JP2005045199A - チップ発光ダイオード及びその製造方法 - Google Patents
チップ発光ダイオード及びその製造方法 Download PDFInfo
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- JP2005045199A JP2005045199A JP2004007357A JP2004007357A JP2005045199A JP 2005045199 A JP2005045199 A JP 2005045199A JP 2004007357 A JP2004007357 A JP 2004007357A JP 2004007357 A JP2004007357 A JP 2004007357A JP 2005045199 A JP2005045199 A JP 2005045199A
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- light emitting
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- emitting diode
- package mold
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 claims description 19
- 238000000926 separation method Methods 0.000 claims description 6
- 239000012778 molding material Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000012141 concentrate Substances 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
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- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005375 photometry Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】 可視角の範囲が広いチップ発光ダイオード及びその製造方法を開示する。チップ発光ダイオードは印刷回路基板に搭載された発光チップを覆うように丸みのある形状に突出した突出部を少なくとも一個以上設けるパッケージモールド部を設ける。パッケージモールド部はその断面が大略半円形または楕円形、放物形の一部であったり、相互所定の接触角を有する複数の平面からなることができ、このような断面が長さ方向に延長された形態でパッケージモールド部の外面を形成する。
【選択図】 図2
Description
110 印刷回路基板
120 金属パッド
53、130 発光チップ
140 ワイヤー
150 リード
160、260、360、460、660、760、860 パッケージモールド部
390 段差部
161、261、361、461、661、662、761、861、862、863 突出部
663、864、865 離隔部
Claims (8)
- 印刷回路基板;
前記印刷回路基板上に一定の間隔をおいて設けられた金属パッド及びリード;
前記金属パッドに結合された発光チップ;
前記発光チップと前記リードとを電気的に連結するワイヤー;及び
前記印刷回路基板で前記発光チップ、前記ワイヤー、及び前記金属パッド及びリードの少なくとも一部を覆うように丸みのある形状に突出した突出部を少なくとも一個以上有するパッケージモールド部;
を含んで構成されることを特徴とするチップ発光ダイオード。 - 前記パッケージモールド部の丸みのある形状は、その縦断面が実質的に半円形、または実質的に楕円形または放物線の一部であることを特徴とする請求項1に記載のチップ発光ダイオード。
- 前記パッケージモールド部の丸みのある形状は、その表面が複数の面からなり、全体として丸みのある面に近似していることを特徴とする請求項1に記載のチップ発光ダイオード。
- 前記パッケージモールド部の外面縁に少なくとも一個の段差部が設けられていることを特徴とする請求項1に記載のチップ発光ダイオード。
- 前記パッケージモールド部の外面には凹凸形状の散乱パターンが形成されていることを特徴とする請求項1に記載のチップ発光ダイオード。
- 前記パッケージモールド部の突出部は一個であることを特徴とする請求項1に記載のチップ発光ダイオード。
- 前記突出部は2個で、互いに所定の離隔距離をおいて配置されており、
前記離隔距離は前記底面の長さに対して0.1乃至0.4倍の範囲内であることを特徴とする請求項1に記載のチップ発光ダイオード。 - 印刷回路基板上に電気が通る金属パッドを設置した後、発光チップを実装する段階;
前記発光チップを前記印刷回路基板上のリードとワイヤーで連結する段階;
前記印刷回路基板をその断面が丸みのある形状に突出した突出部を少なくとも一個有するように形成された凹部を有する金型内に装着する段階;及び
前記金型の凹部内に所定のモールディング材料を注入して、前記印刷回路基板上に前記発光チップ、前記ワイヤー及び前記リードを丸みのある形状に覆うパッケージモールド部を形成する段階;
を含むことを特徴とするチップ発光ダイオード製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20030051365 | 2003-07-25 | ||
KR1020030057331A KR100405453B1 (en) | 2003-07-25 | 2003-08-19 | Chip light emitting diode(led) and manufacturing method thereof |
KR1020030057625A KR100430192B1 (ko) | 2003-08-20 | 2003-08-20 | 칩 발광다이오드 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007161732A Division JP2007235182A (ja) | 2003-07-25 | 2007-06-19 | チップ発光ダイオード |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005045199A true JP2005045199A (ja) | 2005-02-17 |
Family
ID=34084287
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004007357A Pending JP2005045199A (ja) | 2003-07-25 | 2004-01-14 | チップ発光ダイオード及びその製造方法 |
JP2007161732A Withdrawn JP2007235182A (ja) | 2003-07-25 | 2007-06-19 | チップ発光ダイオード |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007161732A Withdrawn JP2007235182A (ja) | 2003-07-25 | 2007-06-19 | チップ発光ダイオード |
Country Status (5)
Country | Link |
---|---|
US (2) | US7042022B2 (ja) |
JP (2) | JP2005045199A (ja) |
CN (1) | CN100382340C (ja) |
DE (1) | DE102004001312B4 (ja) |
TW (1) | TWI239660B (ja) |
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WO2006109886A1 (en) * | 2005-04-12 | 2006-10-19 | Japan Cash Machine Co., Ltd. | Led device and optical detector therewith for bill validator |
JP2006286608A (ja) * | 2005-03-07 | 2006-10-19 | Nichia Chem Ind Ltd | 面状照射光源及び面状照射装置 |
JP2007005749A (ja) * | 2005-06-24 | 2007-01-11 | Epitech Technology Corp | 発光ダイオード |
JP2007173787A (ja) * | 2005-12-21 | 2007-07-05 | Samsung Electro Mech Co Ltd | Ledパッケージ及びこれを用いたバックライトユニット |
JP2007220765A (ja) * | 2006-02-15 | 2007-08-30 | Hitachi Displays Ltd | 液晶表示装置 |
JP2010027974A (ja) * | 2008-07-23 | 2010-02-04 | Sharp Corp | 発光装置の製造方法 |
JP2010103172A (ja) * | 2008-10-21 | 2010-05-06 | Denka Agsp Kk | 発光素子搭載用基板、発光素子パッケージおよび発光素子搭載用基板の製造方法 |
JP2011071136A (ja) * | 2010-12-21 | 2011-04-07 | Koito Mfg Co Ltd | 車両用灯具 |
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US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
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2004
- 2004-01-07 DE DE102004001312A patent/DE102004001312B4/de not_active Expired - Fee Related
- 2004-01-09 CN CNB2004100003576A patent/CN100382340C/zh not_active Expired - Lifetime
- 2004-01-09 TW TW093100501A patent/TWI239660B/zh not_active IP Right Cessation
- 2004-01-09 US US10/754,389 patent/US7042022B2/en not_active Ceased
- 2004-01-14 JP JP2004007357A patent/JP2005045199A/ja active Pending
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2007
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- 2007-06-19 JP JP2007161732A patent/JP2007235182A/ja not_active Withdrawn
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US9142734B2 (en) | 2003-02-26 | 2015-09-22 | Cree, Inc. | Composite white light source and method for fabricating |
US9666772B2 (en) | 2003-04-30 | 2017-05-30 | Cree, Inc. | High powered light emitter packages with compact optics |
JP2006286608A (ja) * | 2005-03-07 | 2006-10-19 | Nichia Chem Ind Ltd | 面状照射光源及び面状照射装置 |
US7501659B2 (en) | 2005-04-12 | 2009-03-10 | Japan Cash Machine Co., Ltd. | LED device and optical detector therewith for bill validator |
JP2008535236A (ja) * | 2005-04-12 | 2008-08-28 | 日本金銭機械株式会社 | 発光ダイオード装置及び発光ダイオード装置を有する紙幣鑑別機用光学式検出装置 |
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JP2007005749A (ja) * | 2005-06-24 | 2007-01-11 | Epitech Technology Corp | 発光ダイオード |
US10096756B2 (en) | 2005-11-25 | 2018-10-09 | Samsung Electronics Co., Ltd. | Side view light emitting diode package |
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JP2007173787A (ja) * | 2005-12-21 | 2007-07-05 | Samsung Electro Mech Co Ltd | Ledパッケージ及びこれを用いたバックライトユニット |
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US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
JP2010027974A (ja) * | 2008-07-23 | 2010-02-04 | Sharp Corp | 発光装置の製造方法 |
JP2010103172A (ja) * | 2008-10-21 | 2010-05-06 | Denka Agsp Kk | 発光素子搭載用基板、発光素子パッケージおよび発光素子搭載用基板の製造方法 |
US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
JP2011071137A (ja) * | 2010-12-21 | 2011-04-07 | Koito Mfg Co Ltd | 車両用灯具 |
JP2011071136A (ja) * | 2010-12-21 | 2011-04-07 | Koito Mfg Co Ltd | 車両用灯具 |
US10615324B2 (en) | 2013-06-14 | 2020-04-07 | Cree Huizhou Solid State Lighting Company Limited | Tiny 6 pin side view surface mount LED |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
Also Published As
Publication number | Publication date |
---|---|
DE102004001312A1 (de) | 2005-03-24 |
CN100382340C (zh) | 2008-04-16 |
US7042022B2 (en) | 2006-05-09 |
US20050017259A1 (en) | 2005-01-27 |
USRE42112E1 (en) | 2011-02-08 |
JP2007235182A (ja) | 2007-09-13 |
DE102004001312B4 (de) | 2010-09-30 |
TWI239660B (en) | 2005-09-11 |
TW200505048A (en) | 2005-02-01 |
CN1577903A (zh) | 2005-02-09 |
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