つ(T 0 −20℃)以下(T0は加熱剥離型粘着シートの剥離開始温度を示す)の温度雰囲気下のボックス内又は室内で、加熱剥離型粘着シートを部分的に加熱して、前記複数の切断片のうち一部の切断片を選択的に剥離させるための加熱部とを有している請求項5〜8の何れかの項に記載の被着物加熱剥離装置。
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JP2004125331A JP4716668B2 (ja) | 2004-04-21 | 2004-04-21 | 被着物の加熱剥離方法及び被着物加熱剥離装置 |
US11/108,778 US20050236107A1 (en) | 2004-04-21 | 2005-04-19 | Method of thermal adherend release and apparatus for thermal adherend release |
KR1020050032734A KR20060047269A (ko) | 2004-04-21 | 2005-04-20 | 피착물의 가열-박리 방법 및 피착물 가열-박리 장치 |
EP05008775A EP1592058A3 (en) | 2004-04-21 | 2005-04-21 | Method of selective thermal release from a heat peelable sheet and corresponding apparatus |
TW094112691A TWI394701B (zh) | 2004-04-21 | 2005-04-21 | 熱脫離被黏著物之方法及用於熱脫離被黏著物之裝置 |
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Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP2005150235A (ja) * | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
US20070114366A1 (en) * | 2005-11-21 | 2007-05-24 | General Electric Company | Optical article having a multi-component structure as an anti-theft feature and a system and method for inhibiting theft of same |
US8911583B2 (en) | 2006-03-01 | 2014-12-16 | Thin Materials Ag | Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement |
JP4589265B2 (ja) * | 2006-05-22 | 2010-12-01 | パナソニック株式会社 | 半導体接合方法 |
JP4589266B2 (ja) * | 2006-05-22 | 2010-12-01 | パナソニック株式会社 | 半導体超音波接合方法 |
DE102006028809B4 (de) * | 2006-06-21 | 2015-10-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wafer-Träger-Anordnung, Schichtverbund zur Verwendung bei der Herstellung einer solchen Wafer-Träger-Anordnung sowie entsprechende Verfahren und Verwendungen |
JP4849993B2 (ja) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | 粘着シート、その製造方法および積層セラミックシートの切断方法 |
US20080200011A1 (en) * | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
JP5235294B2 (ja) * | 2006-11-10 | 2013-07-10 | 日東電工株式会社 | 加熱発泡型再剥離性アクリル系粘着テープ又はシート |
KR100831081B1 (ko) * | 2007-02-22 | 2008-05-20 | (주)해은켐텍 | 상호반응성 공중합체를 이용한 발포시트용 점착수지 및 이를 이용한 발포시트 |
JP2008297412A (ja) * | 2007-05-30 | 2008-12-11 | Nitto Denko Corp | 熱剥離型粘着シート |
US20090017248A1 (en) * | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
JP5171425B2 (ja) * | 2007-10-22 | 2013-03-27 | 日東電工株式会社 | 加熱発泡型再剥離性アクリル系粘着テープ又はシート、及び剥離方法 |
US8488428B2 (en) | 2008-05-14 | 2013-07-16 | Nbcuniversal Media, Llc | Enhanced security of optical article |
DE102009017306B4 (de) * | 2009-04-11 | 2012-04-26 | Karlsruher Institut für Technologie | Vorrichtung zum selektiven Übertragen einer mikrostrukturierten Komponente |
JP2011018805A (ja) * | 2009-07-09 | 2011-01-27 | Sumitomo Bakelite Co Ltd | 半導体用フィルムおよび半導体装置の製造方法 |
JP2011018804A (ja) * | 2009-07-09 | 2011-01-27 | Sumitomo Bakelite Co Ltd | 半導体用フィルムおよび半導体装置の製造方法 |
JP2011018806A (ja) * | 2009-07-09 | 2011-01-27 | Sumitomo Bakelite Co Ltd | 半導体用フィルムおよび半導体装置の製造方法 |
JP5412214B2 (ja) * | 2009-08-31 | 2014-02-12 | 日東電工株式会社 | 保護テープ剥離方法およびその装置 |
US8987632B2 (en) * | 2009-10-09 | 2015-03-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Modification of surface energy via direct laser ablative surface patterning |
JP2011221006A (ja) * | 2010-03-23 | 2011-11-04 | Tokyo Electron Ltd | ウェハ型温度検知センサおよびその製造方法 |
JP5472275B2 (ja) * | 2011-12-14 | 2014-04-16 | 株式会社村田製作所 | エキスパンド装置及び部品の製造方法 |
US9278374B2 (en) | 2012-06-08 | 2016-03-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Modified surface having low adhesion properties to mitigate insect residue adhesion |
WO2014038310A1 (ja) * | 2012-09-07 | 2014-03-13 | 富士電機株式会社 | 半導体素子の製造方法 |
JP6201952B2 (ja) * | 2014-10-20 | 2017-09-27 | Dic株式会社 | 解体方法及びリサイクル部材 |
GB201611165D0 (en) * | 2016-06-27 | 2016-08-10 | Univ Limerick | Adhesive composition |
US11014203B2 (en) | 2016-07-11 | 2021-05-25 | Laird Technologies, Inc. | System for applying interface materials |
US10741519B2 (en) * | 2016-07-11 | 2020-08-11 | Laird Technologies, Inc. | Systems of applying materials to components |
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USD999405S1 (en) | 2017-10-06 | 2023-09-19 | Laird Technologies, Inc. | Material having edging |
WO2019098102A1 (ja) * | 2017-11-16 | 2019-05-23 | リンテック株式会社 | 半導体装置の製造方法 |
JP7033496B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
JP7033497B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
JP7033494B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
JP7033495B2 (ja) * | 2018-05-09 | 2022-03-10 | リンテック株式会社 | 個片体形成装置および個片体形成方法 |
KR102321518B1 (ko) * | 2021-02-08 | 2021-11-04 | (주)라이타이저 | 감광성 수지를 이용한 led칩 전사 장치 |
WO2023017831A1 (ja) * | 2021-08-13 | 2023-02-16 | リンテック株式会社 | 粘着シートの膨張方法 |
CN114133498A (zh) * | 2021-12-13 | 2022-03-04 | 中昊北方涂料工业研究设计院有限公司 | 一种热塑性丙烯酸树脂及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04196148A (ja) * | 1990-11-26 | 1992-07-15 | Matsushita Electric Ind Co Ltd | チップ供給装置 |
JP2002322436A (ja) * | 2001-04-25 | 2002-11-08 | Nitto Denko Corp | 被着物の加熱剥離方法及び被着物加熱剥離装置 |
JP2004087660A (ja) * | 2002-08-26 | 2004-03-18 | Takatori Corp | ウエハのダイシングテープへの転写方法とその装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4154634A (en) * | 1977-09-22 | 1979-05-15 | Plas/Steel Products, Inc. | Method for fabricating improved fiber reinforced plastic rods having a smooth surface |
JPH0260147A (ja) * | 1988-08-26 | 1990-02-28 | Nec Corp | ペレットピックアップ機構 |
US5827394A (en) * | 1996-07-15 | 1998-10-27 | Vanguard International Semiconductor Corporation | Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing |
JP3955659B2 (ja) * | 1997-06-12 | 2007-08-08 | リンテック株式会社 | 電子部品のダイボンディング方法およびそれに使用されるダイボンディング装置 |
DE10051938A1 (de) * | 2000-10-19 | 2002-02-28 | Infineon Technologies Ag | Anordnung mit einem Substrat und einem Träger |
US6814832B2 (en) * | 2001-07-24 | 2004-11-09 | Seiko Epson Corporation | Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance |
US6500733B1 (en) * | 2001-09-20 | 2002-12-31 | Heliovolt Corporation | Synthesis of layers, coatings or films using precursor layer exerted pressure containment |
JP3965055B2 (ja) * | 2002-01-15 | 2007-08-22 | 積水化学工業株式会社 | Icチップの製造方法 |
-
2004
- 2004-04-21 JP JP2004125331A patent/JP4716668B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-19 US US11/108,778 patent/US20050236107A1/en not_active Abandoned
- 2005-04-20 KR KR1020050032734A patent/KR20060047269A/ko not_active Application Discontinuation
- 2005-04-21 TW TW094112691A patent/TWI394701B/zh not_active IP Right Cessation
- 2005-04-21 EP EP05008775A patent/EP1592058A3/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04196148A (ja) * | 1990-11-26 | 1992-07-15 | Matsushita Electric Ind Co Ltd | チップ供給装置 |
JP2002322436A (ja) * | 2001-04-25 | 2002-11-08 | Nitto Denko Corp | 被着物の加熱剥離方法及び被着物加熱剥離装置 |
JP2004087660A (ja) * | 2002-08-26 | 2004-03-18 | Takatori Corp | ウエハのダイシングテープへの転写方法とその装置 |
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TW200540092A (en) | 2005-12-16 |
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KR20060047269A (ko) | 2006-05-18 |
JP2005311031A (ja) | 2005-11-04 |
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