JP4688594B2 - 発光光源、照明装置及び表示装置 - Google Patents
発光光源、照明装置及び表示装置 Download PDFInfo
- Publication number
- JP4688594B2 JP4688594B2 JP2005203062A JP2005203062A JP4688594B2 JP 4688594 B2 JP4688594 B2 JP 4688594B2 JP 2005203062 A JP2005203062 A JP 2005203062A JP 2005203062 A JP2005203062 A JP 2005203062A JP 4688594 B2 JP4688594 B2 JP 4688594B2
- Authority
- JP
- Japan
- Prior art keywords
- bumps
- area
- bump
- led bare
- bare chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/10—Refractors for light sources comprising photoluminescent material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00013—Fully indexed content
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005203062A JP4688594B2 (ja) | 2004-08-06 | 2005-07-12 | 発光光源、照明装置及び表示装置 |
| DE602005025376T DE602005025376D1 (de) | 2004-08-06 | 2005-07-26 | Lichtquelle, herstellungsverfahren für eine lichtquelle, beleuchtungsvorrichtung und anzeigevorrichtung |
| PCT/JP2005/013997 WO2006013800A1 (en) | 2004-08-06 | 2005-07-26 | Light source, manufacturing method of light source, lighting apparatus, and display apparatus |
| EP05767814A EP1794809B1 (en) | 2004-08-06 | 2005-07-26 | Light source, manufacturing method of light source, lighting apparatus, and display apparatus |
| US11/631,583 US7696527B2 (en) | 2004-08-06 | 2005-07-26 | Light source, manufacturing method of light source, lighting apparatus, and display apparatus |
| AT05767814T ATE492036T1 (de) | 2004-08-06 | 2005-07-26 | Lichtquelle, herstellungsverfahren für eine lichtquelle, beleuchtungsvorrichtung und anzeigevorrichtung |
| TW094125823A TWI381542B (zh) | 2004-08-06 | 2005-07-29 | 光源、光源之製造方法、發光裝置及顯示裝置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004231231 | 2004-08-06 | ||
| JP2004231231 | 2004-08-06 | ||
| JP2005203062A JP4688594B2 (ja) | 2004-08-06 | 2005-07-12 | 発光光源、照明装置及び表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006074007A JP2006074007A (ja) | 2006-03-16 |
| JP2006074007A5 JP2006074007A5 (OSRAM) | 2007-02-08 |
| JP4688594B2 true JP4688594B2 (ja) | 2011-05-25 |
Family
ID=35058103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005203062A Expired - Lifetime JP4688594B2 (ja) | 2004-08-06 | 2005-07-12 | 発光光源、照明装置及び表示装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7696527B2 (OSRAM) |
| EP (1) | EP1794809B1 (OSRAM) |
| JP (1) | JP4688594B2 (OSRAM) |
| AT (1) | ATE492036T1 (OSRAM) |
| DE (1) | DE602005025376D1 (OSRAM) |
| TW (1) | TWI381542B (OSRAM) |
| WO (1) | WO2006013800A1 (OSRAM) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
| US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
| USD611628S1 (en) * | 2006-06-20 | 2010-03-09 | Panasonic Corporation | Lighting apparatus |
| US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
| KR100891810B1 (ko) * | 2007-11-06 | 2009-04-07 | 삼성전기주식회사 | 백색 발광 소자 |
| JP5143140B2 (ja) * | 2007-11-15 | 2013-02-13 | パナソニック株式会社 | 半導体発光装置 |
| EP2159475A1 (en) * | 2008-08-28 | 2010-03-03 | T.Y.C. Brother Industrial Co., Ltd. | Illuminating device |
| US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
| US8202741B2 (en) | 2009-03-04 | 2012-06-19 | Koninklijke Philips Electronics N.V. | Method of bonding a semiconductor device using a compliant bonding structure |
| TWD139992S1 (zh) * | 2009-03-13 | 2011-04-11 | 日亞化學工業股份有限公司 | 發光二極體 |
| US9915409B2 (en) | 2015-02-19 | 2018-03-13 | Cree, Inc. | Lens with textured surface facilitating light diffusion |
| US10422503B2 (en) | 2009-10-30 | 2019-09-24 | Ideal Industries Lighting Llc | One-piece multi-lens optical member and method of manufacture |
| DE102010001977A1 (de) * | 2010-02-16 | 2011-08-18 | Osram Gesellschaft mit beschränkter Haftung, 81543 | Leuchtmittel sowie Verfahren zu dessen Herstellung |
| JP2011258673A (ja) * | 2010-06-07 | 2011-12-22 | Toshiba Corp | 半導体発光装置及びその製造方法 |
| JP5873625B2 (ja) * | 2010-08-20 | 2016-03-01 | セイコーエプソン株式会社 | 光源装置及びプロジェクター |
| JP5226047B2 (ja) | 2010-08-26 | 2013-07-03 | シャープ株式会社 | 半導体発光素子の実装方法 |
| US8415704B2 (en) * | 2010-09-22 | 2013-04-09 | Ut-Battelle, Llc | Close-packed array of light emitting devices |
| AU2010101247B4 (en) * | 2010-11-12 | 2013-11-21 | 2Wp International Pty Ltd | Dual mode ratchet pruners |
| US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
| US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
| DE102011112710A1 (de) * | 2011-09-07 | 2013-03-07 | Osram Ag | Beleuchtungsvorrichtung |
| CN103165472A (zh) * | 2011-12-15 | 2013-06-19 | 北京大学深圳研究生院 | 一种fc-bga封装凸点分布的热耗散新方法 |
| DE102012007727A1 (de) | 2012-04-18 | 2013-10-24 | Mühlbauer Ag | Festkörper-Leuchtmittelanordnung sowie Vorrichtung und Verfahren zu deren Herstellung |
| US9920901B2 (en) | 2013-03-15 | 2018-03-20 | Cree, Inc. | LED lensing arrangement |
| US10400984B2 (en) | 2013-03-15 | 2019-09-03 | Cree, Inc. | LED light fixture and unitary optic member therefor |
| US10141378B2 (en) | 2013-10-30 | 2018-11-27 | Industrial Technology Research Institute | Light emitting device free of TFT and chiplet |
| TWI586012B (zh) | 2014-01-02 | 2017-06-01 | 財團法人工業技術研究院 | 發光元件 |
| US20150263256A1 (en) * | 2014-03-14 | 2015-09-17 | Epistar Corporation | Light-emitting array |
| WO2016024180A1 (en) * | 2014-08-11 | 2016-02-18 | Koninklijke Philips N.V. | Alloy stud bump interconnects for semiconductor devices |
| US10207440B2 (en) | 2014-10-07 | 2019-02-19 | Cree, Inc. | Apparatus and method for formation of multi-region articles |
| JP6735072B2 (ja) * | 2014-11-21 | 2020-08-05 | 株式会社Steq | Led光源装置およびプロジェクター |
| US9470394B2 (en) | 2014-11-24 | 2016-10-18 | Cree, Inc. | LED light fixture including optical member with in-situ-formed gasket and method of manufacture |
| TWI677113B (zh) * | 2014-12-24 | 2019-11-11 | 晶元光電股份有限公司 | 發光元件以及其製造方法 |
| JP6501564B2 (ja) * | 2015-03-10 | 2019-04-17 | シチズン電子株式会社 | 発光装置 |
| US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
| JP2017112289A (ja) * | 2015-12-18 | 2017-06-22 | 日亜化学工業株式会社 | 発光装置 |
| JP6780293B2 (ja) * | 2016-05-24 | 2020-11-04 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| US10141215B2 (en) | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
| US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
| US10471545B2 (en) | 2016-11-23 | 2019-11-12 | Rohinni, LLC | Top-side laser for direct transfer of semiconductor devices |
| JP6555247B2 (ja) | 2016-12-28 | 2019-08-07 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| US10062588B2 (en) | 2017-01-18 | 2018-08-28 | Rohinni, LLC | Flexible support substrate for transfer of semiconductor devices |
| US10410905B1 (en) | 2018-05-12 | 2019-09-10 | Rohinni, LLC | Method and apparatus for direct transfer of multiple semiconductor devices |
| US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
| JP7078868B2 (ja) * | 2020-10-13 | 2022-06-01 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| WO2024129810A1 (en) * | 2022-12-16 | 2024-06-20 | Lumileds Llc | Die metallization for dense packed arrays |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3226703B2 (ja) * | 1994-03-18 | 2001-11-05 | 株式会社日立製作所 | 半導体装置及びその製法 |
| JPH0837357A (ja) | 1994-07-26 | 1996-02-06 | Mitsubishi Electric Corp | バンプ電極付電子部品が実装されたプリント配線板およびその実装方法 |
| JP2000332042A (ja) * | 1999-05-17 | 2000-11-30 | Nec Corp | 半導体装置、半導体素子の実装構造、及び半導体装置の実装構造 |
| JP4510961B2 (ja) * | 1999-10-19 | 2010-07-28 | Okiセミコンダクタ株式会社 | 光モジュール |
| US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
| JP2002232016A (ja) * | 2001-02-07 | 2002-08-16 | Matsushita Electric Ind Co Ltd | 半導体発光素子の実装方法 |
| JP2003229627A (ja) * | 2002-02-01 | 2003-08-15 | Hitachi Ltd | 光デバイスの実装方法及び光ヘッド装置 |
| US6958498B2 (en) * | 2002-09-27 | 2005-10-25 | Emcore Corporation | Optimized contact design for flip-chip LED |
| JP2005117035A (ja) * | 2003-09-19 | 2005-04-28 | Showa Denko Kk | フリップチップ型窒化ガリウム系半導体発光素子およびその製造方法 |
-
2005
- 2005-07-12 JP JP2005203062A patent/JP4688594B2/ja not_active Expired - Lifetime
- 2005-07-26 EP EP05767814A patent/EP1794809B1/en not_active Expired - Lifetime
- 2005-07-26 AT AT05767814T patent/ATE492036T1/de not_active IP Right Cessation
- 2005-07-26 WO PCT/JP2005/013997 patent/WO2006013800A1/en not_active Ceased
- 2005-07-26 US US11/631,583 patent/US7696527B2/en not_active Expired - Lifetime
- 2005-07-26 DE DE602005025376T patent/DE602005025376D1/de not_active Expired - Lifetime
- 2005-07-29 TW TW094125823A patent/TWI381542B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006013800A1 (en) | 2006-02-09 |
| TW200612583A (en) | 2006-04-16 |
| TWI381542B (zh) | 2013-01-01 |
| ATE492036T1 (de) | 2011-01-15 |
| JP2006074007A (ja) | 2006-03-16 |
| DE602005025376D1 (de) | 2011-01-27 |
| EP1794809A1 (en) | 2007-06-13 |
| US20090039376A1 (en) | 2009-02-12 |
| US7696527B2 (en) | 2010-04-13 |
| EP1794809B1 (en) | 2010-12-15 |
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