JP4690725B2 - 半導体製造時の残存ポリマーを除去するためのストリッパー溶液、その使用およびそれを用いた残存ポリマーの除去方法 - Google Patents
半導体製造時の残存ポリマーを除去するためのストリッパー溶液、その使用およびそれを用いた残存ポリマーの除去方法 Download PDFInfo
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- 229920000642 polymer Polymers 0.000 title claims description 42
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 27
- 239000000243 solution Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 238000001312 dry etching Methods 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 44
- 235000012431 wafers Nutrition 0.000 description 21
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 239000000654 additive Substances 0.000 description 16
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 14
- 238000005530 etching Methods 0.000 description 14
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 9
- 230000000996 additive effect Effects 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- -1 hexafluorosilicic acid Chemical compound 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- DWYMPOCYEZONEA-UHFFFAOYSA-N fluorophosphoric acid Chemical compound OP(O)(F)=O DWYMPOCYEZONEA-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- GTDKXDWWMOMSFL-UHFFFAOYSA-M tetramethylazanium;fluoride Chemical compound [F-].C[N+](C)(C)C GTDKXDWWMOMSFL-UHFFFAOYSA-M 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/963—Removing process residues from vertical substrate surfaces
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- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Detergent Compositions (AREA)
- Drying Of Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
Description
文献
メルク特許:国際公開第97/36209号。ドライエッチング後のサイドウォール残渣を除去する溶液およびプロセス
アシランド:テクニカルノート、フッ化物含有ストリッパー
SEZ:無機化学DSP
欧州特許出願公開第0773480号:レジスト用除去剤溶液組成物およびこれを使用したレジスト除去方法
欧州特許出願公開第0485161号:ストリッピング組成物および基板からレジストを剥がす方法
米国特許第5,698,503号:ストリッピングおよびクリーニング組成物
米国特許第5,709,756号:基本的なストリッピングおよびクリーニング組成物
欧州特許第0596515号:金属腐食の少ないアルカリ性フォトレジストストリッピング組成物
・SiO2(熱酸化物基板)
・スパッタリングされたチタン 100nm
・スパッタリングされたアルミニウム(0.5%のCu) 900nm
・スパッタリングされたTiN 100nm
アルミニウム導体トラックは、フォトレジストを塗布し、UV照射によって、このレジストを露光し、引き続き現像および硬化することによって構造化される。
上記の層構造を有するエッチングされたウェーハを、SEZスピンエッチャーで処理した。この技術は、プロセスチャンバ内に水平に置いたウェーハを回転させ、ノズルを介してエッチング液を当てる、単一ウェーハプロセスである。このプロセスでは、ノズルアームがウェーハ表面全体を往復しながら水平に移動する。エッチング工程の次は、同じ原理に従って超純水を用いた洗浄工程である。乾燥については、ウェーハを高速回転させながらN2を吹き付けて最終的に乾燥させる。
工程1:ストリッピング
混合物の組成:
硫酸: 12.0重量%
過酸化水素: 2.4重量%
H2SiF6: 500mg/kg
600rpm、通過流1l/分、25℃、30秒
工程2:超純水による洗浄
600rpm、通過流1l/分、25℃、30秒
工程3:N2による吹飛ばしを用いたスピン乾燥
2000rpm、150l/分
図5は、金属被覆の腐食なしに完全に洗浄された表面を示す。500mg/kgを超えるH2SiF6濃度では、金属被覆は表面がエッチングされる。1000mg/kgを用いた図6を参照のこと。
実施例2:
実施例1と同じウェーハを、マトソン AWP200タンクユニットで処理した。
工程1:ストリッピング
混合物の組成:
硫酸: 12.0重量%
過酸化水素: 2.4重量%
H2SiF6: 100mg/kg
再循環15l/分、25℃、45秒
工程2:超純水による洗浄
通過流35l/分、25℃、10分
工程3:マランゴニ乾燥機
図4は、金属被覆の腐食なしに完全に洗浄された表面を示す。
実施例3
実施例1と同じウェーハを、ビーカーで処理した。ストリッピング工程の特徴をよく調べるために、非常に厚いポリマー層を有するウェーハを使用した。
工程1:ストリッピング
混合物の組成:
硫酸: 12重量%
過酸化水素: 2.4重量%
H2SiF6: 100mg/kg
ヘプタン酸: 80mg/kg
100rpm、25℃、60秒
工程2:ビーカー中で超純水による洗浄
25℃、5分
工程3:窒素炉で乾燥
100℃、10分
図12では、ポリマーが薄い残存層から離れて除去されていることが分かる。
実施例3に対する比較例
参考として、同じウェーハを、界面活性剤を添加しない以外は同じ組成物で上記のように処理した。図13では、著しく厚いポリマー層がよく分かる。したがって、添加した界面活性剤が表面の濡れを改善し、これがストリッピング作用に良い影響を与えている。
Claims (7)
- 水溶液中に、総量で100〜500mg/kgのH2SiF 6 、1〜17重量%のH2SO4、および1〜12重量%のH2O2を含む半導体製造時のアルミニウムまたはアルミニウム/銅合金から残存ポリマーを除去するためのストリッパー溶液。
- 12〜17重量%のH2SO4および2〜4重量%のH2O2を含む請求項1記載のストリッパー溶液。
- 請求項1記載のストリッパー溶液の、半導体製造のプロセス工程におけるアルミニウムまたはアルミニウム/銅合金からの残存ポリマー除去剤としての使用。
- AlまたはAl含有導体トラックから残存ポリマーを除去するための請求項3に記載の使用。
- 金属導体トラックおよびコンタクトホールをドライエッチングした後の残存ポリマーを除去するための請求項3に記載の使用。
- 半導体製造のプロセス工程においてスピンエッチャーまたはタンクユニットを使用して残存ポリマーを除去するための請求項3から5のいずれか一項に記載の使用。
- 請求項1に記載のストリッパー溶液を用いて残存ポリマーを除去することを特徴とする、AlまたはAl含有導体トラックから残存ポリマーを除去する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10227867A DE10227867A1 (de) | 2002-06-22 | 2002-06-22 | Zusammensetzung zum Entfernen von Sidewall-Residues |
DE10227867.9 | 2002-06-22 | ||
PCT/EP2003/005549 WO2004001834A1 (de) | 2002-06-22 | 2003-05-27 | Zusammensetzung zum entfernen von 'sidewall-residues' |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005531139A JP2005531139A (ja) | 2005-10-13 |
JP4690725B2 true JP4690725B2 (ja) | 2011-06-01 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004514652A Expired - Fee Related JP4690725B2 (ja) | 2002-06-22 | 2003-05-27 | 半導体製造時の残存ポリマーを除去するためのストリッパー溶液、その使用およびそれを用いた残存ポリマーの除去方法 |
Country Status (11)
Country | Link |
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US (2) | US7417016B2 (ja) |
EP (1) | EP1490899B1 (ja) |
JP (1) | JP4690725B2 (ja) |
KR (1) | KR101044525B1 (ja) |
CN (1) | CN100375250C (ja) |
AU (1) | AU2003242580A1 (ja) |
DE (1) | DE10227867A1 (ja) |
IL (1) | IL165879A (ja) |
RU (1) | RU2313155C2 (ja) |
TW (1) | TWI249087B (ja) |
WO (1) | WO2004001834A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10227867A1 (de) * | 2002-06-22 | 2004-01-08 | Merck Patent Gmbh | Zusammensetzung zum Entfernen von Sidewall-Residues |
JP4839968B2 (ja) * | 2006-06-08 | 2011-12-21 | 東ソー株式会社 | レジスト除去用組成物及びレジストの除去方法 |
JP5017985B2 (ja) * | 2006-09-25 | 2012-09-05 | 東ソー株式会社 | レジスト除去用組成物及びレジストの除去方法 |
US9410111B2 (en) | 2008-02-21 | 2016-08-09 | S.C. Johnson & Son, Inc. | Cleaning composition that provides residual benefits |
US8143206B2 (en) | 2008-02-21 | 2012-03-27 | S.C. Johnson & Son, Inc. | Cleaning composition having high self-adhesion and providing residual benefits |
WO2013074330A1 (en) * | 2011-11-14 | 2013-05-23 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Etching agent for type ii inas/galnsb superlattice epitaxial materials |
US8658588B2 (en) | 2012-01-09 | 2014-02-25 | S.C. Johnson & Son, Inc. | Self-adhesive high viscosity cleaning composition |
CN106206289A (zh) * | 2015-05-07 | 2016-12-07 | 北大方正集团有限公司 | 一种铝刻蚀方法及装置 |
TWI804224B (zh) * | 2016-08-12 | 2023-06-01 | 美商英培雅股份有限公司 | 減少邊緣珠區域中來自含金屬光阻劑之金屬殘留物的方法 |
CN108672686A (zh) * | 2018-04-19 | 2018-10-19 | 安徽相邦复合材料有限公司 | 一种清除熔模铸造砂型残留物清理液的制备方法 |
CN112670163A (zh) * | 2020-12-24 | 2021-04-16 | 中国电子科技集团公司第四十七研究所 | 一种载带自动焊载体去胶方法 |
CN114999898B (zh) * | 2022-08-03 | 2022-11-08 | 广州粤芯半导体技术有限公司 | 具有钝化膜的晶圆刻蚀后的清洗方法和半导体封装方法 |
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-
2002
- 2002-06-22 DE DE10227867A patent/DE10227867A1/de not_active Withdrawn
-
2003
- 2003-05-27 EP EP03760590.4A patent/EP1490899B1/de not_active Expired - Lifetime
- 2003-05-27 AU AU2003242580A patent/AU2003242580A1/en not_active Abandoned
- 2003-05-27 WO PCT/EP2003/005549 patent/WO2004001834A1/de active Application Filing
- 2003-05-27 JP JP2004514652A patent/JP4690725B2/ja not_active Expired - Fee Related
- 2003-05-27 RU RU2005101613/28A patent/RU2313155C2/ru not_active IP Right Cessation
- 2003-05-27 CN CNB03814610XA patent/CN100375250C/zh not_active Expired - Fee Related
- 2003-05-27 US US10/518,463 patent/US7417016B2/en not_active Expired - Lifetime
- 2003-05-27 KR KR1020047020845A patent/KR101044525B1/ko active IP Right Grant
- 2003-06-16 TW TW092116289A patent/TWI249087B/zh not_active IP Right Cessation
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2004
- 2004-12-20 IL IL165879A patent/IL165879A/en active IP Right Grant
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Also Published As
Publication number | Publication date |
---|---|
US20060086372A1 (en) | 2006-04-27 |
KR20050023324A (ko) | 2005-03-09 |
TWI249087B (en) | 2006-02-11 |
IL165879A0 (en) | 2006-01-15 |
IL165879A (en) | 2010-11-30 |
RU2313155C2 (ru) | 2007-12-20 |
TW200401960A (en) | 2004-02-01 |
US7417016B2 (en) | 2008-08-26 |
EP1490899A1 (de) | 2004-12-29 |
WO2004001834A1 (de) | 2003-12-31 |
RU2005101613A (ru) | 2005-07-10 |
JP2005531139A (ja) | 2005-10-13 |
US20080280803A1 (en) | 2008-11-13 |
US7531492B2 (en) | 2009-05-12 |
DE10227867A1 (de) | 2004-01-08 |
KR101044525B1 (ko) | 2011-06-27 |
EP1490899B1 (de) | 2017-09-13 |
AU2003242580A1 (en) | 2004-01-06 |
CN1663032A (zh) | 2005-08-31 |
CN100375250C (zh) | 2008-03-12 |
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